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4 layers100 × 100 mmFarmMesh Node, the printed circuit board in 3D

Developing an integrated hardware and software solution for farm-wide Mesh networking: RP2350B/ESP32-C5 nodes, firmware, network protocols, and Wi-Fi/BLE sensor access.

Size
100 × 100 mm
Copper layers
4
Thickness
1.6 mm
Parts
164
Nets
180
Pads
640
Tracks, vias
1,540, 396
Pours
17
Routed
Yes
KiCad
KiCad 10.0 (file 20260206)
Created
22 Sep 2026
Updated
23 Sep 2026

Overview

FarmMesh Node is an open-source printed circuit board by chinawrj, from the chinawrj/FarmMesh-Node repository on GitHub. It is a 4-layer board of 100 × 100 mm with 164 parts on 180 nets, routed with 1,540 tracks and 396 vias.

It is built around the RP2350B, ESP32-C5-WROOM-1U-N8R8 and LTC3119IFE#PBF, with the TS3USB30EDGSR-TP, RC0402FR-0722RL and RC0603FR-0710KL among its other parts. Its parts include 73 resistors, 50 capacitors, 8 switches, 7 ICs and 7 connectors. It belongs with the radio and wireless boards and the ESP32, RP2350 and RISC-V boards of this library.

Main components

12

README

README.md

FarmMesh Node

An integrated hardware and software solution for farm-wide Mesh networking

English | 简体中文

Overview · Solution scope · A1 hardware · Features & targets · Architecture · Internal interface · Wireless research · Open decisions · Roadmap · Contact · References

Overview

FarmMesh Node is a hardware and software project for a complete farm wireless networking solution. Its scope includes node electronics, embedded firmware, communication protocols, Mesh networking, client and sensor access, and system integration and field validation. Hardware and software are developed together toward the same farm-wide service goals; the A1 PCB is the current hardware milestone within that larger project.

FarmMesh Node aims to provide farm-wide coverage using solar-powered infrastructure nodes that need no pre-installed power or network cabling, combining on-demand high-speed client access with distributed access for hundreds to approximately 1,000 low-traffic sensors. Inter-node links are intended to be entirely wireless. Solar supply, storage and node power budgets remain to be designed; this is not a claim of all-weather energy autonomy, and a gateway/uplink may still be needed.

The client-access design target is 50 Mbps of effective throughput after connecting to a Mesh node, available on demand wherever needed in the farm. The initial capacity assumption is 1–2 concurrent high-speed clients across the whole farm, not per infrastructure node and not a limit on the number of Mesh nodes or total clients. This does not require every location to receive 50 Mbps simultaneously. Measurement endpoints, direction and test conditions remain TBD; there is no guarantee of 50 Mbps across multiple Mesh hops or to the Internet.

Infrastructure nodes are intended to provide concurrent BLE or Wi-Fi access for several hundred to approximately 1,000 low-traffic, low-power sensors across the whole farm, distributed among multiple Mesh nodes. This is an aggregate planning target requiring capacity validation, not 1,000 direct BLE connections per node or simultaneous packet transmission by every sensor. End-device energy requirements and the infrastructure's solar-power budget are separate concerns; neither implies that the forwarding infrastructure must sleep. Low Wi-Fi traffic alone does not establish low power consumption, and BLE/Wi-Fi coexistence requires validation.

Each infrastructure node contains one RP2350B and three ESP32-C5 chips, implemented in A1 with three official ESP32-C5-WROOM-1U-N8R8 modules. The RP2350B is intended to aggregate and forward data inside the node, with an independent internal link to each C5. The separate preliminary 50 Mbps per internal link target is a hardware design input, not a demonstrated user throughput figure or proof that the access-service target can be met. Its directional and raw-rate/payload-rate definitions remain TBD.

Development is staged from the node hardware foundation through firmware and network software to full-system validation. The A1 prototype has eight schematic sheets, a four-layer PCB and a manufacturing package released for controlled engineering prototypes; its release record is RELEASE.md. Firmware and network software implementation remain pending. Coverage, user throughput, terminal capacity, power consumption and sustained internal-link performance have not been measured.

Solution scope and current progress

AreaRole in the complete solutionCurrent progress
Node hardwareRP2350B and three ESP32-C5 modules, power, PCB, antennas and physical interfacesA1 design and reviewed manufacturing package available; assembly and bring-up pending; deployment solar power remains to be designed
Embedded firmwareRP2350 PIO/DMA and C5 PARLIO drivers, framing, buffering, flow control and coordination across the three linksHardware pin assignments frozen for A1; firmware and interface timing validation pending
Network softwareInter-node wireless transport, Mesh protocol and routing, Wi-Fi/BLE client and sensor access, configuration and diagnosticsRequirements and wireless research recorded; protocol selection and implementation pending
System integrationHardware/firmware/network integration, power and RF coexistence, throughput, sensor capacity and farm deploymentStaged first-board test plan available; multi-node and field validation planned

This repository currently contains the hardware release, system requirements and wireless research. Software will be developed as part of the same project; the table distinguishes the intended solution from what is already implemented.

A1 hardware prototype

A1 contains a 100 × 100 mm four-layer PCB, protected single-cell nominal 3.7 V Li-ion input, 3.3 V buck-boost supply, RP2350B, three C5 modules, independent parallel interfaces, UART download headers and RP USB/SWD. USB data disconnects in hardware when VBUS is absent, including ROM BOOTSEL operation. USB does not power or charge the board. Solar charging and storage sizing remain separate design work.

ArtifactUse and status
Release statusAuthoritative prototype fabrication gate and validation boundaries
Manufacturing ZIP / SHA-256Released for controlled A1 prototypes: Gerber, drills, BOM, placements, drawings, editable source and review evidence
KiCad project / PCBEditable native sources; download the repository together with project-local libraries
Eight-page schematic PDFA1 circuit review copy
Manufacturing instructions / parts selectionStackup, assembly requirements, 153 selected assembly parts and accessories
First-board test planStaged power, debug, USB, thermal, load and RF checks; results are not yet measured
Design notesCircuit and layout choices, sources and reproducibility
Power review / RF and digital review / DFM and BOM reviewIndependent engineering review records, with remaining bench-validation boundaries

The C5 modules use external dual-band antennas. Their native USB pins are allocated to PARLIO; each C5 retains UART download and logging. No wireless transport or Mesh protocol is selected by the hardware. A fabrication-ready package does not establish RF, power or throughput performance.

Key features and performance targets

Targets below are planned requirements, not measured results. TBD means to be determined. Chip resource facts and candidate allocations are identified separately.

ItemTarget or configurationStatus and boundaries
Solar power and deploymentSolar-capable infrastructure nodes; no pre-installed power or network cables; wireless inter-node linksDesign goal; solar sizing, storage and node power budget TBD; energy autonomy unverified; gateway/uplink architecture open
Farm-wide coverageWireless access throughout the farmProduct goal; area, terrain, range, node count and placement TBD
On-demand high-speed access50 Mbps effective client-access throughput after connecting to a Mesh nodeDesign goal; measurement endpoints, direction and conditions TBD; no multi-hop or Internet throughput guarantee
High-speed client concurrencyInitially 1–2 across the whole farmCapacity assumption, unverified; not per Mesh node, a Mesh-node count limit or a total-client limit
Concurrent low-traffic accessSeveral hundred to approximately 1,000 sensors across the farm via BLE or Wi-FiAggregate planning target, distributed across nodes; capacity has an upper bound and needs validation; not per-node BLE sessions or simultaneous packets from all sensors
Per-node BLE capacityBounded by C5 controller, host stack/configuration and radio schedulingConnection-based versus advertising/scanning mode TBD; role and per-node limits unconfirmed; three C5 capacities cannot simply be added into a guarantee
End-device energy useSupport low-power terminal operationProduct goal; activity duty cycle, power budget and battery-life target TBD; solar infrastructure budget separately TBD
Node composition1 × RP2350B + 3 × ESP32-C5-WROOM-1U-N8R8Selected A1 architecture; physical validation pending
A1 hardware artifactsEight-sheet KiCad schematic, four-layer PCB and selected BOM; nominal 3.7 V single-cell Li-ion inputFabrication gate in RELEASE.md; solar charging, firmware and physical validation remain separate
Independent internal linksPreliminary target: 50 Mbps per C5–RP2350 link, not shared across three linksInternal-interface target; direction, raw versus payload rate and required margin for the user-service target TBD; unverified
Internal interfacePARLIO ↔ PIO, separate 4-bit TX/RX buses; both clocks supplied by C5Candidate; 12 signals per link; A1 pin assignment drawn and reviewed; programs and timing unverified
RP2350B resources48 Bank0 GPIOs; 3 PIO blocks / 12 state machines; 32 shared instructions per block; 16 system DMA channelsChip resource facts; preliminary interface allocation below is not implementation proof
Wireless roles and interconnectionThree C5 chips per node; Mesh protocol, radio roles/channels and gateway/uplink TBDArchitecture decisions pending; no guaranteed BLE/Wi-Fi coexistence performance or Internet throughput

Architecture

Network concept

The diagram separates end-device access from the Mesh infrastructure. Dotted lines show intended service relationships and node membership, not physical radio links or packet paths. The service box is a logical grouping, not a central device. Inter-node topology, radio roles and Mesh protocol remain open; the measurement endpoint and gateway/uplink boundary are also TBD.

mermaid
flowchart TB
    fast["High-speed clients / 高速客户端<br/>50 Mbps access target / 接入目标<br/>1–2 concurrent farm-wide / 全网并发目标"]
    low["Low-traffic sensors / 低流量传感器<br/>Hundreds to approx. 1,000 farm-wide / 全网数百至约千个<br/>Concurrent access goal / 并发接入目标"]
    mesh["FarmMesh infrastructure services / 基础设施服务层<br/>Logical grouping / 逻辑分组"]
    fast -.- mesh
    low -.-|"BLE or Wi-Fi / 计划接入"| mesh
    subgraph infra["Solar-capable Mesh nodes / 太阳能 Mesh 节点目标"]
        a["FarmMesh Node A"]
        b["FarmMesh Node B"]
        c["FarmMesh Node C"]
    end
    mesh -.- a
    mesh -.- b
    mesh -.- c
    deployment["No pre-installed power or network cables / 免预布电源线或网线<br/>Wireless inter-node links / 节点间纯无线目标"]
    deployment -.- mesh
    boundary["Measurement endpoint and gateway/uplink / 测速端点与网关或上联<br/>TBD / 待定"]
    mesh -.- boundary

Inside one node

Each line represents an independent internal data link. Clock and VALID directions are defined separately in the interface table below; the arrows here do not specify clock sources.

mermaid
flowchart LR
    subgraph node["One FarmMesh Node / 单个节点"]
        rp["RP2350B · PIO + system DMA<br/>Data aggregation and forwarding / 数据汇聚与转发"]
        ca["ESP32-C5 A · PARLIO"]
        cb["ESP32-C5 B · PARLIO"]
        cc["ESP32-C5 C · PARLIO"]
        rp <-->|"Link A / 链路 A"| ca
        rp <-->|"Link B / 链路 B"| cb
        rp <-->|"Link C / 链路 C"| cc
    end

The three ESP32-C5 chips' wireless roles, channels and connections to other nodes are not assigned by this diagram.

Wireless coexistence boundary

Espressif documents shared RF resources with time-division and priority arbitration. Its current C5 coexistence table marks Wi-Fi SoftAP Connecting/Connected combined with BLE Scan/Advertising/Connected as C1 (supported, with unstable performance). This is a constraint to validate if a C5 is assigned both Wi-Fi AP and BLE roles; it does not establish that the three-chip node cannot meet its goals. Radio-role allocation and coexistence must be checked against the selected SDK and operating scenarios. Concurrent terminal service does not imply independent, simultaneous full-load radios on a single C5. See the official RF coexistence guide.

Per-node BLE capacity has an implementation-dependent limit, not one universal fixed connection count imposed by the BLE specification. The C5 controller and NimBLE host expose separate connection-limit settings in the official configuration reference. Connection-based access and connectionless advertising/scanning are different BLE roles and topologies; scanning advertisements must not be counted as persistent connections. Advertising/scanning terminal capacity needs its own validation. Select the access mode and three C5 roles before confirming per-node capacity; simply adding three chip-level limits does not establish node capacity.

Candidate internal interface

The selected hardware interface is ESP32-C5 PARLIO ↔ RP2350 PIO, using separate 4-bit TX and RX data buses. A1 freezes the physical connections; firmware and timing for concurrent bidirectional operation remain unvalidated.

Each C5 supplies both clocks. The RP2350 PIO follows an external clock in both directions, including when the RP2350 sends data to the C5.

Transfer directionDATAClockVALID
C5 → RP23504 signals, C5 → RPC5 TX CLK → RPC5 TX VALID → RP
RP2350 → C54 signals, RP → C5C5 RX CLK → RPRP VALID → C5

This uses 12 signals per link: 8 DATA, 2 CLK and 2 VALID. Three links use 36 signals, plus a common ground reference. A1 freezes the prototype pin assignment in the schematics and C5 pinmap; firmware and hardware timing validation remain open.

PARLIO has separate TX and RX units. A shared-data, half-duplex alternative would require explicit output-enable, tri-state and direction-change handling. PARLIO must not be treated as an automatically reversing shared bus, and disabling TX does not by itself establish a high-impedance output.

Preliminary resource budget

RP2350B resourceAvailableInitial three-link estimate
Bank0 GPIO, QFN80 package4836 interface signals; 12 remain before other allocations
PIO state machines12 across 3 PIO blocks6: one RX and one TX per link
System DMA channels166: one per direction per link
PIO instruction memory32 shared instructions per PIO blockProgram size not yet established

These estimates do not constitute an implemented PIO program or validated timing design. A1 assigns the three interfaces to RP2350B GPIO0–35. Each PIO has a 32-GPIO window selected by GPIOBASE 0 or 16; the PIO configuration and instruction use still need implementation checks. Dedicated QSPI storage pins, USB and SWD do not consume the 48 Bank0 GPIOs. Other board functions use part of the remaining GPIO budget. The 30-GPIO RP2350A cannot accommodate this 36-signal candidate.

Processing responsibilities and timing boundary

  • CPU: initialization, buffer preparation, transaction coordination and exception handling.
  • PIO: beat-level sampling and output timing under the C5-provided clocks.
  • System DMA: block transfers between PIO FIFOs and RP2350 SRAM, intended to avoid CPU byte-by-byte copying.

The C5 PARLIO RX documentation describes receive-clock output and VALID-based reception gating. C5 RX/GDMA transactions must be prepared before data arrives; VALID alone does not create a receive transaction. The RP must prepare the first beat and drive VALID correctly. Start/end behavior, sampling edges and gating timing still require a concrete design and validation.

Frame boundaries, DMA rearming and sustained operation also remain to be designed. A ring-address setting alone is not a guarantee of indefinite operation, and this draft does not claim CPU-free transfer management.

Wireless research status

The wireless link research notes record the 2026-09-22 review, official sources, version-specific binary observations and MTU/MSS constraints. No wireless transport has been selected. The client-access targets and internal hardware candidate above remain unchanged.

TopicCurrent findingStatus and boundary
WDS / four-address bridgeDirect public C5 support not confirmed in the reviewed documentation/APIDoes not establish a hardware impossibility
ESP-NOW and public raw TXDifferent frame/payload limits; neither establishes this project's 50 Mbps effective throughputResearch candidates; no sustained-throughput validation
Rate and power controlsPublic per-peer ESP-NOW rate configuration and per-C5 Wi-Fi maximum-power ceilingDocumented controls; no confirmed ready-to-enable ESP-NOW automatic-rate tool; custom adaptation remains future work
AP+STA + proxy ARPCurrently not pursuedProject direction, not a technical impossibility finding

Open decisions

  1. Define the client-to-Mesh-node 50 Mbps access test: measurement endpoints, uplink/downlink direction and conditions. Start with 1–2 concurrent high-speed clients farm-wide; multi-hop and Internet throughput remain outside any established guarantee.
  2. Define each internal link's 50 Mbps target separately: one direction, both directions combined, or each direction; raw rate versus effective payload rate; and the capacity margin needed to support the user-service goal.
  3. Establish three-link PIO feasibility, clock/timing constraints, GPIO mapping, instruction budget and required CPU participation. Define first-beat readiness, VALID behavior, receive-transaction preparation, frame boundaries and DMA rearming.
  4. Validate the farm-wide planning target of several hundred to approximately 1,000 low-traffic sensors. Select connection-based BLE versus advertising/scanning roles, establish per-node limits and define activity duty cycles, traffic, latency and end-device energy targets. Radio roles/channels and BLE/Wi-Fi coexistence remain to be validated.
  5. Design the solar supply, storage and infrastructure power budget for deployment without pre-installed power or network cabling. Later, decide Mesh protocol and routing, antennas, coverage area/terrain and deployment, gateway/uplink, environmental protection and the full BOM.

These decisions guide the complete hardware and software solution. The current repository establishes the A1 hardware foundation and records the software design inputs; firmware, network protocols, routing and system optimization are the next development stages.

Roadmap

PhaseScopeStatus
1System requirements and hardware/software architectureService targets and A1 hardware allocation recorded; software architecture and protocols remain open
2A1 schematics, PCB and manufacturing packageReleased for controlled engineering prototypes; see RELEASE.md
3Board bring-up, drivers and internal-link firmwareAwaiting assembled boards; firmware and timing validation pending
4Network software, Mesh routing and client/sensor servicesPlanned; integrate with validated node hardware and firmware
5Multi-node integration and farm deploymentPlanned; validate coverage, throughput, sensor capacity, power and reliability

Contact and participation

Interested in FarmMesh Node? Use GitHub Issues to discuss requirements, hardware, firmware, network software, system testing or ways to participate. You can also visit the project owner's GitHub profile.

References

Official sources for subsequent design checks:

Differences in maximum full-duplex width descriptions across C5 documentation still need reconciliation. This draft considers only the 4-bit-per-direction candidate and makes no claim about wider full-duplex configurations. The ESP-IDF stable links can change; record the selected SDK and document versions when the implementation baseline is set.

Parts

164
QtyValueFootprintReferences
2122RResistor_SMD:R_0603_1608MetricR210, R211, R212, R213, R214, R215, R220, R310, R311, R312, R313, R314, R315, R320, R410, R411 +5
1522RResistor_SMD:R_0402_1005MetricR216, R217, R218, R219, R221, R316, R317, R318, R319, R321, R416, R417, R418, R419, R421
910kResistor_SMD:R_0603_1608MetricR201, R202, R203, R301, R302, R303, R401, R402, R403
622u / 10V X7RCapacitor_SMD:C_0805_2012MetricC3, C4, C8, C201, C301, C401
64.7k VALID idle lowResistor_SMD:R_0603_1608MetricR204, R205, R304, R305, R404, R405
5100n / 10VCapacitor_SMD:C_0603_1608MetricC5, C9, C202, C302, C402
4M3 / 3.2mm NPTHMountingHole:MountingHole_3.2mm_M3H1, H2, H3, H4
4RESETButton_Switch_SMD:SW_Push_1P1T_NO_E-Switch_TL3301NxxxxxGSW102, SW201, SW301, SW401
3100u / 6.3V polymerCapacitor_SMD:CP_Elec_5x5.9C203, C303, C403
31u / 10VCapacitor_SMD:C_0603_1608MetricC204, C304, C404
34.7u X5R 20%Capacitor_SMD:C_0402_1005MetricC101, C102, C103
35.1k 1%Resistor_SMD:R_0603_1608MetricR108, R109, R112
3BOOTButton_Switch_SMD:SW_Push_1P1T_NO_E-Switch_TL3301NxxxxxGSW202, SW302, SW402
3ESP32-C5-WROOM-1U-N8R8FarmMesh:ESP32-C5-WROOM-1UU201, U301, U401
3UART / 3V3 reference onlyConnector_PinHeader_2.54mm:PinHeader_1x06_P2.54mm_VerticalJ201, J301, J401
2100kResistor_SMD:R_0603_1608MetricR1, R6
2100k 1%Resistor_SMD:R_0603_1608MetricR3, R8
2100n / 16VCapacitor_SMD:C_0603_1608MetricC1, C2
215p C0GCapacitor_SMD:C_0402_1005MetricC105, C106
21kResistor_SMD:R_0402_1005MetricR103, R105
227R at RPResistor_SMD:R_0402_1005MetricR110, R111
2GNDTestPoint:TestPoint_Pad_D1.5mmTP3, TP102
1+3V3TestPoint:TestPoint_Pad_D1.5mmTP2
1100k 0.1%Resistor_SMD:R_0603_1608MetricR115
1100nCapacitor_SMD:C_0402_1005MetricC104
1100n / 16V at D101Capacitor_SMD:C_0603_1608MetricC127
1100n / 16V at U103Capacitor_SMD:C_0603_1608MetricC128
1100n / 16V at U104Capacitor_SMD:C_0603_1608MetricC129
1100n pin10Capacitor_SMD:C_0402_1005MetricC121
1100n pin15Capacitor_SMD:C_0402_1005MetricC111
1100n pin24Capacitor_SMD:C_0402_1005MetricC112
1100n pin29Capacitor_SMD:C_0402_1005MetricC113
1100n pin32Capacitor_SMD:C_0402_1005MetricC122
1100n pin41Capacitor_SMD:C_0402_1005MetricC114
1100n pin5Capacitor_SMD:C_0402_1005MetricC110
1100n pin50Capacitor_SMD:C_0402_1005MetricC115
1100n pin51Capacitor_SMD:C_0402_1005MetricC123
1100n pin59Capacitor_SMD:C_0402_1005MetricC118
1100n pin60Capacitor_SMD:C_0402_1005MetricC116
1100n pin68Capacitor_SMD:C_0402_1005MetricC119
1100n pin69Capacitor_SMD:C_0402_1005MetricC120
1100n pin76Capacitor_SMD:C_0402_1005MetricC117
110kResistor_SMD:R_0402_1005MetricR102
110k OE pull-upResistor_SMD:R_0603_1608MetricR116
110nCapacitor_SMD:C_0603_1608MetricC126
1120u / 10V polymerCapacitor_SMD:CP_Elec_6.3x5.9C6
112MHz ABM8-272-T3Crystal:Crystal_SMD_3225-4Pin_3.2x2.5mmY101
1162k 1%Resistor_SMD:R_0603_1608MetricR5
1174k 1%Resistor_SMD:R_0603_1608MetricR7
11S Li-ion packConnector_JST:JST_VH_B2P-VH_1x02_P3.96mm_VerticalJ1
11kResistor_SMD:R_0603_1608MetricR104
11n C0G REFCapacitor_SMD:C_0603_1608MetricC130
1220u / 6.3V polymerCapacitor_SMD:CP_Elec_6.3x5.9C7
1237k 0.1%Resistor_SMD:R_0603_1608MetricR114
13.3uH - orientedFarmMesh:AOTA-B201610S3R3-101-TL101
1316k 1%Resistor_SMD:R_0603_1608MetricR2
133RResistor_SMD:R_0402_1005MetricR101
14.7u / 10VCapacitor_SMD:C_0805_2012MetricC11
14.7u at pad32Capacitor_SMD:C_0603_1608MetricC124
14.7uHInductor_SMD:L_Coilcraft_XAL7070-XXXL1
1470p C0GCapacitor_SMD:C_0603_1608MetricC12
15A fuseFuse:Fuse_Littelfuse-NANO2-451_453F1
17.5k 1%Resistor_SMD:R_0603_1608MetricR113
178.7k 1%Resistor_SMD:R_0603_1608MetricR4
1820p C0GCapacitor_SMD:C_0603_1608MetricC10
1BOOTSELButton_Switch_SMD:SW_Push_1P1T_NO_E-Switch_TL3301NxxxxxGSW101
1CORE_1V1TestPoint:TestPoint_Pad_D1.5mmTP101
1DMP2008UFG-7Package_SON:Diodes_PowerDI3333-8Q1
1LTC3119IFE#PBFPackage_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.05x7.56mmU1
1OFF jumperConnector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_VerticalJ2
1PMEG2010EADiode_SMD:D_SOD-323D1
1PWR_GOODTestPoint:TestPoint_Pad_D1.5mmTP104
1RP2350BPackage_DFN_QFN:QFN-80-1EP_10x10mm_P0.4mm_EP3.4x3.4mmU101
1RP_RUNTestPoint:TestPoint_Pad_D1.5mmTP103
1SWD / 3V3 ref onlyConnector_PinHeader_2.54mm:PinHeader_1x05_P2.54mm_VerticalJ101
1TLV3011BIDBVRPackage_TO_SOT_SMD:SOT-23-6U104
1TS3USB30EDGSRPackage_SO:TSSOP-10_3x3mm_P0.5mmU103
1USB4105-GF-AFarmMesh:USB_C_GCT_USB4105_A1J102
1USBLC6-2SC6Package_TO_SOT_SMD:SOT-23-6D101
1VBAT_PROTECTEDTestPoint:TestPoint_Pad_D1.5mmTP1

The 163 most common of 164 parts.

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Questions

How big is the FarmMesh Node PCB?

It measures 100 × 100 mm and has 4 copper layers, 1.6 mm thick.

What parts does the FarmMesh Node use?

164 parts, built around the RP2350B, ESP32-C5-WROOM-1U-N8R8, LTC3119IFE#PBF and TS3USB30EDGSR-TP. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the FarmMesh Node KiCad files?

From the chinawrj/FarmMesh-Node repository on GitHub, at the commit this page was made from: the board is hardware/rev-a/FarmMesh-Node.kicad_pcb and its schematic hardware/rev-a/01-power.kicad_sch. PCBKit opens the board in the browser, with nothing to install.

Can I use the FarmMesh Node design in my own project?

Its repository states no licence, so its author keeps all rights: ask chinawrj before reusing the design.