
At86rf215-design block
oresat/oresat-kicad
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Developing an integrated hardware and software solution for farm-wide Mesh networking: RP2350B/ESP32-C5 nodes, firmware, network protocols, and Wi-Fi/BLE sensor access.
FarmMesh Node is an open-source printed circuit board by chinawrj, from the chinawrj/FarmMesh-Node repository on GitHub. It is a 4-layer board of 100 × 100 mm with 164 parts on 180 nets, routed with 1,540 tracks and 396 vias.
It is built around the RP2350B, ESP32-C5-WROOM-1U-N8R8 and LTC3119IFE#PBF, with the TS3USB30EDGSR-TP, RC0402FR-0722RL and RC0603FR-0710KL among its other parts. Its parts include 73 resistors, 50 capacitors, 8 switches, 7 ICs and 7 connectors. It belongs with the radio and wireless boards and the ESP32, RP2350 and RISC-V boards of this library.
An integrated hardware and software solution for farm-wide Mesh networking
English | 简体中文
Overview · Solution scope · A1 hardware · Features & targets · Architecture · Internal interface · Wireless research · Open decisions · Roadmap · Contact · References
FarmMesh Node is a hardware and software project for a complete farm wireless networking solution. Its scope includes node electronics, embedded firmware, communication protocols, Mesh networking, client and sensor access, and system integration and field validation. Hardware and software are developed together toward the same farm-wide service goals; the A1 PCB is the current hardware milestone within that larger project.
FarmMesh Node aims to provide farm-wide coverage using solar-powered infrastructure nodes that need no pre-installed power or network cabling, combining on-demand high-speed client access with distributed access for hundreds to approximately 1,000 low-traffic sensors. Inter-node links are intended to be entirely wireless. Solar supply, storage and node power budgets remain to be designed; this is not a claim of all-weather energy autonomy, and a gateway/uplink may still be needed.
The client-access design target is 50 Mbps of effective throughput after connecting to a Mesh node, available on demand wherever needed in the farm. The initial capacity assumption is 1–2 concurrent high-speed clients across the whole farm, not per infrastructure node and not a limit on the number of Mesh nodes or total clients. This does not require every location to receive 50 Mbps simultaneously. Measurement endpoints, direction and test conditions remain TBD; there is no guarantee of 50 Mbps across multiple Mesh hops or to the Internet.
Infrastructure nodes are intended to provide concurrent BLE or Wi-Fi access for several hundred to approximately 1,000 low-traffic, low-power sensors across the whole farm, distributed among multiple Mesh nodes. This is an aggregate planning target requiring capacity validation, not 1,000 direct BLE connections per node or simultaneous packet transmission by every sensor. End-device energy requirements and the infrastructure's solar-power budget are separate concerns; neither implies that the forwarding infrastructure must sleep. Low Wi-Fi traffic alone does not establish low power consumption, and BLE/Wi-Fi coexistence requires validation.
Each infrastructure node contains one RP2350B and three ESP32-C5 chips, implemented in A1 with three official ESP32-C5-WROOM-1U-N8R8 modules. The RP2350B is intended to aggregate and forward data inside the node, with an independent internal link to each C5. The separate preliminary 50 Mbps per internal link target is a hardware design input, not a demonstrated user throughput figure or proof that the access-service target can be met. Its directional and raw-rate/payload-rate definitions remain TBD.
Development is staged from the node hardware foundation through firmware and network software to full-system validation. The A1 prototype has eight schematic sheets, a four-layer PCB and a manufacturing package released for controlled engineering prototypes; its release record is RELEASE.md. Firmware and network software implementation remain pending. Coverage, user throughput, terminal capacity, power consumption and sustained internal-link performance have not been measured.
| Area | Role in the complete solution | Current progress |
|---|---|---|
| Node hardware | RP2350B and three ESP32-C5 modules, power, PCB, antennas and physical interfaces | A1 design and reviewed manufacturing package available; assembly and bring-up pending; deployment solar power remains to be designed |
| Embedded firmware | RP2350 PIO/DMA and C5 PARLIO drivers, framing, buffering, flow control and coordination across the three links | Hardware pin assignments frozen for A1; firmware and interface timing validation pending |
| Network software | Inter-node wireless transport, Mesh protocol and routing, Wi-Fi/BLE client and sensor access, configuration and diagnostics | Requirements and wireless research recorded; protocol selection and implementation pending |
| System integration | Hardware/firmware/network integration, power and RF coexistence, throughput, sensor capacity and farm deployment | Staged first-board test plan available; multi-node and field validation planned |
This repository currently contains the hardware release, system requirements and wireless research. Software will be developed as part of the same project; the table distinguishes the intended solution from what is already implemented.
A1 contains a 100 × 100 mm four-layer PCB, protected single-cell nominal 3.7 V Li-ion input, 3.3 V buck-boost supply, RP2350B, three C5 modules, independent parallel interfaces, UART download headers and RP USB/SWD. USB data disconnects in hardware when VBUS is absent, including ROM BOOTSEL operation. USB does not power or charge the board. Solar charging and storage sizing remain separate design work.
| Artifact | Use and status |
|---|---|
| Release status | Authoritative prototype fabrication gate and validation boundaries |
| Manufacturing ZIP / SHA-256 | Released for controlled A1 prototypes: Gerber, drills, BOM, placements, drawings, editable source and review evidence |
| KiCad project / PCB | Editable native sources; download the repository together with project-local libraries |
| Eight-page schematic PDF | A1 circuit review copy |
| Manufacturing instructions / parts selection | Stackup, assembly requirements, 153 selected assembly parts and accessories |
| First-board test plan | Staged power, debug, USB, thermal, load and RF checks; results are not yet measured |
| Design notes | Circuit and layout choices, sources and reproducibility |
| Power review / RF and digital review / DFM and BOM review | Independent engineering review records, with remaining bench-validation boundaries |
The C5 modules use external dual-band antennas. Their native USB pins are allocated to PARLIO; each C5 retains UART download and logging. No wireless transport or Mesh protocol is selected by the hardware. A fabrication-ready package does not establish RF, power or throughput performance.
Targets below are planned requirements, not measured results. TBD means to be determined. Chip resource facts and candidate allocations are identified separately.
| Item | Target or configuration | Status and boundaries |
|---|---|---|
| Solar power and deployment | Solar-capable infrastructure nodes; no pre-installed power or network cables; wireless inter-node links | Design goal; solar sizing, storage and node power budget TBD; energy autonomy unverified; gateway/uplink architecture open |
| Farm-wide coverage | Wireless access throughout the farm | Product goal; area, terrain, range, node count and placement TBD |
| On-demand high-speed access | 50 Mbps effective client-access throughput after connecting to a Mesh node | Design goal; measurement endpoints, direction and conditions TBD; no multi-hop or Internet throughput guarantee |
| High-speed client concurrency | Initially 1–2 across the whole farm | Capacity assumption, unverified; not per Mesh node, a Mesh-node count limit or a total-client limit |
| Concurrent low-traffic access | Several hundred to approximately 1,000 sensors across the farm via BLE or Wi-Fi | Aggregate planning target, distributed across nodes; capacity has an upper bound and needs validation; not per-node BLE sessions or simultaneous packets from all sensors |
| Per-node BLE capacity | Bounded by C5 controller, host stack/configuration and radio scheduling | Connection-based versus advertising/scanning mode TBD; role and per-node limits unconfirmed; three C5 capacities cannot simply be added into a guarantee |
| End-device energy use | Support low-power terminal operation | Product goal; activity duty cycle, power budget and battery-life target TBD; solar infrastructure budget separately TBD |
| Node composition | 1 × RP2350B + 3 × ESP32-C5-WROOM-1U-N8R8 | Selected A1 architecture; physical validation pending |
| A1 hardware artifacts | Eight-sheet KiCad schematic, four-layer PCB and selected BOM; nominal 3.7 V single-cell Li-ion input | Fabrication gate in RELEASE.md; solar charging, firmware and physical validation remain separate |
| Independent internal links | Preliminary target: 50 Mbps per C5–RP2350 link, not shared across three links | Internal-interface target; direction, raw versus payload rate and required margin for the user-service target TBD; unverified |
| Internal interface | PARLIO ↔ PIO, separate 4-bit TX/RX buses; both clocks supplied by C5 | Candidate; 12 signals per link; A1 pin assignment drawn and reviewed; programs and timing unverified |
| RP2350B resources | 48 Bank0 GPIOs; 3 PIO blocks / 12 state machines; 32 shared instructions per block; 16 system DMA channels | Chip resource facts; preliminary interface allocation below is not implementation proof |
| Wireless roles and interconnection | Three C5 chips per node; Mesh protocol, radio roles/channels and gateway/uplink TBD | Architecture decisions pending; no guaranteed BLE/Wi-Fi coexistence performance or Internet throughput |
The diagram separates end-device access from the Mesh infrastructure. Dotted lines show intended service relationships and node membership, not physical radio links or packet paths. The service box is a logical grouping, not a central device. Inter-node topology, radio roles and Mesh protocol remain open; the measurement endpoint and gateway/uplink boundary are also TBD.
flowchart TB
fast["High-speed clients / 高速客户端<br/>50 Mbps access target / 接入目标<br/>1–2 concurrent farm-wide / 全网并发目标"]
low["Low-traffic sensors / 低流量传感器<br/>Hundreds to approx. 1,000 farm-wide / 全网数百至约千个<br/>Concurrent access goal / 并发接入目标"]
mesh["FarmMesh infrastructure services / 基础设施服务层<br/>Logical grouping / 逻辑分组"]
fast -.- mesh
low -.-|"BLE or Wi-Fi / 计划接入"| mesh
subgraph infra["Solar-capable Mesh nodes / 太阳能 Mesh 节点目标"]
a["FarmMesh Node A"]
b["FarmMesh Node B"]
c["FarmMesh Node C"]
end
mesh -.- a
mesh -.- b
mesh -.- c
deployment["No pre-installed power or network cables / 免预布电源线或网线<br/>Wireless inter-node links / 节点间纯无线目标"]
deployment -.- mesh
boundary["Measurement endpoint and gateway/uplink / 测速端点与网关或上联<br/>TBD / 待定"]
mesh -.- boundaryEach line represents an independent internal data link. Clock and VALID directions are defined separately in the interface table below; the arrows here do not specify clock sources.
flowchart LR
subgraph node["One FarmMesh Node / 单个节点"]
rp["RP2350B · PIO + system DMA<br/>Data aggregation and forwarding / 数据汇聚与转发"]
ca["ESP32-C5 A · PARLIO"]
cb["ESP32-C5 B · PARLIO"]
cc["ESP32-C5 C · PARLIO"]
rp <-->|"Link A / 链路 A"| ca
rp <-->|"Link B / 链路 B"| cb
rp <-->|"Link C / 链路 C"| cc
endThe three ESP32-C5 chips' wireless roles, channels and connections to other nodes are not assigned by this diagram.
Espressif documents shared RF resources with time-division and priority arbitration. Its current C5 coexistence table marks Wi-Fi SoftAP Connecting/Connected combined with BLE Scan/Advertising/Connected as C1 (supported, with unstable performance). This is a constraint to validate if a C5 is assigned both Wi-Fi AP and BLE roles; it does not establish that the three-chip node cannot meet its goals. Radio-role allocation and coexistence must be checked against the selected SDK and operating scenarios. Concurrent terminal service does not imply independent, simultaneous full-load radios on a single C5. See the official RF coexistence guide.
Per-node BLE capacity has an implementation-dependent limit, not one universal fixed connection count imposed by the BLE specification. The C5 controller and NimBLE host expose separate connection-limit settings in the official configuration reference. Connection-based access and connectionless advertising/scanning are different BLE roles and topologies; scanning advertisements must not be counted as persistent connections. Advertising/scanning terminal capacity needs its own validation. Select the access mode and three C5 roles before confirming per-node capacity; simply adding three chip-level limits does not establish node capacity.
The selected hardware interface is ESP32-C5 PARLIO ↔ RP2350 PIO, using separate 4-bit TX and RX data buses. A1 freezes the physical connections; firmware and timing for concurrent bidirectional operation remain unvalidated.
Each C5 supplies both clocks. The RP2350 PIO follows an external clock in both directions, including when the RP2350 sends data to the C5.
| Transfer direction | DATA | Clock | VALID |
|---|---|---|---|
| C5 → RP2350 | 4 signals, C5 → RP | C5 TX CLK → RP | C5 TX VALID → RP |
| RP2350 → C5 | 4 signals, RP → C5 | C5 RX CLK → RP | RP VALID → C5 |
This uses 12 signals per link: 8 DATA, 2 CLK and 2 VALID. Three links use 36 signals, plus a common ground reference. A1 freezes the prototype pin assignment in the schematics and C5 pinmap; firmware and hardware timing validation remain open.
PARLIO has separate TX and RX units. A shared-data, half-duplex alternative would require explicit output-enable, tri-state and direction-change handling. PARLIO must not be treated as an automatically reversing shared bus, and disabling TX does not by itself establish a high-impedance output.
| RP2350B resource | Available | Initial three-link estimate |
|---|---|---|
| Bank0 GPIO, QFN80 package | 48 | 36 interface signals; 12 remain before other allocations |
| PIO state machines | 12 across 3 PIO blocks | 6: one RX and one TX per link |
| System DMA channels | 16 | 6: one per direction per link |
| PIO instruction memory | 32 shared instructions per PIO block | Program size not yet established |
These estimates do not constitute an implemented PIO program or validated timing design. A1 assigns the three interfaces to RP2350B GPIO0–35. Each PIO has a 32-GPIO window selected by GPIOBASE 0 or 16; the PIO configuration and instruction use still need implementation checks. Dedicated QSPI storage pins, USB and SWD do not consume the 48 Bank0 GPIOs. Other board functions use part of the remaining GPIO budget. The 30-GPIO RP2350A cannot accommodate this 36-signal candidate.
The C5 PARLIO RX documentation describes receive-clock output and VALID-based reception gating. C5 RX/GDMA transactions must be prepared before data arrives; VALID alone does not create a receive transaction. The RP must prepare the first beat and drive VALID correctly. Start/end behavior, sampling edges and gating timing still require a concrete design and validation.
Frame boundaries, DMA rearming and sustained operation also remain to be designed. A ring-address setting alone is not a guarantee of indefinite operation, and this draft does not claim CPU-free transfer management.
The wireless link research notes record the 2026-09-22 review, official sources, version-specific binary observations and MTU/MSS constraints. No wireless transport has been selected. The client-access targets and internal hardware candidate above remain unchanged.
| Topic | Current finding | Status and boundary |
|---|---|---|
| WDS / four-address bridge | Direct public C5 support not confirmed in the reviewed documentation/API | Does not establish a hardware impossibility |
| ESP-NOW and public raw TX | Different frame/payload limits; neither establishes this project's 50 Mbps effective throughput | Research candidates; no sustained-throughput validation |
| Rate and power controls | Public per-peer ESP-NOW rate configuration and per-C5 Wi-Fi maximum-power ceiling | Documented controls; no confirmed ready-to-enable ESP-NOW automatic-rate tool; custom adaptation remains future work |
| AP+STA + proxy ARP | Currently not pursued | Project direction, not a technical impossibility finding |
These decisions guide the complete hardware and software solution. The current repository establishes the A1 hardware foundation and records the software design inputs; firmware, network protocols, routing and system optimization are the next development stages.
| Phase | Scope | Status |
|---|---|---|
| 1 | System requirements and hardware/software architecture | Service targets and A1 hardware allocation recorded; software architecture and protocols remain open |
| 2 | A1 schematics, PCB and manufacturing package | Released for controlled engineering prototypes; see RELEASE.md |
| 3 | Board bring-up, drivers and internal-link firmware | Awaiting assembled boards; firmware and timing validation pending |
| 4 | Network software, Mesh routing and client/sensor services | Planned; integrate with validated node hardware and firmware |
| 5 | Multi-node integration and farm deployment | Planned; validate coverage, throughput, sensor capacity, power and reliability |
Interested in FarmMesh Node? Use GitHub Issues to discuss requirements, hardware, firmware, network software, system testing or ways to participate. You can also visit the project owner's GitHub profile.
Official sources for subsequent design checks:
Differences in maximum full-duplex width descriptions across C5 documentation still need reconciliation. This draft considers only the 4-bit-per-direction candidate and makes no claim about wider full-duplex configurations. The ESP-IDF stable links can change; record the selected SDK and document versions when the implementation baseline is set.
| Qty | Value | Footprint | References |
|---|---|---|---|
| 21 | 22R | Resistor_SMD:R_0603_1608Metric | R210, R211, R212, R213, R214, R215, R220, R310, R311, R312, R313, R314, R315, R320, R410, R411 +5 |
| 15 | 22R | Resistor_SMD:R_0402_1005Metric | R216, R217, R218, R219, R221, R316, R317, R318, R319, R321, R416, R417, R418, R419, R421 |
| 9 | 10k | Resistor_SMD:R_0603_1608Metric | R201, R202, R203, R301, R302, R303, R401, R402, R403 |
| 6 | 22u / 10V X7R | Capacitor_SMD:C_0805_2012Metric | C3, C4, C8, C201, C301, C401 |
| 6 | 4.7k VALID idle low | Resistor_SMD:R_0603_1608Metric | R204, R205, R304, R305, R404, R405 |
| 5 | 100n / 10V | Capacitor_SMD:C_0603_1608Metric | C5, C9, C202, C302, C402 |
| 4 | M3 / 3.2mm NPTH | MountingHole:MountingHole_3.2mm_M3 | H1, H2, H3, H4 |
| 4 | RESET | Button_Switch_SMD:SW_Push_1P1T_NO_E-Switch_TL3301NxxxxxG | SW102, SW201, SW301, SW401 |
| 3 | 100u / 6.3V polymer | Capacitor_SMD:CP_Elec_5x5.9 | C203, C303, C403 |
| 3 | 1u / 10V | Capacitor_SMD:C_0603_1608Metric | C204, C304, C404 |
| 3 | 4.7u X5R 20% | Capacitor_SMD:C_0402_1005Metric | C101, C102, C103 |
| 3 | 5.1k 1% | Resistor_SMD:R_0603_1608Metric | R108, R109, R112 |
| 3 | BOOT | Button_Switch_SMD:SW_Push_1P1T_NO_E-Switch_TL3301NxxxxxG | SW202, SW302, SW402 |
| 3 | ESP32-C5-WROOM-1U-N8R8 | FarmMesh:ESP32-C5-WROOM-1U | U201, U301, U401 |
| 3 | UART / 3V3 reference only | Connector_PinHeader_2.54mm:PinHeader_1x06_P2.54mm_Vertical | J201, J301, J401 |
| 2 | 100k | Resistor_SMD:R_0603_1608Metric | R1, R6 |
| 2 | 100k 1% | Resistor_SMD:R_0603_1608Metric | R3, R8 |
| 2 | 100n / 16V | Capacitor_SMD:C_0603_1608Metric | C1, C2 |
| 2 | 15p C0G | Capacitor_SMD:C_0402_1005Metric | C105, C106 |
| 2 | 1k | Resistor_SMD:R_0402_1005Metric | R103, R105 |
| 2 | 27R at RP | Resistor_SMD:R_0402_1005Metric | R110, R111 |
| 2 | GND | TestPoint:TestPoint_Pad_D1.5mm | TP3, TP102 |
| 1 | +3V3 | TestPoint:TestPoint_Pad_D1.5mm | TP2 |
| 1 | 100k 0.1% | Resistor_SMD:R_0603_1608Metric | R115 |
| 1 | 100n | Capacitor_SMD:C_0402_1005Metric | C104 |
| 1 | 100n / 16V at D101 | Capacitor_SMD:C_0603_1608Metric | C127 |
| 1 | 100n / 16V at U103 | Capacitor_SMD:C_0603_1608Metric | C128 |
| 1 | 100n / 16V at U104 | Capacitor_SMD:C_0603_1608Metric | C129 |
| 1 | 100n pin10 | Capacitor_SMD:C_0402_1005Metric | C121 |
| 1 | 100n pin15 | Capacitor_SMD:C_0402_1005Metric | C111 |
| 1 | 100n pin24 | Capacitor_SMD:C_0402_1005Metric | C112 |
| 1 | 100n pin29 | Capacitor_SMD:C_0402_1005Metric | C113 |
| 1 | 100n pin32 | Capacitor_SMD:C_0402_1005Metric | C122 |
| 1 | 100n pin41 | Capacitor_SMD:C_0402_1005Metric | C114 |
| 1 | 100n pin5 | Capacitor_SMD:C_0402_1005Metric | C110 |
| 1 | 100n pin50 | Capacitor_SMD:C_0402_1005Metric | C115 |
| 1 | 100n pin51 | Capacitor_SMD:C_0402_1005Metric | C123 |
| 1 | 100n pin59 | Capacitor_SMD:C_0402_1005Metric | C118 |
| 1 | 100n pin60 | Capacitor_SMD:C_0402_1005Metric | C116 |
| 1 | 100n pin68 | Capacitor_SMD:C_0402_1005Metric | C119 |
| 1 | 100n pin69 | Capacitor_SMD:C_0402_1005Metric | C120 |
| 1 | 100n pin76 | Capacitor_SMD:C_0402_1005Metric | C117 |
| 1 | 10k | Resistor_SMD:R_0402_1005Metric | R102 |
| 1 | 10k OE pull-up | Resistor_SMD:R_0603_1608Metric | R116 |
| 1 | 10n | Capacitor_SMD:C_0603_1608Metric | C126 |
| 1 | 120u / 10V polymer | Capacitor_SMD:CP_Elec_6.3x5.9 | C6 |
| 1 | 12MHz ABM8-272-T3 | Crystal:Crystal_SMD_3225-4Pin_3.2x2.5mm | Y101 |
| 1 | 162k 1% | Resistor_SMD:R_0603_1608Metric | R5 |
| 1 | 174k 1% | Resistor_SMD:R_0603_1608Metric | R7 |
| 1 | 1S Li-ion pack | Connector_JST:JST_VH_B2P-VH_1x02_P3.96mm_Vertical | J1 |
| 1 | 1k | Resistor_SMD:R_0603_1608Metric | R104 |
| 1 | 1n C0G REF | Capacitor_SMD:C_0603_1608Metric | C130 |
| 1 | 220u / 6.3V polymer | Capacitor_SMD:CP_Elec_6.3x5.9 | C7 |
| 1 | 237k 0.1% | Resistor_SMD:R_0603_1608Metric | R114 |
| 1 | 3.3uH - oriented | FarmMesh:AOTA-B201610S3R3-101-T | L101 |
| 1 | 316k 1% | Resistor_SMD:R_0603_1608Metric | R2 |
| 1 | 33R | Resistor_SMD:R_0402_1005Metric | R101 |
| 1 | 4.7u / 10V | Capacitor_SMD:C_0805_2012Metric | C11 |
| 1 | 4.7u at pad32 | Capacitor_SMD:C_0603_1608Metric | C124 |
| 1 | 4.7uH | Inductor_SMD:L_Coilcraft_XAL7070-XXX | L1 |
| 1 | 470p C0G | Capacitor_SMD:C_0603_1608Metric | C12 |
| 1 | 5A fuse | Fuse:Fuse_Littelfuse-NANO2-451_453 | F1 |
| 1 | 7.5k 1% | Resistor_SMD:R_0603_1608Metric | R113 |
| 1 | 78.7k 1% | Resistor_SMD:R_0603_1608Metric | R4 |
| 1 | 820p C0G | Capacitor_SMD:C_0603_1608Metric | C10 |
| 1 | BOOTSEL | Button_Switch_SMD:SW_Push_1P1T_NO_E-Switch_TL3301NxxxxxG | SW101 |
| 1 | CORE_1V1 | TestPoint:TestPoint_Pad_D1.5mm | TP101 |
| 1 | DMP2008UFG-7 | Package_SON:Diodes_PowerDI3333-8 | Q1 |
| 1 | LTC3119IFE#PBF | Package_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.05x7.56mm | U1 |
| 1 | OFF jumper | Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical | J2 |
| 1 | PMEG2010EA | Diode_SMD:D_SOD-323 | D1 |
| 1 | PWR_GOOD | TestPoint:TestPoint_Pad_D1.5mm | TP104 |
| 1 | RP2350B | Package_DFN_QFN:QFN-80-1EP_10x10mm_P0.4mm_EP3.4x3.4mm | U101 |
| 1 | RP_RUN | TestPoint:TestPoint_Pad_D1.5mm | TP103 |
| 1 | SWD / 3V3 ref only | Connector_PinHeader_2.54mm:PinHeader_1x05_P2.54mm_Vertical | J101 |
| 1 | TLV3011BIDBVR | Package_TO_SOT_SMD:SOT-23-6 | U104 |
| 1 | TS3USB30EDGSR | Package_SO:TSSOP-10_3x3mm_P0.5mm | U103 |
| 1 | USB4105-GF-A | FarmMesh:USB_C_GCT_USB4105_A1 | J102 |
| 1 | USBLC6-2SC6 | Package_TO_SOT_SMD:SOT-23-6 | D101 |
| 1 | VBAT_PROTECTED | TestPoint:TestPoint_Pad_D1.5mm | TP1 |
The 163 most common of 164 parts.

oresat/oresat-kicad
All things KiCAD for OreSat; libraries, tools, settings, etc.

MiniNugen/Custom_Inverter_Hardware
PCBProjectNameREV1.PrjPCB | Source Documents | | PCBProjectNameREV1.SchDOC | | PCBProjectNameREV1.PcbDOC | | BOM | Settings | Libraries


Thornbots/Electrical
Here is where we store all relevant files for the Electrical team. In here you will store all of the KiCad files that you produce through out the year.


CGainsWorks/emb-drone-flight-stack
Open-source quadrotor flight stack: custom KiCad flight-controller and power distribution boards plus C++ firmware with a PID attitude loop, written from scratch.

enkhbold470/pd-brick
USB-C Power Delivery bench supply: STUSB4500 sink, LM5176 buck-boost, INA228 monitor, 1.2-22 V set over I2C by an ESP32-S3. 4-layer KiCad 10 board.

jbilander/SF2000
Spitfire 2000, A low-end 42 MHz Accelerator with IDE and 4/8 MB fast RAM for the Amiga 2000 co-pro slot (or A500 through an adapter).
It measures 100 × 100 mm and has 4 copper layers, 1.6 mm thick.
164 parts, built around the RP2350B, ESP32-C5-WROOM-1U-N8R8, LTC3119IFE#PBF and TS3USB30EDGSR-TP. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
From the chinawrj/FarmMesh-Node repository on GitHub, at the commit this page was made from: the board is hardware/rev-a/FarmMesh-Node.kicad_pcb and its schematic hardware/rev-a/01-power.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Its repository states no licence, so its author keeps all rights: ask chinawrj before reusing the design.