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4 layers114.7 × 57.4 mmPower Stage, the printed circuit board in 3D

documentation and files for the high efficiency inverter senior design project

Size
114.7 × 57.4 mm
Copper layers
4
Thickness
1.6 mm
Parts
175
Nets
130
Pads
605
Tracks, vias
740, 645
Pours
42
Routed
Yes
KiCad
KiCad 8.0 (file 20240108)
Created
23 Feb 2024
Updated
28 Nov 2024

Overview

Power Stage is an open-source printed circuit board by bbassett6, from the bbassett6/HighEfficiencyInverter repository on GitHub. It is a 4-layer board of 114.7 × 57.4 mm with 175 parts on 130 nets, routed with 740 tracks and 645 vias.

It is built around the ISO6741DW, ISO6760DW and EPC2304ENGRT, with the RFU02VSM6STR among its other parts. Its parts include 58 capacitors, 53 resistors, 21 ICs, 6 diodes and 6 transistors.

Main components

4

README

README.md

Project Executive Summary

What is the design problem and why it should be solved?

With the growing popularity of student-led solar car racing competitions, newly established teams can have restrictive levels of funding to start their engineering endeavors. One of the most critical components of the competitiveness of their cars is the powertrain efficiency, which is heavily influenced by the quality and versatility of their motor controller. As of today, there are only two competitive options that are adopted by most teams, and both represent a substantial amount of the vehicle's cost (over a third of the electrical system's, approximately). This creates a tall barrier of entry for developing engineers to be exposed to real-life design environments that could deeply affect their career choices and subsequent impact in the world, which is why an open-source, accessible inverter would be impactful in the field of sustainable energy, and potentially many others.

What are the technical problems?

Technical problems include • Obtaining efficiency range values comparable or superior to present competitors’ while offering a substantially reduced price: Because of the size of the market, no substantial innovation has been made in mainstream options for approximately 14 years. Recent developments in SiC and GaN-based semiconductors could contribute a significant advantage compared to these outdated designs, but hitting required performance levels for a large range of possible motor and voltage configurations will be a challenge. Additionally, new control methodologies might be more applicable nowadays because of both device development and advances in control theory. • Maximizing efficiency while keeping the inverter design as tolerant as possible to high-voltage design changes depending on the application: Teams' choices of power per motor and DC bus voltage can vary drastically depending on the competition segment (multi- or single-occupant vehicles), creating a challenging optimization problem when attempting to make a product as efficient as possible for as many configurations as expected. • Minimizing inverter-driven high voltage system requirements: In addition to the DC bus compatibility, motor and motor sensing versatility is a factor that influences how seamless the product's integration can be, facilitating its adoption and potentially expanding its impact. • Power density (gravimetric, volumetric): Being heavily influenced by the switching speed of the semiconductor devices being employed, recent product releases could be incredibly important to meet performance levels such as the DOE's 2025 Vehicle Technology goals.

What is the overall design/technical/objective(s)?

Design a financially (under US$ 1000) and technically accessible, high efficiency inverter for use in solar vehicle applications. The design should be easily replicable, testable, and employed by high-school level students. The final efficiency characteristics for applicable performance ranges (e.g. torque, speed, temperature), should be compatible with or surpass those of available options (WaveSculptor22, Mitsuba).

What is the proof of concept? What demonstrates that the solution works?

The proof of concept for the project could consist of a custom-made PCB for the selected power stage topology, containing components such as the switching devices, gate drivers, & high-voltage sensors. This would be complemented with an off-the-shelf development board containing the selected microcontroller and required peripherals, allowing full validation and operation of the converter without a finalized case and custom logic-stage PCB. Should this implementation work as expected, the project would move forward to unification and/or further customization of the boards to achieve a final unified package that is easily integrable.

Demonstrating the solution may involve attaching either an inductive load or a real motor to the inverter and measuring power losses through the power stage at various operating points (steady state cruising, acceleration, regenerative braking).

Parts

175
QtyValueFootprintReferences
131uFCapacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolderC15, C16, C18, C20, C27, C28, C30, C32, C39, C40, C42, C44, C45
1210uFCapacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolderC4, C4, C5, C5, C6, C7, C8, C10, C22, C48, C51, C52
110.1uFCapacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolderC9, C14, C19, C21, C26, C31, C33, C34, C38, C43, C46
82.2 0.1WResistor_SMD:R_0402_1005Metric_Pad0.72x0.64mm_HandSolderR45, R46, R47, R48, R49, R50, R51, R57
60 1/16WResistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolderR13, R15, R27, R29, R41, R43
60.47 1/16WResistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolderR12, R14, R26, R28, R40, R42
610kResistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolderR7, R11, R21, R25, R35, R39
615pFCapacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolderC11, C12, C23, C24, C35, C36
62.2 0.1WResistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolderR4, R5, R18, R19, R32, R33
630kGTSR_KiCAD_Footprints_SD:2152723803T1, T2, T3, T4, T5, T6
6EPC2304ENGRTGTSR_KiCAD_Footprints:EPC2304_ECCQ1, Q2, Q3, Q4, Q5, Q6
6Test_PointTestPoint:TestPoint_Keystone_5000-5004_MiniatureTP1, TP2, TP3, TP4, TP11, TP12
6Test_PointTestPoint:TestPoint_Pad_D1.0mmTP5, TP6, TP7, TP8, TP9, TP10
410kResistor_SMD:R_1206_3216MetricR10, R24, R31, R38
415pFCapacitor_SMD:C_0402_1005Metric_Pad0.74x0.62mm_HandSolderC54, C55, C56, C63
41nFCapacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolderC13, C25, C37, C47
4330Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolderR3, R16, R30, R44
4715kResistor_SMD:R_1206_3216MetricR9, R17, R23, R37
4No. 8MountingHole:MountingHole_2.1mmH1, H2, H3, H4
4TPS73250DBVRPackage_TO_SOT_SMD:TSOT-23-5U3, U13, U14, U17
32 1/16WResistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolderR8, R22, R36
33.3uFGTSR_KiCAD_Footprints:CAP_6050_TDKC1, C2, C3
3470nFCapacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolderC17, C29, C41
350kResistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolderR6, R20, R34
3ADC124S051CIMM/NOPB GTSR_KiCAD_Footprints:SOP50P490X110-10NU6, U9, U12
3GLED_SMD:LED_0603_1608Metric_Pad1.05x0.95mm_HandSolderD1, D1, D2
3Jumper_2_OpenJumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mmJP1, JP2, JP3
3NCP51820AMNTWGGTSR_KiCAD_Footprints:QFN_0AMNTWG_ONS-LU5, U8, U11
3RFU02VSM6STRGTSR_KiCAD_Footprints:DIO_RFU02VS_ROM-MD3, D4, D5
3Screw_Terminal_01x01GTSR_KiCAD_Footprints_SD:CONN6_1057_WREJ3, J4, J5
3~GTSR_KiCAD_Footprints_SD:XDCR_ACS72981LLRATR-100B5U4, U7, U10
21.8kResistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolderR1, R1
2ISO6741Package_SO:SOIC-16W_7.5x10.3mm_P1.27mmU18, U19
2Screw_Terminal_01x01GTSR:CONN6_1057_WREJ1, J6
1100uFCapacitor_THT:CP_Radial_D35.0mm_P10.00mm_SnapInC50
11769205241GTSR_KiCAD_Footprints_SD:176920512U2
11769205241GTSR:176920512U21
1210uFkemet_cap:C4AQLEW6210A3BKC49
1440Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolderR2
1ADC124S051CIMM/NOPB GTSR:SOP50P490X110-10NU15
1Conn_02x10_Odd_EvenConnector_PinHeader_2.54mm:PinHeader_2x10_P2.54mm_HorizontalJ2
1ISO6760iso6760:SOIC16_ISO6760_DW_TEXU20
1TBA 2-1212GTSR:TBA 2_SINGLE_TRPU1
1~GTSR:XDCR_ACS72981LLRATR-100B5U16

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Questions

How big is the Power Stage PCB?

It measures 114.7 × 57.4 mm and has 4 copper layers, 1.6 mm thick.

What parts does the Power Stage use?

175 parts, built around the ISO6741DW, ISO6760DW, EPC2304ENGRT and RFU02VSM6STR. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the Power Stage KiCad files?

From the bbassett6/HighEfficiencyInverter repository on GitHub, at the commit this page was made from: the board is HEI_Power_Stage/Power_Stage/Power_Stage/Power_Stage.kicad_pcb and its schematic EPC_val/EPC_val.kicad_sch. PCBKit opens the board in the browser, with nothing to install.

Can I use the Power Stage design in my own project?

Its repository states no licence, so its author keeps all rights: ask bbassett6 before reusing the design.