Ardor IO

Stereo buffer / mono average / AC outputs / HAND ASSEMBLY

T1.1 compact hand-assembly PCB: 70 × 48 mm. Unbuilt engineering prototype.

KiCad project · Manual BOM · Schematic · Bare-board Gerbers

Supply 5 V / 10 mA. Fit MCP6022-I/P DIP-8 amplifiers; TLV9002 SOIC parts from M1 do not fit. Use Nichicon UES1H100MPM, 10 µF / 50 V bipolar, for C401/C402/C407/C408/C409. The 3.5 mm-pitch footprints reserve the manufacturer's maximum 8.5 mm body diameter; maximum can height is 12.5 mm. Either orientation is valid. C101 and C403 are ordinary polarized radial capacitors, positive on pad 1.

Inputs are line-level, no greater than 1 Vrms per channel. Outputs drive loads of at least 10 kΩ. OUT_MONO is (LEFT + RIGHT) / 2; all three outputs are AC-coupled. Feeding only one channel gives half its amplitude at the mono output. Feed both channels for a full-level mono source. The board is not an instrument preamp or headphone amplifier.

Commission with no signal: check the filtered 5 V rail and about 2.5 V at VREF and the internal buffer outputs. Check near-zero settled DC on the external outputs. Feed separate 1 kHz left/right tones and verify unity stereo buffers, mono averaging and channel separation. Check clipping, noise and oscillation across the audio band. Keep external harnesses short; exposed audio sockets need entry protection.

Connector pin assignments

Directions are relative to this board. Standard header square pads identify pin 1. Read reference and pin numbers from the back silkscreen; mirrored CAD exports are labelled as back views.

J101 — 5V POWER INPUT

J102 — STEREO AUDIO INPUT FROM SOURCE

J103 — BUFFERED STEREO + MONO AUDIO OUTPUT

Assembly and files

Fit low-profile axial parts first, then sockets/headers and radial capacitors. Match diode bands, electrolytic polarity and IC notches to the PCB. Install the ICs or ADC breakout last. H1/H2 are 2.2 mm nonplated M2 mounting holes, not electrical terminals. Check enclosure clearance and capacitor/socket height. T1.1 compacts the layouts; hole positions differ from T1 and M1.

Use the manual BOM and the bare-board Gerber/drill ZIP. There is no SMT assembly order. Front silkscreen shows component references; the front fabrication drawing shows package outlines and orientation; use the BOM for values. Back silk includes port functions and pin numbers. Native checks and package manifests are under verification/; they do not replace prototype measurements.

Assembly accessories list sockets, shunts and panel items in addition to the PCB component BOM.

Family guide · Substitution sources · Native validation