Dlr sensor hat

DLR RTU PCB 🌡️⚡

Single-PCB CM4 carrier for a solar-powered, cellular-connected RTU — mounts to a transmission tower cross-arm, integrates SoM + cellular modem + IEEE 738 sensor suite + solar/LiFePO4 power management. Feeds dlr-rtu-firmware.

Solar-powered remote terminal unit (RTU) deployed unattended on transmission tower cross-arms. A ~20W solar panel and ~50Wh LiFePO4 battery keep the CM4 running indefinitely with cellular PSM idle. A soldered Quectel BG770A (LTE Cat-M1) publishes sensor data and dynamic ratings to the MQTT broker — no site WiFi or wired backhaul required. The unit is designed for 30-year conductor-adjacent deployment with no scheduled maintenance.

~100x80mm 4-layer industrial carrier. Raspberry Pi CM4 (DF40 dual-connector) + Quectel BG770A LCC + FLIR Lepton 3.5 (SPI) + DHT22 (GPIO) + SI1145 (I2C) + YL-83 (analog via ADS1115). MPPT charger from PV input, LiFePO4 BMS, buck for 5V SoM rail, AP2112K LDO for 3.3V analog front-end. Conformal coated, IP55 when potted in field enclosure.

System Context

rectangle transmission_tower {
  rectangle field_enclosure {
    rectangle dlr_carrier {
      rectangle cm4_som
      rectangle cellular_module
      rectangle sensors
      rectangle power_mgmt
    }
  }
  rectangle solar_panel
  rectangle lifepo4_battery
  rectangle conductor
}

queue mqtt_broker
rectangle dispatch_api

solar_panel -d- power_mgmt: PV input
power_mgmt -l- lifepo4_battery: charge / discharge
power_mgmt -d- cm4_som: 5V / 3V3
conductor -u- sensors: thermal view\n(FLIR Lepton)
sensors -r- cm4_som: SPI / I2C / GPIO
cm4_som -r- cellular_module: UART + USB2
cellular_module -r- mqtt_broker: LTE Cat-M1
mqtt_broker -r- dispatch_api: dynamic line rating\n(utility/dlr/...)

The carrier is the physical sensing + edge-compute layer of the DLR feedback loop. Every measurement flows through the IEEE 738 calculation in dlr-rtu-firmware, which publishes the resulting dynamic line rating for mock-derms-dispatch-api's DER curtailment trigger.

Board Spec

graph LR
    SOLAR["Solar Panel<br/>~20W 12V"] --> MPPT["BQ24650 MPPT<br/>+ 2x DMN4035L"]
    MPPT --> BAT["LiFePO4 4S<br/>~50Wh + BMS"]
    BAT --> BUCK["Buck<br/>5V 3A"]
    BUCK --> CM4["CM4 SoM<br/>DF40 x2"]
    BUCK --> BG["Quectel BG770A<br/>Cat-M1 LCC"]
    BUCK --> LDO["AP2112K<br/>3.3V LDO"]
    LDO --> ADC["ADS1115<br/>I2C 0x48"]
    LDO --> UV["SI1145<br/>I2C 0x60"]
    CM4 --> FLIR["FLIR Lepton 3.5<br/>SPI0 + GPIO25"]
    CM4 --> DHT["DHT22<br/>GPIO4"]
    CM4 --> ADC
    CM4 --> UV
    ADC --> RAIN["YL-83<br/>Analog 0-3.3V"]

    style SOLAR fill:#dc4,stroke:#333
    style MPPT fill:#a94,stroke:#333
    style BAT fill:#a94,stroke:#333
    style BUCK fill:#a94,stroke:#333
    style LDO fill:#a94,stroke:#333
    style CM4 fill:#4a9,stroke:#333,color:#fff
    style BG fill:#49a,stroke:#333,color:#fff
    style FLIR fill:#49a,stroke:#333,color:#fff
    style DHT fill:#94a,stroke:#333,color:#fff

CM4 Pinout

flowchart LR
classDef default fill:transparent,stroke:#333
classDef pwr fill:#4a9,stroke:#333,color:#fff
classDef spi fill:#49a,stroke:#333,color:#fff
classDef i2c fill:#94a,stroke:#333,color:#fff
classDef gpio fill:#a94,stroke:#333,color:#fff
classDef uart fill:#a49,stroke:#333,color:#fff
classDef usb fill:#669,stroke:#333,color:#fff

subgraph cm4 ["CM4 (DF40-100)"]
  p_5v["5V_IN"]
  p_sda["GPIO2 SDA1"]
  p_scl["GPIO3 SCL1"]
  p_g4["GPIO4"]
  p_g25["GPIO25"]
  p_mosi["GPIO10 MOSI"]
  p_miso["GPIO9 MISO"]
  p_sck["GPIO11 SCLK"]
  p_ce0["GPIO8 CE0"]
  p_txd["GPIO14 TXD"]
  p_rxd["GPIO15 RXD"]
  p_usb["USB2 D+/D-"]
end

Sensor Interfaces

Every sensor reading on this board maps to exactly one term in the IEEE 738 dynamic rating equation:

$$ I_{max} = \sqrt{\frac{q_c + q_r - q_s}{R_{ac}}} $$

Anemometer Variants

Single PCB + single firmware binary. Variant lives in the kit BOM — sensor, cable harness, PV panel, and battery differ per SKU. Both sensors speak NMEA 0183 ($..MWV) over RS-485, so the firmware driver is talker-agnostic.

Kit BOM

When to deploy which variant

Per-site SKU pick uses NREL WIND Toolkit climatology (or customer SCADA wx history when available). Threshold: fraction-of-year with V_w < 1 m/s perpendicular to conductor.

Fallback policy (both variants)

When the sensor reports void status, times out, or has a checksum/parse error, the driver returns None. The IEEE 738 layer collapses None → V_w = 0.0 → natural-convection-only ampacity = the conductor's static rating. Same conservative fallback used for the icing-fallback policy.

Variant power budget

Low-wind variant's 30 W / 100 Wh upgrade absorbs the WMT702's higher draw and restores both winter margin and 2-day autonomy.

Power Budget

The 3920 mA peak is a worst-case sum, not a supported operating point. The LMR33630 delivers 3.375 A with worst-case silicon, so a coincident CM4-boot + Lepton-shutter + modem-TX peak browns the rail out below the CM4's 4.75 V floor — firmware sequences those loads apart (ADR-017, derived in theory.ipynb §7 and asserted in sim/test_spice.py). The CM4 boot peak on its own holds the rail at ~4.95 V.

Daily energy with CM4-always-on idle + 1/min sensor wake + 1/15 min cellular TX: ~29 Wh/day (derived in theory.ipynb). A 50 Wh battery (90% DoD) gives ~1.6 days autonomy with no PV. A 20W panel at 2.5 sun-hours/day (winter Northeast US worst case) delivers ~45 Wh/day after MPPT η — 1.55x winter margin, 2.5x annual avg.

That margin assumes a 120 mA CM4 idle (tuned Pi OS Lite, headless). The CM4 datasheet §5.3 quotes ~400 mA typical idle; at that figure the budget is 62.6 Wh/day and the 20 W panel does not carry winter (0.72x). Idle current is the single measurement that most needs a bench check before committing to the panel size.

Environmental

Fabrication Pipeline

Fully scripted — no GUI step. KiCad's "Update PCB from Schematic" is GUI-only, so cad/drawing/sync_pcb.py does the same job from the SKiDL netlist: it rebuilds every footprint from the library and reassigns every pad net, which is what keeps the board honest about what the schematic says.

 1. uv run poe notebook         → theory.ipynb: power, signal integrity, 5V transients
 2. uv run poe build            → SKiDL netlist
 3. uv run poe schematic        → hierarchical .kicad_sch (one sheet per block)
 4. uv run poe validate-model   → ERC, 0 violations (exits non-zero otherwise)
 5. uv run poe sim / cover      → pytest: hand calcs + ngspice transients

 6. uv run poe layout-asm       → the whole board flow, in order:
      build       netlist from SKiDL
      sync-asm    footprints + pad nets  <- replaces the GUI "Update PCB from Schematic"
      place-asm   positions from cad/pcb_placement.yaml
      setup-asm   4-layer stack, design rules, net classes, GND + 5V planes
      fanout-asm  escape vias for the 0.4 mm connector, assigned before routing
      route-asm   Specctra DSN -> Freerouting -> SES import -> zone fill
      stitch-asm  vias from surface pads to their plane
      validate-asm DRC, 0 violations

    ┌──────────────────────────────────────────────────────┐
    │  HUMAN: review the render, adjust pcb_placement.yaml │
    └──────────────────────────────────────────────────────┘

 7. uv run poe generate-asm     → gerbers + drill + STEP + BOM + CPL

Board status

ERC is 0. DRC is clean of clearance, short, annular-ring, hole and courtyard errors — what is left is 7 silkscreen-overlap warnings and 2 open connections out of 457 pads, both of them ground pins on J5 (Hirose DF40, 0.4 mm pitch):

Both are redundant pins — the CM4 bonds its grounds internally — so what is missing is return-path quality at that corner of the connector, not a broken net. It is still a DRC error, so the gerbers in output/ stay a preview until it closes.

Why they are open. It is a fanout-capacity limit, not a search failure. A row of 0.6 mm escape vias needs 0.75 mm centre to centre, so on a 0.4 mm pad pitch only every other pin gets a via in the first row. The pins that miss out have to reach a second, deeper row — but two 0.6 mm vias 0.75 mm apart leave a 0.15 mm slot, and a 0.2 mm trace with 0.15 mm clearance needs 0.5 mm. Once the first row is populated the second row is unreachable. Via rows have to be assigned before any routing happens; a router that picks the nearest free site per pin always finishes one slot short.

cad/drawing/fanout.py does that assignment: it clears the connector's fanout band and alternates along each pad row, one pin into the inter-row gap, the next out the back, so same-side vias land 0.8 mm apart. It places all 39 escapes on J5 with zero clearance, short or drill violations — the geometry works.

What is not done is the rebuild. Run on a board that is already routed, the pass has to clear 223 tracks and vias to own its band, and escape_pins rebuilds only 23 of the 35 connections that leaves open — a net regression against the 2 here. Its place is before Freerouting, where a full-strength router does the reconnection, which is where poe layout-asm now calls it. That path has not been run end to end yet, so the board in this repo is still the pre-fanout one. Closing the last two means either that full regeneration, or 0.45 / 0.25 mm vias (JLCPCB advanced tier, and the 0.13 mm annular-ring rule would have to come down with them), or six layers.

Toolchain

KiCad 10 required. The board is KiCad 10 format (20260206); on KiCad 9 poe validate-asm says DRC could not run rather than passing silently. The CI runner gets 10.x from Flatpak. The schematic is format 20250114, which both versions read.

ERC is a blocking gate in CI. DRC runs and reports but does not gate yet — the two open ground pins above are real errors; the || echo comes off once they are closed.

Layer Stack

4-layer, 1.6 mm FR4, controlled impedance (ADR-016). Applied by cad/drawing/board_setup.py, so a regenerated board always has the same stack.

Signals are confined to F.Cu / B.Cu: the router is told the inner layers are power type, so nothing slices a plane. VBAT, 3V3 and 3V8 run as 0.6 mm traces (power net class), necked to 0.25/0.2 mm where an escape has to squeeze past a 0.4 mm-pitch pad. Every via is 0.6/0.3 mm: a 0.5/0.25 mm via would ease the DF40 fanout but leaves a 0.125 mm annular ring, under the 0.13 mm rule.

Unbroken ground plane under the Lepton is critical — SPI runs at 20 MHz and the thermal imager is noise-sensitive. USB2.0 to the BG770A is differential-routed at 90Ω matched impedance with GND directly below. Analog traces from YL-83 to ADS1115 are guard-ringed on F.Cu. Cellular antenna is 50Ω microstrip to a u.FL connector.

Project Structure

├── pyproject.toml              # Dependencies and build config
├── theory.ipynb                # Power, signal integrity, 5V transient derivations
├── sim/
│   ├── constants.py            # Sourced part parameters (datasheet + edition cited)
│   ├── model.py                # Closed-form: buck current, energy, I2C/SPI/USB
│   ├── spice_bank.py           # Shared 5V output capacitor bank
│   ├── spice_ripple.py         # ngspice: open-loop switching ripple (Eq 7)
│   ├── spice_load_step.py      # ngspice: averaged current-mode boot-peak droop
│   ├── test_run.py             # Assert closed-form results match theory.ipynb
│   └── test_spice.py           # Assert ngspice results match theory.ipynb §7
├── cad/
│   ├── netlist/
│   │   ├── model.py            # Top-level SKiDL circuit (main carrier)
│   │   ├── charger.py          # Solar input + BQ24650 MPPT charger (ADR-015)
│   │   ├── power.py            # LMR33630 5V buck + AP2112K / LP5907 LDOs
│   │   ├── som.py              # CM4 DF40 connector + decoupling
│   │   ├── cellular.py         # BG770A + SIM holder + u.FL
│   │   ├── sensors.py          # FLIR (FFC), DHT22, SI1145, ADS1115, YL-83
│   │   ├── anemometer.py       # RS-485 wind sensor port (SKU-agnostic)
│   │   ├── connectors.py       # Battery + debug + USB-C commissioning
│   │   └── lepton_daughter.py  # Daughterboard SKiDL (Molex socket + FFC)
│   ├── schematic/              # Hierarchical .kicad_sch generator
│   │   ├── schematic.py        # Netlist parse, block classification, placement
│   │   ├── multi_sheet.py      # Per-block child sheets, power symbols, PWR_FLAG