

SYSC4907 REV2
Ideas for a university project
- Size
- 57 × 35 mm
- Copper layers
- 4
- Thickness
- 1.6 mm
- Parts
- 122
- Nets
- 155
- Pads
- 479
- Tracks, vias
- 1,274, 82
- Pours
- 2
- Routed
- Yes
- KiCad
- KiCad 5 (file 20171130)
- Created
- 12 May 2020
- Updated
- 14 Apr 2021
Overview
SYSC4907 REV2 is an open-source printed circuit board by MorganJamesSmith, from the MorganJamesSmith/BioSenseWearable repository on GitHub, published under the BSD-3-Clause licence. It is a 4-layer board of 57 × 35 mm with 122 parts on 155 nets, routed with 1,274 tracks and 82 vias.
It is built around the BMD-340-A-R, BME680 and MAX86150EFF+T, with the MCP1640B-I/MC, SI1133-AA00-GM and ZTP-148SR among its other parts. Its parts include 34 capacitors, 31 resistors, 15 ICs, 6 transistors and 4 connectors.
Main components
12BMD-340-A-R
LGA-60LGA-60 Bluetooth Modules ROHSu-bloxBluetooth ModulesBME680
LGA-8-40℃~+85℃ 0.12hpa 0.6hpa 1.3pa/K 1.71V~3.6V 150nA 30Kpa~1.1bar I2C、SPI Temperature Sensor LGA-8 Pressure Sensors ROHSBosch SensortecPressure SensorsMAX86150EFF+T
LGA-22(3.3x5.6x0.5)-40℃~+85℃ Integrated ambient light cancellation (ALC)、With proximity detection function、Supports ECG measurement、Supports simultaneous PPG and ECG measurement LGA-22(3.3x5.6x0.5) Heart Rate Sensors ROHSMaxim Integrated (Analog Devices)Heart Rate SensorsMCP1640B-I/MC
DFN-8(2x3)-40℃~+125℃@(TJ) 1 19uA 2V~5.5V 350mA 500kHz 800mV~5.5V Adjustable Boost Boost Built-in Yes DFN-8(2x3) DC-DC Converters ROHSMicrochip TechnologyDC-DC ConvertersSI1133-AA00-GM
DFN-10(2x2)-40℃~+85℃ 1.62V~3.6V Low power/sleep mode、Spectral correction/filtering、High dynamic range measurement、Interrupt/event trigger DFN-10(2x2) Ambient Light Sensors ROHSSilicon LabsAmbient Light SensorsZTP-148SR
TO-46-4TO-46-4 Temperature SensorsAmphenolTemperature SensorsICM-20948
QFN-24(3x3)-40℃~+85℃ 0.5KB 1.71V~3.6V 16bit 8uA Accelerometer Gyroscope SPI、I2C X,Y,Z X,Y,Z ±16g ±2000dps QFN-24(3x3) Accelerometers ROHSTDK InvenSenseAccelerometersMCP73871-2CCI/ML
QFN-20(4x4)-40℃~+85℃ 1 1.1A 28uA 4.1V~6V 4.2V Charging IC Support Support QFN-20(4x4) Battery Management ROHSMicrochip TechnologyBattery ManagementTXB0104PW
TSSOP-14-40℃~+85℃ 1 1.2V~3.6V 1.65V~5.5V 100Mbps 4 Auto Direction Detection Bidirectional CMOS CMOS Tri-State TSSOP-14 Translators, Level Shifters ROHSTexas InstrumentsTranslators, Level ShiftersUSBLC6-2SC6
SOT-23-60.35pF、0.8pF 100nA 150W@8/20us 15V 2 5V 6A@8/20us 6V ESD SOT-23-6 ESD and Surge Protection (TVS/ESD) ROHSUMWESD And Surge Protection (TVS/ESD)DMG1012T
SOT-523-55℃~+150℃ 1 N-channel 1V 20V 280mW 300mΩ@4.5V、400mΩ@2.5V、500mΩ@1.8V 5.37pF 60.67pF 630mA 736.6pC@4.5V 9.68pF SOT-523 MOSFETs ROHSDiodes IncorporatedMOSFETsDMG1013T
SOT-523-55℃~+150℃ 1 P-Channel 12.07pF 20V 270mW 460mA 500mV 580pC@4.5V 59.76pF 6.36pF 700mΩ@4.5V SOT-523 MOSFETs ROHSDiodes IncorporatedMOSFETs
README
readme.mdP21
Building the Project
The project can be built either with the Makefile in the gcc folder in order to use the arm-none-eabi-gcc toolchain or with the Segger Embedded Studio project in the ses folder.
The SES project and Makefile are both configured to build the project for the
nRF52840 Dongle (PCA10059). The Makefile can also be used to build the project
for the nRF5284-DK (PCA10056) by setting an additional variable when running
make (make BOARD=BOARD_PCA10056).
Programming the Board
If using the Makefile, the board can be programmed through gdb with
make debug, which will start and OpenOCD instance and launch a GDB session
conneted to it. To debug the board with a Black Magic Probe, use the GDB_FILE
variable to specify the probe's serial port. For example,
make debug GDB_FILE=/dev/ttyACM0.
Licensing
The folder nRF5_SDK_17.0.0 is third-party code subject to its own licenses.
All other intellectual property in this repository (code, hardware designs, documentation, etc.) is provided under the BSD-3 clause license (SPDX: BSD-3-Clause https://spdx.org/licenses/BSD-3-Clause.html).
Parts
122| Qty | Value | Footprint | References |
|---|---|---|---|
| 16 | 0.1uF | Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C202, C203, C306, C308, C401, C402, C403, C405, C407, C408, C410, C416, C417, C419, C420, C421 |
| 11 | 100K | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R203, R302, R304, R307, R309, R310, R312, R313, R314, R315, R318 |
| 10 | 10uF | Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C201, C301, C302, C303, C305, C307, C310, C311, C312, C412 |
| 6 | 10K | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R303, R305, R311, R403, R404, R405 |
| 6 | Bridged | Jumper:SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm | JP301, JP303, JP305, JP306, JP307, JP308 |
| 5 | DMG1012T | Package_TO_SOT_SMD:SOT-523 | Q201, Q202, Q203, Q301, Q302 |
| 4 | 1uF | Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C413, C414, C415, C418 |
| 2 | 2.2K | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R201, R202 |
| 2 | 2.2uH | Inductor_SMD:L_Taiyo-Yuden_NR-30xx_HandSoldering | L301, L302 |
| 2 | 22pF | Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C304, C309 |
| 2 | AP3401KT | Package_TO_SOT_SMD:TSOT-23-6 | U302, U303 |
| 2 | NSR0530HT1G | Diode_SMD:D_SOD-323_HandSoldering | D301, D302 |
| 2 | Open | Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm | JP302, JP304 |
| 1 | 0.01uF | Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C411 |
| 1 | 1.8V_PG | TestPoint:TestPoint_Pad_D1.0mm | TP305 |
| 1 | 150K | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R317 |
| 1 | 1K | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R401 |
| 1 | 270K | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R301 |
| 1 | 2K | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R306 |
| 1 | 3.3V_PG | TestPoint:TestPoint_Pad_D1.0mm | TP304 |
| 1 | 30 | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R204 |
| 1 | 300K | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R316 |
| 1 | 309K | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R320 |
| 1 | 4.7 | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R402 |
| 1 | 4.7uH | Inductor_SMD:L_Taiyo-Yuden_NR-30xx_HandSoldering | L303 |
| 1 | 4.7µF | Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C404 |
| 1 | 430K | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R308 |
| 1 | 62 | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R205 |
| 1 | 82 | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R206 |
| 1 | 976K | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R319 |
| 1 | AD8293G80 | Package_TO_SOT_SMD:SOT-23-8 | U403 |
| 1 | BMD-340 | SYSC4907:BMD-340-A-R | U202 |
| 1 | BME680 | Package_LGA:Bosch_LGA-8_3x3mm_P0.8mm_ClockwisePinNumbering | U405 |
| 1 | Battery Connector | Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical | J301 |
| 1 | CLX6F-FKC | SYSC4907:CLX6F-FKC | U204 |
| 1 | DMG1013T | Package_TO_SOT_SMD:SOT-523 | Q303 |
| 1 | HEART_INT | Jumper:SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm | JP209 |
| 1 | I2C_SCL | Jumper:SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm | JP201 |
| 1 | I2C_SDA | Jumper:SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm | JP202 |
| 1 | ICM-20948 | Package_DFN_QFN:QFN-24-1EP_3x3mm_P0.4mm_EP1.75x1.6mm | U406 |
| 1 | IMU_CS | Jumper:SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm | JP206 |
| 1 | IMU_INT | Jumper:SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm | JP207 |
| 1 | IMU_MISO | Jumper:SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm | JP205 |
| 1 | IMU_MOSI | Jumper:SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm | JP204 |
| 1 | IMU_SCK | Jumper:SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm | JP203 |
| 1 | MAX86150EFF+T | SYSC4907:MAX86150EFF+T | U402 |
| 1 | MCP1501 | Package_TO_SOT_SMD:SOT-23-6 | U401 |
| 1 | MCP1640B | Package_TO_SOT_SMD:SOT-23-6 | U304 |
| 1 | MCP73871-2CC | Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm | U301 |
| 1 | Micro_SD_Card_Det_Hirose_DM3AT | Connector_Card:microSD_HC_Hirose_DM3AT-SF-PEJM5 | J203 |
| 1 | PG | TestPoint:TestPoint_Pad_D1.0mm | TP301 |
| 1 | SD_CLK | Jumper:SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm | JP212 |
| 1 | SD_CS | Jumper:SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm | JP210 |
| 1 | SD_MISO | Jumper:SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm | JP213 |
| 1 | SD_MOSI | Jumper:SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm | JP211 |
| 1 | SI1133-AA00-GM | SYSC4907:SI1133-AA00-GM | U407 |
| 1 | SPST | SYSC4907:EVQ-P7C01P | SW301 |
| 1 | ST1 | TestPoint:TestPoint_Pad_D1.0mm | TP302 |
| 1 | ST2 | TestPoint:TestPoint_Pad_D1.0mm | TP303 |
| 1 | SWD | Connector_PinHeader_1.27mm:PinHeader_2x05_P1.27mm_Vertical_SMD | J202 |
| 1 | TXB0104PW | Package_SO:TSSOP-14_4.4x5mm_P0.65mm | U203 |
| 1 | USB4110-GF-A | SYSC4907:USB4110-GF-A | J201 |
| 1 | USBLC6-2SC6 | Package_TO_SOT_SMD:SOT-23-6 | U201 |
| 1 | UV_INT | Jumper:SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm | JP208 |
| 1 | ZTP-148SR | SYSC4907:ZTP-148SR | U404 |
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Questions
How big is the SYSC4907 REV2 PCB?
It measures 57 × 35 mm and has 4 copper layers, 1.6 mm thick.
What parts does the SYSC4907 REV2 use?
122 parts, built around the BMD-340-A-R, BME680, MAX86150EFF+T and MCP1640B-I/MC. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the SYSC4907 REV2 KiCad files?
From the MorganJamesSmith/BioSenseWearable repository on GitHub, at the commit this page was made from: the board is hardware/SYSC4907_REV2/SYSC4907_REV2.kicad_pcb. PCBKit opens the board in the browser, with nothing to install.
Can I use the SYSC4907 REV2 design in my own project?
Its repository publishes it under the BSD-3-Clause licence: you may reuse it on that licence's terms (keep the author's notice, and for a copyleft licence share your changes alike).