2 layers114 × 62 mm
4 layers100 × 100 mm
DataConv
Kreyl/BmstuDataConv- Size
- 100 × 100 mm
- Copper layers
- 4
- Thickness
- 1.6 mm
- Parts
- 108
- Nets
- 92
- Pads
- 388
- Tracks, vias
- 0, 0
- Routed
- Not yet
- KiCad
- KiCad 5 (file 20171130)
- Created
- 25 Feb 2019
- Updated
- 11 Mar 2019
Overview
DataConv is an open-source printed circuit board by Kreyl, from the Kreyl/BmstuDataConv repository on GitHub. It is a 4-layer board of 100 × 100 mm with 108 parts on 92 nets.
It is built around the MAX4453ESA+, USB3300-EZK and USBLC6-4, with the IT-1187 and 74LVX4245MTCX among its other parts. Its parts include 36 capacitors, 29 resistors, 12 diodes, 3 inductors and 2 switches. It belongs with the STM32 boards of this library.
Main components
5
MAX4453ESA+
SOIC-8-40℃~+85℃ 100dB 12mV 15nV/√Hz@10kHz 2 200MHz 22mA 620uA 7uV/℃ 800nA 95V/us Built-in compensation Rail-to-rail output SOIC-8 Operational Amplifier ROHSMaxim Integrated (Analog Devices)Operational Amplifier
USB3300-EZK
QFN-32-EP(5x5)-40℃~+85℃ 3V~3.6V 54.7mA 83uA Controller USB 2.0 QFN-32-EP(5x5) USB Converters ROHSMicrochip TechnologyUSB ConvertersUSBLC6-4
UncategorisedSTMicroelectronicsIT-1187
SMD-4_L5.2-W5.2-P3.50-LS6.5SMD-4_L5.2-W5.2-P3.50-LS6.5 SMT ROHSJLCPCB AssemblyUncategorised
74LVX4245MTCX
TSSOP-24-40℃~+85℃ 1 2.7V~3.6V 4.5V~5.5V 8 Bidirectional Tri-State TSSOP-24 Translators, Level Shifters ROHSonsemiTranslators, Level Shifters
Parts
108| Qty | Value | Footprint | References |
|---|---|---|---|
| 15 | 0.1u | Capacitors:CAP_0603 | C3, C5, C8, C10, C11, C16, C18, C20, C22, C26, C27, C28, C29, C30, C31 |
| 14 | 1k | Resistors:RES_0603 | R4, R7, R8, R9, R10, R11, R12, R13, R14, R15, R16, R17, R20, R26 |
| 10 | LED | LEDs:LED_0603 | D1, D2, D3, D4, D5, D6, D7, D8, D9, D10 |
| 6 | 10k | Resistors:RES_0603 | R2, R5, R21, R27, R28, R29 |
| 5 | 10u | Capacitors:CAP_0603 | C1, C25, C34, C35, C36 |
| 5 | 1u | Capacitors:CAP_0603 | C6, C12, C17, C19, C24 |
| 4 | 18pF | Capacitors:CAP_0603 | C2, C7, C32, C33 |
| 4 | HOLE_METALLED | PCB:Hole3_5_out6mm | HOLE1, HOLE2, HOLE3, HOLE4 |
| 3 | 100R | Resistors:RES_0603 | R23, R24, R25 |
| 3 | CONN_1 | Connectors:PLS-1Rnd | XL4, XL5, XL7 |
| 2 | 100k | Resistors:RES_0603 | R6, R22 |
| 2 | 10n | Capacitors:CAP_0603 | C4, C13 |
| 2 | 1M | Resistors:RES_0603 | R1, R19 |
| 2 | 2.2u | Capacitors:CAP_0603 | C14, C15 |
| 2 | 4.7u | Capacitors:CAP_0603 | C21, C23 |
| 2 | AudioJackSimple | Connectors:AUDIO_CKX3_5_30 | XL9, XL10 |
| 2 | BLM18EG221SN1D | Inductors:IND_0603 | L1, L3 |
| 2 | BNC | Connectors:BNC2 | XW1, XW2 |
| 2 | CONN_6 | Connectors:PLS-6 | XL1, XL8 |
| 2 | IT-1187 | BtnsSwitches:BTN_4x4_SMD | SW1, SW2 |
| 2 | MCP1700 | SOT:SOT23-3A | DA1, DA2 |
| 2 | PESD3V3 | Diodes:SOD323 | D11, D12 |
| 1 | 12 MHz | Quartz:03225C4 | XTAL1 |
| 1 | 12k | Resistors:RES_0603 | R18 |
| 1 | 24MHz | Quartz:03225C4 | XTAL2 |
| 1 | 2R0 | Resistors:RES_0603 | R3 |
| 1 | 2u2 | Capacitors:CAP_0603 | C9 |
| 1 | 74LVX4245MTCX | SO_DIL_TSSOP:TSSOP24_169_P065 | DD3 |
| 1 | 90R | Inductors:DLW21SN | L2 |
| 1 | CONN_10 | Connectors:PLS-10 | XL3 |
| 1 | CONN_3 | Connectors:PLS-3 | XL6 |
| 1 | LED_5050 | LEDs:LED_5050 | Q1 |
| 1 | MAX4453 | SOT:SOT23-8 | DA3 |
| 1 | STM32F405RX-64 | LQFP_TQFP:LQFP64 | DD1 |
| 1 | USB3300 | QFN_DFN:QFN-32_EP_5x5_Pitch0.5mm | DD2 |
| 1 | USBLC6 | SOT:SOT23-6 | U1 |
| 1 | USB_MICRO | Connectors:USBmicro_MOLEX_1050170001 | XL2 |
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Questions
How big is the DataConv PCB?
It measures 100 × 100 mm and has 4 copper layers, 1.6 mm thick.
What parts does the DataConv use?
108 parts, built around the MAX4453ESA+, USB3300-EZK, USBLC6-4 and IT-1187. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the DataConv KiCad files?
From the Kreyl/BmstuDataConv repository on GitHub, at the commit this page was made from: the board is DataConv_hw/DataConv.kicad_pcb. PCBKit opens the board in the browser, with nothing to install.
Can I use the DataConv design in my own project?
Its repository states no licence, so its author keeps all rights: ask Kreyl before reusing the design.