2 layers72 × 72 mm
2 layers90 × 90 mm
LoRa MuPr VAF4751
FTHGL/LoRa_MuPr-VAF4751Multiprotocol LoRa Mesh
- Size
- 90 × 90 mm
- Copper layers
- 2
- Thickness
- 0.89 mm
- Parts
- 81
- Nets
- 124
- Pads
- 402
- Tracks, vias
- 649, 836
- Pours
- 8
- Routed
- Yes
- KiCad
- KiCad 7 (file 20221018)
- Created
- 23 Dec 2023
- Updated
- 12 Jan 2026
Overview
LoRa MuPr VAF4751 is an open-source printed circuit board by FTHGL, from the FTHGL/LoRa_MuPr-VAF4751 repository on GitHub. It is a 2-layer board of 90 × 90 mm with 81 parts on 124 nets, routed with 649 tracks and 836 vias.
It is built around the RN2483A-I/RM105, SIM800C and AMS1117-3.3, with the MIC29302WU, BC337 and ESDA6V1-5SC6 among its other parts. Its parts include 26 capacitors, 22 resistors, 8 ICs, 7 connectors and 5 diodes. It belongs with the radio and wireless boards and the STM32 boards of this library.
Main components
6
RN2483A-I/RM105
SMD,26.7x17.8mm-146dBm -40℃~+85℃ 14dBm 2.1V~3.6V 38.9mA 433MHz、868MHz FSK、GFSK SPI、UART、I2C SMD,26.7x17.8mm LoRa Modules ROHSMicrochip TechnologyLoRa Modules
SIM800C
SMD,17.6x15.7mm3.4V~4.4V CMUX功能、噪声抑制功能、USSD功能 GPRS、GSM UART、GPIO、ADC、SIM card SMD,17.6x15.7mm 2G/3G/4G/5G Modules ROHSSIMCom Wireless Solutions2G/3G/4G/5G Modules
AMS1117-3.3
SOT-223-40℃~+125℃ 0.003%Vout 1 1.1V@(800mA) 15V 1A 3.3V 5mA 72dB@(120Hz) Fixed Over Current Protection、Short Circuit Protection、Thermal shutdown Positive SOT-223 Voltage Regulators - Linear, Low Drop Out (LDO) Regulators ROHSAdvanced Monolithic SystemsVoltage Regulators - Linear, Low Drop Out (LDO) Regulators
MIC29302WU
TO-263-5-40℃~+125℃@(Tj) 1 26V 370mV@(3A) 37mA 3A 400uVrms、260uVrms Adjustable Over Current Protection、Over Temperature Protection、Reverse connection protection、Enable Positive TO-263-5 Voltage Regulators - Linear, Low Drop Out (LDO) Regulators ROHSTECH PUBLICVoltage Regulators - Linear, Low Drop Out (LDO) Regulators
BC337
TO-92-31 NPN 100 100MHz 100nA 45V 5V 625mW 700mV 800mA NPN TO-92-3 Bipolar (BJT) ROHSFoshan Blue Rocket ElecBipolar (BJT)
ESDA6V1-5SC6
SOT-23-6100nA 10A@8/20us 11V、14V 140W@8/20us 5V 60pF 9V ESD IEC 61000-4-2、IEC 61000-4-4 SOT-23-6 ESD and Surge Protection (TVS/ESD) ROHSTECH PUBLICESD And Surge Protection (TVS/ESD)
README
README.mdMulti-Protocol Hybrid Wireless Communication System (LoRa-GSM-DTMF)
An STM32-based hybrid communication platform designed for seamless data and command transmission in environments with limited or no internet infrastructure (disaster management, rural IoT, remote monitoring or etc.). This system integrates low-power LoRa technology with GSM coverage and DTMF control into a single modular architecture.
Technical Architecture
The system utilizes a hybrid topology consisting of a Master node and multiple Slave nodes:
- Master Node: Features an STM32F103C8T6 MCU, SIM800C GSM module, and RN2483A LoRa module. It acts as the network gateway and central authority.
- Slave Nodes: Composed of STM32F103C8T6 and RN2483A modules. These nodes collect sensor data and transmit it to the Master via LoRa.
- Hybrid Topology: Operates in a "Star" configuration under normal conditions, with a dynamic shift to a "Mesh" structure using nodes as opportunistic relays when direct access is obstructed.
Key Features
- Protocol Bridging: Real-time translation of commands received via SMS or Command (DTMF) into LoRa packets for end-node execution.
- Fault Tolerance: Dynamic routing mechanism allowing slave nodes to reach the master through neighboring nodes if the direct link is lost.
- Critical Control (DTMF): Infrastructure-independent device management via voice calls and DTMF tones, bypassing the need for internet or SMS data lines.
- RF Optimization: Impedance-controlled transmission lines (50 Ω) and custom antenna structures optimized for 868 MHz and 1.8 GHz bands.
Hardware Specifications
- MCU: STM32F103C8T6 (ARM Cortex-M3).
- RF Modules: Microchip RN2483A (LoRa), SIMCom SIM800C (GSM/GPRS/DTMF).
- Antenna Design: Integrated IFA (Inverted-F Antenna) for 868 MHz and optimized microstrip structures for 1.8 GHz.
- PCB Design: High RF integrity with dedicated ground planes and impedance-matched traces.
Software Flow
The firmware is modular, managing cross-protocol data flow and task scheduling:
- Ingress: Command reception and validation via GSM (SMS/DTMF).
- Routing: Identification of the target
node_idand LoRa packet encapsulation. - Transmission: Delivery of data to the slave node and reporting the response (ACK/Data) back to the user via GSM.
This project was developed as a Graduation Project at Konya Technical University, Department of Electrical and Electronics Engineering.
Parts
81| Qty | Value | Footprint | References |
|---|---|---|---|
| 9 | 100nF | Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C3, C4, C13, C14, C15, C16, C20, C22, C23 |
| 5 | 1k | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R1, R5, R6, R10, R11 |
| 3 | 22pF | Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C17, C18, C24 |
| 3 | 51R | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R18, R19, R20 |
| 3 | LED | LED_SMD:LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder | D2, D4, D5 |
| 2 | 10uF | Capacitor_Tantalum_SMD:CP_EIA-3216-18_Kemet-A_Pad1.58x1.35mm_HandSolder | C1, C2 |
| 2 | 10uF | Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C6, C12 |
| 2 | 1K | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R15, R16 |
| 2 | 1k5 | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R13, R14 |
| 2 | 1uF | Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C11, C19 |
| 2 | 4.7k | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R7, R8 |
| 2 | 50R | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R12, R22 |
| 2 | Conn_01x13 | Connector_PinHeader_2.00mm:PinHeader_1x13_P2.00mm_Vertical | J10, J11 |
| 2 | LOGO | user_footprint:fthgl15075 | G***, G*** |
| 2 | ~ | _F_Library:LINX_CONSMA001-SMD | U7, U8 |
| 1 | 1.8pF | Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C26 |
| 1 | 100k | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R2 |
| 1 | 100uF | Capacitor_Tantalum_SMD:CP_EIA-3216-18_Kemet-A_Pad1.58x1.35mm_HandSolder | C5 |
| 1 | 100uF | Capacitor_SMD:CP_Elec_8x10 | C9 |
| 1 | 10k | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R21 |
| 1 | 10pF | Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C8 |
| 1 | 1M | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R9 |
| 1 | 27nH | Inductor_SMD:L_0603_1608Metric | L1 |
| 1 | 3.9nH | Inductor_SMD:L_0603_1608Metric_Pad1.05x0.95mm_HandSolder | L3 |
| 1 | 330uF | Capacitor_SMD:CP_Elec_8x10 | C10 |
| 1 | 33pF | Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C7 |
| 1 | 4.7nH | Inductor_SMD:L_0603_1608Metric_Pad1.05x0.95mm_HandSolder | L2 |
| 1 | 43k | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R3 |
| 1 | 470R | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R4 |
| 1 | 4u7F | Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C21 |
| 1 | 5.1V/500mW | Diode_SMD:D_SOD-123 | D3 |
| 1 | 5.6K | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R17 |
| 1 | 9.1pF | Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder | C25 |
| 1 | AMS1117-3.3 | Package_TO_SOT_SMD:SOT-223-3_TabPin2 | U1 |
| 1 | BC337 | Package_TO_SOT_SMD:TSOT-23 | Q1 |
| 1 | Conn_01x04 | Connector_PinHeader_2.00mm:PinHeader_1x04_P2.00mm_Vertical | J2 |
| 1 | Conn_01x06 | Connector_PinHeader_2.00mm:PinHeader_1x06_P2.00mm_Vertical | J5 |
| 1 | Conn_01x08 | Connector_PinHeader_1.27mm:PinHeader_1x08_P1.27mm_Vertical | J6 |
| 1 | Conn_02x03_Counter_Clockwise | Connector_PinHeader_2.54mm:PinHeader_2x03_P2.54mm_Vertical | J3 |
| 1 | Crystall | Crystal:Crystal_SMD_HC49-SD | Y1 |
| 1 | ESDA6V1-5SC6 | Package_TO_SOT_SMD:SOT-23-6 | D1 |
| 1 | MIC29302WU | Package_TO_SOT_SMD:TO-263-5_TabPin3 | U2 |
| 1 | RN2483A-I/RM105 | user_footprint:MICROCHIP_RN2483 | U5 |
| 1 | SIM800C | user_footprint:SİM800C | U4 |
| 1 | SIM_Card | user_footprint:L-KLS1-SIM-066 | J1 |
| 1 | STM32F103C8Tx | Package_QFP:LQFP-48_7x7mm_P0.5mm | U3 |
| 1 | SW_Push | Button_Switch_SMD:SW_SPST_B3U-1000P | SW1 |
| 1 | USB_micro-B_amphenol | user_footprint:USB_micro-B_amphenol_101181994_horizontal | U6 |
The 76 most common of 81 parts.
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Questions
How big is the LoRa MuPr VAF4751 PCB?
It measures 90 × 90 mm and has 2 copper layers, 0.89 mm thick.
What parts does the LoRa MuPr VAF4751 use?
81 parts, built around the RN2483A-I/RM105, SIM800C, AMS1117-3.3 and MIC29302WU. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the LoRa MuPr VAF4751 KiCad files?
From the FTHGL/LoRa_MuPr-VAF4751 repository on GitHub, at the commit this page was made from: the board is LoRa_MuPr-VAF4751/LoRaMuPr-VAF5147_Lora_GSM/LoRa_MuPr-VAF4751.kicad_pcb and its schematic LoRa_MuPr-VAF4751/LoRaMuPr-VAF5147_Lora/LoRa.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the LoRa MuPr VAF4751 design in my own project?
Its repository states no licence, so its author keeps all rights: ask FTHGL before reusing the design.