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2 layers45 × 45 mmWatch, the printed circuit board in 3D

This is a demo board to showcase development with both the BlystL15 (based on the nrf54L15) and the IOComposer AI from I-Syst.inc.

Size
45 × 45 mm
Copper layers
2
Thickness
1.6 mm
Parts
47
Nets
71
Pads
225
Tracks, vias
652, 111
Pours
2
Routed
Yes
KiCad
KiCad 10.0 (file 20260206)
Created
13 Mar 2026
Updated
17 Jun 2026

Overview

Watch is an open-source printed circuit board by DINDIN2007, from the DINDIN2007/Blystwatch repository on GitHub. It is a 2-layer board of 45 × 45 mm with 47 parts on 71 nets, routed with 652 tracks and 111 vias.

It is built around the MAX30102EFD+T, OPT3001DNPRQ1 and TMP117AIDRVR, with the W25Q80EWSNIG, BMI323 and NPM1304-QEAA-R7 among its other parts. Its parts include 21 capacitors, 6 ICs, 4 resistors, 4 connectors and 3 switches. It belongs with the wearables boards of this library.

Main components

12

README

Watch/README.md

Smart-Watch-L15: Hardware Design

This directory contains the hardware design files, schematics, and board layouts for the Smart-Watch-L15. This device serves as a highly integrated demo board to showcase advanced wearable development utilizing the BlystL15 module (based on the Nordic nRF54L15) and the IOComposer AI from I-Syst Inc.

This prototype design emphasizes ultra-low power consumption, clinical-grade sensor accuracy, and a high-density HDI (High-Density Interconnect) layout suitable for a modern smartwatch form factor. For future improvements to the design, a proper industrial standard touchscreen display would elevate this design to be more "finished".


⚙️ Core Components: Uses & Constraints

The smartwatch PCB integrates several specialized ICs to handle processing, power management, and biometric sensing. Here is a breakdown of the primary components, their roles, and specific hardware design constraints.

1. Main MCU: BlystL15 (Nordic nRF54L15)

  • Use: Acts as the central processing unit and Bluetooth Low Energy (BLE) radio. It also utilizes a built-in NFC-A tag peripheral for optional NFC extensions.
  • Constraints: Requires strict adherence to RF keep-out zone to maintain antenna efficiency. Because smartwatch batteries are small, the firmware will heavily relies on deep sleep modes, waking only via hardware interrupts from the sensors.

2. Power Management: Nordic nPM1304 (PMIC)

  • Use: Manages battery charging and system power. It utilizes built-in buck converters to supply stable 1.8V (logic) and 3.3V (LED/Sensor) rails.
  • Constraints: Requires robust power routing. For 0.5mm power traces, via stitching (multiple 0.6mm/0.3mm vias) is used when changing layers to drop electrical resistance and parasitic inductance.

3. Temperature Sensor: Texas Instruments TMP117

  • Use: It operates autonomously to monitor temperature and triggers a hardware interrupt (via the ALERT pin) if a threshold (e.g., a fever) is crossed, saving significant MCU power.
  • Constraints: Requires strict local decoupling (0.1µF capacitor directly on the V+ pin). The ALERT pin requires a dedicated pull-up resistor and the TMP117 is placed far from the hot PMIC modules to reduce noises.

4. Heart Rate & SpO2 Sensor: Analog Devices MAX30102

  • Use: An integrated pulse oximetry and heart-rate monitor module containing internal Red/IR LEDs and photodetectors.
  • Constraints: This 14-pin optical module requires a split power supply: 1.8V for internal logic and a separate 3.3V line capable of handling the high current spikes of the internal LEDs.

5. Ambient Light Sensor: Texas Instruments OPT3001-Q1

  • Use: Measures visible light intensity to match the human eye's. This allows the watch to adjust screen brightness accurately, even under dark glass aesthetics.
  • Constraints: Highly sensitive to secondary optical reflections. The PCB layout must keep structural components away from the sensor's field of view (ideally placing bulky components on the opposite side of the PCB).

6. Storage: Winbond W25Q80EW (8M-bit Serial Flash)

  • Use: 1.8V ultra-low-power flash memory used for local data logging (storing offline biometric data) and copying firmware to RAM.
  • Constraints: Must share the SPI bus efficiently and requires standard high-speed trace routing constraints to maintain signal integrity during fast read/write operations.

7. LSM6DSV80XTR 6-Axis IMU & QVAR Electrodes (Swipe Interface)

  • Use: The IMU handles motion tracking (steps, wrist-tilt wake), while QVAR technology provides a capacitive swipe interface directly on the PCB.
  • Constraints: The QVAR electrode requires absolute isolation. The PCB layer directly beneath the QVAR pad must be completely voided of copper pours (both ground and power) and signal traces to prevent parasitic capacitance. High-speed digital lines (like $I^2C$) are routed far away from this zone.

📐 Hardware Design Gallery

(The following screenshots highlight the routing, schematic logic, and physical form factor of the Smart-Watch-L15).

Schematics

The system is divided into logical blocks to isolate power, sensing, and processing.

MCU & Radio Matching Fig 1: BlystL15 MCU.

Power Management Fig 2: nPM1304 PMIC, Battery and Dock Connectors.

Biometric Sensors Fig 3: Sensors including the LSM6DSV80X (6-axis motion sensor), MAX30102 (Pulse Oximeter and Heart Rate), TMP117 (Temperature Sensor), and OPT3001-Q1 (Light Sensor).

Digital & Interfaces Fig 4: Flash memory, Configurable Buttons, OLED Connectors and Expansion Header

PCB Layout

PCB Routing Fig 5: Top-down view of the routed PCB, showcasing the dense component placement and carefully voided QVAR keep-out zones.

3D Renders

Final physical visualization of the assembled board to be imported in SolidWorks for the design of the Watch's Case.

3D Render Top
Fig 6: 3D Render (Top view) showing the sensor array and screen interface footprint.

3D Render Bottom
Fig 7: 3D Render (Bottom view) showing the BlystL15 module and exposed charging/programming test pads.

Parts

47
QtyValueFootprintReferences
80.1μFCapacitor_SMD:C_0402_1005Metric_Pad0.74x0.62mm_HandSolderC6, C8, C9, C12, C13, C14, C15, C19
410nFCapacitor_SMD:C_0402_1005Metric_Pad0.74x0.62mm_HandSolderC1, C16, C17, C18
410μFCapacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolderC4, C5, C7, C11
3SW_PushButton_Switch_SMD:SW_Push_1P1T-MP_NO_Horizontal_Alps_SKRTLAE010SW1, SW2, SW3
21.0µHInductor_SMD:L_0805_2012MetricL1, L2
24.7kΩResistor_SMD:R_0402_1005MetricR1, R2
24.7μFCapacitor_SMD:C_0402_1005Metric_Pad0.74x0.62mm_HandSolderC2, C10
2C_SmallCapacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolderC20, C21
2LOGOLOGOG***, G***
2TestPointTestPoint:TestPoint_Pad_D1.0mmTP1, TP2
110kΩResistor_SMD:R_0402_1005MetricR4
11µFCapacitor_SMD:C_0402_1005Metric_Pad0.74x0.62mm_HandSolderC3
15kΩResistor_SMD:R_0402_1005MetricR3
1BLYST NANO/L151_I_Syst.inc:BLYSTL15M1
1BMI3231_I_Syst.inc:LGA-14_L3.0-W2.5-P0.50-TL_QMI8658AU1
1Conn_01x03Connector_JST:JST_PH_S3B-PH-SM4-TB_1x03-1MP_P2.00mm_HorizontalJ3
1Conn_02x03_Odd_EvenConnector_PinHeader_2.54mm:PinHeader_2x03_P2.54mm_VerticalJ2
1DOCK_PADS1_I_Syst.inc:Dock_Pads_6PinJ4
1D_SchottkyDiode_SMD:D_SOD-323FD2
1MAX30102EFD+T1_I_Syst.inc:21-1048_F143A5&plus_1_MXM-LU2
1NPM13041_I_Syst.inc:QFN50P500X500X90-33NU5
1OPT3001DNPRQ11_I_Syst.inc:SON65P200X200X65-7NU6
1SP0502Package_TO_SOT_SMD:SOT-23D1
1SSD13061_I_Syst.inc:OLED_1.3in_I2CJ1
1TMP117AIDRVT1_I_Syst.inc:DRV0006BU4
1W25Q80E1_I_Syst.inc:W25Q80EWSNIG_WIN-MU3

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Questions

How big is the Watch PCB?

It measures 45 × 45 mm and has 2 copper layers, 1.6 mm thick.

What parts does the Watch use?

47 parts, built around the MAX30102EFD+T, OPT3001DNPRQ1, TMP117AIDRVR and W25Q80EWSNIG. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the Watch KiCad files?

From the DINDIN2007/Blystwatch repository on GitHub, at the commit this page was made from: the board is Watch/Watch.kicad_pcb and its schematic Dock/Smart-Watch-L15-Dock.kicad_sch. PCBKit opens the board in the browser, with nothing to install.

Can I use the Watch design in my own project?

Its repository states no licence, so its author keeps all rights: ask DINDIN2007 before reusing the design.