Skip to the content
PCBKitNew board

TMP117AIDRVR

Texas Instruments

-55℃~+150℃ 1.7V~5.5V 15.5ms 16bit 3.1uA Factory temperature calibration、Temperature threshold monitoring、Low-power standby、On-chip non-volatile parameter storage、On-chip digital filtering/averaging I2C、SMBus ±0.1℃ WDFN-6-EP(2x2) Temperature Sensors ROHS

Extended
DatasheetJLCPCBLCSCti/TMP117AIDRVR
Category
Temperature Sensors
Package
WDFN-6-EP(2x2)
Pins
6

Overview

The TMP117AIDRVR is a temperature Sensor made by Texas Instruments in a WDFN-6-EP(2x2) package with 6 pins. -55℃~+150℃ 1.7V~5.5V 15.5ms 16bit 3.1uA Factory temperature calibration、Temperature threshold monitoring、Low-power standby、On-chip non-volatile parameter storage、On-chip digital filtering/averaging I2C、SMBus ±0.1℃ WDFN-6-EP(2x2) Temperature Sensors ROHS.

PCBKit's library has its KiCad symbol (Sensor_Temperature:TMP117xxDRV, from KiCad's library) and its footprint (pimoroni-ics:WSON-6-2.1MM-NO-PAD, from Eagle libraries), ready for a KiCad board. 11,869 are in stock at JLCPCB (part C699536). 41 open-source boards in 28 repositories on GitHub use it.

Symbol

SCL1GND2ALERT3ADD04V+5SDA6
Sensor_Temperature:TMP117xxDRVFrom KiCad's library

Footprint

pimoroni-ics:WSON-6-2.1MM-NO-PADFrom Eagle libraries

From the datasheet

16
Supply, least
1.8 V · V+, recommended operating min, TA = -55 °C to 150 °C · p. 5
Supply, most
5.5 V · V+, recommended operating max, TA = -55 °C to 150 °C · p. 5
Supply, least
1.7 V · V+, recommended operating min, TA = -55 °C to 70 °C · p. 5
Supply, absolute maximum
6 V · V+, absolute max · p. 5
Works from
-55 °C · Operating free-air temperature min · p. 5
Works up to
150 °C · Operating free-air temperature max · p. 5
Junction, hottest
155 °C · Operating junction temperature max · p. 5
Takes working
16 µA · V+, typical, 1 Hz with 8 averages, serial bus inactive, TA = 25 °C · p. 6
Takes at most
220 µA · V+, max during active conversion, serial bus inactive · p. 6
Takes asleep
150 nA · V+, typical shutdown, serial bus inactive, TA = 25 °C · p. 6
Junction to air (DRV (WSON))
70.7 K/W · Junction-to-ambient thermal resistance · p. 5
Junction to case (DRV (WSON))
82.3 K/W · Junction-to-case (top) thermal resistance · p. 5
Junction to board (DRV (WSON))
35.4 K/W · Junction-to-board thermal resistance · p. 5
Takes working
135 µA · V+, typical during active conversion · p. 14
Takes asleep
1.25 µA · V+, typical during standby between conversions · p. 14
Takes asleep
250 nA · V+, typical in shutdown mode · p. 14

What it is and has

14
Temperature accuracy
±0.1 °C maximum from –20 °C to 50 °C · p. 1
Resolution
16-bit; 0.0078°C (1 LSB) · p. 1
Temperature alerts
Programmable temperature alert limits · p. 1
Averaging
Selectable averaging · p. 1
System correction
Digital offset · p. 1
EEPROM
48 bits, general-purpose · p. 1
Traceability
NIST traceability · p. 1
Interface
SMBus, I2C · p. 1
Temperature accuracy
±0.15 °C maximum from –40 °C to 70 °C · p. 1
Temperature accuracy
±0.2 °C maximum from –40 °C to 100 °C · p. 1
Temperature accuracy
±0.25 °C maximum from –55 °C to 125 °C · p. 1
Temperature accuracy
±0.3 °C maximum from –55 °C to 150 °C · p. 1
Interface
SMBus and I2C compatible, slave only · p. 20
Bus addressing
Up to four devices on a single bus · p. 21

Around it

2
res 5 kΩ
between SDA and V+; Required pullup; value may be adjusted for the application. · p. 33
cap 0.1-µF
between V+ and GND; Ceramic bypass capacitor; place as close as possible to V+ and choose a temperature rating matching the application. · p. 33

Specifications

60
ParameterConditionsAs printedPage
Supply voltage V+Over free-air temperature rangemin -0.3 · max 6 V5
Voltage atSCL, SDA, ALERT and ADD0min -0.3 · max 6 V5
Operating junction temperature TJmin -55 · max 155 °C5
Storage temperature Tstgmin -65 · max 155 °C5
Electrostatic discharge V(ESD)Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001; rating ±2000 Vmax 2000 V5
Electrostatic discharge V(ESD)Charged-device model (CDM), per JEDEC specification JESD22-C101; rating ±1000 Vmax 1000 V5
Supply voltage, TA = -55 °C to 150 °C V+Nominal supply voltage 3.3 Vmin 1.8 · max 5.5 V5
Supply voltage, TA = -55 °C to 70 °C V+min 1.7 · max 5.5 V5
SCL, SDA, ALERT and ADD0 VI/Omin 0 · max 5.5 V5
Operating free-air temperature TAmin -55 · max 150 °C5
Junction-to-ambient thermal resistance RθJADRV (WSON), 6 PINStyp 70.7 °C/W5
Junction-to-case (top) thermal resistance RθJC(top)DRV (WSON), 6 PINStyp 82.3 °C/W5
Junction-to-case (bottom) thermal resistance RθJC(bot)DRV (WSON), 6 PINStyp 11.7 °C/W5
Junction-to-board thermal resistance RθJBDRV (WSON), 6 PINStyp 35.4 °C/W5
Junction-to-top characterization parameter ψJTDRV (WSON), 6 PINStyp 2.2 °C/W5
Junction-to-board characterization parameter ψJBDRV (WSON), 6 PINStyp 35.3 °C/W5
Thermal Mass MTDRV (WSON), 6 PINStyp 5.1 mJ/°C5
Temperature accuracyTMP117; -20 °C to 50 °C; 8 averages, 1-Hz conversion cycle, thermal pad unsoldered (DRV Package); VIL ≤ 0.05 * V+, VIH ≥ 0.95 * V+; typical ±0.05 °Cmin -0.1 · typ 0.05 · max 0.1 °C6
Temperature accuracyTMP117; -40 °C to 70 °C; 8 averages, 1-Hz conversion cycle, thermal pad unsoldered (DRV Package); VIL ≤ 0.05 * V+, VIH ≥ 0.95 * V+; typical ±0.05 °Cmin -0.15 · typ 0.05 · max 0.15 °C6
Temperature accuracyTMP117; -40 °C to 100 °C; 8 averages, 1-Hz conversion cycle, thermal pad unsoldered (DRV Package); VIL ≤ 0.05 * V+, VIH ≥ 0.95 * V+; typical ±0.1 °Cmin -0.2 · typ 0.1 · max 0.2 °C6
Temperature accuracyTMP117; -55 °C to 125 °C; 8 averages, 1-Hz conversion cycle, thermal pad unsoldered (DRV Package); VIL ≤ 0.05 * V+, VIH ≥ 0.95 * V+; typical ±0.1 °Cmin -0.25 · typ 0.1 · max 0.25 °C6
Temperature accuracyTMP117; -55 °C to 150 °C; 8 averages, 1-Hz conversion cycle, thermal pad unsoldered (DRV Package); VIL ≤ 0.05 * V+, VIH ≥ 0.95 * V+; typical ±0.1 °Cmin -0.3 · typ 0.1 · max 0.3 °C6
DC power supply sensitivityOne-shot mode, 8 Averagestyp 6 m°C/V6
Temperature resolution (LSB)typ 7.8125 m°C6
Repeatability(1)V+ = 3.3 V; 8 averages; 1-Hz conversion cycle; typical ±1 LSBtyp 1 LSB6
Long-term stability and drift1000 hours at 150 °C; typical ±0.03 °Ctyp 0.03 °C6
Temperature cycling and hysteresis(3)8 Averages; typical ±2 LSBtyp 2 LSB6
Conversion timeOne-shot modemin 13 · typ 15.5 · max 17.5 ms6
Input capacitancetyp 4 pF6
Input leakage current IINmin -0.1 · max 0.1 uA6
SDA and ALERT output logic low level VOLIOL = -3 mAmin 0 · max 0.4 V6
Quiescent current during active conversion IQ_ACTIVEActive Conversion, serial bus inactivetyp 135 · max 220 uA6
Quiescent current IQDuty cycle 1 Hz, averaging mode off, serial bus inactive. TA = 25 °Ctyp 3.5 · max 5 uA6
Quiescent current IQDuty cycle 1 Hz, 8 averaging mode on, serial bus inactive. TA = 25 °Ctyp 16 · max 22 uA6
Quiescent current IQDuty cycle 1 Hz, averaging mode off, serial bus active, SCL frequency = 400 kHztyp 15 uA6
Standby current(4) ISBSerial bus inactive. SCL, SDA, and ADD0 = V+. TA = 25 °Ctyp 1.25 · max 3.1 uA6
Shutdown current ISDSerial bus inactive, SCL, SDA, and ADD0 = V+. TA = 25 °Ctyp 0.15 · max 0.5 uA6
Shutdown current ISDSerial bus inactive, SCL, SDA and ADD0 = V+, TA = 150 °Cmax 5 uA6
Shutdown current ISDSerial bus active, SCL frequency = 400 kHz, ADD0 = V+typ 17 uA6
EEPROM write quiescent current IEEADC conversion off; serial bus inactivetyp 240 uA6
Power-on-reset threshold voltage VPORSupply risingtyp 1.6 V7
Brownout detectSupply fallingtyp 1.1 V7
Reset Time tRESETTime required by device to resettyp 1.5 ms7
Programming timeEEPROMtyp 7 ms7
Number of writesEEPROMmin 1000 · typ 50000 Times7
Data retention timeEEPROMmin 10 · typ 100 Years7
SCL operating frequency fSCLFAST-MODEmin 1 · max 400 KHz7
Bus free time between STOP and START conditions tBUFFAST-MODEmin 1300 ns7
Hold time after repeated START condition. After this period, the first clock is generated(1) tHD;STAFAST-MODEmin 600 ns7
Repeated START condition setup time tSU;STAFAST-MODEmin 600 ns7
STOP condition setup time tSU;STOFAST-MODEmin 600 ns7
Data hold time tHD;DATFAST-MODEmin 0 ns7
Data valid time(2) tVD;DATFAST-MODEmax 0.9 us7
Data setup time tSU;DATFAST-MODEmin 100 ns7
SCL clock low period tLOWFAST-MODEmin 1300 ns7
SCL clock high period tHIGHFAST-MODEmin 600 ns7
Data fall time tF – SDAFAST-MODE; minimum 20 × (V+ /5.5) nsmax 300 ns7
Clock fall and rise time tF, tR – SCLFAST-MODEmax 300 ns7
Rise time for SCL ≤ 100 kHz tRFAST-MODEmax 1000 ns7
Serial bus timeout (SDA bus released if there is no clock)FAST-MODEmin 20 · max 40 ms7

Pins, by the datasheet

6
1 SCL
Serial clock. · p. 4
2 GND
Ground. · p. 4
3 ALERT
Over temperature alert or data-ready signal; requires a pullup resistor. · p. 4
4 ADD0
Address select. Connect to GND, V+, SDA, or SCL. · p. 4
5 V+
Supply voltage. · p. 4
6 SDA
Serial data input and open-drain output. Requires a pullup resistor. · p. 4

Ordering codes, by the datasheet

12
TMP117AIDRVR
WSON (DRV), 6 pins · 3000 package quantity; operating temperature -55 to 150 °C; marking T117 · p. 46
TMP117AIDRVT
WSON (DRV), 6 pins · 250 package quantity; operating temperature -55 to 150 °C; marking T117 · p. 46
TMP117AIYBGR
DSBGA (YBG), 6 pins · 3000 package quantity; operating temperature -55 to 150 °C; marking E7 · p. 46
TMP117AIYBGT
DSBGA (YBG), 6 pins · 250 package quantity; operating temperature -55 to 150 °C; marking E7 · p. 46
TMP117MAIDRVR
WSON (DRV), 6 pins · 3000 package quantity; operating temperature 0 to 85 °C; marking 117M · p. 46
TMP117MAIDRVT
WSON (DRV), 6 pins · 250 package quantity; operating temperature 0 to 85 °C; marking 117M · p. 46
TMP117MAIYBGR
DSBGA (YBG), 6 pins · 3000 package quantity; operating temperature 0 to 85 °C; marking EQ · p. 46
TMP117MAIYBGT
DSBGA (YBG), 6 pins · 250 package quantity; operating temperature 0 to 85 °C; marking EQ · p. 46
TMP117NAIDRVR
WSON (DRV), 6 pins · 3000 package quantity; operating temperature -55 to 150 °C; marking 117N · p. 46
TMP117NAIDRVT
WSON (DRV), 6 pins · 250 package quantity; operating temperature -55 to 150 °C; marking 117N · p. 46
TMP117NAIYBGR
DSBGA (YBG), 6 pins · 3000 package quantity; operating temperature -55 to 150 °C; marking ER · p. 46
TMP117NAIYBGT
DSBGA (YBG), 6 pins · 250 package quantity; operating temperature -55 to 150 °C; marking ER · p. 46

Parameters

16
Current - Supply
16uA
Current - Supply(Max)
220uA
Detection Temperature Range
-55℃~+150℃
Features
On-chip digital filtering/averaging
Interface
I2C
Junction Temperature(Max)
155℃
Operating Temperature
-55℃~+150℃
Standby Current
3.1uA
Temperature Conversion Time
15.5ms
Temperature Resolution
16bit
Thermal Resistance(Junction to Ambient)
70.7℃/W
Thermal Resistance(Junction to Board)
35.4℃/W
Thermal Resistance(Junction to Case)
82.3℃/W
Tolerance
±0.1℃
Voltage - Supply
1.7V~5.5V
Voltage - Supply(Absolute Max)
6V

Order codes

1

Pinout

6
The pins of the TMP117AIDRVR
PinNameType
1SCLInput
2GNDPower in
3ALERTOpen collector
4ADD0Input
5V+Power in
6SDAInput/output

Open-source boards using it

All 41
  • 4 layers39 × 39 mmOneInchEye, the printed circuit board in 3D

    OneInchEye

    will127534/OneInchEye

    A One Inch CMOS sensor (IMX283) camera board designed for Raspberry Pi

    94 parts355MIT
  • 4 layers39 × 39 mmShutterEye, the printed circuit board in 3D

    ShutterEye

    will127534/ShutterEye

    A simple camera board using SC910GS 1" 4K@30fps global shutter sensor

    157 parts26MIT
  • 4 layers60 × 40 mmFtx, the printed circuit board in 3D

    Ftx

    SETIatHCRO/Front-Page

    Documentation related to the Allen Telescope Array at the Hat Creek Radio Observatory Wiki Link Below

    153 parts5
  • 4 layers44.5 × 50.6 mmKompic Mk1b, the printed circuit board in 3D

    Kompic Mk1b

    porupski/kompic-wearable

    Compact Open Multi-sensor Platform & Apparat.

    149 parts3GPL-3.0
  • 2 layers56 × 6.2 mmRing pcb, the printed circuit board in 3D

    Ring pcb

    dezash123/ring-pcb

    60 parts2
  • 2 layers228.9 × 5.5 mmTMP117 section 5cm, the printed circuit board in 3D

    TMP117 section 5cm

    BerkeleyLab/DxP-sensor-probes

    Hardware design for the DxP (Distributed sensor Profiling) sensor probe.

    38 parts1
  • 4 layers62.9 × 42.5 mmPCB Design PFE, the printed circuit board in 3D

    PCB Design PFE

    khawlahhouki/fatigue-detection-edge-ai

    Real-time physical fatigue detection using Edge AI on STM32H7 with FreeRTOS, biosignal acquisition (PPG, EMG, IMU) and TFLite INT8 inference

    64 parts1

Show this part on your page

A live frame, for any web page
<iframe src="https://pcbkit.io/embed/parts/ti/TMP117AIDRVR" title="TMP117AIDRVR in PCBKit" width="100%" height="480" style="border:0;border-radius:12px" allow="fullscreen" loading="lazy"></iframe>
A picture
<img src="https://pcbkit.io/embed/parts/ti/TMP117AIDRVR.jpg" alt="TMP117AIDRVR" width="1200" height="900">
A picture that opens the part, for a README
[![TMP117AIDRVR](https://pcbkit.io/embed/parts/ti/TMP117AIDRVR.jpg?size=s)](https://pcbkit.io/parts/ti/TMP117AIDRVR)

Questions

Is there a KiCad symbol and footprint for the TMP117AIDRVR?

Yes. The symbol is Sensor_Temperature:TMP117xxDRV and the footprint pimoroni-ics:WSON-6-2.1MM-NO-PAD, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the TMP117AIDRVR?

WDFN-6-EP(2x2), with 6 pins. Its footprint is drawn on this page.

Where is the TMP117AIDRVR datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Where can I order the TMP117AIDRVR?

JLCPCB lists it as part C699536, with 11,869 in stock; the sellers' links on this page open their listings.

What can replace the TMP117AIDRVR?

Parts like it in the library: the TMP117MAIDRV by Texas Instruments, the TMP117NAIDRV by Texas Instruments, the TMP117MAIYBGR by Texas Instruments and the TMP117NAIYBGR by Texas Instruments. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the TMP117AIDRVR?

41 boards in 28 repositories on GitHub; the most starred are listed on this page, with their KiCad files.

Parts like it

7