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TCAN332D

Texas InstrumentsExtended

-40℃~+125℃ 1Mbps 3V~3.6V 60mA CAN Transceiver SOIC-8 CAN Transceivers ROHS

Part id
ti/TCAN332D
Category
CAN Transceivers
Package
SOIC-8
Pins
8
In stock
2,017 at JLCPCB (C73651)
Used on
31 open-source boards

Overview

The TCAN332D is a CAN Transceiver made by Texas Instruments in a SOIC-8 package with 8 pins. -40℃~+125℃ 1Mbps 3V~3.6V 60mA CAN Transceiver SOIC-8 CAN Transceivers ROHS.

PCBKit's library has its KiCad symbol (Interface_CAN_LIN:TCAN332, from KiCad's library) and its footprint (Package_SO:SOIC-8_3.9x4.9mm_P1.27mm, from KiCad's library), ready for a KiCad board. 2,017 are in stock at JLCPCB (part C73651). 31 open-source boards in 29 repositories on GitHub use it.

Symbol

1TXD2GND3VCC4RXD6CANL7CANH
Interface_CAN_LIN:TCAN332From KiCad's library

Footprint

12345678
Package_SO:SOIC-8_3.9x4.9mm_P1.27mmFrom KiCad's library

From the datasheet

14
Supply, least
3 V · VCC, recommended operating min · p. 5
Supply, most
3.6 V · VCC, recommended operating max · p. 5
Supply, absolute maximum
5 V · VCC, absolute max · p. 5
Works from
-40 °C · Operational free-air temperature min · p. 5
Works up to
125 °C · Operational free-air temperature max · p. 5
Junction, hottest
150 °C · Operating junction temperature max · p. 5
Takes working
55 mA · VCC, normal mode dominant, 60 Ω typical bus load, max · p. 6
Takes at most
60 mA · VCC, normal mode dominant, 50 Ω high bus load, max · p. 6
A pin gives at most
8 mA · Logic output current absolute max · p. 5
Junction to air (D (SOIC))
114.4 K/W · Junction-to-ambient thermal resistance · p. 6
Junction to case (D (SOIC))
58.7 K/W · Junction-to-case top thermal resistance · p. 6
Junction to board (D (SOIC))
55.2 K/W · Junction-to-board thermal resistance · p. 6
Data rate, most
1 Mbit/s · TCAN332 normal mode max · p. 3
Edge
6 ns · RXD output fall time, 15 pF load, typical · p. 9

What it is and has

11
Supply
3.3V single supply operation · p. 1
CAN compatibility
ISO 11898-2 · p. 1
Package options
SOIC-8 and SOT-23 · p. 1
Operating modes
Normal mode only · p. 3
Common mode range
±12V · p. 1
Bus pin fault protection
±14V · p. 1
Protection
Driver dominant time out (TXD DTO) · p. 1
Protection
Receiver dominant time out (RXD DTO) · p. 1
Protection
Undervoltage protection on VCC · p. 1
Protection
Thermal shutdown protection · p. 1
Protection
Current limiting on bus pins · p. 1

Specifications

73
ParameterConditionsAs printedPage
Supply Voltage range VCCOver operating free-air temperature rangemin -0.3 · max 5 V5
Voltage at any bus terminal (CANH or CANL) V(BUS)Over operating free-air temperature rangemin -14 · max 14 V5
Logic input terminal voltage range V(Logic_Input)Over operating free-air temperature rangemin -0.3 · max 5 V5
Logic output terminal voltage range V(Logic_Output)Over operating free-air temperature rangemin -0.3 · max 5 V5
Logic output current IO(LOGIC)Over operating free-air temperature rangemax 8 mA5
Operating junction temperature range TJmin -40 · max 150 °C5
Storage temperature Tstgmax 150 °C5
Electrostatic discharge V(ESD)Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001; all pins except CANH and CANL; ±4000 Vmax 4000 V5
Electrostatic discharge V(ESD)Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001; pins CANH and CANL; ±25000 Vmax 25000 V5
Electrostatic discharge V(ESD)Charged-device model (CDM), per JEDEC specification JESD22-C101; all pins; ±1500 Vmax 1500 V5
Electrostatic discharge V(ESD)IEC 61400-4-2 Contact Discharge; CANH and CANL terminals to GND; ±12000 Vmax 12000 V5
Supply voltage VCCOver operating free-air temperature rangemin 3 · max 3.6 V5
Logic terminal HIGH level output current IOH(LOGIC)Over operating free-air temperature rangemin -2 mA5
Logic terminal LOW level output current IOL(LOGIC)Over operating free-air temperature rangemax 2 mA5
Operational free-air temperature TAmin -40 · max 125 °C5
Junction-to-ambient thermal resistance RθJATCAN33x D (SOIC), 8 PINStyp 114.4 °C/W6
Junction-to-case (top) thermal resistance RθJC(top)TCAN33x D (SOIC), 8 PINStyp 58.7 °C/W6
Junction-to-board thermal resistance RθJBTCAN33x D (SOIC), 8 PINStyp 55.2 °C/W6
Junction-to-top characterization parameter ψJTTCAN33x D (SOIC), 8 PINStyp 11.7 °C/W6
Junction-to-board characterization parameter ψJBTCAN33x D (SOIC), 8 PINStyp 54.6 °C/W6
Average power dissipation PDTCAN33x D (SOIC), 8 PINS; VCC = 3.3 V, TJ = 27°C, RL = 60 Ω, SHDN, S and STB at 0 V, input to TXD at 500 kHz, 50% duty cycle square wave, CL(RXD) = 15 pFtyp 65 mW6
Thermal shutdown temperature TSDTCAN33x D (SOIC), 8 PINStyp 175 °C6
Thermal shutdown hysteresis THYSTCAN33x D (SOIC), 8 PINStyp 5 °C6
Supply current Normal Mode ICCDominant; Figure 6-1; TXD = 0V, RL = 60Ω, CL = open, S, STB and SHDN = 0V; Typical Bus Loadmax 55 mA6
Supply current Normal Mode ICCDominant; Figure 6-1; TXD = 0V, RL = 50Ω, CL = open, S, STB and SHDN = 0V; High Bus Loadmax 60 mA6
Supply current Normal Mode ICCDominant with bus fault; Figure 6-1; TXD = 0V, S, STB and SHDN = 0V, CANH = -12V, RL = open, CL = openmax 180 mA6
Supply current Normal Mode ICCRecessive; Figure 6-1; TXD = VCC, RL = 50Ω, CL = open, S, STB and SHDN = 0Vmax 3.5 mA6
Rising under voltage detection on VCC for protected mode UV(VCC)typ 2.2 · max 2.6 V6
Falling under voltage detection on VCC for protected mode UV(VCC)min 1.65 · typ 2 · max 2.5 V6
Hysteresis voltage on UV(VCC) VHYS(UVVCC)typ 200 mV6
Bus output voltage (dominant) VO(D)CANH; Figures 6-3 and 6-2; TXD = 0V, S, STB and SHDN = 0V, RL = 60Ω, CL = open; maximum VCCmin 2.45 V6
Bus output voltage (dominant) VO(D)CANL; Figures 6-3 and 6-2; TXD = 0V, S, STB and SHDN = 0V, RL = 60Ω, CL = openmin 0.5 · max 1.25 V6
Bus output voltage (recessive) VO(R)Figures 6-3 and 6-2; TXD = VCC, STB, SHDN = 0V, S = 0V or VCC; RL = open (no load)typ 1.85 V6
Differential output voltage (dominant) VOD(D)Figures 6-3 and 6-2; TXD = 0V, S, STB and SHDN = 0V, 50Ω ≤ RL ≤ 65Ω, CL = openmin 1.6 · max 3 V7
Differential output voltage (dominant) VOD(D)Figures 6-3 and 6-2; TXD = 0V, S, STB and SHDN = 0V, 45Ω ≤ RL < 50Ω, CL = openmin 1.5 · max 3 V7
Differential output voltage (recessive) VOD(R)Figures 6-3 and 6-2; TXD = VCC, S, STB and SHDN = 0V, RL = 60Ω, CL = openmin -120 · max 12 mV7
Differential output voltage (recessive) VOD(R)TA < 85°C; Figures 6-3 and 6-2; TXD = VCC, S, STB and SHDN = 0V, RL = open (no load), CL = openmin -50 · max 50 mV7
Differential output voltage (recessive) VOD(R)Figures 6-3 and 6-2; TXD = VCC, S, STB and SHDN = 0V, RL = open (no load), CL = openmin -50 · max 100 mV7
Output symmetry (dominant and recessive) (CANHREC + CANLREC – CANHDOM – CANLDOM) V(SYM)Figures 6-3 and 6-2; S, STB and SHDN = 0V, RL = 60Ω, CL = openmin -400 · max 400 mV7
Short-circuit steady-state output current, Dominant IOS(DOM)Figure 6-9; V(CANH) = –12V, CANL = open, TXD = 0Vmin -200 mA7
Short-circuit steady-state output current, Dominant IOS(DOM)Figure 6-9; V(CANL) = 12V, CANH = open, TXD = 0Vmax 200 mA7
Short-circuit steady-state output current, Recessive IOS(REC)Figure 6-9; –12V ≤ VBUS ≤ 12V, VBUS = CANH = CANL, TXD = VCCmin -5 · max 5 mA7
Input threshold voltage, normal modes and selective wake modes VITReceiver; Figure 6-3 and Table 6-7min 500 · max 900 mV8
Hysteresis voltage for input threshold, normal modes and selective wake modes VHYSReceiver; Figure 6-3 and Table 6-7typ 120 mV8
Common Mode Range: normal and silent modes VCMReceiver; normal modemin -12 · max 12 V8
Power-off (unpowered) bus input leakage current IIOFF(LKG)CANH = CANL = 3.3V, VCC to GND via 0Ω and 47kΩ resistormax 12 uA8
Input capacitance to ground (CANH or CANL) CImax 20 pF8
Differential input capacitance CIDmax 10 pF8
Differential input resistance RIDTXD = VCC, Normal Modemin 30 · max 80 kΩ8
Input resistance (CANH or CANL) RINTXD = VCC, Normal modemin 15 · max 40 kΩ8
Input resistance matching: [1 – (RIN(CANH) / RIN(CANL))] × 100 % RIN(M)V(CANH) = V(CANL)min -3 · max 3 %8
HIGH level input voltage VIHTXD Terminal (CAN Transmit Data Input)min 2 V8
LOW level input voltage VILTXD Terminal (CAN Transmit Data Input)max 0.8 V8
HIGH level input leakage current IIHTXD = VCC = 3.6Vmin -2.5 · typ 0 · max 3 uA8
LOW level input leakage current IILTXD = 0V, VCC = 3.6Vmin -4 · typ 0 · max 0 uA8
Unpowered leakage current ILKG(OFF)TXD = 3.6V, VCC = 0Vmin -2 · typ 0 · max 2.5 uA8
Input Capacitance I(CAP)TXD Terminal (CAN Transmit Data Input)typ 2.5 pF8
LOW level output voltage VOLRXD; Figure 6-3, IO = 2mAtyp 0.2 · max 0.4 V8
Unpowered leakage current ILKG(OFF)RXD = 3.6V, VCC = 0Vmin -1 · typ 0 · max 1 uA8
Total loop delay, driver input (TXD) to receiver output (RXD), recessive to dominant and dominant to recessive tPROP(LOOP)Figure 6-6, S, STB and SHDN = 0V, RL = 60Ω, CL = 100pF, CL(RXD) = 15pFtyp 100 · max 135 ns9
Total Loop delay in highly loaded network tPROP(LOOP)Figure 6-6, S, STB and SHDN = 0V, RL = 120Ω, CL = 200pF, CL(RXD) = 15pFtyp 120 · max 180 ns9
Re-enable time after UV event tUV_RE-ENABLETime for device to return to normal operation from UV(VCC) under voltage eventmax 1000 us9
Propagation delay time, HIGH TXD to Driver Recessive tpHRFigure 6-2, S, STB and SHDN = 0V, RL = 60Ω, CL = 100pFtyp 25 ns9
Propagation delay time, LOW TXD to Driver Dominant tpLDFigure 6-2, S, STB and SHDN = 0V, RL = 60Ω, CL = 100pFtyp 20 ns9
Pulse skew (|tpHR - tpLD|) tsk(p)Figure 6-2, S, STB and SHDN = 0V, RL = 60Ω, CL = 100pFtyp 5 ns9
Differential output signal rise time trFigure 6-2, S, STB and SHDN = 0V, RL = 60Ω, CL = 100pFtyp 17 ns9
Differential output signal fall time tfFigure 6-2, S, STB and SHDN = 0V, RL = 60Ω, CL = 100pFtyp 9 ns9
Driver dominant time out (1) tTXD_DTOFigure 6-8, RL = 60Ω, CL = 100pFmin 1.2 · typ 2.6 · max 3.8 ms9
Propagation delay time, bus recessive input to high RXD output tpRHFigure 6-3, CL(RXD) = 15pF, CANL = 1.5V, CANH = 3.5Vtyp 62 ns9
Propagation delay time, bus dominant input to RXD low output tpDLFigure 6-3, CL(RXD) = 15pF, CANL = 1.5V, CANH = 3.5Vtyp 56 ns9
Output signal rise time (RXD) trFigure 6-3, CL(RXD) = 15pF, CANL = 1.5V, CANH = 3.5Vtyp 7 ns9
Output signal fall time (RXD) tfFigure 6-3, CL(RXD) = 15pF, CANL = 1.5V, CANH = 3.5Vtyp 6 ns9
Receiver dominant time out (2) tRXD_DTOFigure 6-10, CL(RXD) = 15pFmin 1.6 · typ 3 · max 5 ms9

Pins, by the datasheet

8
1 TXD
CAN transmit data input; LOW for dominant and HIGH for recessive bus states; integrated pull up. · p. 4
2 GND
Ground connection. · p. 4
3 VCC
3.3-V supply voltage. · p. 4
4 RXD
Tri-state CAN receive data output; LOW for dominant and HIGH for recessive bus states. · p. 4
5 NC
No Connect – Not internally connected. · p. 4
6 CANL
Low level CAN bus line. · p. 4
7 CANH
High level CAN bus line. · p. 4
8 NC
No Connect – Not internally connected. · p. 4

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Parts like it

8

Questions

Is there a KiCad symbol and footprint for the TCAN332D?

Yes. The symbol is Interface_CAN_LIN:TCAN332 and the footprint Package_SO:SOIC-8_3.9x4.9mm_P1.27mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the TCAN332D?

SOIC-8, with 8 pins. Its footprint is drawn on this page.

Where is the TCAN332D datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Where can I order the TCAN332D?

JLCPCB lists it as part C73651, with 2,017 in stock; the sellers' links on this page open their listings.

What can replace the TCAN332D?

Parts like it in the library: the TJA1051T/3/1J by NXP Semiconductors, the SN65HVD230D by Texas Instruments, the TJA1042T/1J by NXP Semiconductors and the CA-IF1051S by Chipanalog. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the TCAN332D?

31 boards in 29 repositories on GitHub; the most starred are listed on this page, with their KiCad files.