P82B96D

Texas Instruments

-40℃~+85℃ 2 2-Wire Bus 2-Wire Bus 2V~15V 4pF 70ns Buffer SOIC-8 Signal Buffers, Repeaters, Splitters ROHS

Extended

Category: Signal Buffers, Repeaters, Splitters
Package: SOIC-8
Pins: 8

Overview

The P82B96D is a signal Buffers, Repeaters, Splitter made by Texas Instruments in a SOIC-8 package with 8 pins. -40℃~+85℃ 2 2-Wire Bus 2-Wire Bus 2V~15V 4pF 70ns Buffer SOIC-8 Signal Buffers, Repeaters, Splitters ROHS.

PCBKit's library has its KiCad symbol (Interface_Expansion:P82B96, from KiCad's library) and its footprint (Package_SO:SOIC-8_3.9x4.9mm_P1.27mm, from KiCad's library), ready for a KiCad board. 519 are in stock at JLCPCB (part C2652363). 14 open-source boards in 7 repositories on GitHub use it.

Symbol

Interface_Expansion:P82B96From KiCad's library

Footprint

Package_SO:SOIC-8_3.9x4.9mm_P1.27mmFrom KiCad's library

From the datasheet

Supply, least: 2 V · VCC, recommended operating minimum · p. 5
Supply, most: 15 V · VCC, recommended operating maximum · p. 5
Supply, absolute maximum: 18 V · VCC, absolute maximum · p. 5
Works from: -40 °C · Operating free-air temperature minimum · p. 5
Works up to: 85 °C · Operating free-air temperature maximum · p. 5
Takes working: 900 µA · VCC quiescent supply current typical, Sx = Sy = VCC, TA = 25°C · p. 7
A pin gives at most: 250 mA · Sx or Sy continuous output current absolute maximum · p. 5
Junction to air (D (SOIC)): 109.1 K/W · Junction-to-ambient thermal resistance · p. 5
Junction to case (D (SOIC)): 61.6 K/W · Junction-to-case (top) thermal resistance · p. 5
Junction to board (D (SOIC)): 48.6 K/W · Junction-to-board thermal resistance · p. 5

What it is and has

Function: I2C compatible dual bidirectional bus buffer · p. 1
I2C operation: 400-kHz Fast I2C bus operation · p. 1
Bus capacitance: 400 pF on Sx/Sy; up to 4000 pF on Tx/Ty · p. 14

Around it

cap approximately 100 nF: between VCC and GND; Decoupling capacitor; place as close to VCC as possible. · p. 21

Specifications

138

Parameter	Conditions	As printed	Page
Supply voltage on VCC pin VCC	Over operating free-air temperature range	min -0.3 · max 18 V	5
Voltage on buffered input VI	Sx or Sy (SDA or SCL)	min -0.3 · max 18 V	5
Voltage on buffered input VI	Rx or Ry	min -0.3 · max 18 V	5
Voltage on buffered output VO	Sx or Sy (SDA or SCL)	min -0.3 · max 18 V	5
Voltage on buffered output VO	Tx or Ty	min -0.3 · max 18 V	5
Continuous output current IO	Sx or Sy	max 250 mA	5
Continuous output current IO	Tx or Ty	max 250 mA	5
Continuous current through VCC or GND ICC		max 250 mA	5
Operating free-air temperature TA		min -40 · max 85 °C	5
Storage temperature Tstg		min -55 · max 125 °C	5
Electrostatic discharge V(ESD)	Human Body Model (HBM), per ANSI/ESDA/JEDEC JS-001	min -3500 · max 3500 V	5
Electrostatic discharge V(ESD)	Charged-Device Model (CDM), per JEDEC specification JESD22-C101	min -1000 · max 1000 V	5
Electrostatic discharge V(ESD)	Machine Model (MM), per JEDEC specification JESD22-A115-A	min -200 · max 200 V	5
Supply voltage VCC		min 2 · max 15 V	5
Low-level output current IOL	Sx, Sy; VSx, VSy = 1 V, VRx, VRy ≤ 0.42 V	max 3 mA	5
Low-level output current IOL	Tx, Ty; VSx, VSy = 0.4 V, VTx, VTy = 0.4 V	max 30 mA	5
Maximum input/output voltage level VIOmax	Sx, Sy; VTx, VTy = 0.4 V	max 15 V	5
Maximum input/output voltage level VIOmax	Tx, Ty; VSx, VSy = 0.4 V	max 15 V	5
Low-level input voltage difference VILdiff	Sx, Sy	max 0.4 V	5
Junction-to-ambient thermal resistance RθJA	D (SOIC), 8 PINS	typ 109.1 °C/W	5
Junction-to-case (top) thermal resistance RθJC(top)	D (SOIC), 8 PINS	typ 61.6 °C/W	5
Junction-to-board thermal resistance RθJB	D (SOIC), 8 PINS	typ 48.6 °C/W	5
Junction-to-top characterization parameter ψJT	D (SOIC), 8 PINS	typ 19.6 °C/W	5
Junction-to-board characterization parameter ψJB	D (SOIC), 8 PINS	typ 48.2 °C/W	5
Temperature coefficient of input thresholds ΔV/ΔTIN	Sx, Sy; TA = 25°C; typical at VCC = 2.5 V	typ -2 mV/°C	6
Low-level output voltage VOL	Sx, Sy; ISx, ISy = 3 mA; TA = 25°C; typical at VCC = 2.5 V	min 0.8 · typ 0.88 · max 1 V	6
Low-level output voltage VOL	Sx, Sy; ISx, ISy = 0.2 mA; TA = 25°C; typical at VCC = 2.5 V	min 0.67 · typ 0.73 · max 0.79 V	6
Temperature coefficient of output low levels ΔV/ΔTOUT	Sx, Sy; ISx, ISy = 0.2 mA; TA = 25°C; typical at VCC = 2.5 V	typ -1.8 mV/°C	6
Quiescent supply current ICC	Sx = Sy = VCC; TA = 25°C; typical at VCC = 2.5 V	typ 0.9 · max 1.8 mA	6
Quiescent supply current ICC	Sx = Sy = VCC; TA = –40°C to 85°C	max 2 mA	6
Additional supply current per pin low ΔICC	Tx, Ty; TA = 25°C; typical at VCC = 2.5 V	typ 1.7 · max 2.75 mA	6
Additional supply current per pin low ΔICC	Tx, Ty; TA = –40°C to 85°C	max 3 mA	6
Dynamic output sink capability on I2C bus IIOS	Sx, Sy; VSx, VSy > 2 V, VRx, VRy = low; TA = 25°C; typical at VCC = 2.5 V	min 7 · typ 18 mA	6
Dynamic output sink capability on I2C bus IIOS	Sx, Sy; VSx, VSy > 2 V, VRx, VRy = low; TA = –40°C to 85°C	min 5.5 mA	6
Leakage current on I2C bus IIOS	Sx, Sy; VSx, VSy = 2.5 V, VRx, VRy = high; TA = 25°C	typ 0.1 · max 1 uA	6
Leakage current on I2C bus IIOS	Sx, Sy; VSx, VSy = 2.5 V, VRx, VRy = high; TA = –40°C to 85°C	max 1 uA	6
Dynamic output sink capability on buffered bus IIOT	Tx, Ty; VTx, VTy > 1 V, VSx, VSy = low on I2C bus = 0.4 V; TA = 25°C; typical at VCC = 2.5 V	min 60 · typ 100 mA	6
Dynamic output sink capability on buffered bus IIOT	Tx, Ty; VTx, VTy > 1 V, VSx, VSy = low on I2C bus = 0.4 V; TA = –40°C to 85°C	min 60 mA	6
Leakage current on buffered bus IIOT	Tx, Ty; VTx, VTy = VCC = 2.5 V, VSx, VSy = high; TA = 25°C	typ 0.1 · max 1 uA	6
Leakage current on buffered bus IIOT	Tx, Ty; VTx, VTy = VCC = 2.5 V, VSx, VSy = high; TA = –40°C to 85°C	max 1 uA	6
Input current from I2C bus II	Sx, Sy; Bus low, VRx, VRy = high; TA = 25°C; typical at VCC = 2.5 V	typ -1 uA	6
Input current from I2C bus II	Sx, Sy; Bus low, VRx, VRy = high; TA = –40°C to 85°C	max 1 uA	6
Input current from buffered bus II	Rx, Ry; Bus low, VRx, VRy = 0.4 V; TA = 25°C; typical at VCC = 2.5 V	typ -1 uA	6
Input current from buffered bus II	Rx, Ry; Bus low, VRx, VRy = 0.4 V; TA = –40°C to 85°C	max 1 uA	6
Leakage current on buffered bus input II	Rx, Ry; VRx, VRy = VCC; TA = 25°C; typical at VCC = 2.5 V	typ 1 uA	6
Leakage current on buffered bus input II	Rx, Ry; VRx, VRy = VCC; TA = –40°C to 85°C	max 1.5 uA	6
Input threshold VIT	Sx, Sy; Input logic level high threshold on normal I2C bus; TA = 25°C; typical at VCC = 2.5 V	typ 0.65 · max 0.7 V	6
Input threshold VIT	Sx, Sy; Input logic level low threshold on normal I2C bus; TA = 25°C; typical at VCC = 2.5 V	min 0.6 · typ 0.65 V	6
Input/output logic level difference VIOdiff	Sx, Sy; (VSx output low at 3 mA) – (VSx input high max) for I2C applications; TA = 25°C; typical at VCC = 2.5 V	min 100 · typ 150 mV	6
Input/output logic level difference VIOdiff	Sx, Sy; (VSx output low at 3 mA) – (VSx input high max) for I2C applications; TA = –40°C to 85°C	min 100 mV	6
VCC voltage at which all buses are released VIOrel	Sx, Sy, Tx, Ty; Sx, Sy are low, VCC ramping, voltage on Tx, Ty lowered until released; TA = 25°C	min 1 V	6
VCC voltage at which all buses are released VIOrel	Sx, Sy, Tx, Ty; Sx, Sy are low, VCC ramping, voltage on Tx, Ty lowered until released; TA = –40°C to 85°C	min 1 V	6
Temperature coefficient of release voltage ΔV/ΔTREL	TA = 25°C; typical at VCC = 2.5 V	typ -4 mV/°C	6
Input capacitance Cin	Rx, Ry; TA = 25°C; typical at VCC = 2.5 V	typ 2.5 · max 4 pF	6
Input capacitance Cin	Rx, Ry; TA = –40°C to 85°C	max 4 pF	6
Temperature coefficient of input thresholds ΔV/ΔTIN	Sx, Sy; TA = 25°C; typical at VCC = 3.3 V	typ -2 mV/°C	7
Low-level output voltage VOL	Sx, Sy; ISx, ISy = 3 mA; TA = 25°C; typical at VCC = 3.3 V	min 0.8 · typ 0.88 · max 1 V	7
Low-level output voltage VOL	Sx, Sy; ISx, ISy = 0.2 mA; TA = 25°C; typical at VCC = 3.3 V	min 0.67 · typ 0.73 · max 0.79 V	7
Temperature coefficient of output low levels ΔV/ΔTOUT	Sx, Sy; ISx, ISy = 0.2 mA; TA = 25°C; typical at VCC = 3.3 V	typ -1.8 mV/°C	7
Quiescent supply current ICC	Sx = Sy = VCC; TA = 25°C; typical at VCC = 3.3 V	typ 0.9 · max 1.8 mA	7
Additional supply current per pin low ΔICC	Tx, Ty; TA = 25°C; typical at VCC = 3.3 V	typ 1.7 · max 2.75 mA	7
Additional supply current per pin low ΔICC	Tx, Ty; TA = –40°C to 85°C	max 3 mA	7
Dynamic output sink capability on I2C bus IIOS	Sx, Sy; VSx, VSy > 2 V, VRx, VRy = low; TA = 25°C; typical at VCC = 3.3 V	min 7 · typ 18 mA	7
Dynamic output sink capability on I2C bus IIOS	Sx, Sy; VSx, VSy > 2 V, VRx, VRy = low; TA = –40°C to 85°C	min 5.7 mA	7
Leakage current on I2C bus IIOS	Sx, Sy; VSx, VSy = 5 V, VRx, VRy = high; TA = 25°C; typical at VCC = 3.3 V	typ 0.1 · max 1 uA	7
Leakage current on I2C bus IIOS	Sx, Sy; VSx, VSy = 5 V, VRx, VRy = high; TA = –40°C to 85°C	max 1 uA	7
Dynamic output sink capability on buffered bus IIOT	Tx, Ty; VTx, VTy > 1 V, VSx, VSy = low on I2C bus = 0.4 V; TA = 25°C; typical at VCC = 3.3 V	min 60 · typ 100 mA	7
Dynamic output sink capability on buffered bus IIOT	Tx, Ty; VTx, VTy > 1 V, VSx, VSy = low on I2C bus = 0.4 V; TA = –40°C to 85°C	min 60 mA	7
Leakage current on buffered bus IIOT	Tx, Ty; VTx, VTy = VCC = 3.3 V, VSx, VSy = high; TA = 25°C	typ 0.1 · max 1 uA	7
Leakage current on buffered bus IIOT	Tx, Ty; VTx, VTy = VCC = 3.3 V, VSx, VSy = high; TA = –40°C to 85°C	max 1 uA	7
Input current from I2C bus II	Sx, Sy; Bus low, VRx, VRy = high; TA = 25°C; typical at VCC = 3.3 V	typ -1 uA	7
Input current from I2C bus II	Sx, Sy; Bus low, VRx, VRy = high; TA = –40°C to 85°C	max 1 uA	7
Input current from buffered bus II	Rx, Ry; Bus low, VRx, VRy = 0.4 V; TA = 25°C; typical at VCC = 3.3 V	typ -1 uA	7
Input current from buffered bus II	Rx, Ry; Bus low, VRx, VRy = 0.4 V; TA = –40°C to 85°C	max 1 uA	7
Leakage current on buffered bus input II	Rx, Ry; VRx, VRy = VCC; TA = 25°C; typical at VCC = 3.3 V	typ 1 uA	7
Leakage current on buffered bus input II	Rx, Ry; VRx, VRy = VCC; TA = –40°C to 85°C	max 1.5 uA	7
Input threshold VIT	Sx, Sy; Input logic-level high threshold on normal I2C bus; TA = 25°C; typical at VCC = 3.3 V	typ 0.65 · max 0.7 V	7
Input threshold VIT	Sx, Sy; Input logic-level low threshold on normal I2C bus; TA = 25°C; typical at VCC = 3.3 V	min 0.6 · typ 0.65 V	7
Input/output logic level difference VIOdiff	Sx, Sy; (VSx output low at 3 mA) – (VSx input high max) for I2C applications; TA = 25°C; typical at VCC = 3.3 V	min 100 · typ 150 mV	7
Input/output logic level difference VIOdiff	Sx, Sy; (VSx output low at 3 mA) – (VSx input high max) for I2C applications; TA = –40°C to 85°C	min 100 mV	7
VCC voltage at which all buses are released VIOrel	Sx, Sy, Tx, Ty; Sx, Sy are low, VCC ramping, voltage on Tx, Ty lowered until released; TA = 25°C	min 1 V	7
VCC voltage at which all buses are released VIOrel	Sx, Sy, Tx, Ty; Sx, Sy are low, VCC ramping, voltage on Tx, Ty lowered until released; TA = –40°C to 85°C	min 1 V	7
Temperature coefficient of release voltage ΔV/ΔTREL	TA = 25°C; typical at VCC = 3.3 V	typ -4 mV/°C	7
Input capacitance Cin	Rx, Ry; TA = 25°C; typical at VCC = 3.3 V	typ 2.5 · max 4 pF	7
Temperature coefficient of input thresholds ΔV/ΔTIN	Sx, Sy; TA = 25°C; typical at VCC = 5 V	typ -2 mV/°C	8
Low-level output voltage VOL	Sx, Sy; ISx, ISy = 3 mA; TA = 25°C; typical at VCC = 5 V	min 0.8 · typ 0.88 · max 1 V	8
Low-level output voltage VOL	Sx, Sy; ISx, ISy = 0.2 mA; TA = 25°C; typical at VCC = 5 V	min 0.67 · typ 0.73 · max 0.79 V	8
Temperature coefficient of output low levels ΔV/ΔTOUT	Sx, Sy; ISx, ISy = 0.2 mA; TA = 25°C; typical at VCC = 5 V	typ -1.8 mV/°C	8
Quiescent supply current ICC	Sx = Sy = VCC; TA = 25°C; typical at VCC = 5 V	typ 0.9 · max 1.8 mA	8
Additional supply current per pin low ΔICC	Tx, Ty; TA = 25°C; typical at VCC = 5 V	typ 1.7 · max 2.75 mA	8
Additional supply current per pin low ΔICC	Tx, Ty; TA = –40°C to 85°C	max 3 mA	8
Dynamic output sink capability on I2C bus IIOS	Sx, Sy; VSx, VSy > 2 V, VRx, VRy = low; TA = 25°C; typical at VCC = 5 V	min 7 · typ 18 mA	8
Dynamic output sink capability on I2C bus IIOS	Sx, Sy; VSx, VSy > 2 V, VRx, VRy = low; TA = –40°C to 85°C	min 6 mA	8
Leakage current on I2C bus IIOS	Sx, Sy; VSx, VSy = 5 V, VRx, VRy = high; TA = 25°C	typ 0.1 · max 1 uA	8
Dynamic output sink capability on buffered bus IIOT	Tx, Ty; VTx, VTy > 1 V, VSx, VSy = low on I2C bus = 0.4 V; TA = 25°C; typical at VCC = 5 V	min 60 · typ 100 mA	8
Leakage current on buffered bus IIOT	Tx, Ty; VTx, VTy = VCC = 5 V, VSx, VSy = high; TA = 25°C	typ 0.1 · max 1 uA	8
Leakage current on buffered bus IIOT	Tx, Ty; VTx, VTy = VCC = 5 V, VSx, VSy = high; TA = –40°C to 85°C	max 1 uA	8
Input current from I2C bus II	Sx, Sy; Bus low, VRx, VRy = high; TA = 25°C; typical at VCC = 5 V	typ -1 uA	8
Input current from buffered bus II	Rx, Ry; Bus low, VRx, VRy = 0.4 V; TA = 25°C; typical at VCC = 5 V	typ -1 uA	8
Leakage current on buffered bus input II	Rx, Ry; VRx, VRy = VCC; TA = 25°C; typical at VCC = 5 V	typ 1 uA	8
Input threshold VIT	Sx, Sy; Input logic-level high threshold on normal I2C bus; TA = 25°C; typical at VCC = 5 V	typ 0.65 · max 0.7 V	8
Input threshold VIT	Sx, Sy; Input logic-level low threshold on normal I2C bus; TA = 25°C; typical at VCC = 5 V	min 0.6 · typ 0.65 V	8
Input/output logic level difference VIOdiff	Sx, Sy; (VSx output low at 3 mA) – (VSx input high max) for I2C applications; TA = 25°C; typical at VCC = 5 V	min 100 · typ 150 mV	8
VCC voltage at which all buses are released VIOrel	Sx, Sy, Tx, Ty; Sx, Sy are low, VCC ramping, voltage on Tx, Ty lowered until released; TA = 25°C	min 1 V	8
VCC voltage at which all buses are released VIOrel	Sx, Sy, Tx, Ty; Sx, Sy are low, VCC ramping, voltage on Tx, Ty lowered until released; TA = –40°C to 85°C	min 1 V	8
Temperature coefficient of release voltage ΔV/ΔTREL	TA = 25°C; typical at VCC = 5 V	typ -4 mV/°C	9
Input capacitance Cin	Rx, Ry; TA = 25°C; typical at VCC = 5 V	typ 2.5 · max 4 pF	9
Temperature coefficient of input thresholds ΔV/ΔTIN	Sx, Sy; TA = 25°C	typ -2 mV/°C	9
Low-level output voltage VOL	Sx, Sy; ISx, ISy = 3 mA; TA = 25°C	min 0.8 · typ 0.88 · max 1 V	9
Low-level output voltage VOL	Sx, Sy; ISx, ISy = 0.2 mA; TA = 25°C	min 0.67 · typ 0.73 · max 0.79 V	9
Temperature coefficient of output low levels ΔV/ΔTOUT	Sx, Sy; ISx, ISy = 0.2 mA; TA = 25°C	typ -1.8 mV/°C	9
Quiescent supply current ICC	Sx = Sy = VCC; TA = 25°C	typ 0.9 · max 1.8 mA	9
Quiescent supply current ICC	Sx = Sy = VCC; TA = –40°C to 85°C	max 2 mA	9
Additional supply current per pin low ΔICC	Tx, Ty; TA = 25°C	typ 1.7 · max 2.75 mA	9
Dynamic output sink capability on I2C bus IIOS	Sx, Sy; VSx, VSy > 2 V, VRx, VRy = low; TA = 25°C	min 7 · typ 18 mA	9
Dynamic output sink capability on I2C bus IIOS	Sx, Sy; VSx, VSy > 2 V, VRx, VRy = low; TA = –40°C to 85°C	min 6.5 mA	9
Leakage current on I2C bus IIOS	Sx, Sy; VSx, VSy = 15 V, VRx, VRy = high; TA = 25°C	typ 0.1 · max 1 uA	9
Leakage current on I2C bus IIOS	Sx, Sy; VSx, VSy = 15 V, VRx, VRy = high; TA = –40°C to 85°C	max 1 uA	9
Dynamic output sink capability on buffered bus IIOT	Tx, Ty; VTx, VTy > 1 V, VSx, VSy = low on I2C bus = 0.4 V; TA = 25°C	min 60 · typ 100 mA	9
Dynamic output sink capability on buffered bus IIOT	Tx, Ty; VTx, VTy > 1 V, VSx, VSy = low on I2C bus = 0.4 V; TA = –40°C to 85°C	min 60 mA	9
Leakage current on buffered bus IIOT	Tx, Ty; VTx, VTy = VCC = 15 V, VSx, VSy = high; TA = 25°C	typ 0.1 · max 1 uA	9
Leakage current on buffered bus IIOT	Tx, Ty; VTx, VTy = VCC = 15 V, VSx, VSy = high; TA = –40°C to 85°C	max 1 uA	9
Input current from I2C bus II	Sx, Sy; Bus low, VRx, VRy = high; TA = 25°C	typ -1 uA	9
Input current from buffered bus II	Rx, Ry; Bus low, VRx, VRy = 0.4 V; TA = 25°C	typ -1 uA	9
Leakage current on buffered bus input II	Rx, Ry; VRx, VRy = VCC; TA = 25°C	typ 1 uA	9
Input threshold VIT	Sx, Sy; Input logic-level high threshold on normal I2C bus; TA = 25°C	typ 0.65 · max 0.7 V	9
Input threshold VIT	Sx, Sy; second input logic-level high threshold row, as printed; TA = 25°C	min 0.6 · typ 0.65 V	9
Input/output logic level difference (5) VIOdiff	VCC = 15 V, TA = 25°C; Sx, Sy; (VSx output low at 3 mA) – (VSx input high max) for I2C applications	min 100 · typ 150 mV	10
Input/output logic level difference (5) VIOdiff	VCC = 15 V, TA = –40°C to 85°C; Sx, Sy; (VSx output low at 3 mA) – (VSx input high max) for I2C applications	min 100 mV	10
VCC voltage at which all buses are released VIOrel	TA = 25°C; Sx, Sy, Tx, Ty; Sx, Sy are low, VCC ramping, voltage on Tx, Ty lowered until released	min 1 V	10
VCC voltage at which all buses are released VIOrel	TA = –40°C to 85°C; Sx, Sy, Tx, Ty; Sx, Sy are low, VCC ramping, voltage on Tx, Ty lowered until released	min 1 V	10
Temperature coefficient of release voltage ΔV/ΔTREL	TA = 25°C	typ -4 mV/°C	10
Input capacitance Cin	VCC = 15 V, TA = 25°C; Rx, Ry	typ 2.5 · max 4 pF	10
Input capacitance Cin	VCC = 15 V, TA = –40°C to 85°C; Rx, Ry	max 4 pF	10
Buffer delay time on falling input tpzl	VCC = 5 V, TA = 25°C, no capacitive loads; VSx (or VSy) = input switching threshold to VTx (or VTy) output falling 50% of VLOAD; RTx pullup = 160 Ω, CTx = 7 pF + board trace capacitance	typ 70 ns	10
Buffer delay time on rising input tplz	VCC = 5 V, TA = 25°C, no capacitive loads; VSx (or VSy) = input switching threshold to VTx (or VTy) output reaching 50% of VLOAD; RTx pullup = 160 Ω, CTx = 7 pF + board trace capacitance	typ 90 ns	10
Buffer delay time on falling input tpzl	VCC = 5 V, TA = 25°C, no capacitive loads; VRx (or VRy) = input switching threshold to VSx (or VSy) output falling 50% of VLOAD; RSx pullup = 1500 Ω, CTx = 7 pF + board trace capacitance	typ 250 ns	10
Buffer delay time on rising input tplz	VCC = 5 V, TA = 25°C, no capacitive loads; VRx (or VRy) = input switching threshold to VSx (or VSy) output reaching 50% of VLOAD; RSx pullup = 1500 Ω, CTx = 7 pF + board trace capacitance	typ 270 ns	10

Pins, by the datasheet

1 Sx: Serial data bus or SDA. Connect to VCC of I2C master through a pullup resistor. · p. 4
2 Rx: Receive signal. Connect to VCC of P82B96 through a pullup resistor. · p. 4
3 Tx: Transmit signal. Connect to VCC of P82B96 through a pullup resistor. · p. 4
4 GND: Ground. · p. 4
5 Ty: Transmit signal. Connect to VCC of P82B96 through a pullup resistor. · p. 4
6 Ry: Receive signal. Connect to VCC of P82B96 through a pullup resistor. · p. 4
7 Sy: Serial clock bus or SCL. Connect to VCC of I2C master through a pullup resistor. · p. 4
8 VCC: Supply voltage. · p. 4

Ordering codes, by the datasheet

P82B96D: SOIC · 8 pins, package drawing D, quantity 75, operating temperature -40 to 85 °C · p. 23
P82B96DG4: SOIC · 8 pins, package drawing D, quantity 75, operating temperature -40 to 85 °C · p. 23
P82B96DGKR: VSSOP · 8 pins, package drawing DGK, quantity 2500, operating temperature -40 to 85 °C · p. 23
P82B96DGKRG4: VSSOP · 8 pins, package drawing DGK, quantity 2500, operating temperature -40 to 85 °C · p. 23
P82B96DR: SOIC · 8 pins, package drawing D, quantity 2500, operating temperature -40 to 85 °C · p. 23
P82B96DRG4: SOIC · 8 pins, package drawing D, quantity 2500, operating temperature -40 to 85 °C · p. 23
P82B96P: PDIP · 8 pins, package drawing P, quantity 50, operating temperature -40 to 85 °C · p. 23
P82B96PW: TSSOP · 8 pins, package drawing PW, quantity 150, operating temperature -40 to 85 °C · p. 23
P82B96PWG4: TSSOP · 8 pins, package drawing PW, quantity 150, operating temperature -40 to 85 °C · p. 23
P82B96PWR: TSSOP · 8 pins, package drawing PW, quantity 2000, operating temperature -40 to 85 °C · p. 23
P82B96PWRG4: TSSOP · 8 pins, package drawing PW, quantity 2000, operating temperature -40 to 85 °C · p. 23

Parameters

Current - Supply: 900uA
Data Rate: 400Kbps
Delay Time: 70ns
Features: Bus capacitance isolation
Input Capacitance: 4pF
Input Type: 2-Wire Bus
Number of Channels: 2
Operating Temperature: -40℃~+85℃
Output Current per Pin(Max): 250mA
Output Type: 2-Wire Bus
Thermal Resistance(Junction to Ambient): 109.1℃/W
Thermal Resistance(Junction to Board): 48.6℃/W
Thermal Resistance(Junction to Case): 61.6℃/W
Type: Buffer
Voltage - Supply: 2V~15V
Voltage - Supply(Absolute Max): 18V

Order codes

P82B96DRLCSC C2652363
P82B96DLCSC C2863829

Pinout

The pins of the P82B96D
Pin	Name	Type
1	SDA	Input/output
2	RXD-SDA	Input
3	TXD-SDA	Output
4	GND	Power in
5	TXD-SCL	Output
6	RXD-SCL	Input
7	SCL	Input/output
8	VCC	Power in

Open-source boards using it

All 14

2 layers65 × 58 mm
Control panel
lucanastasio/myHomeAutomation
Home automation stuff
169 parts1
2 layers99.1 × 99.1 mm
Connector test stand
L0czek/rakieta
The starter board provides the ignition impulse to fire the engine. It includes an I2C IO expander and an 8-channel digital comparator to require a correct safety byte/address to be present before firing.
86 parts
4 layers426 × 182.3 mm
Dboards-02
QuantumMatter/Rumission
Measuring methane emissions from ruminant agriculture
371 parts
2 layers50 × 100 mm
PIR systém Q
Tomas0015/System-Q

44 parts
2 layers106.7 × 83.8 mm
Controller
Miceuz/triac-bloc
An universal power block based on triac. In essence this is a solid state relay with some bells and whistles
27 parts54
2 layers106.7 × 83.8 mm
Controller
Miceuz/triac-bloc
An universal power block based on triac. In essence this is a solid state relay with some bells and whistles
23 parts54
2 layers60 × 100 mm
Corridor distribution
lucanastasio/myHomeAutomation
Home automation stuff
94 parts1
2 layers50 × 50 mm
Alimentatore
CarloMara/didactic-octo-PSU
So, @nicogela and I decided to build a LAB PSU, but because we're lazy people and we don't like to carry weight we're tring to unite the high efficiency of the switching topologies to the high stability and low noise of…
67 parts

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A picture that opens the part, for a README

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Questions

Is there a KiCad symbol and footprint for the P82B96D?

Yes. The symbol is Interface_Expansion:P82B96 and the footprint Package_SO:SOIC-8_3.9x4.9mm_P1.27mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the P82B96D?

SOIC-8, with 8 pins. Its footprint is drawn on this page.

Where is the P82B96D datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Where can I order the P82B96D?

JLCPCB lists it as part C2652363, with 519 in stock; the sellers' links on this page open their listings.

What can replace the P82B96D?

Parts like it in the library: the TCA4311AD by Texas Instruments, the P82B715TD by NXP Semiconductors, the PCA9508D by NXP Semiconductors and the P82B96TD by NXP Semiconductors. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the P82B96D?

14 boards in 7 repositories on GitHub; the most starred are listed on this page, with their KiCad files.

P82B96D

Overview

Symbol

Footprint

From the datasheet

What it is and has

Around it

Specifications

Pins, by the datasheet

Ordering codes, by the datasheet

Parameters

Order codes

Pinout

Open-source boards using it

Control panel

Connector test stand

Dboards-02

PIR systém Q

Controller

Controller

Corridor distribution

Alimentatore

Show this part on your page

Questions

Is there a KiCad symbol and footprint for the P82B96D?

What package is the P82B96D?

Where is the P82B96D datasheet?

Where can I order the P82B96D?

What can replace the P82B96D?

Which open-source boards use the P82B96D?

Parts like it

TCA4311AD

P82B715TD

PCA9508D

P82B96TD

P82B96TD/S900

PCA9511AD

PCA9515AD112

ISL33001IBZ