
LP2985-33DBV
Texas InstrumentsExtended
-40℃~+125℃@(Tj) 1 150mA 16V 3.3V 30uVrms 45dB@(1kHz) 575mV@(150mA) 850uA Fixed Over Current Protection、Short Circuit Protection、Thermal shutdown、Enable control、Noise bypass terminal Positive SOT-23-5 Voltage Regulators - Linear, Low Drop Out (LDO) Regulators ROHS
- Part id
- ti/LP2985-33DBV
- Category
- Voltage Regulators, Linear, Low Drop Out (LDO) Regulators
- Package
- SOT-23-5
- Pins
- 5
- In stock
- 135,106 at JLCPCB (C95414)
- Used on
- 152 open-source boards
Overview
The LP2985-33DBV is a voltage Regulators, Linear, Low Drop Out (LDO) Regulator made by Texas Instruments in a SOT-23-5 package with 5 pins. -40℃~+125℃@(Tj) 1 150mA 16V 3.3V 30uVrms 45dB@(1kHz) 575mV@(150mA) 850uA Fixed Over Current Protection、Short Circuit Protection、Thermal shutdown、Enable control、Noise bypass terminal Positive SOT-23-5 Voltage Regulators - Linear, Low Drop Out (LDO) Regulators ROHS.
PCBKit's library has its KiCad symbol (dk_PMIC-Voltage-Regulators-Linear:LP2985-33DBVR, from Digikey) and its footprint (Package_TO_SOT_SMD:SOT-23-5, from KiCad's library), ready for a KiCad board. 135,106 are in stock at JLCPCB (part C95414). 152 open-source boards in 133 repositories on GitHub use it.
Symbol
Footprint
From the datasheet
20- Supply, least
- 2.2 V · VIN, recommended operating min, legacy chip · p. 4
- Supply, most
- 16 V · VIN, recommended operating max, legacy chip · p. 4
- Supply, least
- 2.5 V · VIN, recommended operating min, new chip · p. 4
- Supply, absolute maximum
- 16 V · VIN, absolute max, legacy chip · p. 4
- Supply, absolute maximum
- 18 V · VIN, absolute max, new chip · p. 4
- Junction, hottest
- 150 °C · Operating junction, absolute max · p. 4
- Gives
- 150 mA · IOUT, recommended continuous max · p. 4
- Takes working
- 65 µA · GND pin current typical, IOUT = 0 mA, legacy chip · p. 7
- Takes working
- 69 µA · GND pin current typical, IOUT = 0 mA, new chip · p. 7
- Takes asleep
- 10 nA · GND pin current typical, VON/OFF < 0.3 V, VIN = 16 V, legacy chip · p. 7
- Takes asleep
- 1.25 µA · GND pin current typical, VON/OFF < 0.3 V, VIN = 16 V, new chip · p. 7
- Current limit
- 350 mA · Peak Output Current typical, VOUT ≥ VO(NOM) –5%, steady state, legacy chip · p. 8
- Dropout
- 280 mV · Dropout typical at IOUT = 150 mA, legacy chip · p. 6
- Dropout
- 180 mV · Dropout typical at IOUT = 150 mA, new chip · p. 6
- Junction to air (DBV (SOT23-5))
- 205.4 K/W · Junction-to-ambient, legacy chip · p. 5
- Junction to air (DBV (SOT23-5))
- 178.6 K/W · Junction-to-ambient, new chip · p. 5
- Junction to case (DBV (SOT23-5))
- 78.8 K/W · Junction-to-case top, legacy chip · p. 5
- Junction to case (DBV (SOT23-5))
- 77.9 K/W · Junction-to-case top, new chip · p. 5
- Junction to board (DBV (SOT23-5))
- 46.7 K/W · Junction-to-board, legacy chip · p. 5
- Junction to board (DBV (SOT23-5))
- 47.2 K/W · Junction-to-board, new chip · p. 5
What it is and has
8- Output current
- Up to 150mA · p. 1
- Output accuracy
- ±1.5%, standard-grade legacy chip · p. 1
- Output accuracy
- ±0.5%, new chip only · p. 1
- Output noise
- 30μVRMS with 10nF bypass capacitor · p. 1
- Protection
- Output current limiting and thermal protection · p. 1
- Output capacitor
- Stable with 2.2µF ceramic capacitor · p. 1
- Package
- 5-pin SOT-23 (DBV) · p. 1
- Operating junction temperature
- –40°C to +125°C · p. 1
Around it
3- cap 1 µF or larger
- between VIN and GND; Input capacitor. · p. 3
- cap 2.2 µF or larger
- between VOUT and GND; Output capacitor; effective capacitance at the pin must be greater than 1 uF. · p. 3
- cap 10 nF
- between BYPASS and GND; Bypass capacitor used for the stated output-noise performance. · p. 8
Specifications
124| Parameter | Conditions | As printed | Page |
|---|---|---|---|
| Continuous input voltage range (for legacy chip) VIN | Legacy chip | min -0.3 · max 16 V | 4 |
| Continuous input voltage range (for new chip) VIN | New chip | min -0.3 · max 18 V | 4 |
| Output voltage range (for legacy chip) VOUT | Legacy chip | min -0.3 · max 9 V | 4 |
| Output voltage range (for new chip) VOUT | New chip; maximum is VIN + 0.3 V or 9 V, whichever is smaller | min -0.3 V | 4 |
| BYPASS pin voltage range (for new chip) VBYPASS | New chip | min -0.3 · max 3 V | 4 |
| ON/OFF pin voltage range (for legacy chip) VON/OFF | Legacy chip | min -0.3 · max 16 V | 4 |
| ON/OFF pin voltage range (for new chip) VON/OFF | New chip | min -0.3 · max 18 V | 4 |
| Operating junction, TJ Temperature | min -55 · max 150 °C | 4 | |
| Storage, Tstg Temperature | min -65 · max 150 °C | 4 | |
| Electrostatic discharge V(ESD) | Legacy chip; Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 | min -2000 · max 2000 V | 4 |
| Electrostatic discharge V(ESD) | New chip; Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 | min -3000 · max 3000 V | 4 |
| Electrostatic discharge V(ESD) | Legacy chip; Charged device model (CDM), per JEDEC specification JESD22-C101 | min -500 · max 500 V | 4 |
| Electrostatic discharge V(ESD) | New chip; Charged device model (CDM), per JEDEC specification JESD22-C101 | min -1000 · max 1000 V | 4 |
| Supply input voltage (for legacy chip) VIN | Legacy chip | min 2.2 · max 16 V | 4 |
| Supply input voltage (for new chip) VIN | New chip | min 2.5 · max 16 V | 4 |
| Output voltage (for legacy chip) VOUT | Legacy chip | min 1.2 · max 10 V | 4 |
| Output voltage (for new chip) VOUT | New chip | min 1.2 · max 5 V | 4 |
| Bypass voltage VBYPASS | NOM column | typ 1.2 V | 4 |
| Enable voltage (for legacy chip) VON/OFF | Legacy chip; maximum VIN | min 0 V | 4 |
| Enable voltage (for new chip) VON/OFF | New chip | min 0 · max 16 V | 4 |
| Output current IOUT | min 0 · max 150 mA | 4 | |
| Input capacitor CIN | NOM column; capacitor values assumed to derate to 50% of nominal | typ 1 uF | 4 |
| Output capacitor (for legacy chip) COUT | Legacy chip; nominal value in typ | min 2.2 · typ 4.7 uF | 4 |
| Output capacitance (for new chip) COUT | New chip; nominal value in typ; maintain effective output capacitance of 1 uF minimum | min 1 · typ 2.2 · max 200 uF | 4 |
| Operating junction temperature TJ | min -40 · max 125 °C | 4 | |
| Junction-to-ambient thermal resistance RθJA | Legacy chip; DBV (SOT23-5), 5 PINS | typ 205.4 °C/W | 5 |
| Junction-to-ambient thermal resistance RθJA | New chip; DBV (SOT23-5), 5 PINS | typ 178.6 °C/W | 5 |
| Junction-to-case (top) thermal resistance RθJC(top) | Legacy chip; DBV (SOT23-5), 5 PINS | typ 78.8 °C/W | 5 |
| Junction-to-case (top) thermal resistance RθJC(top) | New chip; DBV (SOT23-5), 5 PINS | typ 77.9 °C/W | 5 |
| Junction-to-board thermal resistance RθJB | Legacy chip; DBV (SOT23-5), 5 PINS | typ 46.7 °C/W | 5 |
| Junction-to-board thermal resistance RθJB | New chip; DBV (SOT23-5), 5 PINS | typ 47.2 °C/W | 5 |
| Junction-to-top characterization parameter ψJT | Legacy chip; DBV (SOT23-5), 5 PINS | typ 8.3 °C/W | 5 |
| Junction-to-top characterization parameter ψJT | New chip; DBV (SOT23-5), 5 PINS | typ 15.9 °C/W | 5 |
| Junction-to-board characterization parameter ψJB | Legacy chip; DBV (SOT23-5), 5 PINS | typ 46.3 °C/W | 5 |
| Junction-to-board characterization parameter ψJB | New chip; DBV (SOT23-5), 5 PINS | typ 46.9 °C/W | 5 |
| Output voltage tolerance ∆VOUT | Legacy chip (standard grade); IL = 1 mA | min -1.5 · max 1.5 % | 5 |
| Output voltage tolerance ∆VOUT | New chip; IL = 1 mA | min -0.5 · max 0.5 % | 5 |
| Output voltage tolerance ∆VOUT | Legacy chip (standard grade); 1 mA ≤ IL ≤ 50 mA | min -2.5 · max 2.5 % | 5 |
| Output voltage tolerance ∆VOUT | New chip; 1 mA ≤ IL ≤ 50 mA | min -0.5 · max 0.5 % | 5 |
| Output voltage tolerance ∆VOUT | Legacy chip (standard grade); 1 mA ≤ IL ≤ 150 mA | min -3 · max 3 % | 5 |
| Output voltage tolerance ∆VOUT | New chip; 1 mA ≤ IL ≤ 150 mA | min -0.5 · max 0.5 % | 5 |
| Output voltage tolerance ∆VOUT | Legacy chip (standard grade); 1 mA ≤ IL ≤ 50 mA, –40°C ≤ TJ ≤ 125°C | min -3.5 · max 3.5 % | 5 |
| Output voltage tolerance ∆VOUT | New chip; 1 mA ≤ IL ≤ 50 mA, –40°C ≤ TJ ≤ 125°C | min -1 · max 1 % | 5 |
| Output voltage tolerance ∆VOUT | Legacy chip (standard grade); 1 mA ≤ IL ≤ 150 mA, –40°C ≤ TJ ≤ 125°C | min -4 · max 4 % | 5 |
| Output voltage tolerance ∆VOUT | New chip; 1 mA ≤ IL ≤ 150 mA, –40°C ≤ TJ ≤ 125°C | min -1 · max 1 % | 5 |
| Line Regulation ΔVOUT(ΔVIN) | Legacy chip; VO(NOM) + 1 V ≤ VIN ≤ 16 V | typ 0.007 · max 0.014 %/V | 5 |
| Line Regulation ΔVOUT(ΔVIN) | New chip; VO(NOM) + 1 V ≤ VIN ≤ 16 V | typ 0.002 · max 0.014 %/V | 5 |
| Line Regulation ΔVOUT(ΔVIN) | Legacy chip; VO(NOM) + 1 V ≤ VIN ≤ 16 V, –40°C ≤ TJ ≤ 125°C | typ 0.007 · max 0.032 %/V | 5 |
| Line Regulation ΔVOUT(ΔVIN) | New chip; VO(NOM) + 1 V ≤ VIN ≤ 16 V, –40°C ≤ TJ ≤ 125°C | typ 0.002 · max 0.032 %/V | 5 |
| Dropout voltage VIN - VOUT | Legacy chip; IOUT = 0 mA | typ 1 · max 3 mV | 6 |
| Dropout voltage VIN - VOUT | New chip; IOUT = 0 mA | typ 1 · max 2.75 mV | 6 |
| Dropout voltage VIN - VOUT | Legacy chip; IOUT = 0 mA, –40°C ≤ TJ ≤ 125°C | max 5 mV | 6 |
| Dropout voltage VIN - VOUT | New chip; IOUT = 0 mA, –40°C ≤ TJ ≤ 125°C | max 3 mV | 6 |
| Dropout voltage VIN - VOUT | Legacy chip; IOUT = 1 mA | typ 7 · max 10 mV | 6 |
| Dropout voltage VIN - VOUT | New chip; IOUT = 1 mA | typ 11.5 · max 14 mV | 6 |
| Dropout voltage VIN - VOUT | Legacy chip; IOUT = 1 mA, –40°C ≤ TJ ≤ 125°C | max 15 mV | 6 |
| Dropout voltage VIN - VOUT | New chip; IOUT = 1 mA, –40°C ≤ TJ ≤ 125°C | max 17 mV | 6 |
| Dropout voltage VIN - VOUT | Legacy chip; IOUT = 10 mA | typ 40 · max 60 mV | 6 |
| Dropout voltage VIN - VOUT | New chip; IOUT = 10 mA | typ 98 · max 115 mV | 6 |
| Dropout voltage VIN - VOUT | Legacy chip; IOUT = 10 mA, –40°C ≤ TJ ≤ 125°C | max 90 mV | 6 |
| Dropout voltage VIN - VOUT | New chip; IOUT = 10 mA, –40°C ≤ TJ ≤ 125°C | max 148 mV | 6 |
| Dropout voltage VIN - VOUT | Legacy chip; IOUT = 50 mA | typ 120 · max 150 mV | 6 |
| Dropout voltage VIN - VOUT | New chip; IOUT = 50 mA | typ 120 · max 145 mV | 6 |
| Dropout voltage VIN - VOUT | Legacy chip; IOUT = 50 mA, –40°C ≤ TJ ≤ 125°C | max 225 mV | 6 |
| Dropout voltage VIN - VOUT | New chip; IOUT = 50 mA, –40°C ≤ TJ ≤ 125°C | max 184 mV | 6 |
| Dropout voltage VIN - VOUT | Legacy chip; IOUT = 150 mA | typ 280 · max 350 mV | 6 |
| Dropout voltage VIN - VOUT | New chip; IOUT = 150 mA | typ 180 · max 198 mV | 6 |
| Dropout voltage VIN - VOUT | Legacy chip; IOUT = 150 mA, –40°C ≤ TJ ≤ 125°C | max 575 mV | 6 |
| Dropout voltage VIN - VOUT | New chip; IOUT = 150 mA, –40°C ≤ TJ ≤ 125°C | max 254 mV | 6 |
| GND pin current IGND | Legacy chip; IOUT = 0 mA | typ 65 · max 95 uA | 7 |
| GND pin current IGND | New chip; IOUT = 0 mA | typ 69 · max 95 uA | 7 |
| GND pin current IGND | Legacy chip; IOUT = 0 mA, –40°C ≤ TJ ≤ 125°C | max 125 uA | 7 |
| GND pin current IGND | New chip; IOUT = 0 mA, –40°C ≤ TJ ≤ 125°C | max 120 uA | 7 |
| GND pin current IGND | Legacy chip; IOUT = 1 mA | typ 75 · max 110 uA | 7 |
| GND pin current IGND | New chip; IOUT = 1 mA | typ 78 · max 105 uA | 7 |
| GND pin current IGND | Legacy chip; IOUT = 1 mA, –40°C ≤ TJ ≤ 125°C | max 170 uA | 7 |
| GND pin current IGND | New chip; IOUT = 1 mA, –40°C ≤ TJ ≤ 125°C | max 130 uA | 7 |
| GND pin current IGND | Legacy chip; IOUT = 10 mA | typ 120 · max 220 uA | 7 |
| GND pin current IGND | New chip; IOUT = 10 mA | typ 175 · max 200 uA | 7 |
| GND pin current IGND | Legacy chip; IOUT = 1 0mA, –40°C ≤ TJ ≤ 125°C | max 400 uA | 7 |
| GND pin current IGND | New chip; IOUT = 1 0mA, –40°C ≤ TJ ≤ 125°C | max 240 uA | 7 |
| GND pin current IGND | Legacy chip; IOUT = 50 mA | typ 350 · max 600 uA | 7 |
| GND pin current IGND | New chip; IOUT = 50 mA | typ 380 · max 410 uA | 7 |
| GND pin current IGND | Legacy chip; IOUT = 50 mA, –40°C ≤ TJ ≤ 125°C | max 900 uA | 7 |
| GND pin current IGND | New chip; IOUT = 50 mA, –40°C ≤ TJ ≤ 125°C | max 590 uA | 7 |
| GND pin current IGND | Legacy chip; IOUT = 150 mA | typ 850 · max 1200 uA | 7 |
| GND pin current IGND | New chip; IOUT = 150 mA | typ 765 · max 890 uA | 7 |
| GND pin current IGND | Legacy chip; IOUT = 150 mA, –40°C ≤ TJ ≤ 125°C | max 2000 uA | 7 |
| GND pin current IGND | New chip; IOUT = 150 mA, –40°C ≤ TJ ≤ 125°C | max 1060 uA | 7 |
| GND pin current IGND | Legacy chip; VON/OFF < 0.3 V, VIN = 16 V | typ 0.01 · max 0.08 uA | 7 |
| GND pin current IGND | New chip; VON/OFF < 0.3 V, VIN = 16 V | typ 1.25 · max 1.75 uA | 7 |
| GND pin current IGND | Legacy chip; VON/OFF < 0.15 V, VIN = 16 V, –40°C ≤ TJ ≤ 85°C | typ 0 · max 1 uA | 7 |
| GND pin current IGND | New chip; VON/OFF < 0.15 V, VIN = 16 V, –40°C ≤ TJ ≤ 85°C | typ 1.12 · max 2.25 uA | 7 |
| GND pin current IGND | Legacy chip; VON/OFF < 0.15 V, VIN = 16 V, –40°C ≤ TJ ≤ 125°C | typ 0.01 · max 2 uA | 7 |
| GND pin current IGND | New chip; VON/OFF < 0.15 V, VIN = 16 V, –40°C ≤ TJ ≤ 125°C | typ 1.12 · max 2.75 uA | 7 |
| Rising bias supply UVLO VUVLO+ | New chip; VIN rising, –40°C ≤ TJ ≤ 125°C | typ 2.2 · max 2.4 V | 7 |
| Falling bias supply UVLO VUVLO- | New chip; VIN falling, –40°C ≤ TJ ≤ 125°C | min 1.9 V | 7 |
| UVLO hysteresis VUVLO(HYST) | New chip; –40°C ≤ TJ ≤ 125°C | typ 0.13 V | 7 |
| ON/OFF input voltage VON/OFF | Legacy chip; Low = O/P OFF | typ 0.55 V | 7 |
| ON/OFF input voltage VON/OFF | New chip; Low = O/P OFF | typ 0.72 V | 7 |
| ON/OFF input voltage VON/OFF | Legacy chip; Low = O/P OFF, VOUT + 1 ≤ VIN ≤ 16 V, –40°C ≤ TJ ≤ 125°C | max 0.15 V | 7 |
| ON/OFF input voltage VON/OFF | New chip; Low = O/P OFF, VOUT + 1 ≤ VIN ≤ 16 V, –40°C ≤ TJ ≤ 125°C | max 0.15 V | 7 |
| ON/OFF input voltage VON/OFF | Legacy chip; High = O/P ON | typ 1.4 V | 7 |
| ON/OFF input voltage VON/OFF | New chip; High = O/P ON | typ 0.85 V | 7 |
| ON/OFF input voltage VON/OFF | Legacy chip; High = O/P ON, VOUT + 1 ≤ VIN ≤ 16 V, –40°C ≤ TJ ≤ 125°C | min 1.6 V | 7 |
| ON/OFF input voltage VON/OFF | New chip; High = O/P ON, VOUT + 1 ≤ VIN ≤ 16 V, –40°C ≤ TJ ≤ 125°C | min 1.6 V | 7 |
| ON/OFF input current ION/OFF | Legacy chip; VON/OFF = 0 V | typ 0.01 uA | 8 |
| ON/OFF input current ION/OFF | New chip; VON/OFF = 0 V | typ 0.42 uA | 8 |
| ON/OFF input current ION/OFF | Legacy chip; VON/OFF = 0 V, VOUT + 1 ≤ VIN ≤ 16 V,–40°C ≤ TJ ≤ 125°C | max -1 uA | 8 |
| ON/OFF input current ION/OFF | New chip; VON/OFF = 0 V, VOUT + 1 ≤ VIN ≤ 16 V,–40°C ≤ TJ ≤ 125°C | max -0.9 uA | 8 |
| ON/OFF input current ION/OFF | Legacy chip; VON/OFF = 5 V | typ 5 uA | 8 |
| ON/OFF input current ION/OFF | New chip; VON/OFF = 5 V | typ 0.011 uA | 8 |
| ON/OFF input current ION/OFF | Legacy chip; VON/OFF = 5 V, VOUT + 1 ≤ VIN ≤ 16 V, –40°C ≤ TJ ≤ 125°C | max 15 uA | 8 |
| ON/OFF input current ION/OFF | New chip; VON/OFF = 5 V, VOUT + 1 ≤ VIN ≤ 16 V, –40°C ≤ TJ ≤ 125°C | max 2.2 uA | 8 |
| Peak Output Current IO(PK) | Legacy chip; VOUT ≥ VO(NOM) –5% (steady state) | min 300 · typ 350 mA | 8 |
| Peak Output Current IO(PK) | New chip; VOUT ≥ VO(NOM) –5% (steady state) | min 300 · typ 350 mA | 8 |
| Short Output Current IO(SC) | Legacy chip; RL = 0 Ω (steady state) | typ 400 mA | 8 |
| Short Output Current IO(SC) | New chip; RL = 0 Ω (steady state) | typ 375 mA | 8 |
| Ripple Rejection ΔVO/ΔVIN | Legacy chip; f = 1 kHz, CBYPASS = 10 nF, COUT = 10 uF | typ 45 dB | 8 |
| Ripple Rejection ΔVO/ΔVIN | New chip; f = 1 kHz, CBYPASS = 10 nF, COUT = 10 uF | typ 78 dB | 8 |
| Output noise voltage Vn | Legacy chip; Bandwidth = 300 Hz to 50 kHz, CBYPASS = 10 nF, COUT = 2.2 uF, VOUT = 3.3V, ILOAD = 150 mA | typ 30 uVRMS | 8 |
| Output noise voltage Vn | New chip; Bandwidth = 300 Hz to 50 kHz, CBYPASS = 10 nF, COUT = 2.2 uF, VOUT = 3.3V, ILOAD = 150 mA | typ 30 uVRMS | 8 |
| Thermal shutdown threshold Tsd+ | New chip; Shutdown, temperature increasing | typ 170 °C | 8 |
| Thermal shutdown threshold Tsd- | New chip; Reset, temperature decreasing | typ 150 °C | 8 |
Pins, by the datasheet
5- 1 VIN
- Input supply; connect a capacitor of 1 uF or larger to ground. · p. 3
- 2 GND
- Ground. · p. 3
- 3 ON/OFF
- High enables the LDO; low disables it. Tie to VIN if unused. · p. 3
- 4 BYPASS
- Connect an external capacitor to ground to reduce reference voltage noise. · p. 3
- 5 VOUT
- Regulator output; connect a capacitor of 2.2 uF or larger to ground, maintaining effective capacitance greater than 1 uF. · p. 3
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Questions
Is there a KiCad symbol and footprint for the LP2985-33DBV?
Yes. The symbol is dk_PMIC-Voltage-Regulators-Linear:LP2985-33DBVR and the footprint Package_TO_SOT_SMD:SOT-23-5, both drawn on this page. PCBKit places them on a board for you when you design with it.
What package is the LP2985-33DBV?
SOT-23-5, with 5 pins. Its footprint is drawn on this page.
Where is the LP2985-33DBV datasheet?
Texas Instruments publishes it: the Datasheet link on this page opens it.
Where can I order the LP2985-33DBV?
JLCPCB lists it as part C95414, with 135,106 in stock; the sellers' links on this page open their listings.
What can replace the LP2985-33DBV?
Parts like it in the library: the ME6211C33M5G-N by MICRONE, the SPX3819M5-L-3-3/TR by MaxLinear, the RT9013-33GB by RICHTEK and the XC6219B332MR by UMW. Check their datasheets: a part that fits the footprint may still differ in its ratings.
Which open-source boards use the LP2985-33DBV?
152 boards in 133 repositories on GitHub; the most starred are listed on this page, with their KiCad files.