4 layers85 × 70 mm
KICAD HT
Nicolboy/KICAD-C2000-float-flyback
Alimentation flyback isolée et flottante 200kHz (11-25V→5,5-13V/3A) pour chauffage filament tube + préampli bas bruit — KiCad 10.
168 partsCERN-OHL-S-2.0
Overview
The ISO7710FD is a digital Isolator made by Texas Instruments in a SOIC-8 package with 8 pins. -55℃~+125℃ 0 1 100Mbps 100kV/us 11ns 2.25V~5.5V 2.25V~5.5V 3000 High Level、Low Level SOIC-8 Digital Isolators ROHS.
PCBKit's library has its KiCad symbol (EasyEDA_Cloud:ISO7710FQDRQ1, from EasyEDA) and its footprint (Package_SO:SOIC-8_3.9x4.9mm_P1.27mm, from KiCad's library), ready for a KiCad board. 1,439 are in stock at JLCPCB (part C2865544). 1 open-source board in 1 repository on GitHub use it.
Symbol
Footprint
From the datasheet
16- Supply, least
- 2.25 V · VCC1, recommended operating min · p. 6
- Supply, most
- 5.5 V · VCC1, recommended operating max · p. 6
- Supply, absolute maximum
- 6 V · VCC1, absolute max · p. 5
- Works from
- -55 °C · Ambient temperature min · p. 6
- Works up to
- 125 °C · Ambient temperature max · p. 6
- Junction, hottest
- 150 °C · Junction temperature absolute max · p. 5
- A pin gives at most
- 15 mA · Output current source or sink absolute max · p. 5
- Data rate, most
- 100 Mbit/s · Data rate max · p. 6
- Takes working
- 1.7 mA · sum of ICC1 and ICC2 typical, 5 V, 1 Mbps, CL = 15 pF · p. 11
- Takes at most
- 9.7 mA · sum of ICC1 and ICC2 max, 5 V, 100 Mbps, CL = 15 pF · p. 11
- Junction to air (D(SOIC))
- 146.1 K/W · Junction-to-ambient thermal resistance · p. 7
- Junction to case (D(SOIC))
- 63.1 K/W · Junction-to-case top thermal resistance · p. 7
- Junction to board (D(SOIC))
- 80 K/W · Junction-to-board thermal resistance · p. 7
- Edge
- 1.8 ns · typical output rise time, VCC1 = VCC2 = 5 V ± 10% · p. 14
- Edge
- 700 ps · typical output rise time, VCC1 = VCC2 = 3.3 V ± 10% · p. 14
- Edge
- 1 ns · typical output rise time, VCC1 = VCC2 = 2.5 V ± 10% · p. 15
What it is and has
11- Data rate
- 100Mbps · p. 1
- Level translation
- 2.25V to 5.5V · p. 1
- Default output
- Low for ISO7710F · p. 1
- CMTI
- ±100kV/μs typical · p. 1
- Propagation delay
- 11ns typical, 5V supplies · p. 1
- Package options
- Wide-SOIC (DW-16) and narrow-SOIC (D-8) · p. 1
- UL certification
- UL 1577 component recognition program · p. 1
- Isolation withstand voltage
- 3000 VRMS, D-8, UL 1577 · p. 8
- Data rate
- 100 Mbps · p. 1
- Channel direction
- 1 Forward, 0 Reverse · p. 19
- Default output state
- Low · p. 19
Around it
2- cap 0.1 µF
- between VCC1 and GND1; External bypass decoupling capacitor. · p. 22
- cap 0.1 µF
- between VCC2 and GND2; External bypass decoupling capacitor. · p. 22
Specifications
116| Parameter | Conditions | As printed | Page |
|---|---|---|---|
| Supply Voltage (2) VCC1, VCC2 | min -0.5 · max 6 V | 5 | |
| Voltage at INx, OUTx V | Maximum VCCX + 0.5 V; maximum voltage must not exceed 6 V. | min -0.5 V | 5 |
| Output current IO | min -15 · max 15 mA | 5 | |
| Junction temperature TJ | max 150 °C | 5 | |
| Storage temperature Tstg | min -65 · max 150 °C | 5 | |
| Electrostatic discharge VESD | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins; ±6000 V | min -6000 · max 6000 V | 5 |
| Electrostatic discharge VESD | Charged device model (CDM), per JEDEC specification JESD22-C101, all pins; ±1500 V | min -1500 · max 1500 V | 5 |
| Electrostatic discharge VESD | Contact discharge per IEC 61000-4-2; Isolation barrier withstand test; ±8000 V | min -8000 · max 8000 V | 5 |
| Supply voltage VCC1, VCC2 | min 2.25 · max 5.5 V | 6 | |
| UVLO threshold when supply voltage is rising VCC(UVLO+) | typ 2 · max 2.25 V | 6 | |
| UVLO threshold when supply voltage is falling VCC(UVLO-) | min 1.7 · typ 1.8 V | 6 | |
| Supply voltage UVLO hysteresis VHYS(UVLO) | min 100 · typ 200 mV | 6 | |
| High level output current IOH | VCC2 = 5 V | min -4 mA | 6 |
| High level output current IOH | VCC2 = 3.3 V | min -2 mA | 6 |
| High level output current IOH | VCC2 = 2.5 V | min -1 mA | 6 |
| Low level output current IOL | VCC2 = 5 V | max 4 mA | 6 |
| Low level output current IOL | VCC2 = 3.3 V | max 2 mA | 6 |
| Low level output current IOL | VCC2 = 2.5 V | max 1 mA | 6 |
| Low level Input voltage VIL | MAX = 0.3 x VCC1 | min 0 V | 6 |
| Data Rate DR | min 0 · max 100 Mbps | 6 | |
| Ambient temperature TA | min -55 · typ 25 · max 125 °C | 6 | |
| Junction-to-ambient thermal resistance RθJA | D(SOIC), 8-Pin | typ 146.1 °C/W | 7 |
| Junction-to-case (top) thermal resistance RθJC(top) | D(SOIC), 8-Pin | typ 63.1 °C/W | 7 |
| Junction-to-board thermal resistance RθJB | D(SOIC), 8-Pin | typ 80 °C/W | 7 |
| Junction-to-top characterization parameter ψJT | D(SOIC), 8-Pin | typ 9.6 °C/W | 7 |
| Junction-to-board characterization parameter ψJB | D(SOIC), 8-Pin | typ 79 °C/W | 7 |
| Maximum power dissipation (both sides) PD | ISO7710; VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, Input a 50-MHz 50% duty cycle square wave | max 55 mW | 7 |
| Maximum power dissipation (side-1) PD1 | ISO7710; VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, Input a 50-MHz 50% duty cycle square wave | max 13 mW | 7 |
| Maximum power dissipation (side-2) PD2 | ISO7710; VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, Input a 50-MHz 50% duty cycle square wave | max 42 mW | 7 |
| External clearance(1) CLR | D-8; IEC 60664-1; Shortest terminal-to-terminal distance through air | typ 4 mm | 8 |
| External creepage(1) CPG | D-8; IEC 60664-1; Shortest terminal-to-terminal distance across the package surface | typ 4 mm | 8 |
| Distance through the insulation DTI | D-8; Minimum internal gap (internal clearance) | typ 17 um | 8 |
| Maximum repetitive peak isolation voltage VIORM | D-8; DIN EN IEC 60747-17 (VDE 0884-17); AC voltage (bipolar) | max 637 VPK | 8 |
| Maximum working isolation voltage VIOWM | D-8; AC voltage; time-dependent dielectric breakdown (TDDB) test, see Section 8.2.3.1 | max 450 VRMS | 8 |
| Maximum working isolation voltage VIOWM | D-8; DC voltage | max 637 VDC | 8 |
| Maximum transient isolation voltage VIOTM | D-8; VTEST = VIOTM, t = 60 s (qualification); VTEST = 1.2 × VIOTM, t = 1 s (100% production) | max 4242 VPK | 8 |
| Maximum impulse voltage(3) VIMP | D-8; Tested in air, 1.2/50-us waveform per IEC 62368-1 | max 5000 VPK | 8 |
| Maximum surge isolation voltage(4) VIOSM | D-8; VIOSM ≥ 1.3 x VIMP; Tested in oil (qualification test), 1.2/50-us waveform per IEC 62368-1 | max 10000 VPK | 8 |
| Apparent charge(5) qpd | D-8; Method a: After I/O safety test subgroup 2/3; Vini = VIOTM, tini = 60 s; Vpd(m) = 1.2 × VIORM, tm = 10 s; value ≤5 pC | max 5 pC | 8 |
| Apparent charge(5) qpd | D-8; Method a: After environmental tests subgroup 1; Vini = VIOTM, tini = 60 s; Vpd(m) = 1.6 × VIORM, tm = 10 s; value ≤5 pC | max 5 pC | 8 |
| Apparent charge(5) qpd | D-8; Method b: At routine test (100% production) and preconditioning (type test); Vini = 1.2 x VIOTM, tini = 1 s; Vpd(m) = 1.875 x VIORM (ISO7710), tm = 1 s (method b1) or Vpd(m) = Vini, tm = tini (method b2); value ≤5 pC | max 5 pC | 8 |
| Barrier capacitance, input to output(6) CIO | D-8; VIO = 0.4 × sin (2 πft), f = 1 MHz; value ≅0.4 pF | typ 0.4 pF | 8 |
| Pollution degree | D-8 | typ 2 | 8 |
| Withstand isolation voltage VISO | D-8; UL 1577; VTEST = VISO, t = 60 s (qualification); VTEST = 1.2 × VISO, t = 1 s (100% production) | typ 3000 VRMS | 8 |
| Safety input, output, or supply current (1) IS | D-8 PACKAGE; RθJA =146.1°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 5-3 | max 156 mA | 10 |
| Safety input, output, or supply current (1) IS | D-8 PACKAGE; RθJA = 146.1°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 5-3 | max 238 mA | 10 |
| Safety input, output, or supply current (1) IS | D-8 PACKAGE; RθJA = 146.1°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 5-3 | max 311 mA | 10 |
| Safety input, output, or total power (1) PS | D-8 PACKAGE; RθJA = 146.1°C/W, TJ = 150°C, TA = 25°C, see Figure 5-4 | max 856 mW | 10 |
| Maximum safety temperature (1) TS | D-8 PACKAGE | max 150 °C | 10 |
| High-level output voltage VOH | VCC1 = VCC2 = 5 V ± 10%; IOH = -4 mA; see Figure 6-1; MIN = VCC2 - 0.4 | typ 4.8 V | 11 |
| Low-level output voltage VOL | VCC1 = VCC2 = 5 V ± 10%; IOL = 4 mA; see Figure 6-1 | typ 0.2 · max 0.4 V | 11 |
| High-level input current IIH | VCC1 = VCC2 = 5 V ± 10%; VIH = VCC1 at INx | max 10 uA | 11 |
| Low-level input current IIL | VCC1 = VCC2 = 5 V ± 10%; VIL = 0 V at INx | min -10 uA | 11 |
| Common mode transient immunity CMTI | VCC1 = VCC2 = 5 V ± 10%; VI = VCC1 or 0 V, VCM = 1200 V; see Figure 6-3 | min 85 · typ 100 kV/us | 11 |
| Input Capacitance (1) CI | VI = VCC/ 2 + 0.4×sin(2πft), f = 1 MHz, VCC = 5 V; measured from input pin to same side ground | typ 2 pF | 11 |
| Supply current - DC signal ICC1 | ISO7710 with F suffix; VCC1 = VCC2 = 5 V ± 10%; VI = 0 V | typ 0.5 · max 1.2 mA | 11 |
| Supply current - DC signal ICC2 | ISO7710 with F suffix; VCC1 = VCC2 = 5 V ± 10%; VI = 0 V | typ 0.6 · max 1.2 mA | 11 |
| Supply current - DC signal ICC1 | ISO7710 with F suffix; VCC1 = VCC2 = 5 V ± 10%; VI = VCC1 | typ 1.6 · max 2.4 mA | 11 |
| Supply current - DC signal ICC2 | ISO7710 with F suffix; VCC1 = VCC2 = 5 V ± 10%; VI = VCC1 | typ 0.6 · max 1.2 mA | 11 |
| Supply current - AC signal ICC1 | VCC1 = VCC2 = 5 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 1 Mbps | typ 1.1 · max 1.8 mA | 11 |
| Supply current - AC signal ICC2 | VCC1 = VCC2 = 5 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 1 Mbps | typ 0.6 · max 1.3 mA | 11 |
| Supply current - AC signal ICC1 | VCC1 = VCC2 = 5 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 10 Mbps | typ 1.1 · max 1.9 mA | 11 |
| Supply current - AC signal ICC2 | VCC1 = VCC2 = 5 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 10 Mbps | typ 1.1 · max 1.9 mA | 11 |
| Supply current - AC signal ICC1 | VCC1 = VCC2 = 5 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 100 Mbps | typ 1.4 · max 2.3 mA | 11 |
| Supply current - AC signal ICC2 | VCC1 = VCC2 = 5 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 100 Mbps | typ 5.9 · max 7.4 mA | 11 |
| High-level output voltage VOH | VCC1 = VCC2 = 3.3 V ± 10%; IOH = -2mA; see Figure 6-1; MIN = VCC2 - 0.3 | typ 3.2 V | 12 |
| Low-level output voltage VOL | VCC1 = VCC2 = 3.3 V ± 10%; IOL = 2mA; see Figure 6-1 | typ 0.1 · max 0.3 V | 12 |
| High-level input current IIH | VCC1 = VCC2 = 3.3 V ± 10%; VIH = VCC1 at INx | max 10 uA | 12 |
| Low-level input current IIL | VCC1 = VCC2 = 3.3 V ± 10%; VIL = 0 V at INx | min -10 uA | 12 |
| Common mode transient immunity CMTI | VCC1 = VCC2 = 3.3 V ± 10%; VI = VCC1 or 0 V, VCM = 1200 V; see Figure 6-3 | min 85 · typ 100 kV/us | 12 |
| Supply current - DC signal ICC1 | ISO7710 with F suffix; VCC1 = VCC2 = 3.3 V ± 10%; VI = 0 V | typ 0.5 · max 1.2 mA | 12 |
| Supply current - DC signal ICC2 | ISO7710 with F suffix; VCC1 = VCC2 = 3.3 V ± 10%; VI = 0 V | typ 0.6 · max 1.1 mA | 12 |
| Supply current - DC signal ICC1 | ISO7710 with F suffix; VCC1 = VCC2 = 3.3 V ± 10%; VI = VCC1 | typ 1.6 · max 2.4 mA | 12 |
| Supply current - DC signal ICC2 | ISO7710 with F suffix; VCC1 = VCC2 = 3.3 V ± 10%; VI = VCC1 | typ 0.6 · max 1.2 mA | 12 |
| Supply current - AC signal ICC1 | VCC1 = VCC2 = 3.3 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 1 Mbps | typ 1.1 · max 1.8 mA | 12 |
| Supply current - AC signal ICC2 | VCC1 = VCC2 = 3.3 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 1 Mbps | typ 0.6 · max 1.2 mA | 12 |
| Supply current - AC signal ICC1 | VCC1 = VCC2 = 3.3 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 10 Mbps | typ 1 · max 1.8 mA | 12 |
| Supply current - AC signal ICC2 | VCC1 = VCC2 = 3.3 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 10 Mbps | typ 1.1 · max 1.7 mA | 12 |
| Supply current - AC signal ICC1 | VCC1 = VCC2 = 3.3 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 100 Mbps | typ 1.3 · max 2.1 mA | 12 |
| Supply current - AC signal ICC2 | VCC1 = VCC2 = 3.3 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 100 Mbps | typ 4.3 · max 5.6 mA | 12 |
| High-level output voltage VOH | VCC1 = VCC2 = 2.5 V ± 10%; IOH = -1mA; see Figure 6-1; MIN = VCC2 - 0.2 | typ 2.45 V | 13 |
| Low-level output voltage VOL | VCC1 = VCC2 = 2.5 V ± 10%; IOL = 1mA; see Figure 6-1 | typ 0.05 · max 0.2 V | 13 |
| High-level input current IIH | VCC1 = VCC2 = 2.5 V ± 10%; VIH = VCC1 at INx | max 10 uA | 13 |
| Low-level input current IIL | VCC1 = VCC2 = 2.5 V ± 10%; VIL = 0 V at INx | min -10 uA | 13 |
| Common mode transient immunity CMTI | VCC1 = VCC2 = 2.5 V ± 10%; VI = VCC1 or 0 V, VCM = 1200 V; see Figure 6-3 | min 85 · typ 100 kV/us | 13 |
| Supply current - DC signal ICC1 | ISO7710 with F suffix; VCC1 = VCC2 = 2.5 V ± 10%; VI = 0 V | typ 0.5 · max 1.2 mA | 13 |
| Supply current - DC signal ICC2 | ISO7710 with F suffix; VCC1 = VCC2 = 2.5 V ± 10%; VI = 0 V | typ 0.6 · max 1.1 mA | 13 |
| Supply current - DC signal ICC1 | ISO7710 with F suffix; VCC1 = VCC2 = 2.5 V ± 10%; VI = VCC1 | typ 1.6 · max 2.3 mA | 13 |
| Supply current - DC signal ICC2 | ISO7710 with F suffix; VCC1 = VCC2 = 2.5 V ± 10%; VI = VCC1 | typ 0.6 · max 1.2 mA | 13 |
| Supply current - AC signal ICC1 | VCC1 = VCC2 = 2.5 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 1 Mbps | typ 1.1 · max 1.8 mA | 13 |
| Supply current - AC signal ICC2 | VCC1 = VCC2 = 2.5 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 1 Mbps | typ 0.6 · max 1.2 mA | 13 |
| Supply current - AC signal ICC1 | VCC1 = VCC2 = 2.5 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 10 Mbps | typ 1.1 · max 1.8 mA | 13 |
| Supply current - AC signal ICC2 | VCC1 = VCC2 = 2.5 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 10 Mbps | typ 0.9 · max 1.5 mA | 13 |
| Supply current - AC signal ICC1 | VCC1 = VCC2 = 2.5 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 100 Mbps | typ 1.2 · max 2 mA | 13 |
| Supply current - AC signal ICC2 | VCC1 = VCC2 = 2.5 V ± 10%; All channels switching with square wave clock input; CL = 15 pF; 100 Mbps | typ 3.4 · max 4.6 mA | 13 |
| Propagation delay time tPLH, tPHL | VCC1 = VCC2 = 5 V ± 10%; over recommended operating conditions; See Figure 6-1 | min 6 · typ 11 · max 17 ns | 14 |
| Pulse width distortion(1) |tPHL – tPLH| PWD | VCC1 = VCC2 = 5 V ± 10%; over recommended operating conditions; See Figure 6-1 | typ 0.6 · max 5.9 ns | 14 |
| Part-to-part skew time (2) tsk(pp) | VCC1 = VCC2 = 5 V ± 10%; over recommended operating conditions | max 4.5 ns | 14 |
| Output signal rise time tr | VCC1 = VCC2 = 5 V ± 10%; over recommended operating conditions; See Figure 6-1 | typ 1.8 · max 3.9 ns | 14 |
| Output signal fall time tf | VCC1 = VCC2 = 5 V ± 10%; over recommended operating conditions; See Figure 6-1 | typ 1.9 · max 3.9 ns | 14 |
| Default output delay time from input power loss tDO | VCC1 = VCC2 = 5 V ± 10%; measured from the time VCC1 goes below 1.7V; See Figure 6-2 | typ 0.1 · max 0.3 us | 14 |
| Time interval error tie | VCC1 = VCC2 = 5 V ± 10%; 216 – 1 PRBS data at 100 Mbps | typ 1 ns | 14 |
| Propagation delay time tPLH, tPHL | VCC1 = VCC2 = 3.3 V ± 10%; over recommended operating conditions; See Figure 6-1 | min 6 · typ 11 · max 18.5 ns | 14 |
| Pulse width distortion(1) |tPHL – tPLH| PWD | VCC1 = VCC2 = 3.3 V ± 10%; over recommended operating conditions; See Figure 6-1 | typ 0.5 · max 5.9 ns | 14 |
| Part-to-part skew time (2) tsk(pp) | VCC1 = VCC2 = 3.3 V ± 10%; over recommended operating conditions | max 4.5 ns | 14 |
| Output signal rise time tr | VCC1 = VCC2 = 3.3 V ± 10%; over recommended operating conditions; See Figure 6-1 | typ 0.7 · max 3 ns | 14 |
| Output signal fall time tf | VCC1 = VCC2 = 3.3 V ± 10%; over recommended operating conditions; See Figure 6-1 | typ 0.7 · max 3 ns | 14 |
| Default output delay time from input power loss tDO | VCC1 = VCC2 = 3.3 V ± 10%; measured from the time VCC1 goes below 1.7V; See Figure 6-2 | typ 0.1 · max 0.3 us | 14 |
| Time interval error tie | VCC1 = VCC2 = 3.3 V ± 10%; 216 – 1 PRBS data at 100 Mbps | typ 1 ns | 14 |
| Propagation delay time tPLH, tPHL | VCC1 = VCC2 = 2.5 V ± 10%; over recommended operating conditions; See Figure 6-1 | min 7.5 · typ 12 · max 21 ns | 15 |
| Pulse width distortion(1) |tPHL – tPLH| PWD | VCC1 = VCC2 = 2.5 V ± 10%; over recommended operating conditions; See Figure 6-1 | typ 0.2 · max 5.9 ns | 15 |
| Part-to-part skew time(2) tsk(pp) | VCC1 = VCC2 = 2.5 V ± 10%; over recommended operating conditions | max 4.6 ns | 15 |
| Output signal rise time tr | VCC1 = VCC2 = 2.5 V ± 10%; over recommended operating conditions; See Figure 6-1 | typ 1 · max 3.5 ns | 15 |
| Output signal fall time tf | VCC1 = VCC2 = 2.5 V ± 10%; over recommended operating conditions; See Figure 6-1 | typ 1 · max 3.5 ns | 15 |
| Default output delay time from input power loss tDO | VCC1 = VCC2 = 2.5 V ± 10%; measured from the time VCC1 goes below 1.7V; See Figure 6-2 | typ 0.1 · max 0.3 us | 15 |
| Time interval error tie | VCC1 = VCC2 = 2.5 V ± 10%; 216 – 1 PRBS data at 100 Mbps | typ 1 ns | 15 |
Pins, by the datasheet
8- 1 VCC1
- Power supply, VCC1. · p. 3
- 2 IN
- Input channel. · p. 3
- 3 VCC1
- Power supply, VCC1. · p. 3
- 4 GND1
- Ground connection for VCC1. · p. 3
- 5 GND2
- Ground connection for VCC2. · p. 3
- 6 OUT
- Output channel. · p. 3
- 7 NC
- Not connected; pin has no internal connection. · p. 3
- 8 VCC2
- Power supply, VCC2. · p. 3
Parameters
23- CMTI(kV/us)
- 100kV/us
- Current - Supply
- 1.7mA
- Current - Supply(Max)
- 9.7mA
- Data Rate
- 100Mbps
- Data Rate(Max)
- 100Mbps
- Default Output
- Low Level
- Features
- Fail-safe output
- Isolation Voltage(Vrms)
- 3000
- Junction Temperature(Max)
- 150℃
- Number of Channels
- 1
- Number of Forward Channels
- 1
- Number of Reverse Channels
- 0
- Operating Temperature
- -55℃~+125℃
- Output Current per Pin(Max)
- 15mA
- Propagation Delay(tpd)
- 11ns
- Rise Time
- 1.8ns
- Thermal Resistance(Junction to Ambient)
- 146.1℃/W
- Thermal Resistance(Junction to Board)
- 80℃/W
- Thermal Resistance(Junction to Case)
- 63.1℃/W
- Voltage - Supply
- 2.25V~5.5V
- Voltage - Supply(Absolute Max)
- 6V
- Voltage - Supply(VCCA)
- 2.25V~5.5V
- Voltage - Supply(VCCB)
- 2.25V~5.5V
Order codes
2- ISO7710FDLCSC C2845107
- ISO7710FDRLCSC C2865544
Pinout
8| Pin | Name | Type |
|---|---|---|
| 1 | VCC1 | Unspecified |
| 2 | IN | Unspecified |
| 3 | VCC1 | Unspecified |
| 4 | GND1 | Unspecified |
| 5 | GND2 | Unspecified |
| 6 | OUT | Unspecified |
| 7 | NC | Unspecified |
| 8 | VCC2 | Unspecified |
Open-source boards using it
All 1Show this part on your page
<iframe src="https://pcbkit.io/embed/parts/ti/ISO7710FD" title="ISO7710FD in PCBKit" width="100%" height="480" style="border:0;border-radius:12px" allow="fullscreen" loading="lazy"></iframe><img src="https://pcbkit.io/embed/parts/ti/ISO7710FD.jpg" alt="ISO7710FD" width="1200" height="900">[](https://pcbkit.io/parts/ti/ISO7710FD)Questions
Is there a KiCad symbol and footprint for the ISO7710FD?
Yes. The symbol is EasyEDA_Cloud:ISO7710FQDRQ1 and the footprint Package_SO:SOIC-8_3.9x4.9mm_P1.27mm, both drawn on this page. PCBKit places them on a board for you when you design with it.
What package is the ISO7710FD?
SOIC-8, with 8 pins. Its footprint is drawn on this page.
Where is the ISO7710FD datasheet?
Texas Instruments publishes it: the Datasheet link on this page opens it.
Where can I order the ISO7710FD?
JLCPCB lists it as part C2865544, with 1,439 in stock; the sellers' links on this page open their listings.
What can replace the ISO7710FD?
Parts like it in the library: the CA-IS3721CLS by Chipanalog, the ADUM1200ARZ-YC by YLPTEC, the ADUM1201ARZ-YC by YLPTEC and the ADUM1201ARZ-HX by ZHHXDZ. Check their datasheets: a part that fits the footprint may still differ in its ratings.
Which open-source boards use the ISO7710FD?
1 board in 1 repository on GitHub; the most starred are listed on this page, with their KiCad files.
Parts like it
8
CA-IS3721CLS
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SOP-8-40℃~+125℃ 1 1 100kV/us 10Mbps 3750 3V~5.5V 3V~5.5V 8ns High Level SOP-8 Digital Isolators ROHSYLPTECDigital IsolatorsADUM1201ARZ-HX
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SOP8SOP8 Digital Isolators ROHSBLDigital IsolatorsISO7721DR-Y
SOIC-8SOIC-8 Digital Isolators ROHSYLPTECDigital IsolatorsADUM1200ARZ-HX
SOIC-8-40℃~+125℃ 0 120kV/us 2 2.5V~5.5V 2.5V~5.5V 30Mbps 3750 40ns SOIC-8 Digital Isolators ROHSZHHXDZDigital IsolatorsADUM1200BRZ-HX
SOIC-8-40℃~+125℃ 0 120kV/us 2 2.5V~5.5V 2.5V~5.5V 30Mbps 3750 40ns SOIC-8 Digital Isolators ROHSZHHXDZDigital Isolators