DRV8313PWPR

Q: Is there a KiCad symbol and footprint for the DRV8313PWPR?

Yes. The symbol is EasyEDA_Cloud:DRV8313PWP and the footprint EasyEDA_Cloud:HTSSOP-28_L9.8-W4.5-P0.65-LS6.6-BL-EP, both drawn on this page. PCBKit places them on a board for you when you design with it.

Q: What package is the DRV8313PWPR?

HTSSOP-28, with 29 pins. Its footprint is drawn on this page.

Q: Where is the DRV8313PWPR datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Q: Where can I order the DRV8313PWPR?

JLCPCB lists it as part C92482, with 5,235 in stock; the sellers' links on this page open their listings.

Q: Which open-source boards use the DRV8313PWPR?

18 boards in 17 repositories on GitHub; the most starred are listed on this page, with their KiCad files.

Texas Instruments

-40℃~+125℃ 2.5A 3 800uA Three Phase Yes HTSSOP-28 Brushless DC (BLDC) Motor Driver ROHS

Extended

Datasheetti/DRV8313PWPR

Category: Brushless DC (BLDC) Motor Driver
Package: HTSSOP-28
Pins: 29

Overview

The DRV8313PWPR is a brushless DC (BLDC) Motor Driver made by Texas Instruments in a HTSSOP-28 package with 29 pins. -40℃~+125℃ 2.5A 3 800uA Three Phase Yes HTSSOP-28 Brushless DC (BLDC) Motor Driver ROHS.

PCBKit's library has its KiCad symbol (EasyEDA_Cloud:DRV8313PWP, from EasyEDA) and its footprint (EasyEDA_Cloud:HTSSOP-28_L9.8-W4.5-P0.65-LS6.6-BL-EP, from EasyEDA), ready for a KiCad board. 5,235 are in stock at JLCPCB (part C92482). 18 open-source boards in 17 repositories on GitHub use it.

Symbol

EasyEDA_Cloud:DRV8313PWPFrom EasyEDA

Footprint

EasyEDA_Cloud:HTSSOP-28_L9.8-W4.5-P0.65-LS6.6-BL-EPFrom EasyEDA

From the datasheet

Supply, least: 8 V · VM, recommended operating min · p. 5
Supply, most: 60 V · VM, recommended operating max · p. 5
Supply, absolute maximum: 65 V · VM, absolute max · p. 4
Works from: -40 °C · Operating temperature min, DRV8313PWPR · p. 12
Works up to: 125 °C · Operating temperature max, DRV8313PWPR · p. 12
Junction, hottest: 150 °C · Operating virtual junction temperature absolute max · p. 4
Takes working: 1 mA · VM operating supply current typical, VM = 24 V, fPWM < 50 kHz · p. 5
Takes at most: 5 mA · VM operating supply current max, VM = 24 V, fPWM < 50 kHz · p. 5
Takes asleep: 500 µA · VM sleep-mode supply current typical, VM = 24 V · p. 5
Gives: 1.75 A · RMS output current max per half-bridge, 24 V and 25°C with suitable PCB heatsinking · p. 1
Current limit: 3 A · Overcurrent protection trip level min · p. 5
Junction to air (PWP): 31.6 K/W · Junction-to-ambient thermal resistance · p. 4
Junction to case (PWP): 15.9 K/W · Junction-to-case top thermal resistance · p. 4
Junction to board (PWP): 5.6 K/W · Junction-to-board thermal resistance · p. 4

What it is and has

Half-H-bridge drivers: 3 · p. 1
Motor support: 3-phase brushless DC motor · p. 1
Control: Independent half-bridge control · p. 1
Current sensing: Separate low-side current-sense pins · p. 1
Comparator: General-purpose comparator for current sensing or other functions · p. 1
Integrated regulator: 3.3 V, 10 mA LDO · p. 1
Protection: Undervoltage, overcurrent, overtemperature · p. 8
Package: HTSSOP (PWP), 28 pins · p. 12

Around it

cap 0.01-μF: between CP1 and CP2; 100-V charge-pump flying capacitor. · p. 3
cap 0.1-μF: between VCP and VM; 16-V ceramic charge-pump capacitor. · p. 3
cap 0.47-μF: between V3P3OUT and GND; 6.3-V ceramic bypass capacitor. · p. 3
cap 10-µF (minimum): between VM and GND; Main supply bypass; connect both VM pins to the same supply. · p. 3

Specifications

Parameter	Conditions	As printed	Page
Power-supply voltage range (VM)	Over operating free-air temperature range	min -0.3 · max 65 V	4
Digital-pin voltage range	Over operating free-air temperature range	min -0.5 · max 7 V	4
Comparator input-voltage range	Over operating free-air temperature range	min -0.5 · max 7 V	4
Pin voltage (GND1, GND2, GND3)	Over operating free-air temperature range	min -600 · max 600 mV	4
Continuous motor-drive output current	Observe power dissipation and thermal limits	max 2.5 A	4
Operating virtual junction temperature range TJ		min -40 · max 150 ºC	4
Storage temperature range Tstg		min -60 · max 150 ºC	4
Junction-to-ambient thermal resistance θJA	DRV8313, PWP, 28 PINS; JEDEC high-K board, natural convection	typ 31.6 °C/W	4
Junction-to-case (top) thermal resistance θJCtop	DRV8313, PWP, 28 PINS	typ 15.9 °C/W	4
Junction-to-board thermal resistance θJB	DRV8313, PWP, 28 PINS	typ 5.6 °C/W	4
Junction-to-top characterization parameter ψJT	DRV8313, PWP, 28 PINS	typ 0.2 °C/W	4
Junction-to-board characterization parameter ψJB	DRV8313, PWP, 28 PINS	typ 5.5 °C/W	4
Junction-to-case (bottom) thermal resistance θJCbot	DRV8313, PWP, 28 PINS	typ 1.4 °C/W	4
Motor power-supply voltage range VM	All VM pins must be connected to the same supply voltage	min 8 · max 60 V	5
GND1, GND2, GND3 pin voltage VGNDX		min -500 · typ 0 · max 500 mV	5
V3P3OUT load current IV3P3		min 0 · max 10 mA	5
VM operating supply current IVM	TA = 25°C, VM = 24 V, fPWM < 50 kHz	typ 1 · max 5 mA	5
VM sleep-mode supply current IVMQ	TA = 25°C, VM = 24 V	typ 500 · max 800 uA	5
VM undervoltage lockout voltage VUVLO	TA = 25°C, VM rising	typ 6.3 · max 8 V	5
V3P3OUT voltage V3P3	TA = 25°C, IOUT = 0 to 10 mA	min 3.1 · typ 3.3 · max 3.52 V	5
Input low voltage VIL	TA = 25°C	typ 0.6 · max 0.7 V	5
Input high voltage VIH	TA = 25°C	min 2.2 · max 5.25 V	5
Input hysteresis VHYS	TA = 25°C	min 50 · max 600 mV	5
Input low current IIL	TA = 25°C, VIN = 0	min -5 · max 5 uA	5
Input high current IIH	TA = 25°C, VIN = 3.3 V	max 100 uA	5
Pulldown resistance RPD	TA = 25°C	typ 100 kΩ	5
Output low voltage VOL	TA = 25°C, nFAULT and COMPO open-drain outputs, IO = 5 mA	max 0.5 V	5
Output high leakage current IOH	TA = 25°C, nFAULT and COMPO open-drain outputs, VO = 3.3 V	max 1 uA	5
Common-mode input-voltage range VCM	TA = 25°C, comparator	min 0 · max 5 V	5
Input offset voltage VIO	TA = 25°C, comparator	min -7 · max 7 mV	5
Input bias current IIB	TA = 25°C, comparator	min -300 · max 300 nA	5
Response time tR	TA = 25°C, comparator, 100-mV step with 10-mV overdrive	max 2 us	5
High-side FET on-resistance rds(on)	VM = 24 V, IO = 1 A, TJ = 25°C	typ 0.24 Ω	5
High-side FET on-resistance rds(on)	VM = 24 V, IO = 1 A, TJ = 85°C	typ 0.29 · max 0.39 Ω	5
Low-side FET on-resistance rds(on)	VM = 24 V, IO = 1 A, TJ = 25°C	typ 0.24 Ω	5
Low-side FET on-resistance rds(on)	VM = 24 V, IO = 1 A, TJ = 85°C	typ 0.29 · max 0.39 Ω	5
Off-state leakage current IOFF	TA = 25°C, H-bridge FETs	min -2 · max 2 uA	5
Output dead time tDEAD	TA = 25°C	typ 90 ns	5
Overcurrent protection trip level IOCP	TA = 25°C	min 3 A	5
Overcurrent protection deglitch time tOCP	TA = 25°C	typ 5 us	5
Thermal shutdown temperature TTSD	Die temperature	min 150 · typ 160 · max 180 °C	5
Delay time, ENx high to OUTx high, INx = 1 t1	TA = 25°, VM = 24 V, RL = 20 Ω; not production tested	min 130 · max 330 ns	6
Delay time, ENx low to OUTx low, INx = 1 t2	TA = 25°, VM = 24 V, RL = 20 Ω; not production tested	min 275 · max 475 ns	6
Delay time, ENx high to OUTx low, INx = 0 t3	TA = 25°, VM = 24 V, RL = 20 Ω; not production tested	min 100 · max 300 ns	6
Delay time, ENx low to OUTx high, INx = 0 t4	TA = 25°, VM = 24 V, RL = 20 Ω; not production tested	min 200 · max 400 ns	6
Delay time, INx high to OUTx high t5	TA = 25°, VM = 24 V, RL = 20 Ω; not production tested	min 300 · max 500 ns	6
Delay time, INx low to OUTx low t6	TA = 25°, VM = 24 V, RL = 20 Ω; not production tested	min 275 · max 475 ns	6
Output rise time, resistive load to GND tr	TA = 25°, VM = 24 V, RL = 20 Ω; not production tested	min 30 · max 150 ns	6
Output fall time, resistive load to GND tf	TA = 25°, VM = 24 V, RL = 20 Ω; not production tested	min 30 · max 150 ns	6

Pins, by the datasheet

1 CP1: Charge-pump flying capacitor terminal; connect a 0.01-uF 100-V capacitor between CP1 and CP2. · p. 3
2 CP2: Charge-pump flying capacitor terminal; connect a 0.01-uF 100-V capacitor between CP1 and CP2. · p. 3
3 VCP: High-side gate drive voltage; connect a 0.1-uF 16-V ceramic capacitor to VM. · p. 3
4 VM: Main power supply; connect both VM pins to the same supply and bypass to GND with at least 10-uF capacitance. · p. 3
5 OUT1: Output 1; connect to load. · p. 4
6 PGND1: Ground for OUT1; connect to ground or a low-side current-sense resistor. · p. 4
7 PGND2: Ground for OUT2; connect to ground or a low-side current-sense resistor. · p. 4
8 OUT2: Output 2; connect to load. · p. 4
9 OUT3: Output 3; connect to load. · p. 4
10 PGND3: Ground for OUT3; connect to ground or a low-side current-sense resistor. · p. 4
11 VM: Main power supply; connect both VM pins to the same supply and bypass to GND with at least 10-uF capacitance. · p. 3
12 COMPP: Comparator positive input. · p. 3
13 COMPN: Comparator negative input. · p. 3
14 GND: Device ground; connect to system ground. · p. 3
15 V3P3OUT: 3.3-V regulator output; bypass to GND with a 0.47-uF 6.3-V ceramic capacitor; external loads are permitted. · p. 3
16 nRESET: Active-low reset initializes internal logic and disables outputs; internal pulldown. · p. 3
17 nSLEEP: High enables the device; low enters low-power sleep mode; internal pulldown. · p. 3
18 nFAULT: Low indicates overtemperature, overcurrent, or undervoltage lockout. · p. 3
19 nCOMPO: Open-drain comparator output. · p. 3
20 GND: Device ground; connect to system ground. · p. 3
21 NC: NC in package pinout. · p. 3
22 EN3: Channel 3 enable; high enables OUT3; internal pulldown. · p. 3
23 IN3: Logic input controls OUT3 state; internal pulldown. · p. 3
24 EN2: Channel 2 enable; high enables OUT2; internal pulldown. · p. 3
25 IN2: Logic input controls OUT2 state; internal pulldown. · p. 3
26 EN1: Channel 1 enable; high enables OUT1; internal pulldown. · p. 3
27 IN1: Logic input controls OUT1 state; internal pulldown. · p. 3
28 GND: Device ground; connect to system ground. · p. 3
PPAD GND: Ground thermal pad; connect to system ground and PCB copper for heat dissipation. · p. 3

Ordering codes, by the datasheet

DRV8313PWP: HTSSOP (PWP), 28 pins · 50 per tube; operating temperature -40 to 125°C · p. 12
DRV8313PWP.A: HTSSOP (PWP), 28 pins · 50 per tube; operating temperature -40 to 125°C; suffix difference unspecified · p. 12
DRV8313PWP.B: HTSSOP (PWP), 28 pins · 50 per tube; operating temperature -40 to 125°C; suffix difference unspecified · p. 12
DRV8313PWPR: HTSSOP (PWP), 28 pins · 2000 per large tape and reel; operating temperature -40 to 125°C · p. 12
DRV8313PWPR.A: HTSSOP (PWP), 28 pins · 2000 per large tape and reel; operating temperature -40 to 125°C; suffix difference unspecified · p. 12
DRV8313PWPR.B: HTSSOP (PWP), 28 pins · 2000 per large tape and reel; operating temperature -40 to 125°C; suffix difference unspecified · p. 12
DRV8313PWPRG4: HTSSOP (PWP), 28 pins · 2000 per large tape and reel; operating temperature -40 to 125°C; suffix difference unspecified · p. 12
DRV8313PWPRG4.A: HTSSOP (PWP), 28 pins · 2000 per large tape and reel; operating temperature -40 to 125°C; suffix difference unspecified · p. 12
DRV8313PWPRG4.B: HTSSOP (PWP), 28 pins · 2000 per large tape and reel; operating temperature -40 to 125°C; suffix difference unspecified · p. 12
DRV8313RHH: VQFN (RHH), 36 pins · 60 per tube; operating temperature -40 to 125°C · p. 12
DRV8313RHH.A: VQFN (RHH), 36 pins · 60 per tube; operating temperature -40 to 125°C; suffix difference unspecified · p. 12
DRV8313RHH.B: VQFN (RHH), 36 pins · 60 per tube; operating temperature -40 to 125°C; suffix difference unspecified · p. 12
DRV8313RHHR: VQFN (RHH), 36 pins · 2500 per large tape and reel; operating temperature -40 to 125°C · p. 12
DRV8313RHHR.A: VQFN (RHH), 36 pins · 2500 per large tape and reel; operating temperature -40 to 125°C; suffix difference unspecified · p. 12
DRV8313RHHR.B: VQFN (RHH), 36 pins · 2500 per large tape and reel; operating temperature -40 to 125°C; suffix difference unspecified · p. 12
DRV8313RHHRG4: VQFN (RHH), 36 pins · 2500 per large tape and reel; operating temperature -40 to 125°C; suffix difference unspecified · p. 12
DRV8313RHHRG4.A: VQFN (RHH), 36 pins · 2500 per large tape and reel; operating temperature -40 to 125°C; suffix difference unspecified · p. 12
DRV8313RHHRG4.B: VQFN (RHH), 36 pins · 2500 per large tape and reel; operating temperature -40 to 125°C; suffix difference unspecified · p. 12

Parameters

Current - Supply: 1mA
Current - Supply(Max): 5mA
Current Limit: 3A
Drive Type: Three Phase
Integrated FETs: Yes
Junction Temperature(Max): 150℃
Number of Half Bridges: 3
Operating Temperature: -40℃~+125℃
Output Current: 1.75A
Peak Current: 2.5A
Quiescent Current(Iq): 800uA
Standby Current: 500uA
Thermal Resistance(Junction to Ambient): 31.6℃/W
Thermal Resistance(Junction to Board): 5.6℃/W
Thermal Resistance(Junction to Case): 15.9℃/W
Voltage - Supply: 8V~60V
Voltage - Supply(Absolute Max): 65V

Order codes

DRV8313PWPRLCSC C92482

Pinout

The pins of the DRV8313PWPR
Pin	Name	Type
1	CP1	Unspecified
2	CP2	Unspecified
3	VCP	Unspecified
4	VM	Unspecified
5	OUT1	Unspecified
6	PGND1	Unspecified
7	PGND2	Unspecified
8	OUT2	Unspecified
9	OUT3	Unspecified
10	PGND3	Unspecified
11	VM	Unspecified
12	COMPP	Unspecified
13	COMPN	Unspecified
14	GND	Unspecified
15	V3P3OUT	Unspecified
16	RESET#	Unspecified
17	SLEEP#	Unspecified
18	FAULT#	Unspecified
19	COMPO#	Unspecified
20	GND	Unspecified
21	NC	Unspecified
22	EN3	Unspecified
23	IN3	Unspecified
24	EN2	Unspecified
25	IN2	Unspecified
26	EN1	Unspecified
27	IN1	Unspecified
28	GND	Unspecified
29	EP	Unspecified

Open-source boards using it

All 18

4 layers16.6 × 16.6 mm
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Labathome pcb
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Der kleine Bruder von lab@home. Ermöglicht das Experimentieren mit PT1...PTn-Gliedern, die intern als RC-Kombination (entkoppelt über Operationsverstärker) ausgeführt sind.
292 parts5MIT
2 layers84 × 58 mm
SmartKnobController ME507
Larson-Nick/SmartKnobController
This folder contains all mechanical and electrical design files for the Smart Knob Controller, created using KiCAD v9.0 and SolidWorks 2024.
90 parts1
2 layers
SimpleFOCminiS3
Felipegalind0/simpleFOCminiS3

4 parts
4 layers33.9 × 34.5 mm
Torque controller
jgleyze/torque_controller

34 parts
4 layers50 × 50 mm
Drv8313-board
kaydensigh/drv8313-board
Open-hardware DRV8313 3-phase motor driver module (8-60V, 4-layer). Derived from SimpleFOCMini.
30 partsMIT
4 layers50.8 × 0.5 mm
Focus Dial
realamoghm/Focus-Dial
A standalone hardware controller that allows users to enter, manage, and visualize focus states through a simple physical interaction.
96 parts
4 layers46 × 46 mm
Foc driver
Zhang-JK/Dual-FOC-Controller

65 parts

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Questions

Is there a KiCad symbol and footprint for the DRV8313PWPR?

Yes. The symbol is EasyEDA_Cloud:DRV8313PWP and the footprint EasyEDA_Cloud:HTSSOP-28_L9.8-W4.5-P0.65-LS6.6-BL-EP, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the DRV8313PWPR?

HTSSOP-28, with 29 pins. Its footprint is drawn on this page.

Where is the DRV8313PWPR datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Where can I order the DRV8313PWPR?

JLCPCB lists it as part C92482, with 5,235 in stock; the sellers' links on this page open their listings.

Which open-source boards use the DRV8313PWPR?

18 boards in 17 repositories on GitHub; the most starred are listed on this page, with their KiCad files.