| Supply voltage VCC | | min -0.3 · max 4 V | 6 |
| Supply voltage differences VCC to VDD | | min -0.1 · max 0.1 V | 6 |
| Ground voltage differences AGND to DGND | | min -0.1 · max 0.1 V | 6 |
| Digital input voltage | Digital input | min -0.3 · max 6.5 V | 6 |
| Digital input voltage | Digital output; maximum (VDD + 0.3) < 4 V | min -0.3 V | 6 |
| Analog input voltage | XTI, XTO; maximum (VCC + 0.3) < 4 V | min -0.3 V | 6 |
| Analog input voltage | FILT; maximum (VCC + 0.3) < 4 V | min -0.3 V | 6 |
| Input current (any pins except supplies) | | min -10 · max 10 mA | 6 |
| Ambient temperature under bias | | min -40 · max 125 °C | 6 |
| Junction temperature | | max 150 °C | 6 |
| Lead temperature (soldering) | | max 260 °C | 6 |
| Package temperature (reflow, peak) | | max 260 °C | 6 |
| Storage temperature Tstg | | min -55 · max 150 °C | 6 |
| Electrostatic discharge V(ESD) | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001; rating ±500 V | max 500 V | 6 |
| Electrostatic discharge V(ESD) | Charged-device model (CDM), per JEDEC specification JESD22-C101; rating ±250 V | max 250 V | 6 |
| Analog supply voltage VCC | | min 2.7 · typ 3.3 · max 3.6 VDC | 6 |
| Digital supply voltage VDD | | min 2.7 · typ 3.3 · max 3.6 VDC | 6 |
| Digital input clock frequency | XTI is connected to clock source | typ 24.576 MHz | 6 |
| Digital output load capacitance, except SCKO | | max 20 pF | 6 |
| Digital output load capacitance (SCKO) | | max 10 pF | 6 |
| Operating free-air temperature TA | | min -40 · max 85 °C | 6 |
| Junction-to-ambient thermal resistance RθJA | TSSOP (PW), 28 pins | typ 81.9 °C/W | 7 |
| Junction-to-case (top) thermal resistance RθJC(top) | TSSOP (PW), 28 pins | typ 22.5 °C/W | 7 |
| Junction-to-board thermal resistance RθJB | TSSOP (PW), 28 pins | typ 40 °C/W | 7 |
| Junction-to-top characterization parameter ψJT | TSSOP (PW), 28 pins | typ 0.7 °C/W | 7 |
| Junction-to-board characterization parameter ψJB | TSSOP (PW), 28 pins | typ 39.4 °C/W | 7 |
| Input logic level (2) VIH | 5-V tolerant TTL inputs: RXIN, FMT0, FMT1, PSCK0, PSCK1, CKSEL, RST, RSV | min 2 · max 5.5 VDC | 7 |
| Input logic level (2) VIL | 5-V tolerant TTL inputs: RXIN, FMT0, FMT1, PSCK0, PSCK1, CKSEL, RST, RSV | max 0.8 VDC | 7 |
| Input leakage current (4) IIH | VIN = VDD; internal pulldowns: FMT0, FMT1, PSCK0, PSCK1, CKSEL, RSV | typ 65 · max 100 uA | 7 |
| Input leakage current (4) IIL | VIN = 0 V; internal pulldowns: FMT0, FMT1, PSCK0, PSCK1, CKSEL, RSV | min -10 · max 10 uA | 7 |
| Input leakage current (5) IIH | VIN = VDD; internal pullup: RST | min -10 · max 10 uA | 7 |
| Input leakage current (5) IIL | VIN = 0 V; internal pullup: RST | min -100 · typ -65 uA | 7 |
| Input leakage current (6) IIH | VIN = VDD; no internal pullup and pulldown: RXIN, XTI | min -10 · max 10 uA | 7 |
| Input leakage current (6) IIL | VIN = 0 V; no internal pullup and pulldown: RXIN, XTI | min -10 · max 10 uA | 7 |
| Serial audio data width | | min 16 · max 24 Bit | 7 |
| SCKO jitter | fS = 48 kHz, SCKO = 256 fS, measured periodic | typ 50 · max 100 ps rms | 7 |
| Frequency accuracy | XTI is connected to clock source | min -100 · max 100 ppm | 7 |
| Operation voltage range VCC | | min 2.7 · typ 3.3 · max 3.6 VDC | 7 |
| Operation voltage range VDD | | min 2.7 · typ 3.3 · max 3.6 VDC | 7 |
| Supply current (7) ICC | fS = 96 kHz, PLL locked, XTI connected to DGND; no output load | typ 6 · max 8.3 mA | 7 |
| Supply current (7) ICC | fS = 96 kHz, PLL locked, XTI connected to 24.576-MHz resonator; no output load | typ 6 · max 8.3 mA | 7 |
| Supply current (7) ICC | RXIN = H or L, XTI = L, RST = L; no output load | typ 130 uA | 7 |
| Supply current (7) IDD | fS = 96 kHz, PLL locked, XTI connected to 24.576-MHz resonator; no output load | typ 9 · max 12.4 mA | 8 |
| Supply current (7) IDD | RXIN = H or L, XTI = L, RST = L; no output load | typ 72 uA | 8 |
| Power dissipation (7) PD | fS = 96 kHz, PLL locked, XTI connected to DGND; no output load | typ 40 · max 55 mW | 8 |
| Power dissipation (7) PD | fS = 96 kHz, PLL locked, XTI connected to 24.576-MHz resonator; no output load | typ 50 · max 68 mW | 8 |
| Power dissipation (7) PD | RXIN = H or L, XTI = L, RST = L; no output load | typ 0.67 mW | 8 |
| Operation temperature range TA | | min -40 · max 85 °C | 8 |
| Thermal resistance θJA | 28-pin T-SSOP | typ 105 °C/W | 8 |
| Input sampling frequency range | | min 28 · max 108 kHz | 8 |
| XTI source clock frequency | XTI is connected to clock source | typ 24.576 MHz | 8 |
| XTI input-clock duty cycle | XTI is connected to clock source | min 45 · max 55 % | 8 |
| CLKST pulse duration, high tCLKST | | min 4 · max 20 us | 8 |
| System clock pulse cycle time tSCY | | min 18 ns | 8 |
| Delay time of SCK rising edge to BCK rising edge tSCBC | | min 4 · typ 8 · max 15 ns | 8 |
| Delay time of BCKO falling edge to LRCKO valid tCKLR | See Figure 16 | min -5 · typ 0.5 · max 0.5 ns | 8 |
| BCKO pulse duration, HIGH tBCH | See Figure 16 | min 60 ns | 8 |
| BCKO pulse duration, LOW tBCL | See Figure 16 | min 60 ns | 8 |
| Delay time of BCKO falling edge to DOUT valid tBCDO | See Figure 16 | min -5 · typ 1 · max 5 ns | 8 |
| Rising time of all signals tr | | max 10 ns | 8 |
| Falling time of all signals tf | | max 10 ns | 8 |
| PLL lock-up time | From biphase signal detection to error-out release (ERROR = L) | max 100 ms | 9 |
| SCKO frequency | 128 fS | min 3.584 · max 13.824 MHz | 9 |
| SCKO frequency | 256 fS | min 7.168 · max 27.648 MHz | 9 |
| SCKO frequency | 384 fS | min 10.752 · max 41.472 MHz | 9 |
| SCKO frequency | 512 fS | min 14.336 · max 55.296 MHz | 9 |
| BCKO frequency | 64 fS | min 1.792 · max 6.912 MHz | 9 |
| LRCKO frequency | fS | min 28 · max 108 kHz | 9 |
| SCKO duty cycle | | min 45 · max 55 % | 9 |