
B091 2-4channel 24bit ADC ADS131M02-4
skunkforce/b091_2-4channel_24bit_ADC_ADS131M02-4
to pull the submodules before opening the project with kicad.
Texas InstrumentsExtended
-40℃~+125℃ 2.7V~3.6V 24 4 4mA 64kHz 79dB 8.192MHz Built-in External Input buffer、Power-on reset、Integrated modulator、Synchronous triggering、Simultaneous sampling、Built-in digital filter SPI Sigma-Delta Support Yes TSSOP-20 Analog to Digital Converters (ADC) ROHS
The ADS131M04IPW is an analog To Digital Converter made by Texas Instruments in a TSSOP-20 package with 20 pins. -40℃~+125℃ 2.7V~3.6V 24 4 4mA 64kHz 79dB 8.192MHz Built-in External Input buffer、Power-on reset、Integrated modulator、Synchronous triggering、Simultaneous sampling、Built-in digital filter SPI Sigma-Delta Support Yes TSSOP-20 Analog to Digital Converters (ADC) ROHS.
PCBKit's library has its KiCad symbol (Analog_ADC:ADS131M04xPW, from KiCad's library) and its footprint (Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm, from KiCad's library), ready for a KiCad board. 999 are in stock at JLCPCB (part C2862562). 8 open-source boards in 5 repositories on GitHub use it.
| Parameter | Conditions | As printed | Page |
|---|---|---|---|
| Power-supply voltage | AVDD to AGND | min -0.3 · max 3.9 V | 5 |
| Power-supply voltage | AGND to DGND | min -0.3 · max 0.3 V | 5 |
| Power-supply voltage | DVDD to DGND | min -0.3 · max 3.9 V | 5 |
| Power-supply voltage | DVDD to DGND, CAP tied to DVDD | min -0.3 · max 2.2 V | 5 |
| Power-supply voltage | CAP to DGND | min -0.3 · max 2.2 V | 5 |
| Input current | Continuous, all pins except power-supply pins | min -10 · max 10 mA | 5 |
| Temperature TJ | Junction | max 150 °C | 5 |
| Temperature Tstg | Storage | min -60 · max 150 °C | 5 |
| Electrostatic discharge V(ESD) | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1); rating ±2000 V | max 2000 V | 5 |
| Electrostatic discharge V(ESD) | Charged device model (CDM), per JEDEC specification JESD22-C101(2); rating ±500 V | max 500 V | 5 |
| Analog power supply | AVDD to AGND, normal operating modes; typ field is NOM | min 2.7 · typ 3 · max 3.6 V | 6 |
| Analog power supply | AVDD to AGND, standby and current-detect modes; typ field is NOM | min 2.4 · typ 3 · max 3.6 V | 6 |
| Analog power supply | AGND to DGND; typ field is NOM | min -0.3 · typ 0 · max 0.3 V | 6 |
| Digital power supply | DVDD to DGND; typ field is NOM | min 2.7 · typ 3 · max 3.6 V | 6 |
| Digital power supply | DVDD to DGND, DVDD shorted to CAP (digital LDO bypassed); typ field is NOM | min 1.65 · typ 1.8 · max 2 V | 6 |
| External clock frequency fCLKIN | High-resolution mode; typ field is NOM | min 0.3 · typ 8.192 · max 8.4 MHz | 6 |
| External clock frequency fCLKIN | Low-power mode; typ field is NOM | min 0.3 · typ 4.096 · max 4.15 MHz | 6 |
| External clock frequency fCLKIN | Very-low-power mode; typ field is NOM | min 0.3 · typ 2.048 · max 2.08 MHz | 6 |
| Duty cycle | External clock source; typ field is NOM | min 40 · typ 50 · max 60 % | 6 |
| Operating ambient temperature TA | min -40 · max 125 °C | 6 | |
| Junction-to-ambient thermal resistance RθJA | PW (TSSOP), 20 pins | typ 94.9 °C/W | 6 |
| Junction-to-case (top) thermal resistance RθJC(top) | PW (TSSOP), 20 pins | typ 34.9 °C/W | 6 |
| Junction-to-board thermal resistance RθJB | PW (TSSOP), 20 pins | typ 46.4 °C/W | 6 |
| Junction-to-top characterization parameter ΨJT | PW (TSSOP), 20 pins | typ 2.7 °C/W | 6 |
| Junction-to-board characterization parameter ΨJB | PW (TSSOP), 20 pins | typ 46 °C/W | 6 |
| Input bias current IB | Gain = 1, 2, or 4, VINP = VINN = 0 V, IB = (IBP + IBN) / 2 | typ 0.6 uA | 7 |
| Input bias current IB | Gain = 8, 16, 32, 64 or 128, VINP = VINN = 0 V, IB = (IBP + IBN) / 2 | typ 0.2 uA | 7 |
| Differential input impedance Zin | Gain = 1, 2, or 4 | typ 300 kΩ | 7 |
| Differential input impedance Zin | Gain = 8, 16, 32, 64, or 128; ±1 uA/V, current can flow either into or out of the input pin | typ 1 uA/V | 7 |
| Resolution | min 24 Bits | 7 | |
| Data rate fDATA | High-resolution mode, fCLKIN = 8.192 MHz | min 250 SPS | 7 |
| Data rate fDATA | Low-power mode, fCLKIN = 4.096 MHz | min 125 SPS | 7 |
| Data rate fDATA | Very-low-power mode, fCLKIN = 2.048 MHz | min 62.5 SPS | 7 |
| Startup time | Measured from supplies at 90% to first DRDY falling edge | typ 0.5 ms | 7 |
| Integral nonlinearity (best fit) INL | typ 6 ppm of FSR | 7 | |
| Offset error (input referred) | Global-chop mode disabled; typical ±175 uV | typ 175 uV | 7 |
| Offset error (input referred) | Global-chop mode, channel 0; typical ±35 uV | typ 35 uV | 7 |
| Offset error (input referred) | Global-chop mode, channels 1-3; typical ±15 uV | typ 15 uV | 7 |
| Offset drift | Global-chop mode disabled | typ 300 nV/°C | 7 |
| Offset drift | Global-chop mode | typ 200 nV/°C | 7 |
| Offset error time drift | 1000 hours at 85°C, TSSOP package | typ 4 uV | 7 |
| Gain error | Typical ±0.1% | typ 0.1 % | 7 |
| Gain drift | Including internal reference | typ 8.5 ppm/°C | 7 |
| Gain error time drift | 1000 hours at 85°C, TSSOP package | typ 400 ppm | 7 |
| Common-mode rejection ratio CMRR | At dc | typ 100 dB | 7 |
| Common-mode rejection ratio CMRR | fCM = 50 Hz or 60 Hz | typ 94 dB | 7 |
| Power-supply rejection ratio PSRR | AVDD at dc | typ 75 dB | 7 |
| Power-supply rejection ratio PSRR | DVDD at dc | typ 88 dB | 7 |
| Power-supply rejection ratio PSRR | AVDD supply, fPS = 50 Hz or 60 Hz | typ 78 dB | 7 |
| Power-supply rejection ratio PSRR | DVDD supply, fPS = 50 Hz or 60 Hz | typ 85 dB | 7 |
| Input-referred noise | typ 5.35 uVRMS | 7 | |
| Input-referred noise | During fast-startup | typ 1.5 mVRMS | 7 |
| Dynamic range | Gain = 1 | min 99 · typ 102 dB | 7 |
| Dynamic range | Gain = 64 | typ 80 dB | 7 |
| Crosstalk | fIN = 50 Hz or 60 Hz | typ -120 dB | 7 |
| Signal-to-noise ratio SNR | fIN = 50 Hz or 60 Hz, gain = 1, VIN = –0.5 dBFS, normalized | typ 100 dB | 7 |
| Signal-to-noise ratio SNR | fIN = 50 Hz or 60 Hz, gain = 64, VIN = –0.5 dBFS, normalized | typ 79 dB | 7 |
| Total harmonic distortion THD | fIN = 50 Hz or 60 Hz (up to 50 harmonics), VIN = –0.5 dBFS | typ -100 dB | 7 |
| Spurious-free dynamic range SFDR | fIN = 50 Hz or 60 Hz (up to 50 harmonics), VIN = –0.5 dBFS | typ 105 dB | 8 |
| Internal reference voltage VREF | typ 1.2 V | 8 | |
| Accuracy | Internal voltage reference; TA = 25°C; typical ±0.1% | typ 0.1 % | 8 |
| Temperature drift | Internal voltage reference | typ 7.5 · max 20 ppm/°C | 8 |
| Input current IIN | DGND < VDigital Input < DVDD | min -1 · max 1 uA | 8 |
| Analog supply current IAVDD | High-resolution mode | typ 3.5 · max 4 mA | 8 |
| Analog supply current IAVDD | Low-power mode | typ 2 · max 2.2 mA | 8 |
| Analog supply current IAVDD | Very-low-power mode | typ 1 · max 1.2 mA | 8 |
| Analog supply current IAVDD | Current-detect mode | typ 0.9 mA | 8 |
| Analog supply current IAVDD | Standby mode | typ 0.3 uA | 8 |
| Digital supply current(2) IDVDD | High-resolution mode; SPI idle | typ 0.4 · max 0.5 mA | 8 |
| Digital supply current(2) IDVDD | Low-power mode; SPI idle | typ 0.2 · max 0.3 mA | 8 |
| Digital supply current(2) IDVDD | Very-low-power mode; SPI idle | typ 0.1 · max 0.2 mA | 8 |
| Digital supply current(2) IDVDD | Current-detect mode; SPI idle | typ 0.065 mA | 8 |
| Digital supply current(2) IDVDD | Standby mode; SPI idle | typ 1 uA | 8 |
| Power dissipation PD | High-resolution mode | typ 12 mW | 8 |
| Power dissipation PD | Low-power mode | typ 6.6 mW | 8 |
| Power dissipation PD | Very-low-power mode | typ 3.3 mW | 8 |
| Power dissipation PD | Current-detect mode | typ 2.9 mW | 8 |
| Power dissipation PD | Standby mode | typ 3.9 uW | 8 |
| Pulse duration, CLKIN high tw(CLH) | 1.65 V ≤ DVDD ≤ 2.0 V | min 49 ns | 9 |
| Pulse duration, CLKIN low tw(CLL) | 1.65 V ≤ DVDD ≤ 2.0 V | min 49 ns | 9 |
| SCLK period tc(SC) | 1.65 V ≤ DVDD ≤ 2.0 V | min 64 ns | 9 |
| Pulse duration, SCLK low tw(SCL) | 1.65 V ≤ DVDD ≤ 2.0 V | min 32 ns | 9 |
| Pulse duration, SCLK high tw(SCH) | 1.65 V ≤ DVDD ≤ 2.0 V | min 32 ns | 9 |
| Delay time, first SCLK rising edge after CS falling edge td(CSSC) | 1.65 V ≤ DVDD ≤ 2.0 V | min 16 ns | 9 |
| Delay time, CS rising edge after final SCLK falling edge td(SCCS) | 1.65 V ≤ DVDD ≤ 2.0 V | min 10 ns | 9 |
| Pulse duration, CS high tw(CSH) | 1.65 V ≤ DVDD ≤ 2.0 V | min 20 ns | 9 |
| Setup time, DIN valid before SCLK falling egde tsu(DI) | 1.65 V ≤ DVDD ≤ 2.0 V | min 5 ns | 9 |
| Hold time, DIN valid after SCLK falling edge th(DI) | 1.65 V ≤ DVDD ≤ 2.0 V | min 8 ns | 9 |
| Pulse duration, SYNC/RESET low to generate device reset tw(RSL) | 1.65 V ≤ DVDD ≤ 2.0 V | min 2048 tCLKIN | 9 |
| Pulse duration, SYNC/RESET low for synchronization tw(SYL) | 1.65 V ≤ DVDD ≤ 2.0 V | min 1 · max 2047 tCLKIN | 9 |
| Setup time, SYNC/RESET valid before CLKIN rising edge tsu(SY) | 1.65 V ≤ DVDD ≤ 2.0 V | min 10 ns | 9 |
| Pulse duration, CLKIN low tw(CLL) | 2.7 V ≤ DVDD ≤ 3.6 V | min 49 ns | 9 |
| Pulse duration, CLKIN high tw(CLH) | 2.7 V ≤ DVDD ≤ 3.6 V | min 49 ns | 9 |
| SCLK period tc(SC) | 2.7 V ≤ DVDD ≤ 3.6 V | min 40 ns | 9 |
| Pulse duration, SCLK low tw(SCL) | 2.7 V ≤ DVDD ≤ 3.6 V | min 20 ns | 9 |
| Pulse duration, SCLK high tw(SCH) | 2.7 V ≤ DVDD ≤ 3.6 V | min 20 ns | 9 |
| Delay time, first SCLK rising edge after CS falling edge td(CSSC) | 2.7 V ≤ DVDD ≤ 3.6 V | min 16 ns | 9 |
| Delay time, CS rising edge after final SCLK falling edge td(SCCS) | 2.7 V ≤ DVDD ≤ 3.6 V | min 10 ns | 9 |
| Pulse duration, CS high tw(CSH) | 2.7 V ≤ DVDD ≤ 3.6 V | min 15 ns | 9 |
| Setup time, DIN valid before SCLK falling egde tsu(DI) | 2.7 V ≤ DVDD ≤ 3.6 V | min 5 ns | 9 |
| Hold time, DIN valid after SCLK falling edge th(DI) | 2.7 V ≤ DVDD ≤ 3.6 V | min 8 ns | 9 |
| Pulse duration, SYNC/RESET low to generate device reset tw(RSL) | 2.7 V ≤ DVDD ≤ 3.6 V | min 2048 tCLKIN | 9 |
| Pulse duration, SYNC/RESET low for synchronization tw(SYL) | 2.7 V ≤ DVDD ≤ 3.6 V | min 1 · max 2047 tCLKIN | 9 |
| Setup time, SYNC/RESET valid before CLKIN rising edge tsu(SY) | 2.7 V ≤ DVDD ≤ 3.6 V | min 10 ns | 9 |
| Propagation delay time, CS falling edge to DOUT driven tp(CSDO) | 1.65 V ≤ DVDD ≤ 2.0 V; DOUT load: 20 pF || 100 kΩ | max 50 ns | 9 |
| Progapation delay time, SCLK rising edge to valid new DOUT tp(SCDO) | 1.65 V ≤ DVDD ≤ 2.0 V; DOUT load: 20 pF || 100 kΩ | max 32 ns | 9 |
| Propagation delay time, CS rising edge to DOUT high impedance tp(CSDOZ) | 1.65 V ≤ DVDD ≤ 2.0 V; DOUT load: 20 pF || 100 kΩ | max 75 ns | 9 |
| Pulse duration, DRDY high tw(DRH) | 1.65 V ≤ DVDD ≤ 2.0 V | typ 4 tCLKIN | 9 |
| Pulse duration, DRDY low tw(DRL) | 1.65 V ≤ DVDD ≤ 2.0 V | typ 4 tCLKIN | 9 |
| SPI timeout | 1.65 V ≤ DVDD ≤ 2.0 V | min 32768 tCLKIN | 9 |
| Power-on-reset time tPOR | 1.65 V ≤ DVDD ≤ 2.0 V; measured from supplies at 90% to first DRDY rising edge | typ 250 us | 9 |
| Register default acquisition time tREGACQ | 1.65 V ≤ DVDD ≤ 2.0 V | typ 5 us | 9 |
| Propagation delay time, CS falling edge to DOUT driven tp(CSDO) | 2.7 V ≤ DVDD ≤ 3.6 V; over operating ambient temperature range; DOUT load: 20 pF || 100 kΩ | max 50 ns | 10 |
| Progapation delay time, SCLK rising edge to valid new DOUT tp(SCDO) | 2.7 V ≤ DVDD ≤ 3.6 V; over operating ambient temperature range; DOUT load: 20 pF || 100 kΩ | max 20 ns | 10 |
| Propagation delay time, CS rising edge to DOUT high impedance tp(CSDOZ) | 2.7 V ≤ DVDD ≤ 3.6 V; over operating ambient temperature range; DOUT load: 20 pF || 100 kΩ | max 75 ns | 10 |
| Pulse duration, DRDY high tw(DRH) | 2.7 V ≤ DVDD ≤ 3.6 V; over operating ambient temperature range; DOUT load: 20 pF || 100 kΩ | typ 4 tCLKIN | 10 |
| Pulse duration, DRDY low tw(DRL) | 2.7 V ≤ DVDD ≤ 3.6 V; over operating ambient temperature range; DOUT load: 20 pF || 100 kΩ | typ 4 tCLKIN | 10 |
| SPI timeout | 2.7 V ≤ DVDD ≤ 3.6 V; over operating ambient temperature range; DOUT load: 20 pF || 100 kΩ | min 32768 tCLKIN | 10 |
| Power-on-reset time tPOR | Measured from supplies at 90% to first DRDY rising edge; 2.7 V ≤ DVDD ≤ 3.6 V | typ 250 us | 10 |
| Register default acquisition time tREGACQ | 2.7 V ≤ DVDD ≤ 3.6 V; over operating ambient temperature range; DOUT load: 20 pF || 100 kΩ | typ 5 us | 10 |

skunkforce/b091_2-4channel_24bit_ADC_ADS131M02-4
to pull the submodules before opening the project with kicad.



jayis1/hacker-devices
Full-cycle hardware designs for security research devices — each device is a subfolder with its own README, schematics, PCB layout, and software stack

jayis1/hacker-devices
Full-cycle hardware designs for security research devices — each device is a subfolder with its own README, schematics, PCB layout, and software stack

jayis1/hardware-design-lab
Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

jayis1/hardware-design-lab
Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

Yes. The symbol is Analog_ADC:ADS131M04xPW and the footprint Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm, both drawn on this page. PCBKit places them on a board for you when you design with it.
TSSOP-20, with 20 pins. Its footprint is drawn on this page.
Texas Instruments publishes it: the Datasheet link on this page opens it.
JLCPCB lists it as part C2862562, with 999 in stock; the sellers' links on this page open their listings.
Parts like it in the library: the ADS131M02IPW by Texas Instruments, the ADS131M03IPW by Texas Instruments, the ADS131M08IPBSR by Texas Instruments and the ADS131M02IRUK by Texas Instruments. Check their datasheets: a part that fits the footprint may still differ in its ratings.
8 boards in 5 repositories on GitHub; the most starred are listed on this page, with their KiCad files.