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ADS131M04IPW

Texas InstrumentsExtended

-40℃~+125℃ 2.7V~3.6V 24 4 4mA 64kHz 79dB 8.192MHz Built-in External Input buffer、Power-on reset、Integrated modulator、Synchronous triggering、Simultaneous sampling、Built-in digital filter SPI Sigma-Delta Support Yes TSSOP-20 Analog to Digital Converters (ADC) ROHS

Part id
ti/ADS131M04IPW
Category
Analog To Digital Converters (ADC)
Package
TSSOP-20
Pins
20
In stock
999 at JLCPCB (C2862562)
Used on
8 open-source boards

Overview

The ADS131M04IPW is an analog To Digital Converter made by Texas Instruments in a TSSOP-20 package with 20 pins. -40℃~+125℃ 2.7V~3.6V 24 4 4mA 64kHz 79dB 8.192MHz Built-in External Input buffer、Power-on reset、Integrated modulator、Synchronous triggering、Simultaneous sampling、Built-in digital filter SPI Sigma-Delta Support Yes TSSOP-20 Analog to Digital Converters (ADC) ROHS.

PCBKit's library has its KiCad symbol (Analog_ADC:ADS131M04xPW, from KiCad's library) and its footprint (Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm, from KiCad's library), ready for a KiCad board. 999 are in stock at JLCPCB (part C2862562). 8 open-source boards in 5 repositories on GitHub use it.

Symbol

AIN1N5DOUT15DIN16CLKIN17CAP18DGND19DVDD20AVDD1AGND2AIN0P3AIN0N4AIN1P6AIN2P7AIN2N8AIN3N9AIN3P10SYNC/RESET11CS12DRDY13SCLK14
Analog_ADC:ADS131M04xPWFrom KiCad's library

Footprint

1234567891011121314151617181920
Package_SO:TSSOP-20_4.4x6.5mm_P0.65mmFrom KiCad's library

From the datasheet

16
Supply, least
2.7 V · AVDD, normal operating modes, min · p. 6
Supply, most
3.6 V · AVDD, normal operating modes, max · p. 6
Supply, least
2.4 V · AVDD, standby and current-detect modes, min · p. 6
Supply, least
1.65 V · DVDD, digital LDO bypassed, min · p. 6
Supply, most
2 V · DVDD, digital LDO bypassed, max · p. 6
Supply, absolute maximum
3.9 V · AVDD to AGND, absolute max · p. 5
Supply, absolute maximum
2.2 V · DVDD to DGND, CAP tied to DVDD, absolute max · p. 5
Works from
-40 °C · Operating ambient temperature, min · p. 6
Works up to
125 °C · Operating ambient temperature, max · p. 6
Junction, hottest
150 °C · Junction temperature, absolute max · p. 5
Takes working
3.9 mA · sum of AVDD and DVDD, high-resolution mode, SPI idle, typical · p. 8
Takes at most
4.5 mA · sum of AVDD and DVDD, high-resolution mode, SPI idle, max · p. 8
Takes asleep
1.3 µA · sum of AVDD and DVDD, standby mode, typical · p. 8
Junction to air (PW (TSSOP))
94.9 K/W · Junction-to-ambient thermal resistance · p. 6
Junction to case (PW (TSSOP))
34.9 K/W · Junction-to-case (top) thermal resistance · p. 6
Junction to board (PW (TSSOP))
46.4 K/W · Junction-to-board thermal resistance · p. 6

What it is and has

15
ADC
4-channel, simultaneously sampling, 24-bit, delta-sigma · p. 1
Differential inputs
4, simultaneously sampling · p. 1
Data rate
Programmable up to 64 kSPS · p. 1
Programmable gain
Up to 128 · p. 1
Dynamic range
102 dB at gain = 1, 4 kSPS · p. 1
Dynamic range
80 dB at gain = 64, 4 kSPS · p. 1
Total harmonic distortion
–100 dB · p. 1
Channel phase calibration resolution
244 ns at 8.192-MHz fCLKIN · p. 1
Crosstalk between channels
–120 dB · p. 1
Internal reference
Low-drift, 1.2 V · p. 1
CRC
Communications and register map · p. 1
Package options
20-pin TSSOP or 20-pin WQFN · p. 1
Differential inputs
4 simultaneously sampling · p. 1
Internal reference
Nominal 1.2 V · p. 19
Communication CRC
16-bit input and output CRC · p. 28

Around it

3
cap 1 µF
between AVDD and AGND; Analog supply capacitor. · p. 4
cap 220 nF
between CAP and DGND; Digital LDO regulator output capacitor. · p. 4
cap 1 µF
between DVDD and DGND; Digital I/O supply capacitor. · p. 4

Specifications

120
ParameterConditionsAs printedPage
Power-supply voltageAVDD to AGNDmin -0.3 · max 3.9 V5
Power-supply voltageAGND to DGNDmin -0.3 · max 0.3 V5
Power-supply voltageDVDD to DGNDmin -0.3 · max 3.9 V5
Power-supply voltageDVDD to DGND, CAP tied to DVDDmin -0.3 · max 2.2 V5
Power-supply voltageCAP to DGNDmin -0.3 · max 2.2 V5
Input currentContinuous, all pins except power-supply pinsmin -10 · max 10 mA5
Temperature TJJunctionmax 150 °C5
Temperature TstgStoragemin -60 · max 150 °C5
Electrostatic discharge V(ESD)Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1); rating ±2000 Vmax 2000 V5
Electrostatic discharge V(ESD)Charged device model (CDM), per JEDEC specification JESD22-C101(2); rating ±500 Vmax 500 V5
Analog power supplyAVDD to AGND, normal operating modes; typ field is NOMmin 2.7 · typ 3 · max 3.6 V6
Analog power supplyAVDD to AGND, standby and current-detect modes; typ field is NOMmin 2.4 · typ 3 · max 3.6 V6
Analog power supplyAGND to DGND; typ field is NOMmin -0.3 · typ 0 · max 0.3 V6
Digital power supplyDVDD to DGND; typ field is NOMmin 2.7 · typ 3 · max 3.6 V6
Digital power supplyDVDD to DGND, DVDD shorted to CAP (digital LDO bypassed); typ field is NOMmin 1.65 · typ 1.8 · max 2 V6
External clock frequency fCLKINHigh-resolution mode; typ field is NOMmin 0.3 · typ 8.192 · max 8.4 MHz6
External clock frequency fCLKINLow-power mode; typ field is NOMmin 0.3 · typ 4.096 · max 4.15 MHz6
External clock frequency fCLKINVery-low-power mode; typ field is NOMmin 0.3 · typ 2.048 · max 2.08 MHz6
Duty cycleExternal clock source; typ field is NOMmin 40 · typ 50 · max 60 %6
Operating ambient temperature TAmin -40 · max 125 °C6
Junction-to-ambient thermal resistance RθJAPW (TSSOP), 20 pinstyp 94.9 °C/W6
Junction-to-case (top) thermal resistance RθJC(top)PW (TSSOP), 20 pinstyp 34.9 °C/W6
Junction-to-board thermal resistance RθJBPW (TSSOP), 20 pinstyp 46.4 °C/W6
Junction-to-top characterization parameter ΨJTPW (TSSOP), 20 pinstyp 2.7 °C/W6
Junction-to-board characterization parameter ΨJBPW (TSSOP), 20 pinstyp 46 °C/W6
Input bias current IBGain = 1, 2, or 4, VINP = VINN = 0 V, IB = (IBP + IBN) / 2typ 0.6 uA7
Input bias current IBGain = 8, 16, 32, 64 or 128, VINP = VINN = 0 V, IB = (IBP + IBN) / 2typ 0.2 uA7
Differential input impedance ZinGain = 1, 2, or 4typ 300 kΩ7
Differential input impedance ZinGain = 8, 16, 32, 64, or 128; ±1 uA/V, current can flow either into or out of the input pintyp 1 uA/V7
Resolutionmin 24 Bits7
Data rate fDATAHigh-resolution mode, fCLKIN = 8.192 MHzmin 250 SPS7
Data rate fDATALow-power mode, fCLKIN = 4.096 MHzmin 125 SPS7
Data rate fDATAVery-low-power mode, fCLKIN = 2.048 MHzmin 62.5 SPS7
Startup timeMeasured from supplies at 90% to first DRDY falling edgetyp 0.5 ms7
Integral nonlinearity (best fit) INLtyp 6 ppm of FSR7
Offset error (input referred)Global-chop mode disabled; typical ±175 uVtyp 175 uV7
Offset error (input referred)Global-chop mode, channel 0; typical ±35 uVtyp 35 uV7
Offset error (input referred)Global-chop mode, channels 1-3; typical ±15 uVtyp 15 uV7
Offset driftGlobal-chop mode disabledtyp 300 nV/°C7
Offset driftGlobal-chop modetyp 200 nV/°C7
Offset error time drift1000 hours at 85°C, TSSOP packagetyp 4 uV7
Gain errorTypical ±0.1%typ 0.1 %7
Gain driftIncluding internal referencetyp 8.5 ppm/°C7
Gain error time drift1000 hours at 85°C, TSSOP packagetyp 400 ppm7
Common-mode rejection ratio CMRRAt dctyp 100 dB7
Common-mode rejection ratio CMRRfCM = 50 Hz or 60 Hztyp 94 dB7
Power-supply rejection ratio PSRRAVDD at dctyp 75 dB7
Power-supply rejection ratio PSRRDVDD at dctyp 88 dB7
Power-supply rejection ratio PSRRAVDD supply, fPS = 50 Hz or 60 Hztyp 78 dB7
Power-supply rejection ratio PSRRDVDD supply, fPS = 50 Hz or 60 Hztyp 85 dB7
Input-referred noisetyp 5.35 uVRMS7
Input-referred noiseDuring fast-startuptyp 1.5 mVRMS7
Dynamic rangeGain = 1min 99 · typ 102 dB7
Dynamic rangeGain = 64typ 80 dB7
CrosstalkfIN = 50 Hz or 60 Hztyp -120 dB7
Signal-to-noise ratio SNRfIN = 50 Hz or 60 Hz, gain = 1, VIN = –0.5 dBFS, normalizedtyp 100 dB7
Signal-to-noise ratio SNRfIN = 50 Hz or 60 Hz, gain = 64, VIN = –0.5 dBFS, normalizedtyp 79 dB7
Total harmonic distortion THDfIN = 50 Hz or 60 Hz (up to 50 harmonics), VIN = –0.5 dBFStyp -100 dB7
Spurious-free dynamic range SFDRfIN = 50 Hz or 60 Hz (up to 50 harmonics), VIN = –0.5 dBFStyp 105 dB8
Internal reference voltage VREFtyp 1.2 V8
AccuracyInternal voltage reference; TA = 25°C; typical ±0.1%typ 0.1 %8
Temperature driftInternal voltage referencetyp 7.5 · max 20 ppm/°C8
Input current IINDGND < VDigital Input < DVDDmin -1 · max 1 uA8
Analog supply current IAVDDHigh-resolution modetyp 3.5 · max 4 mA8
Analog supply current IAVDDLow-power modetyp 2 · max 2.2 mA8
Analog supply current IAVDDVery-low-power modetyp 1 · max 1.2 mA8
Analog supply current IAVDDCurrent-detect modetyp 0.9 mA8
Analog supply current IAVDDStandby modetyp 0.3 uA8
Digital supply current(2) IDVDDHigh-resolution mode; SPI idletyp 0.4 · max 0.5 mA8
Digital supply current(2) IDVDDLow-power mode; SPI idletyp 0.2 · max 0.3 mA8
Digital supply current(2) IDVDDVery-low-power mode; SPI idletyp 0.1 · max 0.2 mA8
Digital supply current(2) IDVDDCurrent-detect mode; SPI idletyp 0.065 mA8
Digital supply current(2) IDVDDStandby mode; SPI idletyp 1 uA8
Power dissipation PDHigh-resolution modetyp 12 mW8
Power dissipation PDLow-power modetyp 6.6 mW8
Power dissipation PDVery-low-power modetyp 3.3 mW8
Power dissipation PDCurrent-detect modetyp 2.9 mW8
Power dissipation PDStandby modetyp 3.9 uW8
Pulse duration, CLKIN high tw(CLH)1.65 V ≤ DVDD ≤ 2.0 Vmin 49 ns9
Pulse duration, CLKIN low tw(CLL)1.65 V ≤ DVDD ≤ 2.0 Vmin 49 ns9
SCLK period tc(SC)1.65 V ≤ DVDD ≤ 2.0 Vmin 64 ns9
Pulse duration, SCLK low tw(SCL)1.65 V ≤ DVDD ≤ 2.0 Vmin 32 ns9
Pulse duration, SCLK high tw(SCH)1.65 V ≤ DVDD ≤ 2.0 Vmin 32 ns9
Delay time, first SCLK rising edge after CS falling edge td(CSSC)1.65 V ≤ DVDD ≤ 2.0 Vmin 16 ns9
Delay time, CS rising edge after final SCLK falling edge td(SCCS)1.65 V ≤ DVDD ≤ 2.0 Vmin 10 ns9
Pulse duration, CS high tw(CSH)1.65 V ≤ DVDD ≤ 2.0 Vmin 20 ns9
Setup time, DIN valid before SCLK falling egde tsu(DI)1.65 V ≤ DVDD ≤ 2.0 Vmin 5 ns9
Hold time, DIN valid after SCLK falling edge th(DI)1.65 V ≤ DVDD ≤ 2.0 Vmin 8 ns9
Pulse duration, SYNC/RESET low to generate device reset tw(RSL)1.65 V ≤ DVDD ≤ 2.0 Vmin 2048 tCLKIN9
Pulse duration, SYNC/RESET low for synchronization tw(SYL)1.65 V ≤ DVDD ≤ 2.0 Vmin 1 · max 2047 tCLKIN9
Setup time, SYNC/RESET valid before CLKIN rising edge tsu(SY)1.65 V ≤ DVDD ≤ 2.0 Vmin 10 ns9
Pulse duration, CLKIN low tw(CLL)2.7 V ≤ DVDD ≤ 3.6 Vmin 49 ns9
Pulse duration, CLKIN high tw(CLH)2.7 V ≤ DVDD ≤ 3.6 Vmin 49 ns9
SCLK period tc(SC)2.7 V ≤ DVDD ≤ 3.6 Vmin 40 ns9
Pulse duration, SCLK low tw(SCL)2.7 V ≤ DVDD ≤ 3.6 Vmin 20 ns9
Pulse duration, SCLK high tw(SCH)2.7 V ≤ DVDD ≤ 3.6 Vmin 20 ns9
Delay time, first SCLK rising edge after CS falling edge td(CSSC)2.7 V ≤ DVDD ≤ 3.6 Vmin 16 ns9
Delay time, CS rising edge after final SCLK falling edge td(SCCS)2.7 V ≤ DVDD ≤ 3.6 Vmin 10 ns9
Pulse duration, CS high tw(CSH)2.7 V ≤ DVDD ≤ 3.6 Vmin 15 ns9
Setup time, DIN valid before SCLK falling egde tsu(DI)2.7 V ≤ DVDD ≤ 3.6 Vmin 5 ns9
Hold time, DIN valid after SCLK falling edge th(DI)2.7 V ≤ DVDD ≤ 3.6 Vmin 8 ns9
Pulse duration, SYNC/RESET low to generate device reset tw(RSL)2.7 V ≤ DVDD ≤ 3.6 Vmin 2048 tCLKIN9
Pulse duration, SYNC/RESET low for synchronization tw(SYL)2.7 V ≤ DVDD ≤ 3.6 Vmin 1 · max 2047 tCLKIN9
Setup time, SYNC/RESET valid before CLKIN rising edge tsu(SY)2.7 V ≤ DVDD ≤ 3.6 Vmin 10 ns9
Propagation delay time, CS falling edge to DOUT driven tp(CSDO)1.65 V ≤ DVDD ≤ 2.0 V; DOUT load: 20 pF || 100 kΩmax 50 ns9
Progapation delay time, SCLK rising edge to valid new DOUT tp(SCDO)1.65 V ≤ DVDD ≤ 2.0 V; DOUT load: 20 pF || 100 kΩmax 32 ns9
Propagation delay time, CS rising edge to DOUT high impedance tp(CSDOZ)1.65 V ≤ DVDD ≤ 2.0 V; DOUT load: 20 pF || 100 kΩmax 75 ns9
Pulse duration, DRDY high tw(DRH)1.65 V ≤ DVDD ≤ 2.0 Vtyp 4 tCLKIN9
Pulse duration, DRDY low tw(DRL)1.65 V ≤ DVDD ≤ 2.0 Vtyp 4 tCLKIN9
SPI timeout1.65 V ≤ DVDD ≤ 2.0 Vmin 32768 tCLKIN9
Power-on-reset time tPOR1.65 V ≤ DVDD ≤ 2.0 V; measured from supplies at 90% to first DRDY rising edgetyp 250 us9
Register default acquisition time tREGACQ1.65 V ≤ DVDD ≤ 2.0 Vtyp 5 us9
Propagation delay time, CS falling edge to DOUT driven tp(CSDO)2.7 V ≤ DVDD ≤ 3.6 V; over operating ambient temperature range; DOUT load: 20 pF || 100 kΩmax 50 ns10
Progapation delay time, SCLK rising edge to valid new DOUT tp(SCDO)2.7 V ≤ DVDD ≤ 3.6 V; over operating ambient temperature range; DOUT load: 20 pF || 100 kΩmax 20 ns10
Propagation delay time, CS rising edge to DOUT high impedance tp(CSDOZ)2.7 V ≤ DVDD ≤ 3.6 V; over operating ambient temperature range; DOUT load: 20 pF || 100 kΩmax 75 ns10
Pulse duration, DRDY high tw(DRH)2.7 V ≤ DVDD ≤ 3.6 V; over operating ambient temperature range; DOUT load: 20 pF || 100 kΩtyp 4 tCLKIN10
Pulse duration, DRDY low tw(DRL)2.7 V ≤ DVDD ≤ 3.6 V; over operating ambient temperature range; DOUT load: 20 pF || 100 kΩtyp 4 tCLKIN10
SPI timeout2.7 V ≤ DVDD ≤ 3.6 V; over operating ambient temperature range; DOUT load: 20 pF || 100 kΩmin 32768 tCLKIN10
Power-on-reset time tPORMeasured from supplies at 90% to first DRDY rising edge; 2.7 V ≤ DVDD ≤ 3.6 Vtyp 250 us10
Register default acquisition time tREGACQ2.7 V ≤ DVDD ≤ 3.6 V; over operating ambient temperature range; DOUT load: 20 pF || 100 kΩtyp 5 us10

Pins, by the datasheet

20
1 AVDD
Analog supply. Connect a 1-uF capacitor to AGND. · p. 4
2 AGND
Analog ground. · p. 4
3 AIN0P
Positive analog input 0. · p. 4
4 AIN0N
Negative analog input 0. · p. 4
5 AIN1N
Negative analog input 1. · p. 4
6 AIN1P
Positive analog input 1. · p. 4
7 AIN2P
Positive analog input 2. · p. 4
8 AIN2N
Negative analog input 2. · p. 4
9 AIN3N
Negative analog input 3. · p. 4
10 AIN3P
Positive analog input 3. · p. 4
11 SYNC/RESET
Conversion synchronization or system reset; active low. · p. 4
12 CS
Chip select; active low. · p. 4
13 DRDY
Data ready; active low. · p. 4
14 SCLK
Serial data clock. · p. 4
15 DOUT
Serial data output. · p. 4
16 DIN
Serial data input. · p. 4
17 CLKIN
Master clock input. · p. 4
18 CAP
Digital low-dropout (LDO) regulator output. Connect a 220-nF capacitor to DGND. · p. 4
19 DGND
Digital ground. · p. 4
20 DVDD
Digital I/O supply. Connect a 1-uF capacitor to DGND. · p. 4

Open-source boards using it

8
  • 4 layers85 × 54 mmDevice, the printed circuit board in 3D

    Device

    jayis1/hacker-devices

    Full-cycle hardware designs for security research devices — each device is a subfolder with its own README, schematics, PCB layout, and software stack

    10 parts2
  • 4 layers110 × 75 mmDevice, the printed circuit board in 3D

    Device

    jayis1/hacker-devices

    Full-cycle hardware designs for security research devices — each device is a subfolder with its own README, schematics, PCB layout, and software stack

    8 parts2
  • 2 layers75 × 57 mmDevice, the printed circuit board in 3D

    Device

    jayis1/hardware-design-lab

    Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

    6 parts
  • 4 layers80 × 80 mmDevice, the printed circuit board in 3D

    Device

    jayis1/hardware-design-lab

    Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack

    16 parts
  • 2 layers101.9 × 109.5 mmENGG3800-g15, the printed circuit board in 3D

    ENGG3800-g15

    JoshCrouch/ENGG3800-HW

    224 parts

Parts like it

8

Questions

Is there a KiCad symbol and footprint for the ADS131M04IPW?

Yes. The symbol is Analog_ADC:ADS131M04xPW and the footprint Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the ADS131M04IPW?

TSSOP-20, with 20 pins. Its footprint is drawn on this page.

Where is the ADS131M04IPW datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Where can I order the ADS131M04IPW?

JLCPCB lists it as part C2862562, with 999 in stock; the sellers' links on this page open their listings.

What can replace the ADS131M04IPW?

Parts like it in the library: the ADS131M02IPW by Texas Instruments, the ADS131M03IPW by Texas Instruments, the ADS131M08IPBSR by Texas Instruments and the ADS131M02IRUK by Texas Instruments. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the ADS131M04IPW?

8 boards in 5 repositories on GitHub; the most starred are listed on this page, with their KiCad files.