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STDS75DS2F

STMicroelectronicsExtended

-55℃~+125℃ 1.2s 12bit 2.7V~5.5V I2C、SMBus ±2℃ MSOP-8 Temperature Sensors ROHS

Part id
st/STDS75DS2F
Category
Temperature Sensors
Package
MSOP-8
Pins
8
In stock
35 at JLCPCB (C283289)
Used on
3 open-source boards

Overview

The STDS75DS2F is a temperature Sensor made by STMicroelectronics in a MSOP-8 package with 8 pins. -55℃~+125℃ 1.2s 12bit 2.7V~5.5V I2C、SMBus ±2℃ MSOP-8 Temperature Sensors ROHS.

PCBKit's library has its KiCad symbol (EasyEDA_Cloud:STDS75DS2F, from EasyEDA) and its footprint (Package_SO:MSOP-8_3x3mm_P0.65mm, from KiCad's library), ready for a KiCad board. 35 are in stock at JLCPCB (part C283289). 3 open-source boards in 3 repositories on GitHub use it.

Symbol

SDA1SCL2O.S./INT3GND4A25A16A07VDD8
EasyEDA_Cloud:STDS75DS2FFrom EasyEDA

Footprint

12345678
Package_SO:MSOP-8_3x3mm_P0.65mmFrom KiCad's library

From the datasheet

10
Supply, least
2.7 V · VDD, recommended operating min · p. 30
Supply, most
5.5 V · VDD, recommended operating max · p. 30
Supply, absolute maximum
7 V · VDD, absolute max · p. 28
Works from
-55 °C · Ambient operating temperature min · p. 29
Works up to
125 °C · Ambient operating temperature max · p. 29
Takes working
125 µA · VDD, active temperature conversions typical at 3.3 V · p. 30
Takes at most
150 µA · VDD, active temperature conversions max at 3.3 V · p. 30
Takes asleep
1 µA · Standby, serial port inactive max at 25 °C · p. 30
A pin gives at most
10 mA · Output current absolute max · p. 28
Junction to air (MSOP8 (TSSOP8))
216.3 K/W · Junction-to-ambient thermal resistance · p. 28

What it is and has

8
Function
Digital temperature sensor and thermal watchdog · p. 1
Temperature measurement range
–55 °C to +125 °C · p. 1
Typical accuracy
±0.5 °C · p. 1
Serial interface
2-wire I2C/SMBus-compatible · p. 1
Thermometer resolution
9 to 12 bits; 0.5 °C to 0.0625 °C; default 9 bits · p. 1
9-bit conversion time
150 ms max · p. 1
Package
MSOP8 (TSSOP8) · p. 1
Calibration
Factory-calibrated · p. 6

Around it

1
cap 0.1 µF
between VDD and GND; Recommended bypass capacitor. · p. 11

Specifications

38
ParameterConditionsAs printedPage
Storage temperature TSTGVCC off, VBAT offmin -60 · max 150 °C28
Lead solder temperature for 10 seconds TSLDReflow peak; time above 255 °C must not exceed 30 secondsmax 260 °C28
Supply voltage VDDmax 7 V28
Output current IOmax 10 mA28
Power dissipation PDmax 320 mW28
Thermal resistance θJAMSOP8 (TSSOP8)max 216.3 °C/W28
VDD/VBAT supply voltageSTDS75min 2.7 · max 5.5 V29
Ambient operating temperature (TA)STDS75min -55 · max 125 °C29
Input rise and fall timesSTDS75max 5 ns29
Supply voltage VDDTA = –55 to +125 °Cmin 2.7 · max 5.5 V30
VDD supply current, active temperature conversions IDDVDD = 3.3 Vtyp 125 · max 150 uA30
VDD supply current, communication only IDDTA = 25 °Ctyp 70 · max 100 uA30
Standby supply current, serial port inactive IDD1TA = 25 °Cmax 1 uA30
Accuracy for corresponding range 2.7 V ≤ VDD ≤ 5.5 V–25 °C < TA < 100 °C; values are ± magnitudestyp 0.5 · max 2 °C30
Accuracy for corresponding range 2.7 V ≤ VDD ≤ 5.5 V–55 °C < TA < 125 °C; values are ± magnitudestyp 0.5 · max 3 °C30
Resolution12-bit temperature datamax 0.0625 °C30
Resolutionmin 9 · max 12 bits30
Conversion time tCONV9-bit resolutionmax 150 ms30
Conversion time tCONV10-bit resolutionmax 300 ms30
Conversion time tCONV11-bit resolutionmax 600 ms30
Conversion time tCONV12-bit resolutionmax 1200 ms30
Overtemperature shutdown TOSDefault valuetyp 80 °C30
Hysteresis THYSDefault valuetyp 75 °C30
OS/INT saturation voltage (VDD = 5V) VOL14 mA sink currentmax 0.5 V30
Input logic low VILDigital pins; maximum 0.3 x VDDmin -0.45 V30
Output logic (SDA) VOL2IOL2 = 3 mAmax 0.4 V30
Capacitance CINtyp 5 pF30
SCL clock frequency fSCLTA = –55 to 125 °C; VDD = 2.7 V to 5.5 Vmin 0 · max 400 kHz31
Time the bus must be free before a new transmission can start tBUFTA = –55 to 125 °C; VDD = 2.7 V to 5.5 Vmin 1.3 us31
SDA and SCL fall time tFTA = –55 to 125 °C; VDD = 2.7 V to 5.5 Vmax 300 ns31
Data hold time tHD:DATTransmitter must internally provide hold time to bridge the undefined region of the falling edge of SCLmin 0 us31
START condition hold time (after this period the first clock pulse is generated) tHD:STATA = –55 to 125 °C; VDD = 2.7 V to 5.5 Vmin 600 ns31
Clock high period tHIGHTA = –55 to 125 °C; VDD = 2.7 V to 5.5 Vmin 600 ns31
Clock low period tLOWTA = –55 to 125 °C; VDD = 2.7 V to 5.5 Vmin 1.3 us31
SDA and SCL rise time tRTA = –55 to 125 °C; VDD = 2.7 V to 5.5 Vmax 300 ns31
Data setup time tSU:DATTA = –55 to 125 °C; VDD = 2.7 V to 5.5 Vmin 100 ns31
START condition setup time (only relevant for a repeated start condition) tSU:STATA = –55 to 125 °C; VDD = 2.7 V to 5.5 Vmin 600 ns31
STOP condition setup time tSU:STOTA = –55 to 125 °C; VDD = 2.7 V to 5.5 Vmin 600 ns31

Pins, by the datasheet

8
1 SDA
Serial data input/output; open drain. · p. 7
2 SCL
Serial clock input. · p. 7
3 OS/INT
Overlimit signal/interrupt alert output; open drain. · p. 7
4 GND
Ground. · p. 7
5 A2
Address2 input. · p. 7
6 A1
Address1 input. · p. 7
7 A0
Address0 input. · p. 7
8 VDD
Supply voltage (2.7 V to 5.5 V). · p. 7

Open-source boards using it

3
  • 4 layers79 × 81 mmBIRDS X PCB, the printed circuit board in 3D

    BIRDS X PCB

    AlbertaSat/BIRDS-X_PCB

    Repository for the PCB design for the BIRDS-X project

    162 parts1CERN-OHL-P-2.0
  • 2 layers52 × 67 mmTbogg Sensor Pkg PCB, the printed circuit board in 3D

    Tbogg Sensor Pkg PCB

    UofC-GNCTR-2024/Tbogg-Sensor-Package-PCB

    The sensor package (strain, temperature, vibration) for the 2024 UofC GNCTR tbogg. Designed as an R&D intrastructure monitoring solution.

    48 parts1MIT
  • 2 layers99.1 × 87.6 mmProject Supernova PCB, the printed circuit board in 3D

    Project Supernova PCB

    DeflateAwning/project-supernova-balloon-pcb

    A Helium Network Helium Balloon

    65 partsMIT

Parts like it

8

Questions

Is there a KiCad symbol and footprint for the STDS75DS2F?

Yes. The symbol is EasyEDA_Cloud:STDS75DS2F and the footprint Package_SO:MSOP-8_3x3mm_P0.65mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the STDS75DS2F?

MSOP-8, with 8 pins. Its footprint is drawn on this page.

Where is the STDS75DS2F datasheet?

STMicroelectronics publishes it: the Datasheet link on this page opens it.

Where can I order the STDS75DS2F?

JLCPCB lists it as part C283289, with 35 in stock; the sellers' links on this page open their listings.

What can replace the STDS75DS2F?

Parts like it in the library: the DS18B20U by UMW, the LM75BDP(UMW) by UMW, the DS18B20U-15(MY) by Mysentech and the TMP175AIDGKR(UMW) by UMW. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the STDS75DS2F?

3 boards in 3 repositories on GitHub; the most starred are listed on this page, with their KiCad files.