SHT45-AD1B-R2

Sensirion

-40℃~+125℃ 1.08V~3.6V 16bit 1uA 8.3ms Factory temperature calibration I2C ±0.1℃ DFN-4(1.5x1.5) Temperature Sensors ROHS

Extended

Datasheetsensirion/SHT45-AD1B-R2

Category: Temperature Sensors
Package: DFN-4(1.5x1.5)
Pins: 5

Overview

The SHT45-AD1B-R2 is a temperature Sensor made by Sensirion in a DFN-4(1.5x1.5) package with 4 pins. -40℃~+125℃ 1.08V~3.6V 16bit 1uA 8.3ms Factory temperature calibration I2C ±0.1℃ DFN-4(1.5x1.5) Temperature Sensors ROHS.

PCBKit's library has its KiCad symbol (Sensor_Humidity:SHT4x, from KiCad's library) and its footprint (Sensor_Humidity:Sensirion_DFN-4_1.5x1.5mm_P0.8mm_SHT4x_NoCentralPad, from KiCad's library), ready for a KiCad board. 7,023 are in stock at JLCPCB (part C5221601). 16 open-source boards in 13 repositories on GitHub use it.

Symbol

Sensor_Humidity:SHT4xFrom KiCad's library

Footprint

Sensor_Humidity:Sensirion_DFN-4_1.5x1.5mm_P0.8mm_SHT4x_NoCentralPadFrom KiCad's library

From the datasheet

Supply, least: 1.08 V · VDD, recommended operating minimum · p. 8
Supply, most: 3.6 V · VDD, recommended operating maximum · p. 8
Works from: -40 °C · Operating temperature minimum · p. 9
Works up to: 125 °C · Operating temperature maximum · p. 9
Takes working: 320 µA · VDD, typical measurement current, no heater · p. 8
Takes asleep: 80 nA · VDD, typical idle current at 25°C · p. 8
Junction to air (DFN): 246 K/W · Typical, heater off, die pad soldered · p. 15
Junction to air (DFN): 308 K/W · Typical, heater on at 200 mW, die pad soldered · p. 15
Junction to air (DFN): 297 K/W · Typical, heater off, die pad not soldered · p. 15
Junction to air (DFN): 357 K/W · Typical, heater on at 200 mW, die pad not soldered · p. 15
Junction to case (DFN): 189 K/W · Typical, heater off, die pad soldered · p. 15
Junction to case (DFN): 255 K/W · Typical, heater on at 200 mW, die pad soldered · p. 15
Junction to case (DFN): 191 K/W · Typical, heater off, die pad not soldered · p. 15
Junction to case (DFN): 257 K/W · Typical, heater on at 200 mW, die pad not soldered · p. 15
Junction to board (DFN): 159 K/W · Typical thermal resistance, heater off, die pad soldered · p. 15
Junction to board (DFN): 225 K/W · Typical thermal resistance, heater on at 200 mW, die pad soldered · p. 15
Junction to board (DFN): 193 K/W · Typical thermal resistance, heater off, die pad not soldered · p. 15
Junction to board (DFN): 258 K/W · Typical thermal resistance, heater on at 200 mW, die pad not soldered · p. 15

What it is and has

Measurement resolution: 16-bit · p. 1
Accuracy and I2C address: ±1.0 %RH, ±0.1°C; 0x44 · p. 1
Interface: I2C FM+, CRC checksum · p. 1
Heater: Variable power · p. 1
Condensing operation: Fully functional in condensing environment · p. 1
Qualification: JEDEC JESD47 · p. 1
Traceability: NIST · p. 1

Around it

res 820 Ω minimum: between SDA and VDD; I2C pull-up requirement for VDD < 1.62 V. · p. 8
res 390 Ω minimum: between SDA and VDD; I2C pull-up requirement for VDD ≥ 1.62 V. · p. 8

Specifications

Parameter	Conditions	As printed	Page
SHT45 RH accuracy	SHT45, typical accuracy	typ 1 %RH	4
Repeatability	High repeatability, 25°C and 50%RH; 3σ	typ 0.08 %RH	4
Repeatability	Medium repeatability, 25°C and 50%RH; 3σ	typ 0.15 %RH	4
Repeatability	Low repeatability, 25°C and 50%RH; 3σ	typ 0.25 %RH	4
Resolution	A/D converter	typ 0.01 %RH	4
Hysteresis	At 25°C; ±0.8 %RH	typ 0.8 %RH	4
Specified range	Extended	min 0 · max 100 %RH	4
Response time	t63%, measured at 25°C and 1 m/s airflow	typ 4 s	4
Supply voltage VDD		min 1.08 · typ 3.3 · max 3.6 V	8
Power-up/down level VPOR	Static power supply	min 0.6 · max 1.08 V	8
Slew rate of the supply voltage VDD, slew	Supply between VDD, min and VDD, max	max 20 V/ms	8
Supply current (no heater) IDD	Idle state, at 25°C	typ 0.08 · max 1 uA	8
Supply current (no heater) IDD	Idle state, at 125°C	max 3.4 uA	8
Supply current (no heater) IDD	Power up	typ 50 uA	8
Supply current (no heater) IDD	Measurement	typ 320 · max 500 uA	8
Supply current (no heater) IDD	Average, high repeatability, continuous operation with one measurement per second	typ 2.2 uA	8
Supply current (no heater) IDD	Average, medium repeatability, continuous operation with one measurement per second	typ 1.2 uA	8
Supply current (no heater) IDD	Average, low repeatability, continuous operation with one measurement per second	typ 0.4 uA	8
Power consumpt. at VDD=1.2V (no heater)	Average, high repeatability, continuous operation with one measurement per second	typ 2.6 uW	8
Power consumpt. at VDD=1.2V (no heater)	Average, medium repeatability, continuous operation with one measurement per second	typ 1.4 uW	8
Power consumpt. at VDD=1.2V (no heater)	Average, low repeatability, continuous operation with one measurement per second	typ 0.5 uW	8
Low level input voltage VIL	Maximum 0.3*VDD	min 0 V	8
Pull up resistors Rp	VDD < 1.62 V	min 820 Ω	8
Pull up resistors Rp	VDD ≥ 1.62 V	min 390 Ω	8
Low level output voltage VOL	VDD > 2.0V, Rpullup > 390 Ω	max 0.4 V	8
Capacitive bus load Cb	RP ≤ 820 Ω: fast mode	max 400 pF	8
Capacitive bus load Cb	Rp = 390 Ω, VDD > 1.62 V: fast mode plus	max 340 pF	8
Power-up time tPU	After hard reset, VDD ≥ VPOR	typ 0.3 · max 1 ms	9
Soft reset time tSR	After soft reset; also valid for I2C general call reset	max 1 ms	9
Measurement duration tMEAS,l	Low repeatability; including tPU	typ 1.3 · max 1.6 ms	9
Measurement duration tMEAS,m	Medium repeatability; including tPU	typ 3.7 · max 4.5 ms	9
Measurement duration tMEAS,h	High repeatability; including tPU	typ 6.9 · max 8.3 ms	9
Heater-on duration tHeater	Long pulse	min 0.9 · typ 1 · max 1.1 s	9
Heater-on duration tHeater	Short pulse	min 0.09 · typ 0.1 · max 0.11 s	9
Operating temperature range		min -40 · max 125 °C	9
Storage temperature range		min -40 · max 150 °C	9
ESD HBM		max 2 kV	9
ESD CDM		max 500 V	9
Latch up, JESD78 Class II, 125°C	Rating +-100 mA	min -100 · max 100 mA	9
Junction-to-ambient thermal resistance 𝑅𝜃𝐽𝐴	Heater off, die pad soldered; simulation	typ 246 K/W	15
Junction-to-ambient thermal resistance 𝑅𝜃𝐽𝐴	Heater on, die pad soldered; heater power 200 mW; simulation	typ 308 K/W	15
Junction-to-ambient thermal resistance 𝑅𝜃𝐽𝐴	Heater off, die pad not soldered; simulation	typ 297 K/W	15
Junction-to-ambient thermal resistance 𝑅𝜃𝐽𝐴	Heater on, die pad not soldered; heater power 200 mW; simulation	typ 357 K/W	15
Junction-to-case thermal resistance 𝑅𝜃𝐽𝐶	Heater off, die pad soldered; simulation	typ 189 K/W	15
Junction-to-case thermal resistance 𝑅𝜃𝐽𝐶	Heater on, die pad soldered; heater power 200 mW; simulation	typ 255 K/W	15
Junction-to-case thermal resistance 𝑅𝜃𝐽𝐶	Heater off, die pad not soldered; simulation	typ 191 K/W	15
Junction-to-case thermal resistance 𝑅𝜃𝐽𝐶	Heater on, die pad not soldered; heater power 200 mW; simulation	typ 257 K/W	15
Junction-to-board thermal resistance 𝑅𝜃𝐽𝐵	Heater off, die pad soldered; simulation	typ 159 K/W	15
Junction-to-board thermal resistance 𝑅𝜃𝐽𝐵	Heater on, die pad soldered; heater power 200 mW; simulation	typ 225 K/W	15
Junction-to-board thermal resistance 𝑅𝜃𝐽𝐵	Heater off, die pad not soldered; simulation	typ 193 K/W	15
Junction-to-board thermal resistance 𝑅𝜃𝐽𝐵	Heater on, die pad not soldered; heater power 200 mW; simulation	typ 258 K/W	15
Junction-to-board characterization param. Ψ𝐽𝐵	Heater off, die pad soldered; simulation	typ 159 K/W	15
Junction-to-board characterization param. Ψ𝐽𝐵	Heater on, die pad soldered; heater power 200 mW; simulation	typ 223 K/W	15
Junction-to-board characterization param. Ψ𝐽𝐵	Heater off, die pad not soldered; simulation	typ 191 K/W	15
Junction-to-board characterization param. Ψ𝐽𝐵	Heater on, die pad not soldered; heater power 200 mW; simulation	typ 254 K/W	15
Junction-to-top characterization param. Ψ𝐽𝑇	Heater off, die pad soldered; simulation	typ 38 K/W	15
Junction-to-top characterization param. Ψ𝐽𝑇	Heater on, die pad soldered; heater power 200 mW; simulation	typ 105 K/W	15
Junction-to-top characterization param. Ψ𝐽𝑇	Heater off, die pad not soldered; simulation	typ 44 K/W	15
Junction-to-top characterization param. Ψ𝐽𝑇	Heater on, die pad not soldered; heater power 200 mW; simulation	typ 112 K/W	15

Pins, by the datasheet

1 SDA: Serial data, bidirectional. · p. 14
2 SCL: Serial clock, unidirectional input. · p. 14
3 VDD: Supply voltage. · p. 14
4 VSS: Ground. · p. 14

Ordering codes, by the datasheet

SHT45-AD1B-R2: DFN · ±1.0 %RH, ±0.1°C accuracy; 0x44 I2C address; without membrane; tape on reel, 2’500 pieces · p. 16
SHT45-AD1B-R3: DFN · ±1.0 %RH, ±0.1°C accuracy; 0x44 I2C address; without membrane; tape on reel, 10’000 pieces · p. 16

Parameters

Current - Supply: 320uA
Detection Temperature Range: -40℃~+125℃
Features: Factory temperature calibration
Interface: I2C
Operating Temperature: -40℃~+125℃
Standby Current: 80nA
Temperature Conversion Time: 8.3ms
Temperature Resolution: 16bit
Thermal Resistance(Junction to Ambient): 357℃/W
Thermal Resistance(Junction to Board): 258℃/W
Thermal Resistance(Junction to Case): 257℃/W
Tolerance: ±0.1℃
Voltage - Supply: 1.08V~3.6V

Order codes

SHT45-AD1B-R2LCSC C5221601

Pinout

The pins of the SHT45-AD1B-R2
Pin	Name	Type
1	SDA	Input/output
2	SCL	Input
3	VDD	Power in
4	VSS	Power in

Open-source boards using it

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9 parts

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Questions

Is there a KiCad symbol and footprint for the SHT45-AD1B-R2?

Yes. The symbol is Sensor_Humidity:SHT4x and the footprint Sensor_Humidity:Sensirion_DFN-4_1.5x1.5mm_P0.8mm_SHT4x_NoCentralPad, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the SHT45-AD1B-R2?

DFN-4(1.5x1.5), with 4 pins. Its footprint is drawn on this page.

Where is the SHT45-AD1B-R2 datasheet?

Sensirion publishes it: the Datasheet link on this page opens it.

Where can I order the SHT45-AD1B-R2?

JLCPCB lists it as part C5221601, with 7,023 in stock; the sellers' links on this page open their listings.

Which open-source boards use the SHT45-AD1B-R2?

16 boards in 13 repositories on GitHub; the most starred are listed on this page, with their KiCad files.