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FUSB302BMPX on a board, in 3D

FUSB302BMPX

onsemi

-40℃~+125℃ 2.8V~5.5V 25uA Controller USB 3.1 WFQFN-14(2.5x2.5) USB Converters ROHS

Extended
DatasheetJLCPCBLCSConsemi/FUSB302BMPX
Category
USB Converters
Package
WFQFN-14(2.5x2.5)
Pins
15

Overview

The FUSB302BMPX is a USB Converter made by onsemi in a WFQFN-14(2.5x2.5) package with 15 pins. -40℃~+125℃ 2.8V~5.5V 25uA Controller USB 3.1 WFQFN-14(2.5x2.5) USB Converters ROHS.

PCBKit's library has its KiCad symbol (Interface_USB:FUSB302BMPX, from KiCad's library) and its footprint (Package_DFN_QFN:WQFN-14-1EP_2.5x2.5mm_P0.5mm_EP1.45x1.45mm, from KiCad's library), ready for a KiCad board. 9,742 are in stock at JLCPCB (part C132291). 75 open-source boards in 60 repositories on GitHub use it.

Symbol

CC21VBUS2VDD3INT_N5SCL6SDA7GND8CC110VCONN12VCONN13
Interface_USB:FUSB302BMPXFrom KiCad's library

Footprint

15
Package_DFN_QFN:WQFN-14-1EP_2.5x2.5mm_P0.5mm_EP1.45x1.45mmFrom KiCad's library

From the datasheet

13
Supply, least
2.7 V · VDD, recommended operating min; functional operation only · p. 14
Supply, most
5.5 V · VDD, recommended operating max · p. 14
Supply, least
4 V · VBUS, recommended operating min · p. 14
Supply, most
21 V · VBUS, recommended operating max · p. 14
Supply, absolute maximum
6 V · VDD, absolute maximum · p. 14
Supply, absolute maximum
28 V · VBUS, absolute maximum · p. 14
Works from
-40 °C · TA, recommended operating min · p. 14
Works up to
85 °C · TA, recommended operating max · p. 14
Junction, hottest
150 °C · Junction temperature absolute maximum · p. 14
Current limit
800 mA · VCONN switch OCP typical, OCPreg=0Fh · p. 16
Takes asleep
370 nA · Disabled current typical, VDD=3.0 to 5.5 V, nothing attached · p. 17
Takes asleep
25 µA · Unattached standby toggle current typical, TOG_SAVE_PWR2:1=01 · p. 17
Takes asleep
40 µA · BMC PD standby current typical, attached, neither transmitting nor receiving · p. 17

Specifications

66
ParameterConditionsAs printedPage
Supply Voltage from VDD VvDDmin -0.5 · max 6 V14
CC pins when configured as Host, Device or Dual Role Port VCC_HDDRPmin -0.5 · max 6 V14
VBUS Supply Voltage VVBUSmin -0.5 · max 28 V14
Storage Temperature Range TSTORAGEmin -65 · max 150 C14
Maximum Junction Temperature TJmax 150 C14
Lead Temperature (Soldering, 10 Seconds) TLmax 260 C14
Human Body Model, ANSI/ESDA/JEDEC JS-001-2012 ESDAll Pinsmin 4 kV14
Charged Device Model, JEDEC JESD22-C101 ESDAll Pinsmin 1 kV14
VBUS Supply Voltage VVBUSmin 4 · typ 5 · max 21 V14
VDD Supply Voltage VVDDMinimum is for functional operation only; electrical parameters require at least 3.0 V.min 2.7 · typ 3.3 · max 5.5 V14
VCONN Supply Voltage VVCONNmin 2.7 · max 5.5 V14
VCONN Supply Current IVCONNmax 560 mA14
Operating Temperature TAmin -40 · max 85 C14
RDSON for SW1_CC1 and SW1_CC2 RSW_CCxVCONN to CC1 & CC2; TA=-40 to +85°C; TJ=-40 to +125°Ctyp 0.4 · max 1.2 Ω16
Over-Current Protection (OCP) limit at which VCONN switch shuts off over the entire VCONN voltage range ISW_CCXOCPreg=0Fh; TA=-40 to +85°C; TJ=-40 to +125°Cmin 600 · typ 800 · max 1000 mA16
Time taken for the VCONN switch to turn on during which Over-Current Protection is disabled tSoftStartTA=-40 to +85°C; TJ=-40 to +125°Ctyp 1.5 ms16
SRC 80 uA CC current (Default) I80_CCXHOST_CUR1=0, HOST_CUR0=1; TA=-40 to +85°C; TJ=-40 to +125°Cmin 64 · typ 80 · max 96 uA16
SRC 180 uA CC Current (1.5 A) I180_CCXHOST_CUR1=1, HOST_CUR0=0; TA=-40 to +85°C; TJ=-40 to +125°Cmin 166 · typ 180 · max 194 uA16
SRC 330 uA CC Current (3 A) I330_CCXHOST_CUR1=1, HOST_CUR0=1; TA=-40 to +85°C; TJ=-40 to +125°Cmin 304 · typ 330 · max 356 uA16
SNK Pull-down Voltage in Dead Battery under all Pull-up SRC Loads VUFPDBTA=-40 to +85°C; TJ=-40 to +125°Cmax 2.18 V16
Device Pull-down Resistance RDEVICEMinimum and maximum guaranteed only with power applied; TA=-40 to +85°C; TJ=-40 to +125°Cmin 4.6 · typ 5.1 · max 5.6 kΩ16
CC Resistance for Disabled State zOPENTA=-40 to +85°C; TJ=-40 to +125°Cmin 126 kΩ16
Wake threshold for CC pin SRC or SNK LOW value. WAKElowBandgap and wake circuit on, PWR[0]=1; TA=-40 to +85°C; TJ=-40 to +125°Ctyp 0.25 V16
Wake threshold for CC pin SRC or SNK HIGH value. WAKEhighBandgap and wake circuit on, PWR[0]=1; TA=-40 to +85°C; TJ=-40 to +125°Ctyp 1.45 V16
Hysteresis on the Ra and Rd Comparators vBC_LVLhysTA=-40 to +85°C; TJ=-40 to +125°Ctyp 20 mV16
CC Pin Thresholds, Assumes PWR=4‟h7 vBC_LVLBC=2‟b00; TA=-40 to +85°C; TJ=-40 to +125°Cmin 0.15 · typ 0.2 · max 0.25 V16
CC Pin Thresholds, Assumes PWR=4‟h7 vBC_LVLBC=2‟b01; TA=-40 to +85°C; TJ=-40 to +125°Cmin 0.61 · typ 0.66 · max 0.7 V16
CC Pin Thresholds, Assumes PWR=4‟h7 vBC_LVLBC=2‟b10; TA=-40 to +85°C; TJ=-40 to +125°Cmin 1.16 · typ 1.23 · max 1.31 V16
Measure block MDAC step size for each code in MDAC[5:0] register vMDACstepCCTA=-40 to +85°C; TJ=-40 to +125°Ctyp 42 mV16
Measure block MDAC step size for each code in MDAC[5:0] register for VBUS measurement vMDACstepVBUSTA=-40 to +85°C; TJ=-40 to +125°Ctyp 420 mV16
VBUS threshold at which I_VBUSOK interrupt is triggered. vVBUSthrMeasure block on, PWR[2]=1; TA=-40 to +85°C; TJ=-40 to +125°Cmax 4 V16
When TOGGLE=1, time at which internal versions of PU_EN1=PU_EN2=0 and PWDN1=PDWN2=1 selected to present externally as a SNK in the DRP toggle tTOG1TA=-40 to +85°C; TJ=-40 to +125°Cmin 30 · typ 45 · max 60 ms16
When TOGGLE=1, time at which internal versions of PU_EN1=1 or PU_EN2=1 and PWDN1=PDWN2=0 selected to present externally as a SRC in the DRP toggle tTOG2TA=-40 to +85°C; TJ=-40 to +125°Cmin 20 · typ 30 · max 40 ms16
Disable time after a full toggle (tTOG1+tTOG2) cycle so as to save power tDISTOG_SAVE_PWR2:1=00; TA=-40 to +85°C; TJ=-40 to +125°Ctyp 0 ms16
Disable time after a full toggle (tTOG1+tTOG2) cycle so as to save power tDISTOG_SAVE_PWR2:1=01; TA=-40 to +85°C; TJ=-40 to +125°Ctyp 40 ms16
Disable time after a full toggle (tTOG1+tTOG2) cycle so as to save power tDISTOG_SAVE_PWR2:1=10; TA=-40 to +85°C; TJ=-40 to +125°Ctyp 80 ms16
Disable time after a full toggle (tTOG1+tTOG2) cycle so as to save power tDISTOG_SAVE_PWR2:1=11; TA=-40 to +85°C; TJ=-40 to +125°Ctyp 160 ms16
Temp. for Vconn Switch Off TshutTA=-40 to +85°C; TJ=-40 to +125°Ctyp 145 °C16
Temp. Hysteresis for Vconn Switch Turn On ThysTA=-40 to +85°C; TJ=-40 to +125°Ctyp 10 °C16
Disabled Current IdisableVDD=3.0 to 5.5 V; Nothing Attached, No I2C Transactions; TA=-40 to +85°C; TJ=-40 to +125°Ctyp 0.37 · max 5 uA17
Unattached (standby) Toggle Current ItogVDD=3.0 to 5.5 V; Nothing attached, TOGGLE=1, PWR[3:0]=1h, WAKE_EN=0, TOG_SAVE_PWR2:1=01; TA=-40 to +85°C; TJ=-40 to +125°Ctyp 25 · max 40 uA17
BMC PD Standby Current Ipd_stby_measVDD=3.0 to 5.5 V; Device Attached, BMC PD Active But Not Sending or Receiving Anything, PWR[3:0]=7h; TA=-40 to +85°C; TJ=-40 to +125°Ctyp 40 uA17
If a Soft Reset message fails, a Hard Reset is sent after tHardReset of CRCReceiveTimer expiring tHardResetTA=-40 to +85°C; TJ=-40 to +125°Cmax 5 ms17
If the FUSB302B cannot send a Hard Reset within tHardResetComplete time because of a busy line, then a I_HARDFAIL interrupt is triggered tHardResetCompleteTA=-40 to +85°C; TJ=-40 to +125°Cmax 5 ms17
This is the value for which the CRCReceiveTimer expires. tReceiveTimer starts on the last bit of the EOP of the transmitted packet; TA=-40 to +85°C; TJ=-40 to +125°Cmin 0.9 · max 1.1 ms17
Once the CRCReceiveTimer expires, a retry packet has to be sent out within tRetry time. tRetryTA=-40 to +85°C; TJ=-40 to +125°Cmax 75 us17
If a GoodCRC packet is not received within tReceive for NRETRIES then a Soft Reset packet is sent within tSoftReset time. tSoftResetTA=-40 to +85°C; TJ=-40 to +125°Cmax 5 ms17
From receiving a packet, we have to send a GoodCRC in response within tTransmit time. tTransmitLast bit of received EOP to first bit of GoodCRC preamble; TA=-40 to +85°C; TJ=-40 to +125°Cmax 195 us17
Output Low Voltage VOLINTNINT_N; VDD=3.0 to 5.5 V; IOL=4 mA; TA=-40 to +85°C; TJ=-40 to +125°Cmax 0.4 V18
Time from global interrupt mask bit cleared to when INT_N goes LOW TINT_MaskVDD=3.0 to 5.5 V; TA=-40 to +85°C; TJ=-40 to +125°Cmin 50 us18
Low-Level Input Voltage VILI2CSDA, SCL; VDD=3.0 to 5.5 V; TA=-40 to +85°C; TJ=-40 to +125°Cmax 0.51 V18
High-Level Input Voltage VIHI2CSDA, SCL; VDD=3.0 to 5.5 V; TA=-40 to +85°C; TJ=-40 to +125°Cmin 1.32 V18
Hysteresis of Schmitt Trigger Inputs VHYSSDA, SCL; VDD=3.0 to 5.5 V; TA=-40 to +85°C; TJ=-40 to +125°Cmin 94 mV18
Input Current of SDA and SCL Pins II2CVDD=3.0 to 5.5 V; Input Voltage 0.26 V to 2.0 V; TA=-40 to +85°C; TJ=-40 to +125°Cmin -10 · max 10 uA18
VDD Current when SDA or SCL is HIGH ICCTI2CVDD=3.0 to 5.5 V; Input Voltage 1.8 V; TA=-40 to +85°C; TJ=-40 to +125°Cmin -10 · max 10 uA18
Low-Level Output Voltage (Open-Drain) VOLSDAVDD=3.0 to 5.5 V; IOL=2 mA; TA=-40 to +85°C; TJ=-40 to +125°Cmin 0 · max 0.35 V18
Low-Level Output Current (Open-Drain) IOLSDAVDD=3.0 to 5.5 V; VOLSDA=0.4 V; TA=-40 to +85°C; TJ=-40 to +125°Cmin 20 mA18
Capacitance for Each I/O Pin CIVDD=3.0 to 5.5 V; TA=-40 to +85°C; TJ=-40 to +125°Ctyp 5 pF18
CCX Receiver Capacitance CRECVmin 200 · max 600 pF35
VCONN Source Bulk Capacitance CBULKmin 10 · max 220 uF35
VCONN Decoupling Capacitance CVCONNtyp 0.1 uF35
VDD Decoupling Capacitance CVDD1typ 0.1 uF35
VDD Decoupling Capacitance CVDD2typ 1 uF35
I2C Pull-up Resistors RPUtyp 4.7 kΩ35
INT_N Pull-up Resistor RPU_INTmin 1 · typ 4.7 kΩ35
I2C Pull-up Voltage VPUmin 1.62 · typ 1.8 · max 1.98 V35

Pins, by the datasheet

14
1 CC2
Configuration Channel for attach, orientation, detach, charging-current detection or advertisement, and USB BMC Power Delivery. · p. 4
2 VBUS
VBUS input for device attach and detach detection; expected to be an OVP protected input. · p. 4
3 VDD
Input supply voltage. · p. 4
4 VDD
Input supply voltage. · p. 4
5 INT_N
Active LOW interrupt output prompting the processor to read I2C register bits. · p. 4
6 SCL
I2C serial clock connected to the phone-based I2C master. · p. 4
7 SDA
I2C serial data connected to the phone-based I2C master. · p. 4
8 GND
Ground. · p. 4
9 GND
Ground. · p. 4
10 CC1
Configuration Channel for attach, orientation, detach, charging-current detection or advertisement, and USB BMC Power Delivery. · p. 4
11 CC1
Configuration Channel for attach, orientation, detach, charging-current detection or advertisement, and USB BMC Power Delivery. · p. 4
12 VCONN
Regulated input switched to the appropriate CC pin to power USB3.1 full-featured cables and accessories. · p. 4
13 VCONN
Regulated input switched to the appropriate CC pin to power USB3.1 full-featured cables and accessories. · p. 4
14 CC2
Configuration Channel for attach, orientation, detach, charging-current detection or advertisement, and USB BMC Power Delivery. · p. 4

Ordering codes, by the datasheet

5
FUSB302BUCX
9-Ball Wafer-Level Chip Scale Package (WLCSP), 0.4 mm Pitch · Top mark H4; -40 to 85°C; tape and reel. · p. 3
FUSB302BMPX
14-lead MLP 2.5 mm x 2.5 mm, 0.5 mm Pitch · Top mark UA; tape and reel. · p. 3
FUSB302B01MPX
14-lead MLP 2.5 mm x 2.5 mm, 0.5 mm Pitch · Top mark UP; tape and reel. · p. 3
FUSB302B10MPX
14-lead MLP 2.5 mm x 2.5 mm, 0.5 mm Pitch · Top mark US; tape and reel. · p. 3
FUSB302B11MPX
14-lead MLP 2.5 mm x 2.5 mm, 0.5 mm Pitch · Top mark UT; tape and reel. · p. 3

Parameters

10
Applications Function
Controller
Current Limit
800mA
Features
FIFO buffer;Wake-up function;Low-power mode;Power-on reset
Junction Temperature(Max)
150℃
Operating Temperature
-40℃~+85℃
Quiescent Supply Current
25uA
Standby Current
370nA
USB Protocol
USB 3.1
Voltage - Supply
2.7V~21V
Voltage - Supply(Absolute Max)
6V

Order codes

1

Pinout

15
The pins of the FUSB302BMPX
PinNameType
1CC2Input/output
2VBUSInput
3VDDPower in
4VDDPassive
5INT_NOpen collector
6SCLInput
7SDAInput/output
8GNDPower in
9GNDPassive
10CC1Input/output
11CC1Input/output
12VCONNPower in
13VCONNPower in
14CC2Input/output
15GNDPassive

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Questions

Is there a KiCad symbol and footprint for the FUSB302BMPX?

Yes. The symbol is Interface_USB:FUSB302BMPX and the footprint Package_DFN_QFN:WQFN-14-1EP_2.5x2.5mm_P0.5mm_EP1.45x1.45mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the FUSB302BMPX?

WFQFN-14(2.5x2.5), with 15 pins. Its footprint is drawn on this page.

Where is the FUSB302BMPX datasheet?

onsemi publishes it: the Datasheet link on this page opens it.

Where can I order the FUSB302BMPX?

JLCPCB lists it as part C132291, with 9,742 in stock; the sellers' links on this page open their listings.

What can replace the FUSB302BMPX?

Parts like it in the library: the FUSB302B01MPX by onsemi, the FUSB302B10MPX by onsemi and the FUSB302B11MPX by onsemi. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the FUSB302BMPX?

75 boards in 60 repositories on GitHub; the most starred are listed on this page, with their KiCad files.

Parts like it

3