

Overview
The FUSB302BMPX is a USB Converter made by onsemi in a WFQFN-14(2.5x2.5) package with 15 pins. -40℃~+125℃ 2.8V~5.5V 25uA Controller USB 3.1 WFQFN-14(2.5x2.5) USB Converters ROHS.
PCBKit's library has its KiCad symbol (Interface_USB:FUSB302BMPX, from KiCad's library) and its footprint (Package_DFN_QFN:WQFN-14-1EP_2.5x2.5mm_P0.5mm_EP1.45x1.45mm, from KiCad's library), ready for a KiCad board. 9,742 are in stock at JLCPCB (part C132291). 75 open-source boards in 60 repositories on GitHub use it.
Symbol
Footprint
From the datasheet
13- Supply, least
- 2.7 V · VDD, recommended operating min; functional operation only · p. 14
- Supply, most
- 5.5 V · VDD, recommended operating max · p. 14
- Supply, least
- 4 V · VBUS, recommended operating min · p. 14
- Supply, most
- 21 V · VBUS, recommended operating max · p. 14
- Supply, absolute maximum
- 6 V · VDD, absolute maximum · p. 14
- Supply, absolute maximum
- 28 V · VBUS, absolute maximum · p. 14
- Works from
- -40 °C · TA, recommended operating min · p. 14
- Works up to
- 85 °C · TA, recommended operating max · p. 14
- Junction, hottest
- 150 °C · Junction temperature absolute maximum · p. 14
- Current limit
- 800 mA · VCONN switch OCP typical, OCPreg=0Fh · p. 16
- Takes asleep
- 370 nA · Disabled current typical, VDD=3.0 to 5.5 V, nothing attached · p. 17
- Takes asleep
- 25 µA · Unattached standby toggle current typical, TOG_SAVE_PWR2:1=01 · p. 17
- Takes asleep
- 40 µA · BMC PD standby current typical, attached, neither transmitting nor receiving · p. 17
Specifications
66| Parameter | Conditions | As printed | Page |
|---|---|---|---|
| Supply Voltage from VDD VvDD | min -0.5 · max 6 V | 14 | |
| CC pins when configured as Host, Device or Dual Role Port VCC_HDDRP | min -0.5 · max 6 V | 14 | |
| VBUS Supply Voltage VVBUS | min -0.5 · max 28 V | 14 | |
| Storage Temperature Range TSTORAGE | min -65 · max 150 C | 14 | |
| Maximum Junction Temperature TJ | max 150 C | 14 | |
| Lead Temperature (Soldering, 10 Seconds) TL | max 260 C | 14 | |
| Human Body Model, ANSI/ESDA/JEDEC JS-001-2012 ESD | All Pins | min 4 kV | 14 |
| Charged Device Model, JEDEC JESD22-C101 ESD | All Pins | min 1 kV | 14 |
| VBUS Supply Voltage VVBUS | min 4 · typ 5 · max 21 V | 14 | |
| VDD Supply Voltage VVDD | Minimum is for functional operation only; electrical parameters require at least 3.0 V. | min 2.7 · typ 3.3 · max 5.5 V | 14 |
| VCONN Supply Voltage VVCONN | min 2.7 · max 5.5 V | 14 | |
| VCONN Supply Current IVCONN | max 560 mA | 14 | |
| Operating Temperature TA | min -40 · max 85 C | 14 | |
| RDSON for SW1_CC1 and SW1_CC2 RSW_CCx | VCONN to CC1 & CC2; TA=-40 to +85°C; TJ=-40 to +125°C | typ 0.4 · max 1.2 Ω | 16 |
| Over-Current Protection (OCP) limit at which VCONN switch shuts off over the entire VCONN voltage range ISW_CCX | OCPreg=0Fh; TA=-40 to +85°C; TJ=-40 to +125°C | min 600 · typ 800 · max 1000 mA | 16 |
| Time taken for the VCONN switch to turn on during which Over-Current Protection is disabled tSoftStart | TA=-40 to +85°C; TJ=-40 to +125°C | typ 1.5 ms | 16 |
| SRC 80 uA CC current (Default) I80_CCX | HOST_CUR1=0, HOST_CUR0=1; TA=-40 to +85°C; TJ=-40 to +125°C | min 64 · typ 80 · max 96 uA | 16 |
| SRC 180 uA CC Current (1.5 A) I180_CCX | HOST_CUR1=1, HOST_CUR0=0; TA=-40 to +85°C; TJ=-40 to +125°C | min 166 · typ 180 · max 194 uA | 16 |
| SRC 330 uA CC Current (3 A) I330_CCX | HOST_CUR1=1, HOST_CUR0=1; TA=-40 to +85°C; TJ=-40 to +125°C | min 304 · typ 330 · max 356 uA | 16 |
| SNK Pull-down Voltage in Dead Battery under all Pull-up SRC Loads VUFPDB | TA=-40 to +85°C; TJ=-40 to +125°C | max 2.18 V | 16 |
| Device Pull-down Resistance RDEVICE | Minimum and maximum guaranteed only with power applied; TA=-40 to +85°C; TJ=-40 to +125°C | min 4.6 · typ 5.1 · max 5.6 kΩ | 16 |
| CC Resistance for Disabled State zOPEN | TA=-40 to +85°C; TJ=-40 to +125°C | min 126 kΩ | 16 |
| Wake threshold for CC pin SRC or SNK LOW value. WAKElow | Bandgap and wake circuit on, PWR[0]=1; TA=-40 to +85°C; TJ=-40 to +125°C | typ 0.25 V | 16 |
| Wake threshold for CC pin SRC or SNK HIGH value. WAKEhigh | Bandgap and wake circuit on, PWR[0]=1; TA=-40 to +85°C; TJ=-40 to +125°C | typ 1.45 V | 16 |
| Hysteresis on the Ra and Rd Comparators vBC_LVLhys | TA=-40 to +85°C; TJ=-40 to +125°C | typ 20 mV | 16 |
| CC Pin Thresholds, Assumes PWR=4‟h7 vBC_LVL | BC=2‟b00; TA=-40 to +85°C; TJ=-40 to +125°C | min 0.15 · typ 0.2 · max 0.25 V | 16 |
| CC Pin Thresholds, Assumes PWR=4‟h7 vBC_LVL | BC=2‟b01; TA=-40 to +85°C; TJ=-40 to +125°C | min 0.61 · typ 0.66 · max 0.7 V | 16 |
| CC Pin Thresholds, Assumes PWR=4‟h7 vBC_LVL | BC=2‟b10; TA=-40 to +85°C; TJ=-40 to +125°C | min 1.16 · typ 1.23 · max 1.31 V | 16 |
| Measure block MDAC step size for each code in MDAC[5:0] register vMDACstepCC | TA=-40 to +85°C; TJ=-40 to +125°C | typ 42 mV | 16 |
| Measure block MDAC step size for each code in MDAC[5:0] register for VBUS measurement vMDACstepVBUS | TA=-40 to +85°C; TJ=-40 to +125°C | typ 420 mV | 16 |
| VBUS threshold at which I_VBUSOK interrupt is triggered. vVBUSthr | Measure block on, PWR[2]=1; TA=-40 to +85°C; TJ=-40 to +125°C | max 4 V | 16 |
| When TOGGLE=1, time at which internal versions of PU_EN1=PU_EN2=0 and PWDN1=PDWN2=1 selected to present externally as a SNK in the DRP toggle tTOG1 | TA=-40 to +85°C; TJ=-40 to +125°C | min 30 · typ 45 · max 60 ms | 16 |
| When TOGGLE=1, time at which internal versions of PU_EN1=1 or PU_EN2=1 and PWDN1=PDWN2=0 selected to present externally as a SRC in the DRP toggle tTOG2 | TA=-40 to +85°C; TJ=-40 to +125°C | min 20 · typ 30 · max 40 ms | 16 |
| Disable time after a full toggle (tTOG1+tTOG2) cycle so as to save power tDIS | TOG_SAVE_PWR2:1=00; TA=-40 to +85°C; TJ=-40 to +125°C | typ 0 ms | 16 |
| Disable time after a full toggle (tTOG1+tTOG2) cycle so as to save power tDIS | TOG_SAVE_PWR2:1=01; TA=-40 to +85°C; TJ=-40 to +125°C | typ 40 ms | 16 |
| Disable time after a full toggle (tTOG1+tTOG2) cycle so as to save power tDIS | TOG_SAVE_PWR2:1=10; TA=-40 to +85°C; TJ=-40 to +125°C | typ 80 ms | 16 |
| Disable time after a full toggle (tTOG1+tTOG2) cycle so as to save power tDIS | TOG_SAVE_PWR2:1=11; TA=-40 to +85°C; TJ=-40 to +125°C | typ 160 ms | 16 |
| Temp. for Vconn Switch Off Tshut | TA=-40 to +85°C; TJ=-40 to +125°C | typ 145 °C | 16 |
| Temp. Hysteresis for Vconn Switch Turn On Thys | TA=-40 to +85°C; TJ=-40 to +125°C | typ 10 °C | 16 |
| Disabled Current Idisable | VDD=3.0 to 5.5 V; Nothing Attached, No I2C Transactions; TA=-40 to +85°C; TJ=-40 to +125°C | typ 0.37 · max 5 uA | 17 |
| Unattached (standby) Toggle Current Itog | VDD=3.0 to 5.5 V; Nothing attached, TOGGLE=1, PWR[3:0]=1h, WAKE_EN=0, TOG_SAVE_PWR2:1=01; TA=-40 to +85°C; TJ=-40 to +125°C | typ 25 · max 40 uA | 17 |
| BMC PD Standby Current Ipd_stby_meas | VDD=3.0 to 5.5 V; Device Attached, BMC PD Active But Not Sending or Receiving Anything, PWR[3:0]=7h; TA=-40 to +85°C; TJ=-40 to +125°C | typ 40 uA | 17 |
| If a Soft Reset message fails, a Hard Reset is sent after tHardReset of CRCReceiveTimer expiring tHardReset | TA=-40 to +85°C; TJ=-40 to +125°C | max 5 ms | 17 |
| If the FUSB302B cannot send a Hard Reset within tHardResetComplete time because of a busy line, then a I_HARDFAIL interrupt is triggered tHardResetComplete | TA=-40 to +85°C; TJ=-40 to +125°C | max 5 ms | 17 |
| This is the value for which the CRCReceiveTimer expires. tReceive | Timer starts on the last bit of the EOP of the transmitted packet; TA=-40 to +85°C; TJ=-40 to +125°C | min 0.9 · max 1.1 ms | 17 |
| Once the CRCReceiveTimer expires, a retry packet has to be sent out within tRetry time. tRetry | TA=-40 to +85°C; TJ=-40 to +125°C | max 75 us | 17 |
| If a GoodCRC packet is not received within tReceive for NRETRIES then a Soft Reset packet is sent within tSoftReset time. tSoftReset | TA=-40 to +85°C; TJ=-40 to +125°C | max 5 ms | 17 |
| From receiving a packet, we have to send a GoodCRC in response within tTransmit time. tTransmit | Last bit of received EOP to first bit of GoodCRC preamble; TA=-40 to +85°C; TJ=-40 to +125°C | max 195 us | 17 |
| Output Low Voltage VOLINTN | INT_N; VDD=3.0 to 5.5 V; IOL=4 mA; TA=-40 to +85°C; TJ=-40 to +125°C | max 0.4 V | 18 |
| Time from global interrupt mask bit cleared to when INT_N goes LOW TINT_Mask | VDD=3.0 to 5.5 V; TA=-40 to +85°C; TJ=-40 to +125°C | min 50 us | 18 |
| Low-Level Input Voltage VILI2C | SDA, SCL; VDD=3.0 to 5.5 V; TA=-40 to +85°C; TJ=-40 to +125°C | max 0.51 V | 18 |
| High-Level Input Voltage VIHI2C | SDA, SCL; VDD=3.0 to 5.5 V; TA=-40 to +85°C; TJ=-40 to +125°C | min 1.32 V | 18 |
| Hysteresis of Schmitt Trigger Inputs VHYS | SDA, SCL; VDD=3.0 to 5.5 V; TA=-40 to +85°C; TJ=-40 to +125°C | min 94 mV | 18 |
| Input Current of SDA and SCL Pins II2C | VDD=3.0 to 5.5 V; Input Voltage 0.26 V to 2.0 V; TA=-40 to +85°C; TJ=-40 to +125°C | min -10 · max 10 uA | 18 |
| VDD Current when SDA or SCL is HIGH ICCTI2C | VDD=3.0 to 5.5 V; Input Voltage 1.8 V; TA=-40 to +85°C; TJ=-40 to +125°C | min -10 · max 10 uA | 18 |
| Low-Level Output Voltage (Open-Drain) VOLSDA | VDD=3.0 to 5.5 V; IOL=2 mA; TA=-40 to +85°C; TJ=-40 to +125°C | min 0 · max 0.35 V | 18 |
| Low-Level Output Current (Open-Drain) IOLSDA | VDD=3.0 to 5.5 V; VOLSDA=0.4 V; TA=-40 to +85°C; TJ=-40 to +125°C | min 20 mA | 18 |
| Capacitance for Each I/O Pin CI | VDD=3.0 to 5.5 V; TA=-40 to +85°C; TJ=-40 to +125°C | typ 5 pF | 18 |
| CCX Receiver Capacitance CRECV | min 200 · max 600 pF | 35 | |
| VCONN Source Bulk Capacitance CBULK | min 10 · max 220 uF | 35 | |
| VCONN Decoupling Capacitance CVCONN | typ 0.1 uF | 35 | |
| VDD Decoupling Capacitance CVDD1 | typ 0.1 uF | 35 | |
| VDD Decoupling Capacitance CVDD2 | typ 1 uF | 35 | |
| I2C Pull-up Resistors RPU | typ 4.7 kΩ | 35 | |
| INT_N Pull-up Resistor RPU_INT | min 1 · typ 4.7 kΩ | 35 | |
| I2C Pull-up Voltage VPU | min 1.62 · typ 1.8 · max 1.98 V | 35 |
Pins, by the datasheet
14- 1 CC2
- Configuration Channel for attach, orientation, detach, charging-current detection or advertisement, and USB BMC Power Delivery. · p. 4
- 2 VBUS
- VBUS input for device attach and detach detection; expected to be an OVP protected input. · p. 4
- 3 VDD
- Input supply voltage. · p. 4
- 4 VDD
- Input supply voltage. · p. 4
- 5 INT_N
- Active LOW interrupt output prompting the processor to read I2C register bits. · p. 4
- 6 SCL
- I2C serial clock connected to the phone-based I2C master. · p. 4
- 7 SDA
- I2C serial data connected to the phone-based I2C master. · p. 4
- 8 GND
- Ground. · p. 4
- 9 GND
- Ground. · p. 4
- 10 CC1
- Configuration Channel for attach, orientation, detach, charging-current detection or advertisement, and USB BMC Power Delivery. · p. 4
- 11 CC1
- Configuration Channel for attach, orientation, detach, charging-current detection or advertisement, and USB BMC Power Delivery. · p. 4
- 12 VCONN
- Regulated input switched to the appropriate CC pin to power USB3.1 full-featured cables and accessories. · p. 4
- 13 VCONN
- Regulated input switched to the appropriate CC pin to power USB3.1 full-featured cables and accessories. · p. 4
- 14 CC2
- Configuration Channel for attach, orientation, detach, charging-current detection or advertisement, and USB BMC Power Delivery. · p. 4
Ordering codes, by the datasheet
5- FUSB302BUCX
- 9-Ball Wafer-Level Chip Scale Package (WLCSP), 0.4 mm Pitch · Top mark H4; -40 to 85°C; tape and reel. · p. 3
- FUSB302BMPX
- 14-lead MLP 2.5 mm x 2.5 mm, 0.5 mm Pitch · Top mark UA; tape and reel. · p. 3
- FUSB302B01MPX
- 14-lead MLP 2.5 mm x 2.5 mm, 0.5 mm Pitch · Top mark UP; tape and reel. · p. 3
- FUSB302B10MPX
- 14-lead MLP 2.5 mm x 2.5 mm, 0.5 mm Pitch · Top mark US; tape and reel. · p. 3
- FUSB302B11MPX
- 14-lead MLP 2.5 mm x 2.5 mm, 0.5 mm Pitch · Top mark UT; tape and reel. · p. 3
Parameters
10- Applications Function
- Controller
- Current Limit
- 800mA
- Features
- FIFO buffer;Wake-up function;Low-power mode;Power-on reset
- Junction Temperature(Max)
- 150℃
- Operating Temperature
- -40℃~+85℃
- Quiescent Supply Current
- 25uA
- Standby Current
- 370nA
- USB Protocol
- USB 3.1
- Voltage - Supply
- 2.7V~21V
- Voltage - Supply(Absolute Max)
- 6V
Order codes
1- FUSB302BMPXLCSC C132291
Pinout
15| Pin | Name | Type |
|---|---|---|
| 1 | CC2 | Input/output |
| 2 | VBUS | Input |
| 3 | VDD | Power in |
| 4 | VDD | Passive |
| 5 | INT_N | Open collector |
| 6 | SCL | Input |
| 7 | SDA | Input/output |
| 8 | GND | Power in |
| 9 | GND | Passive |
| 10 | CC1 | Input/output |
| 11 | CC1 | Input/output |
| 12 | VCONN | Power in |
| 13 | VCONN | Power in |
| 14 | CC2 | Input/output |
| 15 | GND | Passive |
Open-source boards using it
All 75- 4 layers40.6 × 17.8 mm

- 2 layers43.2 × 17.6 mm

- 2 layers34.5 × 28 mm

USB PD Breakout
ReclaimerLabs/USB-PD-Breakout
A breakout board for the FUSB302 USB Power Delivery PHY
25 parts110MIT - 8 layers45 × 70 mm

- 2 layers37.8 × 52.3 mm

- 4 layers83.1 × 92.5 mm

- 6 layers76 × 46.4 mm

Rp2350 driver
sequoia-hope/rp2350-motor-controller
An RP2350 based brushless motor controller
291 parts39 - 4 layers26 × 98 mm

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Is there a KiCad symbol and footprint for the FUSB302BMPX?
Yes. The symbol is Interface_USB:FUSB302BMPX and the footprint Package_DFN_QFN:WQFN-14-1EP_2.5x2.5mm_P0.5mm_EP1.45x1.45mm, both drawn on this page. PCBKit places them on a board for you when you design with it.
What package is the FUSB302BMPX?
WFQFN-14(2.5x2.5), with 15 pins. Its footprint is drawn on this page.
Where is the FUSB302BMPX datasheet?
onsemi publishes it: the Datasheet link on this page opens it.
Where can I order the FUSB302BMPX?
JLCPCB lists it as part C132291, with 9,742 in stock; the sellers' links on this page open their listings.
What can replace the FUSB302BMPX?
Parts like it in the library: the FUSB302B01MPX by onsemi, the FUSB302B10MPX by onsemi and the FUSB302B11MPX by onsemi. Check their datasheets: a part that fits the footprint may still differ in its ratings.
Which open-source boards use the FUSB302BMPX?
75 boards in 60 repositories on GitHub; the most starred are listed on this page, with their KiCad files.
Parts like it
3FUSB302B01MPX
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WQFN-14(2.5x2.5)-40℃~+85℃ 25uA 3.3V、5V 560mA Controller USB 3.1 WQFN-14(2.5x2.5) USB Converters ROHSonsemiUSB ConvertersFUSB302B11MPX
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