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AS5600-ASOM, in 3D

AS5600-ASOM

Advanced Monolithic Systems

-40℃~+125℃ 0°~360° 1.75mm 3.3V、5V 3.9mm 4.9mm 6.5mA Magnetic rotary position sensor No PWM、I2C SOIC-8 Position Sensors ROHS

Extended
DatasheetJLCPCBLCSCams/AS5600-ASOM
Category
Position Sensors
Package
SOIC-8
Pins
8

Overview

The AS5600-ASOM is a position Sensor made by Advanced Monolithic Systems in a SOIC-8 package with 8 pins. -40℃~+125℃ 0°~360° 1.75mm 3.3V、5V 3.9mm 4.9mm 6.5mA Magnetic rotary position sensor No PWM、I2C SOIC-8 Position Sensors ROHS.

PCBKit's library has its KiCad symbol (EasyEDA_Cloud:AS5600L-ASOM, from EasyEDA) and its footprint (Package_SO:SOIC-8_3.9x4.9mm_P1.27mm, from KiCad's library), ready for a KiCad board. 351 are in stock at JLCPCB (part C79815). 16 open-source boards in 16 repositories on GitHub use it.

Symbol

VDD5V1VDD3V32OUT3GND4PGO5SDA6SCL7DIR8
EasyEDA_Cloud:AS5600L-ASOMFrom EasyEDA

Footprint

12345678
Package_SO:SOIC-8_3.9x4.9mm_P1.27mmFrom KiCad's library

From the datasheet

13
Supply, least
4.5 V · VDD5V, recommended operating min, 5.0V mode · p. 5
Supply, most
5.5 V · VDD5V, recommended operating max, 5.0V mode · p. 5
Supply, least
3 V · VDD3V3, recommended operating min, 3.3V mode · p. 5
Supply, most
3.6 V · VDD3V3, recommended operating max, 3.3V mode · p. 5
Supply, absolute maximum
6.1 V · VDD5V, absolute max · p. 4
Supply, absolute maximum
4 V · VDD3V3, absolute max · p. 4
Works from
-40 °C · Operating ambient temperature min · p. 5
Works up to
125 °C · Operating ambient temperature max · p. 5
Takes working
6.5 mA · Supply current max, NOM always on, PM = 00, typical magnetic field 60mT, excluding external load · p. 5
Takes at most
6.5 mA · Supply current max, NOM always on, excluding external load · p. 5
Takes asleep
3.4 mA · Supply current max, LPM1, polling time 5ms · p. 5
Takes asleep
1.8 mA · Supply current max, LPM2, polling time 20ms · p. 5
Takes asleep
1.5 mA · Supply current max, LPM3, polling time 100ms · p. 5

What it is and has

8
Angle measurement
Contactless · p. 1
Programmable angular range
18° to 360° · p. 1
DAC resolution
12-bit · p. 1
Low power mode
Automatic entry · p. 2
Magnet detection
Automatic · p. 2
Package
SOIC-8 · p. 2
I²C address
0x36, 7-bit · p. 10
I²C clock
1 MHz maximum · p. 10

Around it

3
cap 100 nF
between VDD5V and GND; Decoupling capacitor for 5V operation. · p. 3
cap 1 μF
between VDD3V3 and GND; Required for the internal LDO in 5.0V operation. · p. 9
cap 10 μF
between VDD3V3 and GND; Required only during OTP programming in 3.3V operation. · p. 20

Specifications

57
ParameterConditionsAs printedPage
DC Supply Voltage at VDD5V pin VDD5Vmin -0.3 · max 6.1 V4
DC Supply Voltage at VDD3V3 pin VDD3V3min -0.3 · max 4 V4
DC Supply Voltage at all digital or analog pins VIOMaximum: VDD+0.3 Vmin -0.3 V4
Input current (latch-up immunity) ISCRNorm: JESD78min -100 · max 100 mA4
Continuous power dissipation PTTA = 70°Cmax 50 mW4
Electrostatic discharge HBM ESDHBMNorm: MIL 883 E method 3015.7; rating ±2 kVmax 2 kV4
Storage temperature range TSTRGmin -55 · max 125 °C4
Package body temperature TBODYNorm: ICP/JEDEC J-STD-020max 260 °C4
Relative humidity (non-condensing) RHNCmin 5 · max 85 %4
Moisture sensitivity level MSLNorm: ICP/JEDEC J-STD-033; level 3max 34
Positive supply voltage in 5.0V mode VDD5V5.0V operation mode; during OTP burn procedure, supply line source resistance should not exceed 1Ohmmin 4.5 · typ 5 · max 5.5 V5
Positive supply voltage in 3.3V mode VDD3V33.3V operation modemin 3 · typ 3.3 · max 3.6 V5
Positive supply voltage in 3.3V mode VDD3V3During OTP burn procedure (2); supply line source resistance should not exceed 1Ohmmin 3.3 · typ 3.4 · max 3.5 V5
Supply current in NOM (1) IDDPM = 00; Always on; typical magnetic field (60mT), excluding current delivered to external load and tolerance on polling timesmax 6.5 mA5
Supply current in LPM1 (1) lDD_LPM1PM = 01; Polling time = 5ms; typical magnetic field (60mT), excluding current delivered to external load and tolerance on polling timesmax 3.4 mA5
Supply current in LPM2 (1) lDD_ LPM2PM = 10; Polling time = 20ms; typical magnetic field (60mT), excluding current delivered to external load and tolerance on polling timesmax 1.8 mA5
Supply current in LPM3 (1) lDD_ LPM3PM = 11; Polling time = 100ms; typical magnetic field (60mT), excluding current delivered to external load and tolerance on polling timesmax 1.5 mA5
Supply current per bit for burn procedure IDD_BURNInitial peak, 1 usmax 100 mA5
Supply current per bit for burn procedure IDD_BURNSteady burning,<30 usmax 40 mA5
Operating temperature TAmin -40 · max 125 °C5
Programming temperature TPmin 20 · max 30 °C5
Low-level output voltage V_OLmax 0.4 V6
Leakage current I_LKGMaximum magnitude ±1 uAmax 1 uA6
DAC integral-non-linearity electrical specification INL_DACMaximum magnitude ±5 LSBmax 5 LSB6
DAC differential-non-linearity electrical specification DNL_DACMaximum magnitude ±1 LSBmax 1 LSB6
Output resistive load ROUT_FD0 to VDD outputmin 100 kΩ6
Output resistive load ROUT_PD10% to 90% outputmin 10 kΩ6
Output capacitive load COUTmax 1 nF6
PWM frequency (1) PWMf1PWMF = 00; tolerance is ±5%typ 115 Hz7
PWM frequency (1) PWMf2PWMF = 01; tolerance is ±5%typ 230 Hz7
PWM frequency (1) PWMf3PWMF = 10; tolerance is ±5%typ 460 Hz7
PWM frequency (1) PWMf4PWMF = 11; tolerance is ±5%typ 920 Hz7
PWM duty cycle PWM_DCmin 2.9 · max 97.1 %7
PWM slew rate PWM_SRCload = 1nFmin 0.5 · max 2 V/us7
Output current for PWM output I_OMinimum source/sink capability ±0.5 mAmin 0.5 mA7
Capacitive load for PWM output C_Lmax 1 nF7
Watchdog detection time (1) T_DETWDWD = 1; tolerance is ±5%typ 1 minute7
Power-up time T_PUmax 10 ms7
Sampling rate F_Smax 150 us7
Settling time T_SETTL1SF = 00max 2.2 ms7
Settling time T_SETTL2SF = 01max 1.1 ms7
Settling time T_SETTL3SF = 10max 0.55 ms7
Settling time T_SETTL4SF = 11max 0.286 ms7
Orthogonal magnetic field strength, regular output noise ON_SLOW and ON_FAST BzRequired orthogonal component of the magnetic field strength measured at the die's surface along a circle of 1mmmin 30 · max 90 mT8
Minimum required orthogonal magnetic field strength, Magnet detection level Bz_ERRORmax 8 mT8
Resolution REStyp 12 bit8
System INL INL_BLDeviation from best line fit; 360° maximum angle, no magnet displacement, no zero-programming performed (PWM, I²C); maximum magnitude ±1 degreemax 1 degree8
RMS output noise (1 sigma) ON_SLOWOrthogonal component for the magnetic field within the specified range (Bz), after 2.2 ms; SF = 00max 0.015 degree8
RMS output noise (1 sigma) ON_FASTOrthogonal component for the magnetic field within the specified range (Bz), after 286 us, SF=11max 0.043 degree8
Logic low input voltage VILMaximum: 0.3 x VDDmin -0.3 V11
Logic low output voltage (open-drain or open-collector) at 3 mA sink current VOLVDD > 2.5Vmax 0.4 V11
Logic low output current IOLVOL = 0.4Vmin 20 mA11
Output fall time from VIHmax to VILmax tOF(1) In Fast-mode Plus, fall time is specified the same for both output stage and bus timing; consider series resistors for bus timingmin 10 · max 120 ns11
Pulse width of spikes that must be suppressed by the input filter tSP(2) Input filters on SDA and SCL suppress noise spikes of less than 50 nsmax 50 ns11
Input current at each I/O Pin IIInput Voltage between 0.1 x VDD and 0.9 x VDD; (3) I/O pins must not load or drive SDA and SCL if VDD is switched OFFmin -10 · max 10 uA11
Total capacitive load for each bus line CBmax 550 pF11
I/O capacitance (SDA, SCL) (4) CI/O(4) Special-purpose devices such as multiplexers and switches may exceed this capacitance because they connect multiple paths togethermax 10 pF11

Pins, by the datasheet

8
1 VDD5V
Positive voltage supply in 5V mode; requires 100 nF decoupling capacitor. · p. 3
2 VDD3V3
Positive voltage supply in 3.3V mode; requires external 1-uF decoupling capacitor in 5V mode. · p. 3
3 OUT
Analog/PWM output. · p. 3
4 GND
Ground. · p. 3
5 PGO
Program option with internal pull-up; connect to GND for Programming Option B. · p. 3
6 SDA
I²C data input/output; consider external pull-up. · p. 3
7 SCL
I²C clock; consider external pull-up. · p. 3
8 DIR
Direction polarity: GND makes values increase clockwise; VDD makes values increase counterclockwise. · p. 3

Parameters

14
Current - Supply
6.5mA
Current - Supply(Max)
6.5mA
Features
Programmable transmission
Height
1.75mm
Interface
I2C
Length
4.9mm
Module
No
Operating Temperature
-40℃~+125℃
Rotation Angle
0°~360°
Standby Current
3.4mA
Type
Magnetic rotary position sensor
Voltage - Supply
3V~5.5V
Voltage - Supply(Absolute Max)
6.1V
Width
3.9mm

Order codes

1

Pinout

8
The pins of the AS5600-ASOM
PinNameType
1VDD5VUnspecified
2VDD3V3Unspecified
3OUTUnspecified
4GNDUnspecified
5PGOUnspecified
6SDAUnspecified
7SCLUnspecified
8DIRUnspecified

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Questions

Is there a KiCad symbol and footprint for the AS5600-ASOM?

Yes. The symbol is EasyEDA_Cloud:AS5600L-ASOM and the footprint Package_SO:SOIC-8_3.9x4.9mm_P1.27mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the AS5600-ASOM?

SOIC-8, with 8 pins. Its footprint is drawn on this page.

Where is the AS5600-ASOM datasheet?

Advanced Monolithic Systems publishes it: the Datasheet link on this page opens it.

Where can I order the AS5600-ASOM?

JLCPCB lists it as part C79815, with 351 in stock; the sellers' links on this page open their listings.

What can replace the AS5600-ASOM?

Parts like it in the library: the TLE5012BE1000 by Infineon Technologies, the HMC1512-TR by Honeywell, the AS5600-ASOT-SOIC8 by Infineon Technologies and the MLX90316KDC-BCG-000-RE by Melexis. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the AS5600-ASOM?

16 boards in 16 repositories on GitHub; the most starred are listed on this page, with their KiCad files.

Parts like it

8