4 layers82.5 × 82.5 mm
1s3p battery board
stellarcorp/tvsc
Core software repository for the Tennessee Valley Stellar Corporation
141 parts1MIT
4 layers82.5 × 82.5 mm
Core board
stellarcorp/tvsc1Core software repository for the Tennessee Valley Stellar Corporation
- Size
- 82.5 × 82.5 mm
- Copper layers
- 4
- Thickness
- 1.6 mm
- Parts
- 150
- Nets
- 209
- Pads
- 563
- Tracks, vias
- 681, 240
- Pours
- 20
- Routed
- Yes
- KiCad
- KiCad 10.0 (file 20260206)
- Created
- 17 Nov 2022
- Updated
- 2 Nov 2026
Overview
Core board is an open-source printed circuit board by stellarcorp, from the stellarcorp/tvsc repository on GitHub, published under the MIT licence. It is a 4-layer board of 82.5 × 82.5 mm with 150 parts on 209 nets, routed with 681 tracks and 240 vias.
It is built around the STM32L452RCT6, TCAN330D and TPS63900DSKR, with the BMI323, PAC1934T-I/JQ and CL05B104KO5NNN among its other parts. Its parts include 27 resistors, 25 capacitors, 5 ICs, 3 connectors and 1 diode. It belongs with the STM32 boards of this library.
Main components
12
STM32L452RCT6
LQFP-64(10x10)-40℃~+85℃ 1.71V~3.6V 12bit 12bit 160KB 256KB 32 Bit 52 80MHz ARM Cortex-M4 Built-in FLASH LQFP-64(10x10) Microcontrollers (MCU/MPU/SOC) ROHSSTMicroelectronicsMicrocontrollers (MCU/MPU/SOC)
TCAN330D
SOIC-8-40℃~+125℃ 1Mbps 20uA 3V~3.6V 60mA CAN Transceiver SOIC-8 CAN Transceivers ROHSTexas InstrumentsCAN Transceivers
TPS63900DSKR
WSON-10-EP(2.5x2.5)-40℃~+125℃@(TJ) 1 1.8V~5.5V 1.8V~5V 400mA 75nA Adjustable Buck-Boost Buck-Boost Built-in Overcurrent Protection、Adjustable current limiting、Dynamic voltage scaling Yes WSON-10-EP(2.5x2.5) DC-DC Converters ROHSTexas InstrumentsDC-DC Converters
BMI323
LGA-14-40℃~+85℃ IMU (accelerometer + gyroscope) Motion event detection LGA-14 Accelerometers ROHSBosch SensortecAccelerometers
PAC1934T-I/JQ
UQFN-16-EP(4x4)-40℃~+85℃@(Ta) 2.7V~5.5V 4 585uA Open Drain Power Supervisor UQFN-16-EP(4x4) Supervisor and Reset ICs ROHSMicrochip TechnologySupervisor And Reset ICs
CL05B104KO5NNN
0402100nF 16V X7R ±10% 0402 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSSamsung Electro-MechanicsMultilayer Ceramic Capacitors MLCC - SMD/SMT
0402WGF9311
0402-55℃~+155℃ 50V 62.5mW 9.31kΩ Thick Film Resistor ±1% ±100ppm/℃ 0402 Chip Resistor - Surface Mount ROHSUNI-ROYALChip Resistor - Surface Mount0402WGF330J
0402-55℃~+155℃ 33Ω 50V 62.5mW Thick Film Resistor ±1% ±100ppm/℃ 0402 Chip Resistor - Surface Mount ROHSUNI-ROYALChip Resistor - Surface MountCL05A105KA5NQN
04021uF 25V X5R ±10% 0402 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSSamsung Electro-MechanicsMultilayer Ceramic Capacitors MLCC - SMD/SMT
WSL0805R1000DEA18
0805100mΩ 250mW Current Sense Resistor SMD ±0.5% ±75ppm/℃ 0805 Current Sense Resistors / Shunt Resistors ROHSVishay IntertechnologyCurrent Sense Resistors / Shunt Resistors
GRM187R60J226ME15D
060322uF 6.3V X5R ±20% 0603 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSMurataMultilayer Ceramic Capacitors MLCC - SMD/SMT0402WGF604J
0402-55℃~+155℃ 50V 60.4Ω 62.5mW Thick Film Resistor ±1% ±100ppm/℃ 0402 Chip Resistor - Surface Mount ROHSUNI-ROYALChip Resistor - Surface Mount
README
README.md#TVSC
This repository is the principal codebase for the Tennessee Valley Stellar Corporation. We are a community-scale space agency in east Tennessee dedicated to the open development of technologies enabling the public use of space.
Repository structure
There are three main sections to the repository. The most active development at the moment is taking place in the hal and the electronics directories. The hal directory contains the Hardware Abstraction Layer. The electronics directory holds our PCB design work. The rest of the repository (the third section) consists of older code that is in need of maintenance/documentation or deletion.
Getting started
Bazel
We use Bazel for our build system. It is one of the few build tools that allow for multi-language, cross-platform hermetic builds. For more information, checkout https://bazel.build/
Part of Bazel is a command line tool called Bazelisk. This tool manages Bazel installations on your local machine and allows us to specify in the repo itself the version of Bazel to use and prevents build errors due to build system versioning. Bazelisk executables are checked into the top-level of this repo. Please use them when building.
On the first run of bazelisk on a given computer, it will download the correct version of Bazel. So, this first build may take a while.
Toolchain
The build uses the local toolchain for desktop builds. This toolchain should support C++20.
For embedded builds, the toolchain and system libraries are downloaded from various external repositories.
The builds are designed to work on Linux. Other systems can be added as needed.
Do a test build for your local system:
From the top-level of the repo,
./bazelisk-linux-amd64 build --config=nucleo_l452re //...The first build will take a long time, but future builds should be relatively fast.
Parts
150| Qty | Value | Footprint | References |
|---|---|---|---|
| 49 | NetTie_2 | footprints:NetTie-2_SMD_Pad0.279mm | NT801, NT802, NT803, NT804, NT805, NT806, NT807, NT808, NT809, NT810, NT811, NT812, NT813, NT814, NT815, NT816 +33 |
| 32 | NetTie_2 | footprints:NetTie-2_SMD_Pad0.3mm | NT301, NT302, NT303, NT304, NT305, NT306, NT307, NT308, NT309, NT310, NT311, NT312, NT313, NT314, NT315, NT316 +16 |
| 14 | 100n | footprints:Nondescript_C_0402_1005Metric | C301, C302, C305, C306, C308, C309, C311, C312, C402, C403, C501, C502, C902, C903 |
| 13 | 9k31 | footprints:Nondescript_R_0402_1005Metric | R301, R305, R306, R307, R308, R309, R310, R311, R312, R501, R901, R902, R903 |
| 9 | 33 | footprints:Nondescript_R_0402_1005Metric | R102, R302, R303, R304, R313, R701, R702, R703, R704 |
| 8 | 1u | footprints:Nondescript_C_0402_1005Metric | C303, C304, C307, C310, C313, C314, C401, C901 |
| 4 | NetTie_2 | NetTie:NetTie-2_SMD_Pad0.5mm | NT401, NT402, NT403, NT404 |
| 2 | 100m | Resistor_SMD:R_0805_2012Metric | R101, R602 |
| 2 | 22u | footprints:Nondescript_C_0603_1608Metric | C601, C603 |
| 2 | 60 | footprints:Nondescript_R_0402_1005Metric | R401, R402 |
| 2 | SolderJumper_2_Open | Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm | JP401, JP402 |
| 1 | 10u | footprints:Nondescript_C_0603_1608Metric | C602 |
| 1 | 2.2µH | Inductor_SMD:L_1008_2520Metric | L601 |
| 1 | 36k5 | footprints:Nondescript_R_0402_1005Metric | R601 |
| 1 | BMI323 | Package_LGA:Bosch_LGA-14_3x2.5mm_P0.5mm | U901 |
| 1 | DEBUG | LED_SMD:LED_0603_1608Metric | D101 |
| 1 | PAC1934T-I/JQ | Package_DFN_QFN:UQFN-16-1EP_4x4mm_P0.65mm_EP2.6x2.6mm | U501 |
| 1 | QSH-030-01-L-D-A | footprints:SAMTEC_QSH-030-01-L-D-A | J802 |
| 1 | QTH-030-07-L-D-A | footprints:SAMTEC_QTH-030-07-L-D-A | J801 |
| 1 | STLINK | Connector:Tag-Connect_TC2030-IDC-NL_2x03_P1.27mm_Vertical | J701 |
| 1 | STM32L452RCTx | Package_QFP:LQFP-64_10x10mm_P0.5mm | U301 |
| 1 | TCAN330DR | footprints:SOIC127P600X175-8N | U401 |
| 1 | TPS63900 | footprints:WSON-10-1EP_2.5x2.5mm_P0.5mm_EP1.2x2mm_ThermalVias | U601 |
| 1 | ~ | footprints:Core_Board | PCB801 |
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Questions
How big is the Core board PCB?
It measures 82.5 × 82.5 mm and has 4 copper layers, 1.6 mm thick.
What parts does the Core board use?
150 parts, built around the STM32L452RCT6, TCAN330D, TPS63900DSKR and BMI323. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the Core board KiCad files?
From the stellarcorp/tvsc repository on GitHub, at the commit this page was made from: the board is electronics/projects/blocks/core_board/core_board.kicad_pcb. PCBKit opens the board in the browser, with nothing to install.
Can I use the Core board design in my own project?
Its repository publishes it under the MIT licence: you may reuse it on that licence's terms (keep the author's notice, and for a copyleft licence share your changes alike).