

Eng Thesis
Engineering thesis HW repo
- Size
- 65.5 × 74.8 mm
- Copper layers
- 4
- Thickness
- 1.6 mm
- Parts
- 118
- Nets
- 106
- Pads
- 376
- Tracks, vias
- 736, 244
- Pours
- 9
- Routed
- Yes
- KiCad
- KiCad 7 (file 20221018)
- Created
- 30 Oct 2023
- Updated
- 22 Oct 2024
Overview
Eng Thesis is an open-source printed circuit board by Roxasch97, from the Roxasch97/Eng_Thesis repository on GitHub. It is a 4-layer board of 65.5 × 74.8 mm with 118 parts on 106 nets, routed with 736 tracks and 244 vias.
It is built around the SN75176AD, SN6507DGQ and ISO1541D, with the BAT165E6327HTSA1 among its other parts. Its parts include 41 capacitors, 40 resistors, 9 ICs, 7 diodes and 7 connectors. It belongs with the STM32 boards of this library.
Main components
4SN75176AD
SOIC-80℃~+70℃ 1 1 4.75V~5.25V 5Mbps Transceiver SOIC-8 RS-485 / RS-422 ICs ROHSTexas InstrumentsRS-485/RS-422 ICsSN6507DGQ
MSOP-10-EP-55℃~+125℃ 1Ω 3V~36V 4mA 500mA Soft-start、Overcurrent Protection、Over temperature protection、Under-voltage lockout、Short-Circuit Protection MSOP-10-EP Transformer Drivers ROHSTexas InstrumentsPower Management - SpecializedISO1541D
SOIC-8-40℃~+125℃ 2500 50kV/us Bidirectional Open-drain buffer output SOIC-8 I2C Isolators ROHSTexas InstrumentsI2C IsolatorsBAT165E6327HTSA1
SOD-32340V 50uA@40V 740mV@750mA 750mA SOD-323 Schottky Diodes ROHSInfineon TechnologiesSchottky Diodes
Parts
118| Qty | Value | Footprint | References |
|---|---|---|---|
| 12 | 4.7k | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R1, R3, R5, R6, R16, R17, R39, R40, R41, R42, R43, R44 |
| 11 | 1k | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R10, R11, R12, R20, R21, R22, R34, R35, R36, R37, R38 |
| 10 | 0.1u | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C7, C8, C23, C27, C29, C34, C35, C42, C43, C44 |
| 9 | 33n | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C26, C30, C31, C32, C33, C36, C37, C38, C39 |
| 6 | 100n | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C1, C2, C3, C4, C9, C11 |
| 4 | 100 | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R28, R29, R30, R31 |
| 4 | 10k | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R2, R4, R8, R9 |
| 4 | 1u | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C10, C15, C19, C24 |
| 4 | 30m | Resistor_SMD:R_2512_6332Metric_Pad1.40x3.35mm_HandSolder | R24, R25, R26, R27 |
| 4 | LED | LED_SMD:LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder | D1, D2, D7, D8 |
| 3 | 4.7u | Capacitor_Tantalum_SMD:CP_EIA-3216-18_Kemet-A_Pad1.58x1.35mm_HandSolder | C14, C16, C25 |
| 3 | Screw_Terminal_01x02 | LibLoader:TB508P2PBL | J7, J8, J9 |
| 2 | 10n | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C13, C22 |
| 2 | 200k | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R32, R33 |
| 2 | 20p | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C45, C46 |
| 2 | BAT165E6327HTSA1 | Diode_SMD:D_SOD-323F | D5, D6 |
| 2 | LD3985G33R_TSOT23 | Package_TO_SOT_SMD:TSOT-23-5 | U4, U6 |
| 1 | 10,26u | Inductor_SMD:L_1210_3225Metric_Pad1.42x2.65mm_HandSolder | L1 |
| 1 | 10u | Capacitor_Tantalum_SMD:CP_EIA-3216-18_Kemet-A_Pad1.58x1.35mm_HandSolder | C6 |
| 1 | 10u | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C21 |
| 1 | 110k | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R23 |
| 1 | 2.2u | Capacitor_SMD:CP_Elec_4x5.3 | C12 |
| 1 | 21K | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R14 |
| 1 | 3.58 MHz | Crystal:Crystal_SMD_HC49-SD_HandSoldering | Y2 |
| 1 | 33n | Capacitor_SMD:C_1210_3225Metric_Pad1.33x2.70mm_HandSolder | C41 |
| 1 | 3V3_ISO | TestPoint:TestPoint_Pad_1.5x1.5mm | TP6 |
| 1 | 4,7u | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C5 |
| 1 | 50K | Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R18 |
| 1 | 78250MC-R | LibLoader:SOP254P1270X660-6N | T2 |
| 1 | ADE7953xCP | Package_CSP:LFCSP-28-1EP_5x5mm_P0.5mm_EP3.14x3.14mm | U7 |
| 1 | Conn_01x02_Socket | LibLoader:TB508P2PBL | J5 |
| 1 | Conn_01x03_Socket | Connector_PinSocket_2.54mm:PinSocket_1x03_P2.54mm_Vertical | J2 |
| 1 | D_Zener | Diode_SMD:D_MELF | D4 |
| 1 | Fuse | Fuse:Fuse_2920_7451Metric_Pad2.10x5.45mm_HandSolder | F1 |
| 1 | ISO1541 | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | U8 |
| 1 | ISO6721RBDR | LibLoader:SOIC127P600X175-8N | IC1 |
| 1 | Jack-DC | LibLoader:PCGK21 | J6 |
| 1 | LF50_TO252 | Package_TO_SOT_SMD:TO-252-2 | U3 |
| 1 | MODBUS_ADDR | LibLoader:SDA08H1BD | SW1 |
| 1 | Q_PMOS_GSD | Package_TO_SOT_SMD:SOT-23_Handsoldering | Q1 |
| 1 | RESET | LibLoader:TL3305BF160QG | SW2 |
| 1 | SN6507DGQ | Package_SO:HVSSOP-10-1EP_3x3mm_P0.5mm_EP1.57x1.88mm | U5 |
| 1 | SN75176AD | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | U1 |
| 1 | STM32F030C8Tx | Package_QFP:LQFP-48_7x7mm_P0.5mm | U2 |
| 1 | ST_Llink | Connector_PinHeader_2.54mm:PinHeader_1x06_P2.54mm_Vertical | J1 |
| 1 | SolderJumper_2_Open | Jumper:SolderJumper-2_P1.3mm_Open_TrianglePad1.0x1.5mm | JP1 |
| 1 | TestPoint | TestPoint:TestPoint_Pad_1.5x1.5mm | TP3 |
The 114 most common of 118 parts.
Questions
How big is the Eng Thesis PCB?
It measures 65.5 × 74.8 mm and has 4 copper layers, 1.6 mm thick.
What parts does the Eng Thesis use?
118 parts, built around the SN75176AD, SN6507DGQ, ISO1541D and BAT165E6327HTSA1. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the Eng Thesis KiCad files?
From the Roxasch97/Eng_Thesis repository on GitHub, at the commit this page was made from: the board is Eng_Thesis.kicad_pcb and its schematic Eng_Thesis.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the Eng Thesis design in my own project?
Its repository states no licence, so its author keeps all rights: ask Roxasch97 before reusing the design.
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