CameraBoard

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title: "LV3 Camera Board" subtitle: | Fabrication and Assembly Information
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About this Board

Board Description

This board runs the 9 cameras for the 360 view camera setup on LV3.x. It takes 19V to charge the 4S battery pack, and only runs the cameras when rocketready is asserted.

Documentation Links

• Git repository: https://github.com/psas/lv3.1-avionics
• TODO: Design Notes + Design Review Notes

Documentation Files

Contact Information

• Website: https://www.pdxaerospace.org/
• Email: aerospace@pdx.edu
• Instagram: @pdxaerospace

Board Renders

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Printed Circuit Board (PCB) Fabrication Information

Board Info

• 2 layer board
• Bounding box is 101.6000 x 76.2000 mm
• Board thickness is 1.59 mm (0.063 inch)

Board Requirements

• Design Rules
  • Minimum Trace / Space design rulea: 0.1524 mm (6.0 mil) / 0.1524 mm (6.0 mil)
  • Outer dimension router tolerance: +/- 0.254 mm (10.0 mil)
  • Hole placement tolerance: +/- 0.075 mm (3.0 mil)
• Drills
  • Drill Positional Tolerance: 0.051 mm (2.0 mil)
  • Drill Size tolerance: +/- 0.064 mm (2.5 mil)
• Plated/Un-plated holes
  • There are no un-plated (NPT) holes
  • There are 96 plated through (PTH) holes
  • PTH minimum diameter: 0.254 mm (10 mil)
  • PTH minimum annulus: 0.102 mm (4 mil) radius
• Outline/Routing
  • No requirements.
• Slots
  • There are no slots.
• Cutouts
  • There are no cutouts
• There are 3 fiducials on the top layer.
• Panel tabs ("mouse bites")
  • Card edges must be smooth; no mouse bites or other intrusions into the card outline.
  • If external mouse bites are required, minimize and customer will remove by hand before assembly.
• If not otherwise specified, build to IPC 6012 Class 2 or better.

Materials

• No requirements for materials.
• Copper Surface treatment should be ENIG, althogh immersion Silver is acceptable.
• White silkscreen on top and bottom surface
• Taiyo PSR-4000 or equivalent soldermask on top and bottom, no requirements for color.

Stack Up

• Any FR4 like material is acceptable.
• 1 oz Copper on top and bottom layers
• 1.6 mm thick when done (1/16 inch)

Array / Panel Information

• Coordinate with Contract Manufacturer (CM) for optimal size of this panel.
• If no feedback from CM, then produce single boards (no panel).

Fabrication Files

IPC-2581 File

Legacy PCB Files

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Printed Circuit Board Assembly (PCBA) Information

Assembly Info

• All components are on the top side of the board.
• Mixed SMT and TH components.

Assembly Requirements

• Assemble to IPC Class 2 or better
• Solder paste can be ROHS or leaded.
• No clean, or Aqueous flux and wash, can be used.
• No conformal coating.

Component Specific Assembly Information

• None

Assembly Files

IPC-2581 File

Bill of Materials (BOM)

Solder Paste Stencils

Mounting/Placement Location