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4 layers94.7 × 73.7 mmThermocouple, the printed circuit board in 3D

A small liquid rocket engine test stand.

Size
94.7 × 73.7 mm
Copper layers
4
Thickness
1.6 mm
Parts
117
Nets
105
Pads
393
Tracks, vias
1,061, 111
Pours
4
Routed
Yes
KiCad
KiCad 4
Created
24 Jun 2015
Updated
11 Jan 2021

Overview

Thermocouple is an open-source printed circuit board by psas, from the psas/liquid-engine-test-stand repository on GitHub, published under the GPL-2.0 licence. It is a 4-layer board of 94.7 × 73.7 mm with 117 parts on 105 nets, routed with 1,061 tracks and 111 vias.

It is built around the LM358DR and LTC3260IDE. Its parts include 59 resistors, 42 capacitors, 10 ICs and 2 connectors.

Main components

2

README

README.md

liquid-engine-test-stand

Orthographic View of Test Stand

Liquid Fuel Engine Test Stand (LFETS) Project Overview

PSAS team members have already designed and built a 2.5 kN regeneratively cooled bipropellant (liquid oxygen and ethanol) rocket engine. This engine design included a number of innovative features including fully parametric CAD design using python scripts and SolidWorks, direct metal laser sintering (DMLS) additive manufacturing by i3D manufacturing, direct spark ignition and pintle injection. Although the rocket engine itself has already been produced, much of the overall system complexity lies in the piping, control, and data acquisition systems which support it. This project intends to flesh out these systems in order to test the engine and its successors.

The test stand will safely test current and PSAS future generation liquid fuel engines prior to integration into a flight vehicle. PSAS will use the stand to measure engine performance, liquid fuel and oxidizer flow rates, propellant mixing capabilities and other engine performance figures of merit. These tests will be performed remotely, using automated valve switching and data acquisition systems. The LFETS system is designed to be portable by truck, and will support propulsion testing of engines up to 10 kN of thrust. The project will be open-source and will utilize live web-based Jupyter notebook design documentation.

The feed system uses a classic regulated pressure-fed thermodynamic cycle. Gaseous nitrogen is the pressurant. The LFETS system includes a welded thrust loading truss structure, propellant and pressurant supply tanks, and feed system flow componentry. The project also includes safety and Failure Mode Effects Analysis, and procedures for safe operation and transport. The LFETS Electrical Ground Support Equipment (EGSE) will allow for the test stand to be controlled remotely. The test stand computer controls all actuators in the LFETS system, auto-sequences engine ignition, start, shutdown, pad-safing, and contingency procedures for any test exception, as well as receiving telemetry from sensors and instrumentation. The LFETS EGSE system is derived from the 3rd generation PSAS launch tower computer, which uses a BeagleBone Black microcontroller, the Marionette open-source DAQ, and a custom “SCADA-like” GUI.

Useful Links

CAD Files

CAD Guide

Bill of Materials

PID

Capstone Class Work

Parts

117
QtyValueFootprintReferences
160Resistors_SMD:R_0805_HandSolderingR38, R39, R40, R41, R44, R45, R46, R47, R48, R50, R52, R54, R55, R56, R57, R58
15.1uFCapacitors_SMD:C_0402C8, C24, C25, C26, C27, C28, C29, C30, C31, C32, C33, C38, C39, C41, C42
12100Resistors_SMD:R_1206R10, R11, R12, R13, R14, R15, R16, R17, R30, R31, R32, R33
10.01uFCapacitors_SMD:C_0402C3, C5, C15, C16, C17, C18, C19, C20, C21, C22
91uFCapacitors_SMD:C_0603_HandSolderingC4, C11, C12, C13, C14, C34, C35, C36, C37
710uFCapacitors_SMD:C_0603_HandSolderingC1, C2, C6, C7, C10, C23, C40
410KResistors_SMD:R_0603_HandSolderingR18, R19, R20, R21
4178Resistors_SMD:R_0402R49, R51, R53, R59
41MResistors_SMD:R_0805_HandSolderingR6, R7, R8, R9
43.32KResistors_SMD:R_0805_HandSolderingR22, R23, R24, R25
45KResistors_SMD:R_1206R26, R27, R28, R29
4AD8495snapEda:SOP65P490X110-8NU3, U4, U5, U6
4MountingHole_2.7mm_M2.5_Pad_ViaMounting_Holes:MountingHole_2.7mm_M2.5_Pad_ViaREF1, REF2, REF3, REF4
2221KResistors_SMD:R_0805_HandSolderingR2, R5
230.1KResistors_SMD:R_0805_HandSolderingR1, R4
2MCP3424T-E/STsnapEda:SOP65P640X120-14NU8, U10
11.3KResistors_SMD:R_0603_HandSolderingR43
110.2KResistors_SMD:R_0805_HandSolderingR35
111.1KResistors_SMD:R_0603_HandSolderingR36
12.2uFCapacitors_SMD:C_0805_HandSolderingC9
12.55KResistors_SMD:R_0402R37
1200KResistors_SMD:R_0805_HandSolderingR3
14.75KResistors_SMD:R_0805_HandSolderingR42
15.17KResistors_SMD:R_0603_HandSolderingR34
1ADA4062snapEda:ADA4062-4ARUZU7
1CONN_02X13Pin_Headers:Pin_Header_Straight_2x13P1
1DB25snapEda:TE_Conn_5747846_4_DB25J1
1LM358DRdigikey-footprints:SOIC-8_W3.9mmU9
1LM78L05ACZ_NOPBdigikey-footprints:TO-92-3U2
1LTC3260snapEda:MSOP-16_MSEU1

Questions

How big is the Thermocouple PCB?

It measures 94.7 × 73.7 mm and has 4 copper layers, 1.6 mm thick.

What parts does the Thermocouple use?

117 parts, built around the LM358DR and LTC3260IDE. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the Thermocouple KiCad files?

From the psas/liquid-engine-test-stand repository on GitHub, at the commit this page was made from: the board is TSAR/TSAR_ADC/kicad_board_design/thermocouple.kicad_pcb. PCBKit opens the board in the browser, with nothing to install.

Can I use the Thermocouple design in my own project?

Its repository publishes it under the GPL-2.0 licence: you may reuse it on that licence's terms (keep the author's notice, and for a copyleft licence share your changes alike).

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