2 layers90 × 39 mm
Thermocouple Board.PROTO
robherc/Thermocouple_Board
Ultra-fast, Ultra-Precise Thermocouple reading board with SPI and Analog outputs
112 parts1BSD-3-Clause
2 layers101.6 × 120.6 mm
Crush main board
MuddSub/crush-main-boardKiCAD files containing the design and layout of the signal board for Crush.
- Size
- 101.6 × 120.6 mm
- Copper layers
- 2
- Thickness
- 1.6 mm
- Parts
- 47
- Nets
- 87
- Pads
- 355
- Tracks, vias
- 532, 63
- Pours
- 4
- Routed
- Yes
- KiCad
- KiCad 7 (file 20221018)
- Created
- 26 Feb 2023
- Updated
- 2 Nov 2026
Overview
Crush main board is an open-source printed circuit board by MuddSub, from the MuddSub/crush-main-board repository on GitHub. It is a 2-layer board of 101.6 × 120.6 mm with 47 parts on 87 nets, routed with 532 tracks and 63 vias.
It is built around the TEENSY 4.1, ISO7740DW and ISO1640BDR-HXY, with the BSN20, DMG2301L and SM5817PL-TP among its other parts. Its parts include 17 connectors, 8 capacitors, 6 resistors, 6 ICs and 4 transistors. It belongs with the NXP (LPC, Kinetis, i.MX RT) boards of this library.
Main components
6
TEENSY 4.1
Development Boards & Kits - ARM ModuleSparkFun ElectronicsUncategorised
ISO7740DW
SOIC-16-300mil-55℃~+125℃ 0 10.7ns 100Mbps 100kV/us 2.25V~5.5V 2.25V~5.5V 4 5000 High Level SOIC-16-300mil Digital Isolators ROHSTexas InstrumentsDigital Isolators
ISO1640BDR-HXY
SOP-8SOP-8 I2C Isolators ROHSHXY MOSFETI2C Isolators
BSN20
SOT-23-55℃~+150℃ 1 N-channel 1.5V 17.5pF 2.4nC@10V 2.5Ω@10V 300mA 350mW 50V 6.5pF N-Channel SOT-23 MOSFETs ROHSSlkorMOSFETsDMG2301L
SOT-23-55℃~+150℃ 1 P-Channel 1.2V 1.5W 150mΩ@2.5V 20V 3A 5.5nC@4.5V P-Channel SOT-23 MOSFETs ROHSDiodes IncorporatedMOSFETs
SM5817PL-TP
SOD-123FL-65℃~+125℃ 1 Independent 1A 20V 30A 450mV@1A SOD-123FL Schottky Diodes ROHSMicro Commercial ComponentsSchottky Diodes
Parts
47| Qty | Value | Footprint | References |
|---|---|---|---|
| 8 | 0u1 | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C1, C2, C3, C4, C5, C6, C7, C8 |
| 6 | 2k4 | Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder | R1, R2, R3, R4, R5, R7 |
| 4 | MountingHole_Pad | MountingHole:MountingHole_3.7mm_Pad_Via | H1, H2, H3, H4 |
| 3 | 3x2 Header | Crush_Mainboard_Footprints:3x2_Header | J5, J6, J12 |
| 3 | 3x3 Header | Crush_Mainboard_Footprints:3x3_Header | J9, J10, J11 |
| 3 | BSN20 | Package_TO_SOT_SMD:SOT-23 | Q1, Q2, Q3 |
| 2 | 3x4 Header | Crush_Mainboard_Footprints:3x4_Header | J7, J8 |
| 2 | 3x4_Header | Crush_Mainboard_Footprints:3x4_Header | J13, J14 |
| 2 | 4x4_Header | Crush_Mainboard_Footprints:4x4_Header | J1, J2 |
| 2 | Conn_01x02 | Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical | J16, J17 |
| 2 | INA232B | Package_TO_SOT_SMD:SOT-23-8_Handsoldering | U5, U6 |
| 2 | ISO7740DW | Crush_Mainboard_Footprints:SOIC127P1030X265-16N | U2, U3 |
| 1 | 2157601008 | Crush_Mainboard_Footprints:MOLEX_2157601008 | J15 |
| 1 | 3x1_Header | Crush_Mainboard_Footprints:3x1_Header | J4 |
| 1 | 6x2_Header | Crush_Mainboard_Footprints:6x2_Header | J3 |
| 1 | DMG2301L | Package_TO_SOT_SMD:SOT-23 | Q5 |
| 1 | ISO1640BDR | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | U4 |
| 1 | LOGO | LOGO | G*** |
| 1 | SM5817PL-TP | Crush_Mainboard_Footprints:SODFL3718X108N | D1 |
| 1 | Teensy4.1 | Crush_Mainboard_Footprints:Teensy41 | U1 |
Questions
How big is the Crush main board PCB?
It measures 101.6 × 120.6 mm and has 2 copper layers, 1.6 mm thick.
What parts does the Crush main board use?
47 parts, built around the TEENSY 4.1, ISO7740DW, ISO1640BDR-HXY and BSN20. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the Crush main board KiCad files?
From the MuddSub/crush-main-board repository on GitHub, at the commit this page was made from: the board is crush-main-board.kicad_pcb and its schematic crush-main-board.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the Crush main board design in my own project?
Its repository states no licence, so its author keeps all rights: ask MuddSub before reusing the design.
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