Controller

Sensor routing handoff

Open sensor.kicad_pro. The compact sensor is 18 × 64 mm, four layers, with 16 footprints and zero unrouted connections. Mount its mask-covered glass face with thin adhesive film, top 2 mm below the rim. J1 is six outward-face solder pads; the pigtail exits left when looking at the electronics. No component lead or mount sits between electrode copper and glass.

The glass-facing B.Cu electrodes and In2.Cu driven shields are fixed geometry. F.Cu holds electronics and all ordinary routes; In1.Cu provides continuous ground. The accepted routing has 117 track segments and nine tented vias, including five GND vias. All ground pads share the F.Cu fill, connected to In1.Cu. Preserve the routed board and its exact accepted glass-side breakouts. Through vias default to 0.45/0.20 mm.

Strict ERC and schematic parity are clean. Six exact, UUID-bound padstack warnings are excluded because the intentional driven-shield pads exist only on In2.Cu. Their complete geometry/net contract is checked separately; unrelated padstack warnings remain enabled. See the routing guide, design basis and handoff lock for current acceptance and evidence. Final preparation records the outward pad-number/RIM labels and native mask/paste/via verification. The subsequent stencil receipt selects the 100 µm process without changing native geometry. Older two-layer and above-rim instructions are superseded.

Keep this project, its custom rules and local libraries together. Route, refill with B, save and run sh scripts/check-routing.sh sensor --final before fabrication checks/export. Unconnected items are allowed without --final. Physical capacitance and adhesive response remain commissioning measurements.

Owner routing is accepted in the routing receipt. Final pre-fabrication review remains deferred until all three boards are reviewed together.