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2 layers153 × 77 mmDevelopment board, the printed circuit board in 3D

Development board

inoa-io/satellite2

Satellite Hardware Project and Documentation

Size
153 × 77 mm
Copper layers
2
Thickness
1.6 mm
Parts
103
Nets
157
Pads
426
Tracks, vias
496, 2
Pours
2
Routed
Yes
KiCad
KiCad 6 (file 20211014)
Created
9 Nov 2021
Updated
18 Mar 2026

Overview

Development board is an open-source printed circuit board by inoa-io, from the inoa-io/satellite repository on GitHub, published under the CERN-OHL-P-2.0 licence. It is a 2-layer board of 153 × 77 mm with 103 parts on 157 nets, routed with 496 tracks and 2 vias.

It is built around the MAX3486CSA+, LTV-817S and SN74CBT16292DL, with the FT2232HL, LD1117S33 and BAV303-TR among its other parts. Its parts include 40 resistors, 17 capacitors, 11 diodes, 10 connectors and 8 ICs. It belongs with the microcontroller boards boards of this library.

Main components

9

README

README.md

Inoa Satellite

Main

The Inoa Satellite is a lightweight and secure gateway for your fuse box or industrial environment.

Please see our Project Pages for details.

./docs/assets/images/satellite.jpg

Why?

There is a huge amount of IoT gateways out there, but none of these fulfill completely all of our design goals:

  • Usage in a rough industrial environment
  • Hardware driven security (HSM)
  • Inexpensive hardware to be able to finance a huge fleet of devices
  • Low energy consumption
  • Fuse box casing (DIN rail)
  • Small (2 FE / 36 mm) to allow mounting in existing fuse boxes
  • Extendable design to be future proof
  • Modular design to adapt hardware to use cases and keep costs low

How?

We use KiCad for our PCB designs, Parts Community and SnapEDA for symbols, footprints, models 'n stuff...

To meet our design goals, we decided to:

  • Use the ESP32
  • Use the ATECC family of chips as HSM
  • Choose industrial proof parts, shielding and ESD protection
  • Pick a certified DIN rail casing
  • Cut the design to several stacked modules

Modules

General

The Satellite comes with a stacked design allowing to interchange the modules on each level of the stack to fit the needs of its planned duty.

This allows quick and cheap adjustment of single devices, ensures expandability, keeps costs low and offers replacement of defect modules with spare parts.

The Satellite consists of up to 4 levels (level 1 is the bottom). Level 3 is an optional level and may be left out.

  • Level 1 holds the power supply and metering / control peripheries.
  • Level 2 is the main module for the micro controller
  • Level 3 is the network / communication level (Ethernet, NB IoT, LoRa, ...)
  • Level 4 is meant for the user panel

Metering Modules

Electric Metering Module

The electric metering module is dedicated to be used for interacting with electric meters, inverters, batteries and so on. It is a base module on level 1 of the stack. Its features are:

  • 5V-24V power input
  • PE / Shield pin
  • 2x RS485 interface (used for e.g. ModBus, ...)
  • 2x pulse interface (S0, Photoelectric barrier, ...)
  • 2x relay driver
CT Metering Module

The CT module is dedicated to be used for EMS use cases. Current transformers (split core) with voltage output may be used (e.g. SCT-013).

It is a base module on level 1 of the stack. Its features are:

  • 5V-24V power input
  • 3x CT
  • 1x Analog in (ADC)
  • 1x Digital in (e.g. S0 meters)
  • 1x RS485 interface (ModBus RTU meters)
MBus / WMBus Metering Module

The M-Bus module is dedicated to be used for interacting with different meters via RS485 or M-Bus. The module acts as M-Bus master, but a separate power supply is needed. Because the size of this power supply depends on the amount of connected meters, we decided to give the ability to choose a fitting, external power supply.

The M-Bus module is a base module on level 1 of the stack. Its features are:

  • 5V-24V power input
  • 1x M-Bus interface
  • 1x RS485 interface (ModBus RTU meters)
  • 2x pulse interface (S0 meters)
  • PE / Shield pins for bus connections

SoC Module

The SoC module is the heart of the satellite and home of the microprocessor, flash memory and HSM (hardware security module). It is the main module on level 2 of the stack. Its features are:

  • ESP32 MPU (32 Bit, Dual Core, 240 MHz)
  • 8 MB RAM
  • 16 MB flash
  • µSD Card slot for external storage
  • HSM (ATECC608)

Ethernet Module

The Ethernet module connects the Satellite to Ethernet. It is a network module on level 3 of the stack. Its features are:

  • W5500 Ethernet chip (MAC+PHY)
  • ESD protection
  • Shielded RJ45 plug

NB IoT Module

Coming soon

LoRa Module

Coming soon

Panel Module

The panel module is the "user interface" and home of all user input output devices of the Satellite. It is the top module on level 4. Its features are:

  • Power and status LED
  • Reset and setup button
  • 128x64 OLED display (optional)
  • RS232 Debug interface
  • External WiFi antenna (optional)

Casings

We use a DIN rail mounted casing in 2 FE width. See Datasheet for details.

Development

Building the Project

You will need:

Clone this project and run ./build.sh. You will get a selection of the possible modules to be built. Tests will be executed and the build result is placed in the out folder.

Project structure

FolderPurpose
./casingConstruction files for the casing
./configsKiCad-Export configuration
./development-boardDesign for the development board
./docsDocumentation
./ethernet-extensionDesign for the Ethernet module
./librariesElectric symbols, footprints and 3D models
./metering-moduleDesign for the metering module
./nbiot-extensionDesign for the NB IoT module
./outBuild output folder
./panel-moduleDesign for the panel module
./soc-moduleDesign for the SoC module

Conventions

Markings
  • Each PCB has an etched label for "TOP" and "BOT" marks
  • Each PCB has an etched label for the product serial following the pattern: SR-XX-NNN (e.g. SR-SM-021)
  • The product serial start with "SR" for "Satellite Rail", the next two characters are reserved for the module, the 3 digits represents the version
SerialModule / PartCurrent Version
SR-SC-XXXSoC Modulev2.0
SR-EM-XXXElectric Meteringv2.0
SR-CM-XXXCurrent Loop Meteringv2.0
SR-MM-XXXMBus / WMBus Meteringv2.0
SR-ET-XXXEthernet Modulev2.0
SR-NB-XXXNB IoT Modulev2.0
SR-LR-XXXLoRa / LoRa WAN Modulev2.0
SR-PN-XXXPanel Modulev2.0
Tracks / Vias / Grids

Despite of the low energy consumption of the MCU itself, we are planning with a maximum current of 1A to be future proof for extra extensions that have a higher energy demand (LoRa, NB IoT, ...).

We chose two different of track widths for main power and for data lines (0.25 mm / 0.5 mm) and planned a minimum temperature of 0°C. See the table below.

Track (mm)Track (mil)10°20°30°40°50°60°
0.1mm4mil0.4A0.6A0.8A0.9A1.0A1.1A
0.2mm8mil0.7A1.0A1.2A1.4A1.6A1.7A
0.3mm12mil0.9A1.3A1.6A1.8A2.0A2.2A
0.4mm16mil1.1A1.5A1.9A2.2A2.4A2.7A
0.5mm20mil1.3A1.8A2.2A2.5A2.8A3.1A
0.6mm24mil1.4A2.0A2.4A2.8A3.1A3.4A

We chose a 0.1mm grid for all PCB designs, because our casings and mechanics are also measured in millimeters.

We chose 0.8mm 0.4mm vias.

Pin Out

Pin ESPPin SatellitePin NameStandard Purpose
1East 1GNDGround
2West 13V3Power supply
3West 2EN3Reset
4West 3I36I2C Interrupt
5West 4I39UART 1 RX
6West 5I34SPI 2 MISO
7West 6I35UART 2 RX
8West 7IO32SPI 2 MOSI
9West 8IO33SPI 2 CLK
10West 9IO25UART 1 TXE
11West 10IO26UART 1 TX
12West 11IO27SPI 2 CS (Ethernet)
13West 12IO14Ethernet Reset
14West 13IO12
15NCGNDGround
16West 14IO13Status LED
17NCNCInternal Flash / RAM
18NCNCInternal Flash / RAM
19NCNCInternal Flash / RAM
20NCNCInternal Flash / RAM
21NCNCInternal Flash / RAM
22NCNCInternal Flash / RAM
23East 13IO15UART 2 TX
24East 12IO2UART 2 TXE
25East 11IO0Setup Button
26East 10IO4Ethernet Interrupt
27NCNCInternal Flash / RAM
28NCNCInternal Flash / RAM
29East 9IO5SPI 1 CS (SD)
30East 8IO18SPI 1 CLK
31East 7IO19SPI 1 MISO
32NCNCInternal Flash / RAM
33East 6IO21I2C SDA
34East 5URXD0UART 0 RX
35East 4UTXD0UART 0 TX
36East 3IO22I2C SCL
37East 2IO23SPI 1 MOSI
38East 1GNDGround
NCEast 14ShieldShield / PE

Parts

103
QtyValueFootprintReferences
810kResistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolderR4, R5, R7, R25, R34, R35, R36, R37
8220RResistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolderR26, R27, R28, R29, R30, R31, R32, R33
7100nFCapacitor_SMD:C_1206_3216Metric_Pad1.33x1.80mm_HandSolderC1, C3, C4, C14, C15, C16, C17
4120RResistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolderR13, R14, R15, R16
42kResistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolderR9, R10, R11, R12
4MountingHole_PadMountingHole:MountingHole_3.2mm_M3_DIN965_PadH1, H2, H3, H4
333RResistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolderR1, R2, R3
3400RResistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolderR19, R21, R23
3800RResistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolderR20, R22, R24
3D_TVSDiode_SMD:D_0603_1608Metric_Pad1.05x0.95mm_HandSolderD9, D10, D11
20u1Capacitor_SMD:C_1206_3216Metric_Pad1.33x1.80mm_HandSolderC11, C13
212pFCapacitor_SMD:C_1206_3216Metric_Pad1.33x1.80mm_HandSolderC8, C9
21k@100MHzResistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolderFB1, FB2
24u7Capacitor_SMD:C_1206_3216Metric_Pad1.33x1.80mm_HandSolderC10, C12
2BAV303Diode_SMD:D_MicroMELFD4, D5
2CCapacitor_SMD:C_1206_3216Metric_Pad1.33x1.80mm_HandSolderC6, C7
2LTV-817SPackage_DIP:SMDIP-4_W9.53mmU4, U5
2MMBT3904Package_TO_SOT_SMD:SOT-23Q1, Q2
2RResistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolderR39, R40
2S8050Package_TO_SOT_SMD:SOT-23Q3, Q4
2SN74CBT16292Package_SO:TSSOP-20_4.4x6.5mm_P0.65mmU7, U8
10RResistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolderR8
110uFCapacitor_SMD:C_1206_3216Metric_Pad1.33x1.80mm_HandSolderC5
110uFCapacitor_Tantalum_SMD:CP_EIA-3216-18_Kemet-A_Pad1.58x1.35mm_HandSolderC2
112MHzCrystal:Crystal_SMD_HC49-SD_HandSolderingY1
112kResistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolderR38
1150RResistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolderR17
11N5819Diode_SMD:D_SOD-323_HandSolderingD2
1270RResistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolderR18
12k2Resistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolderR6
16V/800mAFuse:Fuse_1206_3216Metric_Pad1.42x1.75mm_HandSolderF1
193C46-WMN6TPPackage_SO:SOIC-8_3.9x4.9mm_P1.27mmU3
1AntennaMountingHole:MountingHole_5.5mmH6
1Antenna CableMountingHole:MountingHole_5.5mmH5
1Audiofootprints:CUI_SJ1-3523NJ6
1BZT52C6V2Diode_SMD:D_SOD-323_HandSolderingD1
1EastConnector_PinHeader_2.54mm:PinHeader_1x14_P2.54mm_VerticalJ1
1Ext_5VConnector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_HorizontalJ10
1FT2232HLPackage_QFP:LQFP-64_10x10mm_P0.5mmU2
1Keyboardfootprints:TE_5749180-1J4
1LD1117S33Package_TO_SOT_SMD:SOT-223-3_TabPin2U1
1MAX3486Package_SO:SOIC-8_3.9x4.9mm_P1.27mmU6
1Mousefootprints:TE_5749180-1J5
1PinOutConnector_PinHeader_2.54mm:PinHeader_2x14_P2.54mm_VerticalJ9
1PowerLED_SMD:LED_1206_3216Metric_Pad1.42x1.75mm_HandSolderD3
1PowerButton_Switch_THT:SW_E-Switch_EG1224_SPDT_AngledSW3
1RXDLED_SMD:LED_1206_3216Metric_Pad1.42x1.75mm_HandSolderD7
1ResetButton_Switch_SMD:SW_SPST_PTS645SW1
1Screw_Terminalfootprints:TE_1-1776113-0J2
1SetupButton_Switch_SMD:SW_SPST_PTS645SW2
1StatusLED_SMD:LED_1206_3216Metric_Pad1.42x1.75mm_HandSolderD8
1TXDLED_SMD:LED_1206_3216Metric_Pad1.42x1.75mm_HandSolderD6
1USB_BConnector_USB:USB_B_OST_USB-B1HSxx_HorizontalJ3
1VGAfootprints:AMPHENOL_L77HDE15SD1CH4FJ7
1WestConnector_PinHeader_2.54mm:PinHeader_1x14_P2.54mm_VerticalJ8

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Questions

How big is the Development board PCB?

It measures 153 × 77 mm and has 2 copper layers, 1.6 mm thick.

What parts does the Development board use?

103 parts, built around the MAX3486CSA+, LTV-817S, SN74CBT16292DL and FT2232HL. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the Development board KiCad files?

From the inoa-io/satellite repository on GitHub, at the commit this page was made from: the board is electrics/pc-board/development-board.kicad_pcb and its schematic electrics/ct-module/ct-module.kicad_sch. PCBKit opens the board in the browser, with nothing to install.

Can I use the Development board design in my own project?

Its repository publishes it under the CERN-OHL-P-2.0 licence: you may reuse it on that licence's terms (keep the author's notice, and for a copyleft licence share your changes alike).