2 layers68 × 79 mm
Hybrid valve board
CarletonURocketry/hybrid-valve-board
KiCAD board project that keeps hybrid rocket valves open during flight.
54 parts2
6 layers151.5 × 71 mm
Be iot v v1 0
hamit3/brn_pcbnrf9160 sens publisher
- Size
- 151.5 × 71 mm
- Copper layers
- 6
- Thickness
- 1.58 mm
- Parts
- 150
- Nets
- 204
- Pads
- 692
- Tracks, vias
- 389, 126
- Pours
- 11
- Routed
- Yes
- KiCad
- KiCad 9.0 (file 20241229)
- Created
- 27 Apr 2026
- Updated
- 27 Apr 2026
Overview
Be iot v v1 0 is an open-source printed circuit board by hamit3, from the hamit3/brn_pcb repository on GitHub. It is a 6-layer board of 151.5 × 71 mm with 150 parts on 204 nets, routed with 389 tracks and 126 vias.
It is built around the MDBT50Q-1MV2, NRF9160-SICA-R and BME688, with the STS-31-DIS, TPS63070RNMR and BMA400 among its other parts. Its parts include 56 capacitors, 42 resistors, 14 ICs, 10 connectors and 7 diodes. It belongs with the home automation and IoT boards and the nRF52 and nRF5x boards of this library.
Main components
12
MDBT50Q-1MV2
SMD-61PSMD-61P Bluetooth Modules ROHSRAYTACBluetooth Modules
NRF9160-SICA-R
LGA-127(10.5x16)-108dBm -40℃~+85℃ 1.57542GHz 23dBm 3V~5.5V 700MHz~2.2GHz DMA function SPI、UART、ADC、GPIO、I2C、I2S、PDM、PWM transceiver LGA-127(10.5x16) RF Transceiver ICs ROHSNordic SemiconRF Transceiver ICs
BME688
SMD-8P-40℃~+85℃ 0%RH~100%RH 1.71V~3.6V 2.1uA I2C、SPI ±0.5℃ ±3%RH SMD-8P Temperature and Humidity Sensor ROHSBosch SensortecTemperature And Humidity Sensor
STS-31-DIS
TDFN-8(2.5x2.5)-40℃~+125℃ 15.5ms 16bit 2.15V~5.5V 2uA I2C ±0.2℃ TDFN-8(2.5x2.5) Temperature Sensors ROHSSensirionTemperature Sensors
TPS63070RNMR
VQFN-15-HR(2.5x3)-40℃~+125℃@(TJ) 1 2.4MHz 2.5V~9V 2A 2V~16V 50uA Adjustable Buck-Boost Buck-Boost Built-in Yes VQFN-15-HR(2.5x3) DC-DC Converters ROHSTexas InstrumentsDC-DC Converters
BMA400
LGA-12(2x2)-40℃~+85℃ 1.71V~3.6V 12bit 160nA 1KB Accelerometer SPI、I2C X,Y,Z ±16g LGA-12(2x2) Accelerometers ROHSBosch SensortecAccelerometers
PCF85063ATL/1
DFN-10-EP(2.6x2.6)-40℃~+85℃ 0.22uA 220nA 900mV~5.5V External I2C InsideSRAM/NVRAM、Programmable clock output、Alarm function、Periodic interrupt output、Countdown timer Yes DFN-10-EP(2.6x2.6) Real Time Clocks ROHSNXP SemiconductorsReal Time Clocks
SCD41-D-R2
LGA-20UncategorisedSensirion
SI2308BDS-T1-GE3
SOT-23-3-55℃~+150℃ 1 N-channel 1.8W 15pF 190pF 192mΩ@4.5V 2.3A 26pF 3V 6.8nC@10V 60V N-Channel ±20V SOT-23-3 MOSFETs ROHSVishay IntertechnologyMOSFETs
MBRA340
SMA(DO-214AC)-55℃~+150℃ 1 Independent 100A 300uA@40V 3A 40V 450mV@3A SMA(DO-214AC) Schottky Diodes ROHSonsemiSchottky Diodes
MPZ1608S601ATA00
0603-55℃~+125℃ 1 150mΩ 1A 600Ω@100MHz ±25% 0603 Ferrite Beads ROHSTDKFerrite Beads
XFL4020-152MEC
SMD,4x4mm1.5uH 14.4mΩ 4.6A 9.1A Magnetic Shielded Inductor ±20% SMD,4x4mm Power Inductors ROHSCoilcraftPower Inductors
Parts
150| Qty | Value | Footprint | References |
|---|---|---|---|
| 23 | 100n | epts_footprints:CAP_CL10_SAM | C10, C11, C12, C16, C17, C20, C21, C27, C28, C30, C39, C42, C43, C44, C45, C46 +7 |
| 12 | 100K | epts_footprints:RESC1508X55N | R4, R5, R11, R12, R16, R17, R18, R20, R28, R36, R39, R40 |
| 11 | 10u/6V3/CER/0805 | epts_footprints:CAPC2012X140N | C13, C18, C19, C36, C40, C41, C48, C51, C52, C54, C56 |
| 8 | 22u/6V3/CER/1206 | Capacitor_SMD:C_1206_3216Metric_Pad1.33x1.80mm_HandSolder | C1, C2, C22, C23, C24, C25, C26, C29 |
| 5 | 47K | epts_footprints:RESC1508X55N | R27, R44, R45, R49, R50 |
| 4 | 1K | epts_footprints:RESC1508X55N | R6, R10, R24, R43 |
| 4 | 22R | epts_footprints:RESC1508X55N | R31, R32, R33, R34 |
| 4 | 7691 | epts_footprints:KEYSTONE_7691 | J4, J5, J8, J9 |
| 4 | Fiducial | Fiducial:Fiducial_0.75mm_Mask2.25mm | FID1, FID2, FID3, FID4 |
| 3 | 10K | epts_footprints:RESC1508X55N | R29, R37, R42 |
| 3 | MBRA340 | Diode_SMD:D_SMA | D1, D2, D3 |
| 3 | ~ | epts_footprints:CAP_CL10_SAM | C34, C37, C38 |
| 2 | 0R | epts_footprints:RESC1508X55N | R3, R35 |
| 2 | 18pF | epts_footprints:CAPC1608X90N | C14, C15 |
| 2 | 1K5 | epts_footprints:RESC1508X55N | R25, R26 |
| 2 | 1u/6V3/CER/0805 | epts_footprints:CAPC2012X140N | C4, C5 |
| 2 | 2K2 | epts_footprints:RESC1508X55N | R14, R41 |
| 2 | 5.11K | epts_footprints:RC0603N_YAG | R8, R9 |
| 2 | 6K8 | epts_footprints:RESC1508X55N | R13, R38 |
| 2 | AP7165-SPG-13 | epts_footprints:SOIC127P600X135-8N | U1, U8 |
| 2 | Conn_01x01_Pin | TestPoint:TestPoint_Pad_3.0x3.0mm | J1, J7 |
| 2 | EEEFT0J331AL | epts_footprints:CAP_EEEFT0J331AL | C3, C7 |
| 2 | EVQ-P7A01P | epts_footprints:SW_EVQ-P7A01P | S1, S2 |
| 2 | LED | LED_SMD:LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder | D4, D10 |
| 2 | MPZ1608S601ATA00 | epts_footprints:INDC1608X95N | FB2, FB3 |
| 2 | TC2050 | Connector:Tag-Connect_TC2050-IDC-FP_2x05_P1.27mm_Vertical | J6, J10 |
| 2 | XFL4020-152MEC | epts_footprints:IND_XFL4020-152MEC | L4, L5 |
| 2 | ~ | epts_footprints:XTAL_CM315D32768DZFT | Y1, Y2 |
| 1 | 0R | Resistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolder | R2 |
| 1 | 100K | Resistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolder | R1 |
| 1 | 100R | epts_footprints:RESC1508X55N | R7 |
| 1 | 1N4148WX-TP | epts_footprints:CR_SOD323_MCC | CR1 |
| 1 | 2232 | epts_footprints:BAT_2232 | BT1 |
| 1 | 22P_CAP_0603 | epts_footprints:CAPC1608X90N | C35 |
| 1 | 2452808-1 | epts_footprints:TE_2452808-1 | J3 |
| 1 | 560K | epts_footprints:RESC1508X55N | R19 |
| 1 | AI-1223-TWT-3V-2-R | epts_footprints:XDCR_AI-1223-TWT-3V-2-R | LS1 |
| 1 | BAV70 | Package_TO_SOT_SMD:SOT-23 | D6 |
| 1 | BMA400 | epts_footprints:XDCR_BMA400 | U6 |
| 1 | BME688 | epts_footprints:IC_BME688 | U12 |
| 1 | CER_CAP_0850 | epts_footprints:CAPC2012X140N | C33 |
| 1 | GCM1555C1H2R7BA16D | GCM1555C1H2R7BA16D:CAPC1005X55N | C31 |
| 1 | GCQ1555C1HR50CB01D | GCQ1555C1HR50CB01D:CAPC1005X55N | C32 |
| 1 | LQG15HS8N2G02D | epts_footprints:INDC1005X55N | L2 |
| 1 | MDBT50Q-1MV2 | RF_Module:Raytac_MDBT50Q | U4 |
| 1 | MPZ1608S601ATA00 | MPZ1608S601ATA00:INDC1608X95N | FB4 |
| 1 | NRF9160-SICA-R | epts_footprints:XCVR_NRF9160-SICA-R | U7 |
| 1 | PCF85063ATL | Package_DFN_QFN:DFN-10-1EP_2.6x2.6mm_P0.5mm_EP1.3x2.2mm | U9 |
| 1 | PCS.55.A | epts_footprints:PCS55A | ANT1 |
| 1 | PESD15VS5UD-QX | epts_footprints:SOT95P275X110-6N | D5 |
| 1 | SAM-M8Q-0-10 | epts_footprints:MODULE_SAM-M8Q-0-10 | IC1 |
| 1 | SCD41-D-R2 | Sensor:Sensirion_SCD4x-1EP_10.1x10.1mm_P1.25mm_EP4.8x4.8mm | U11 |
| 1 | SI2308BDS-T1-GE3 | epts_footprints:SOT95P237X112-3N | IC2 |
| 1 | SI2329DS-T1-GE3 | epts_footprints:SOT95P237X112-3N | Q1 |
| 1 | STS-31-DIS | epts_footprints:TDFN8_STS-31_SEN | U2 |
| 1 | T491A106K006AT | epts_footprints:CAPC3216X110N | C6 |
| 1 | TPS63070RNMR | epts_footprints:VREG_TPS63070RNMR | U5 |
| 1 | TPS7A0233PDQNR | epts_footprints:SOT95P280X145-5N | U3 |
| 1 | USB4085-GF-A_REVB | epts_footprints:GCT_USB4085-GF-A_REVB | J2 |
| 1 | jst_connector | epts_footprints:MOLEX_0530470410 | U10 |
The 148 most common of 150 parts.
Questions
How big is the Be iot v v1 0 PCB?
It measures 151.5 × 71 mm and has 6 copper layers, 1.58 mm thick.
What parts does the Be iot v v1 0 use?
150 parts, built around the MDBT50Q-1MV2, NRF9160-SICA-R, BME688 and STS-31-DIS. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the Be iot v v1 0 KiCad files?
From the hamit3/brn_pcb repository on GitHub, at the commit this page was made from: the board is 08__BACKUPS/be_iot_v_v1_0.kicad_pcb and its schematic CPU.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the Be iot v v1 0 design in my own project?
Its repository states no licence, so its author keeps all rights: ask hamit3 before reusing the design.
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