4 layers252 × 92 mm
Cooksense
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
195 parts3MIT
6 layers178 × 118 mm
MoriShield Carrier 6L
aswinserigreen/morishield_hardwareall components bom , pcb layouts and schematics of morishield is maintained here
- Size
- 178 × 118 mm
- Copper layers
- 6
- Thickness
- 1.6 mm
- Parts
- 157
- Nets
- 71
- Pads
- 487
- Tracks, vias
- 1,143, 226
- Pours
- 5
- Routed
- Yes
- KiCad
- KiCad 10.0 (file 20260206)
- Created
- 14 Sep 2026
- Updated
- 27 Oct 2026
Overview
MoriShield Carrier 6L is an open-source printed circuit board by aswinserigreen, from the aswinserigreen/morishield_hardware repository on GitHub. It is a 6-layer board of 178 × 118 mm with 157 parts on 71 nets, routed with 1,143 tracks and 226 vias.
It is built around the TCA9535PW, TCA9548APW and TPS3823-33DBV, with the TPS7A2033DQN, SRV05-4 and PESD5V0S1BA among its other parts. Its parts include 47 resistors, 36 capacitors, 23 connectors, 9 transistors and 5 diodes.
Main components
11
TCA9535PW
TSSOP-24-40℃~+85℃ 1.5uA 1.65V~5.5V 10mA 16 25mA 400kHz 4V 8 I2C、SMBus Interrupt Output Push-Pull Reset function、Cascade and address expansion、Built-in LED driver TSSOP-24 I/O Expanders ROHSTexas InstrumentsI/O ExpandersTCA9548APW
TSSOP-24-40℃~+85℃ 1.65V~5.5V 2uA 400Kbps 80uA I2C、SMBus Power-up/reset configuration TSSOP-24 Interface - Specialized ROHSTexas InstrumentsSignal Switches, Multiplexers, Decoders
TPS3823-33DBV
SOT-23-5-40℃~+85℃ 1 1.6s 15uA 2.5V、3V、3.3V、5V 2.93V Active Low Push-pull Voltage Monitor Yes Yes SOT-23-5 Supervisor and Reset ICs ROHSTexas InstrumentsMonitors & Reset Circuits
TPS7A2033DQN
X2SON-4(1x1)-40℃~+125℃ 1 140mV 3.3V 300mA 6.5uA 6V 7uVrms 95dB@(1kHz) Over Current Protection、Over Temperature Protection、Soft Start、Enable Positive X2SON-4(1x1) Voltage Regulators - Linear, Low Drop Out (LDO) Regulators ROHSTexas InstrumentsUncategorised
SRV05-4
SOT-23-6L-55℃~+150℃ 15V 1pF 4A 5V 5uA 6V 80W ESD Four channels IEC 61000-4-2、IEC 61000-4-5 Unidirectional SOT-23-6L ESD and Surge Protection (TVS/ESD) ROHShongjiachengESD And Surge Protection (TVS/ESD)
PESD5V0S1BA
SOD-323-55℃~+150℃ 1 12A@8/20us 130W@8/20us 14V 35pF 5V 5nA 9.5V Bidirectional ESD IEC 61000-4-2、IEC 61000-4-5 SOD-323 ESD and Surge Protection (TVS/ESD) ROHSNexperiaESD And Surge Protection (TVS/ESD)
AO3401A
SOT-231 P-Channel 14nC@10V 30V 47mΩ@10V、60mΩ@4.5V、85mΩ@2.5V 4A 55pF 645pF 80pF 900mV SOT-23 MOSFETs ROHSAlpha & Omega SemiconductorMOSFETs
100UF/16V
C1812C1812 SMT ROHSJLCPCB AssemblyUncategorised
SMBJ5.0A
DO-214AA(SMB)-65℃~+150℃ 5V 600W@10/1000us 65.3A@10/1000us 7V 800uA 9.2V TVS Unidirectional DO-214AA(SMB) ESD and Surge Protection (TVS/ESD) ROHSMDDESD And Surge Protection (TVS/ESD)
SMCJ5.0A
SMC(DO-214AB)Uncategorisedhongjiacheng
SS56
SMA(DO-214AC)Schottky Diodeshongjiacheng
README
6L/README.mdMoriShield Carrier — 6-layer variant (6L/)
6-layer routing of the shared MoriShield Carrier schematic
(Proto-Simple Rev 0.2, 2026-10-22). Fully routed — zero unconnected
nets. Open MoriShield_Carrier_6L.kicad_pro in KiCad 10.
Project files
| File | Purpose |
|---|---|
MoriShield_Carrier_6L.kicad_pro | KiCad 10 project |
MoriShield_Carrier.kicad_sch | Schematic — identical to the 4L copy (project references this name) |
MoriShield_Carrier_6L.kicad_pcb | 6-layer layout, 178 x 118 mm, 1.6 mm |
MoriShield_Carrier_6L.kicad_dru | Custom DRC rules (LOOSE5V / LOOSE_U7 relaxed-clearance areas, RS485 pair rule) |
fp-lib-table / sym-lib-table | Project libraries → ../libraries/ (repo-shared) |
fabrication/ | Gerber X2 + Excellon drill, generated 2026-10-26 |
reports/ | drc.json (board DRC), erc.json (schematic ERC — shared schematic, same report as 4L) |
Stackup — 6 copper layers, 1.6 mm
| Layer | Function |
|---|---|
| F.Cu | Signals + component-side pours |
| In1.Cu | Solid GND plane |
| In2.Cu | +5V plane (+ /3V3_SENS_SW zone) |
| In3.Cu | Additional signal routing layer |
| In4.Cu | Additional signal routing layer |
| B.Cu | Signals + PE (protective earth) pour |
The two extra inner signal layers are what let this variant close all 17 originally-unconnected nets — including the ones that are still walled in on the 4-layer board.
Design rules: min track/clearance 0.2 mm, vias 0.8/0.45 mm, 1 oz Cu.
The *.kicad_dru file relaxes clearance to 0.2 mm inside the named
rule areas (LOOSE5V, LOOSE_U7) only — still above the 0.127 mm
fab minimum.
Connectivity map (verified from the shared schematic)
| Ref | Footprint/Value | Carries |
|---|---|---|
| J1 + J2 | Sock_1x22_L / _R | ESP32-S3 DevKit (S3-WROOM-1 N16R8) |
| J3 + J4 | Sock_1x12_L / _R | A7672S 4G/GSM modem (Parry board) |
| J5 | MX126-5.0-02P | Modem power feed |
| J6 | Sock_1x07 | EBYTE E22-900T22D LoRa 868 MHz |
| J7 | Sock_1x08 | MPU-6050 accel/gyro module |
| J8 | Sock_1x06 | DS3231 RTC module |
| J11, J12, J14, J17, J20 | JST_XH_4 | I²C mux ports — SHT45, SGP41, BME688 probes, J20 = AS5600 wind |
| J13 | JST_ZH_5 | Sensirion SPS30 particulate sensor |
| J15 | JST_XH_3 | Capacitive soil moisture (analog) |
| J16 | JST_XH_2 | FSR406 force/rain sensor |
| J18 | ScrewTerm_2 | 12 V input |
| J19 | PE/EARTH | Protective earth stud |
| J21 | FDC1004 | Capacitive electrode interface |
| J22 | JST_XH_2 | Aux 2-pin |
| J23 | EXT_BTN | External button |
| J24 | PANEL_LED_5V | Panel LED output |
| J25 | BUZZER_5V | Buzzer output |
ICs: U4 TPS3823-33 watchdog, U6 TPS7A2033 LDO, U7 TCA9548A I²C mux, U8 TCA9535 GPIO expander. Protection: F1 PTC 4 A fuse, D2 SMCJ5.0A TVS, D7 SS56, SRV05-4 ESD arrays on external ports. Load switching: 2N7000/2N7002 NMOS + AO3401A PMOS drivers (LED/buzzer/sensor enables). SW1 tactile button.
Design status (reports/, 2026-10-26)
| Check | Result |
|---|---|
| DRC electrical errors | 0 |
| Unconnected pairs | 0 — routing complete |
| ERC (shared schematic) | 0 errors — see reports/erc.json |
| Cosmetic warnings | 134: 78 silk-over-copper, 46 silk-overlap, 2 text-thickness, 3 track-dangling, 4 via-dangling, 1 lib-footprint-mismatch (Q9) |
This variant is fabrication-ready. The 134 warnings are cosmetic (silkscreen placement, dangling via/stub flags on intentional stitching, one Q9 footprint-library mismatch) — none affect electrical connectivity.
Fabrication notes
- 6 layers, 1.6 mm, 1 oz copper, min track/clearance 0.2 mm, min via 0.8/0.45 mm.
- Gerbers + drill in
fabrication/(2026-10-26). Regenerate before ordering if the PCB is edited after that date. - ENIG or HASL, solder mask both sides, request e-test.
- Higher fab cost than
4L/— use the 4-layer variant if the remaining/WDT_WDIlink there is acceptable to close with a wire/jumper.
Parts
157| Qty | Value | Footprint | References |
|---|---|---|---|
| 25 | 100nF | C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C3, C4, C10, C14, C16, C29, C30, C34, C35, C36, C39, C40, C41, C42, C43, C44 +9 |
| 15 | 4.7k | R_1206_3216Metric_Pad1.30x1.75mm_HandSolder | R16, R35, R36, R37, R38, R39, R40, R41, R42, R43, R44, R45, R46, R47, R48 |
| 8 | SRV05-4 | SOT-23-6 | ESD1, ESD2, ESD7, ESD8, ESD9, ESD10, ESD11, ESD12 |
| 7 | 10k | R_1206_3216Metric_Pad1.30x1.75mm_HandSolder | R5, R10, R13, R14, R49, R51, R52 |
| 6 | PESD5V0S1BA | D_SOD-323 | ESD3, ESD4, ESD17, ESD18, ESD19, ESD20 |
| 5 | 100k | R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R20, R21, R23, R53, R55 |
| 5 | JST_XH_4 | MoriShield_Carrier:JST_XH_B4B-XH-A_1x04_P2.50mm_Vertical | J11, J12, J14, J17, J20 |
| 4 | 1k | R_1206_3216Metric_Pad1.30x1.75mm_HandSolder | R6, R7, R11, R15 |
| 4 | 4.7k | R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R25, R26, R27, R28 |
| 4 | 47R | R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R31, R32, R33, R34 |
| 4 | M3 | MountingHole_3.2mm_M3 | H1, H2, H3, H4 |
| 3 | 10k | R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R22, R24, R54 |
| 3 | 2N7000 | TO-92_Inline | Q1, Q5, Q6 |
| 3 | AO3401A | SOT-23 | Q2, Q3, Q7 |
| 2 | +5V | TestPoint_Pad_D2.0mm | TP2, TP3 |
| 2 | 10uF/10V | C_1206_3216Metric_Pad1.33x1.80mm_HandSolder | C28, C38 |
| 2 | 10uF/16V | C_1206_3216Metric_Pad1.33x1.80mm_HandSolder | C32, C51 |
| 2 | 1k | R_0805_2012Metric_Pad1.20x1.40mm_HandSolder | R29, R30 |
| 2 | 1uF/10V | C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C26, C27 |
| 2 | 2N7002 | SOT-23 | Q4, Q8 |
| 2 | DNP | MoriShield_Carrier:R_Axial_DIN0207_L6.3mm_D2.5mm_P7.62mm_Horizontal | R1, R2 |
| 2 | JST_XH_2 | MoriShield_Carrier:JST_XH_B2B-XH-A_1x02_P2.50mm_Vertical | J16, J22 |
| 1 | 100R | R_1206_3216Metric_Pad1.30x1.75mm_HandSolder | R50 |
| 1 | 100nF/16V | C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C33 |
| 1 | 100uF/16V | CP_Radial_D6.3mm_P2.50mm | C31 |
| 1 | 10uF/25V | MoriShield_Carrier:CP_Radial_D5.0mm_P2.50mm | C1 |
| 1 | 10uF/50V_X7R | CP_Radial_D10.0mm_P5.00mm | C13 |
| 1 | 120R@100MHz 2A | L_0805_2012Metric | FB2 |
| 1 | 3V3_C | TestPoint_Pad_D2.0mm | TP4 |
| 1 | 470uF/25V | MoriShield_Carrier:CP_Radial_D10.0mm_P5.00mm | C5 |
| 1 | AO3401A | Package_TO_SOT_SMD:SOT-23 | Q9 |
| 1 | BUZZER_5V | MoriShield_Carrier:JST_XH_B2B-XH-A_1x02_P2.50mm_Vertical | J25 |
| 1 | EXT_BTN | MoriShield_Carrier:JST_XH_B2B-XH-A_1x02_P2.50mm_Vertical | J23 |
| 1 | FDC1004 | JST_XH_B4B-XH-A_1x04_P2.50mm_Vertical | J21 |
| 1 | GND | TestPoint_Pad_D2.0mm | TP5 |
| 1 | GRN | MoriShield_Carrier:LED_D3.0mm | D3 |
| 1 | I2C0_SCL | TestPoint_Pad_D2.0mm | TP8 |
| 1 | I2C0_SCL_CH6 | TestPoint_Pad_D2.0mm | TP12 |
| 1 | I2C0_SDA | TestPoint_Pad_D2.0mm | TP7 |
| 1 | I2C0_SDA_CH6 | TestPoint_Pad_D2.0mm | TP11 |
| 1 | JST_XH_3 | MoriShield_Carrier:JST_XH_B3B-XH-A_1x03_P2.50mm_Vertical | J15 |
| 1 | JST_ZH_5 | MoriShield_Carrier:JST_ZH_B5B-ZR_1x05_P1.50mm_Vertical | J13 |
| 1 | MX126-5.0-02P | MoriShield_Carrier:TerminalBlock_MaiXu_MX126-5.0-02P_1x02_P5.00mm_R270 | J5 |
| 1 | PANEL_LED_5V | MoriShield_Carrier:JST_XH_B4B-XH-A_1x04_P2.50mm_Vertical | J24 |
| 1 | PE/EARTH | MoriShield_Carrier:TerminalBlock_MaiXu_MX126-5.0-02P_1x02_P5.00mm_R270 | J19 |
| 1 | PTC_4A | MoriShield_Carrier:Fuseholder_Clip-5x20mm_Littelfuse_111_Inline_P20.00x5.00mm_D1.05mm_Horizontal | F1 |
| 1 | RED | MoriShield_Carrier:LED_D3.0mm | D6 |
| 1 | RST_ESP | TestPoint_Pad_D2.0mm | TP6 |
| 1 | SMBJ5.0A | D_SMB_Handsoldering | ESD16 |
| 1 | SMCJ5.0A | D_SMC_Handsoldering | D2 |
| 1 | SS56 | D_SMC_Handsoldering | D7 |
| 1 | SW_6x6 | MoriShield_Carrier:SW_6x6 | SW1 |
| 1 | ScrewTerm_2 | MoriShield_Carrier:TerminalBlock_MaiXu_MX126-5.0-02P_1x02_P5.00mm_R270 | J18 |
| 1 | Sock_1x06 | MoriShield_Carrier:PinSocket_1x06_P2.54mm_Vertical | J8 |
| 1 | Sock_1x07 | MoriShield_Carrier:PinSocket_1x07_P2.54mm_Vertical_R90 | J6 |
| 1 | Sock_1x08 | MoriShield_Carrier:PinSocket_1x08_P2.54mm_Vertical | J7 |
| 1 | Sock_1x12_L | MoriShield_Carrier:PinSocket_1x12_P2.54mm_Vertical | J3 |
| 1 | Sock_1x12_R | MoriShield_Carrier:PinSocket_1x12_P2.54mm_Vertical | J4 |
| 1 | Sock_1x22_L | MoriShield_Carrier:PinSocket_1x22_P2.54mm_Vertical_R180 | J1 |
| 1 | Sock_1x22_R | MoriShield_Carrier:PinSocket_1x22_P2.54mm_Vertical_R180 | J2 |
| 1 | TCA9535 | TSSOP-24_4.4x7.8mm_P0.65mm_HS | U8 |
| 1 | TCA9548A | TSSOP-24_4.4x7.8mm_P0.65mm_HS | U7 |
| 1 | TPS3823-33 | SOT-23-5_HS | U4 |
| 1 | TPS7A2033 | SOT-23-5 | U6 |
| 1 | UART2_MOD_RX | TestPoint_Pad_D2.0mm | TP10 |
| 1 | UART2_MOD_TX | TestPoint_Pad_D2.0mm | TP9 |
| 1 | YEL | MoriShield_Carrier:LED_D3.0mm | D4 |
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Questions
How big is the MoriShield Carrier 6L PCB?
It measures 178 × 118 mm and has 6 copper layers, 1.6 mm thick.
What parts does the MoriShield Carrier 6L use?
157 parts, built around the TCA9535PW, TCA9548APW, TPS3823-33DBV and TPS7A2033DQN. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the MoriShield Carrier 6L KiCad files?
From the aswinserigreen/morishield_hardware repository on GitHub, at the commit this page was made from: the board is 6L/MoriShield_Carrier_6L.kicad_pcb and its schematic 4L/MoriShield_Carrier.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the MoriShield Carrier 6L design in my own project?
Its repository states no licence, so its author keeps all rights: ask aswinserigreen before reusing the design.