Skip to the content
PCBKitNew board
4 layers100 × 60 mmT1conv, the printed circuit board in 3D

100BASE-T1 ↔ 100BASE-TX media converter + dual CAN FD/USB adapter on one board.

Size
100 × 60 mm
Copper layers
4
Thickness
1.61 mm
Parts
125
Nets
132
Pads
476
Tracks, vias
787, 198
Pours
44
Routed
Yes
KiCad
KiCad 10.0 (file 20260206)
Created
16 Aug 2026
Updated
4 Nov 2026

Overview

T1conv is an open-source printed circuit board by ajefferies2, from the ajefferies2/t1conv repository on GitHub. It is a 4-layer board of 100 × 60 mm with 125 parts on 132 nets, routed with 787 tracks and 198 vias.

It is built around the STM32G0B1CET6, TCAN1042HGVDRBRQ1 and DP83TC811RWRNDRQ1, with the AP63203QWU, DP83822IRHBR and AQY212GHAX among its other parts. Its parts include 47 capacitors, 34 resistors, 11 ICs, 6 diodes and 6 connectors. It belongs with the STM32 boards of this library.

Main components

12

README

README.md

t1conv

100BASE-T1 ↔ 100BASE-TX media converter + dual CAN FD/USB adapter on one board.

3D view of the board

Rendered from the saved hardware on 4 November 2026. Some footprints, including the USB connector, CAN chokes, and PhotoMOS relays, have no 3D model; use the assembly drawing to review their placement.

Review the design

No Gerber viewer is needed. These exports come from the KiCad sources in this repository; the PDFs and SVGs support zooming into component labels and routing.

ViewWhat to look at
Complete schematic PDFSix sheets: system, power, MCU, CAN, T1, Ethernet
Top assembly drawing · SVGComponent outlines, references, and connector placement
Bottom assembly drawing · SVGUnderside, viewed from below
Four copper layers PDFOne page per layer, all viewed from above
Top 3D view · Bottom 3D viewBoard orientation and mechanical overview
KiCad project · PCBEditable design sources

Walkthrough

  1. System: follow the Ethernet data path between the two PHYs over RGMII; the MCU configures the PHYs and provides the separate USB/CAN function.
  2. Power and USB: follow USB-C VBUS through the TPS22918 soft-start switch to the AP63203 3.3 V buck; locate USB protection and the MCU USB connection.
  3. Interfaces: review the T1 and RJ45 protection/filtering, then the two CAN transceivers and their switchable termination.
  4. Layout: use the top assembly drawing to locate each block, then compare signal routing with the ground and power layers beneath it.
  5. Bring-up: discuss PHY configuration, power/clock checks, Ethernet link testing, and CAN/USB firmware work still to complete.

Hardware

The DP83TC811 and DP83822 pass Ethernet data directly between them over RGMII. The STM32G0B1 handles PHY setup and the two CAN FD channels, each with a TCAN1042 transceiver. I'm planning to use gs_usb for CAN over USB.

Each CAN channel has switchable termination: two 60.4 Ω resistors and a PhotoMOS relay. CAN and USB share ground, so this is not an isolated adapter.

USB-C supplies power through a TPS22918 soft-start load switch and provides the USB connection. There are SWD pads and a BOOT button for programming and recovery through the STM32's ROM bootloader.

Configuration

  • R18/R19 select TX clock delay on the DP83TC811 (MAC[2:0] = 101). The DP83822 also delays its incoming TX clock by default (0x17[11] = 0, 0x17[12] = 0). Each PHY handles the delay on its own input.
  • Both boards boot as T1 master. One needs to be set to slave for the link to work.
  • Firmware needs to advertise only 100BASE-TX full duplex on the RJ45 side. The PHY's default settings also advertise 10 Mb/s and half duplex.

Schematics

Complete schematic PDF · KiCad schematics. Click each image for a zoomable SVG.

Top level

Top-level schematic

Power

Power schematic

MCU

MCU and USB schematic

Dual CAN FD

Dual CAN FD schematic

100BASE-T1 PHY

100BASE-T1 PHY schematic

100BASE-TX Ethernet PHY

100BASE-TX Ethernet PHY schematic

Assembly and mechanical views

Top assembly

Top component placement

Board underside

Bottom 3D view, viewed from below

Bottom assembly PDF. Both underside views are mirrored relative to the copper-layer plots below.

PCB layers

The board is four layers, ~1.6 mm thick. The planned stackup is JLC04161H-7628. All copper-layer pictures are viewed from above, including B.Cu, so features line up between layers. Click an image for its vector version.

KiCad board

LayerUse
L1: F.CuComponents, signals, and local copper pours
L2: In1.CuGround plane
L3: In2.CuPower planes: 3.3 V, USB VBUS, and Ethernet AVD33
L4: B.CuSignals and local copper pours

Both signal layers

Top and bottom signal layers together

L1: Top copper and silkscreen

Top copper and component labels

L2: Ground plane

Inner ground plane

L3: Power planes

Inner power planes

L4: Bottom copper

Bottom copper viewed from the top

Design status and export provenance

This is a design-review snapshot, not a manufacturing release. KiCad 10.0.6 checks on 4 November 2026 reported 0 unrouted connections, 4 DRC errors, and 0 ERC errors. The four DRC errors are SW1 copper-to-board-edge clearances. There are also 23 DRC warnings, 15 schematic/PCB parity warnings, and 16 ERC warnings; see the DRC report and ERC report. These checks do not establish hardware functionality or replace bring-up testing. The earlier August Gerber package predates this design and should not be used to manufacture this snapshot.

To regenerate the review exports, use KiCad 10 (including its Python pcbnew module), Inkscape, and Python 3:

sh
python3 scripts/export-hardware.py

Use --skip-3d to update only the drawings and rule-check reports. Rendering requires the standard KiCad 3D models and the personal models referenced by ${ATJ_LIB}; missing models do not appear in the 3D views. The drawings use the symbols and footprints embedded in the design. Exported copper views refill zones in memory; the script does not save changes to the source board. Source SHA-256 hashes identify the saved hardware used for these exports.

Parts

125
QtyValueFootprintReferences
18.1uFCapacitor_SMD:C_0603_1608MetricC3, C4, C10, C12, C14, C15, C17, C21, C24, C25, C32, C36, C39, C41, C43, C45 +2
71uFCapacitor_SMD:C_0603_1608MetricC18, C22, C33, C37, C40, C42, C47
5470Resistor_SMD:R_0603_1608MetricR6, R7, R8, R12, R24
410nFCapacitor_SMD:C_0603_1608MetricC16, C20, C31, C35
410uFCapacitor_SMD:C_0805_2012MetricC19, C23, C34, C38
412pFCapacitor_SMD:C_0603_1608MetricC6, C7, C29, C30
41k@100MHzResistor_SMD:R_0805_2012MetricFB1, FB2, FB4, FB5
42.49kResistor_SMD:R_0603_1608MetricR5, R18, R19, R23
449.9Resistor_SMD:R_0603_1608MetricR25, R26, R27, R28
460.4Resistor_SMD:R_0603_1608MetricR9, R10, R30, R31
4LEDLED_SMD:LED_0603_1608MetricD1, D2, D3, D5
34.7uFCapacitor_SMD:C_0603_1608MetricC11, C13, C44
2100kResistor_SMD:R_0603_1608MetricR14, R17
210kResistor_SMD:R_0603_1608MetricR3, R4
222pFCapacitor_SMD:C_0603_1608MetricC27, C28
222uFCapacitor_SMD:C_1206_3216MetricC1, C2
225MHzpassive:Crystal_SMD_3225-4Pin_3.2x2.5mmY3, Y4
22kResistor_SMD:R_0603_1608MetricR15, R16
2330Resistor_SMD:R_0603_1608MetricR11, R29
25.1kResistor_SMD:R_0603_1608MetricR1, R2
2AQY212GHAic:AQY212GHAU5, U10
2PESD2CANic:SOT-23D4, D6
2PhoenixMC_1x03connector:PhoenixContact_MC_1,5_3-G-3.5_1x03_P3.50mm_HorizontalJ3, J5
2SRF4532-510Ypassive:SRF4532FL2, FL3
2TCAN1042HGVDRBRQ1ic:TCAN1042_VSON8U4, U9
108B0-1X1T-06-Fconnector:08B0-1X1T-06-FJ6
11.96kResistor_SMD:R_0603_1608MetricR22
110uFCapacitor_SMD:C_1206_3216MetricC5
110uHpassive:SWPA5040L1
116MHzpassive:Crystal_SMD_3225-4Pin_3.2x2.5mmY2
11kResistor_SMD:R_0603_1608MetricR34
12.2kResistor_SMD:R_0603_1608MetricR33
1270Resistor_SMD:R_0603_1608MetricR13
14.7kResistor_SMD:R_0603_1608MetricR32
14.7nFCapacitor_SMD:C_1210_3225MetricC26
14.7nFCapacitor_SMD:C_0603_1608MetricC46
14.87kResistor_SMD:R_0603_1608MetricR20
16.2kResistor_SMD:R_0603_1608MetricR21
1ACT1210L-201passive:ACT1210L_3225FL1
1AO3400Aic:SOT-23Q1
1AP63203QWUic:AP63203_TSOT26U1
1Conn_ARM_SWD_TagConnect_TC2030-NLConnector:Tag-Connect_TC2030-IDC-NL_2x03_P1.27mm_VerticalJ4
1DP83822ic:DP83822_RHB0032BU7
1DP83TC811Ric:DP83TC811R_RND0036AU6
1PhoenixMC_1x02connector:PhoenixContact_MC_1,5_2-G-3.5_1x02_P3.50mm_HorizontalJ2
1STM32G0B1CET6ic:STM32G0B1_LQFP48U3
1SW_Pushpassive:SW_Push_Panasonic_EVQP4_EdgeMountSW1
1TPD4E05U06DQAic:TPD4E05U06_DQA0010AU8
1TPS22918TDBVRQ1ic:DBV0006A_NU11
1TYPE-C-31-M-12Connector_USB:USB_C_Receptacle_HRO_TYPE-C-31-M-12J1
1USBLC6-2SC6ic:SOT-23-6U2

The 117 most common of 125 parts.

Questions

How big is the T1conv PCB?

It measures 100 × 60 mm and has 4 copper layers, 1.61 mm thick.

What parts does the T1conv use?

125 parts, built around the STM32G0B1CET6, TCAN1042HGVDRBRQ1, DP83TC811RWRNDRQ1 and AP63203QWU. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the T1conv KiCad files?

From the ajefferies2/t1conv repository on GitHub, at the commit this page was made from: the board is hw/t1conv.kicad_pcb and its schematic hw/Can.kicad_sch. PCBKit opens the board in the browser, with nothing to install.

Can I use the T1conv design in my own project?

Its repository states no licence, so its author keeps all rights: ask ajefferies2 before reusing the design.

Similar boards

  • 4 layers78 × 56 mmAlakol, the printed circuit board in 3D

    Alakol

    richardeoin/alakol

    A specialised datalogger for superpressure balloon manufacturing

    118 parts1
  • 2 layers151.4 × 128.5 mmEnvelope generator, the printed circuit board in 3D

    Envelope generator

    naokiiwakami/envelope-generator

    Analog3 envelope generator

    128 partsMIT
  • 8 layers115.3 × 25.3 mmPROC091G, the printed circuit board in 3D

    PROC091G

    um-kiho/ti_radar

    AWR6843AOP (Antenna-on-Package) 60GHz FMCW 레이더를 이용한 존재 감지(Presence Detection) 시스템입니다. 내장 ARM Cortex-R4F MCU + C674x DSP에서 신호 처리 및 존재 판정을 수행하고, UART로 결과를 출력합니다.

    446 parts
  • 6 layers50 × 23 mmEsp32p4amoled3.19, the printed circuit board in 3D

    Esp32p4amoled3.19

    v-cu/dpf-load-monitor-wide

    ESP32-P4 diagnostic display for VAG diesels — live DPF and engine data over CAN (UDS) on a 3.19" ultra-wide AMOLED. Firmware, KiCad files, BOM and 3D enclosure.

    115 parts12
  • 4 layers216 × 144 mmSheet1, the printed circuit board in 3D

    Sheet1

    motor-and-motion-control-lab/mmlab-12PhaseDrive-388Slave

    PCB Electronics for Humanoid Robots and Bearingless Motor Systems

    620 parts3GPL-3.0
  • 8 layers100 × 70 mmRadio Project, the printed circuit board in 3D

    Radio Project

    thomas-montano/Radio_Puck

    Small STM32 based ethernet connected radio puck capable of full duplex transmit and receive as well as dual RX or dual TX. Capable of rates up to 1 Mbps and completely configurable for many kinds of different modes.

    154 parts
  • 4 layers130 × 90 mmProgrammable usb2 hub, the printed circuit board in 3D

    Programmable usb2 hub

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    218 parts3MIT
  • 4 layers87.6 × 50.8 mm100base t1-converter, the printed circuit board in 3D

    100base t1-converter

    ehntoo/100base-t1-converter

    This project provides a media converter for connecting 100Base-TX ethernet to 100Base-T1 (Automotive Ethernet) networks, using an NXP TJA1101 PHY.

    83 parts16