

T1conv
100BASE-T1 ↔ 100BASE-TX media converter + dual CAN FD/USB adapter on one board.
- Size
- 100 × 60 mm
- Copper layers
- 4
- Thickness
- 1.61 mm
- Parts
- 125
- Nets
- 132
- Pads
- 476
- Tracks, vias
- 787, 198
- Pours
- 44
- Routed
- Yes
- KiCad
- KiCad 10.0 (file 20260206)
- Created
- 16 Aug 2026
- Updated
- 4 Nov 2026
Overview
T1conv is an open-source printed circuit board by ajefferies2, from the ajefferies2/t1conv repository on GitHub. It is a 4-layer board of 100 × 60 mm with 125 parts on 132 nets, routed with 787 tracks and 198 vias.
It is built around the STM32G0B1CET6, TCAN1042HGVDRBRQ1 and DP83TC811RWRNDRQ1, with the AP63203QWU, DP83822IRHBR and AQY212GHAX among its other parts. Its parts include 47 capacitors, 34 resistors, 11 ICs, 6 diodes and 6 connectors. It belongs with the STM32 boards of this library.
Main components
12STM32G0B1CET6
LQFP-48(7x7)1.7V~3.6V 12bit 12bit 44 64MHz ARM Cortex-M0+ LQFP-48(7x7) Microcontrollers (MCU/MPU/SOC) ROHSSTMicroelectronicsMicrocontrollers (MCU/MPU/SOC)TCAN1042HGVDRBRQ1
HVSON-8-EP(3x3)-55℃~+150℃ 4.5V~5.5V 5Mbps 5uA 70mA CAN Transceiver HVSON-8-EP(3x3) CAN Transceivers ROHSTexas InstrumentsCAN TransceiversDP83TC811RWRNDRQ1
HVQFN-36-EP(6x6)-40℃~+125℃ 1 1.8V、2.5V、3.3V 100BASE-T1 100Mbit/s Ethernet Transceiver MII、RMII、RGMII HVQFN-36-EP(6x6) Ethernet Transceivers ROHSTexas InstrumentsEthernet TransceiversAP63203QWU
TSOT-23-6-40℃~+125℃@(TA) 1 1.1MHz 22uA 2A 3.3V 3.8V~32V Buck Built-in Fixed Overcurrent Protection、Light load efficient mode、Cycle-by-cycle current limiting、Hiccup current limiting、EMI optimization (spread spectrum) Step-down type Yes TSOT-23-6 DC-DC Converters ROHSDiodes IncorporatedDC-DC ConvertersDP83822IRHBR
VQFN-32-EP(5x5)-40℃~+85℃ 1.71V~3.45V 100Mbps Interrupt generation、Enable/shutdown function、Wake-up function MII、RMII、RGMII VQFN-32-EP(5x5) Ethernet Connectors / Modular Connectors (RJ45 RJ11) ROHSTexas InstrumentsInterface - SpecializedAQY212GHAX
SMD-4P-40℃~+85℃ 1.1A 1.32V 1.3ms 100us 340mΩ 50mA 550mW 5kV 60V AC,DC One set normally open: 2A (SPST - normally open) SMD-4P Solid State Relays (MOS Output) ROHSPanasonicSolid State Relays (MOS Output)TPD4E05U06DQAR
USON-10-40℃~+125℃ 0.5pF 10nA 14V 2.5A@8/20us 40W@8/20us 5.5V 6.5V ESD Four channels IEC 61000-4-2、IEC 61000-4-5、IEC 61000-4-4 Unidirectional USON-10(1x2.5) ESD and Surge Protection (TVS/ESD) ROHSTexas InstrumentsESD Protection DevicesTPS22918TDBVRQ1
SOT-23-6-40℃~+105℃ 1 1V~5.5V 2A 52mΩ Active High Load Switch Output discharge function、Soft-start SOT-23-6 Power Distribution Switches ROHSTexas InstrumentsPower Distribution SwitchesUSBLC6-2SC6
SOT-23-60.35pF、0.8pF 100nA 150W@8/20us 15V 2 5V 6A@8/20us 6V ESD SOT-23-6 ESD and Surge Protection (TVS/ESD) ROHSUMWESD And Surge Protection (TVS/ESD)ECS-250-12-33Q-JES-TR
SMD3225-4P-40℃~+125℃ 12pF 25MHz 40Ω ±20ppm ±50ppm SMD3225-4P Crystals ROHSECSCrystalsPESD2CAN,215-JSM
SOT-23100nA 17pF 2 230W@8/20us 24V 30.5V 4A@8/20us 60V Bidirectional ESD IEC 61000-4-2 SOT-23 ESD and Surge Protection (TVS/ESD) ROHSJSMSEMIUncategorisedSRF4532-510Y
SMD-4P,4.5x3.2mm-40℃~+125℃ 10MΩ 125V 2 200mA 2kΩ@10MHz 3.5Ω 50V 51uH@100kHz SMD-4P,4.5x3.2mm Common Mode Filters ROHSBournsCommon Mode Filters
README
README.mdt1conv
100BASE-T1 ↔ 100BASE-TX media converter + dual CAN FD/USB adapter on one board.

Rendered from the saved hardware on 4 November 2026. Some footprints, including the USB connector, CAN chokes, and PhotoMOS relays, have no 3D model; use the assembly drawing to review their placement.
Review the design
No Gerber viewer is needed. These exports come from the KiCad sources in this repository; the PDFs and SVGs support zooming into component labels and routing.
| View | What to look at |
|---|---|
| Complete schematic PDF | Six sheets: system, power, MCU, CAN, T1, Ethernet |
| Top assembly drawing · SVG | Component outlines, references, and connector placement |
| Bottom assembly drawing · SVG | Underside, viewed from below |
| Four copper layers PDF | One page per layer, all viewed from above |
| Top 3D view · Bottom 3D view | Board orientation and mechanical overview |
| KiCad project · PCB | Editable design sources |
Walkthrough
- System: follow the Ethernet data path between the two PHYs over RGMII; the MCU configures the PHYs and provides the separate USB/CAN function.
- Power and USB: follow USB-C VBUS through the TPS22918 soft-start switch to the AP63203 3.3 V buck; locate USB protection and the MCU USB connection.
- Interfaces: review the T1 and RJ45 protection/filtering, then the two CAN transceivers and their switchable termination.
- Layout: use the top assembly drawing to locate each block, then compare signal routing with the ground and power layers beneath it.
- Bring-up: discuss PHY configuration, power/clock checks, Ethernet link testing, and CAN/USB firmware work still to complete.
Hardware
The DP83TC811 and DP83822 pass Ethernet data directly between them over RGMII. The STM32G0B1 handles PHY setup and the two CAN FD channels, each with a TCAN1042 transceiver. I'm planning to use gs_usb for CAN over USB.
Each CAN channel has switchable termination: two 60.4 Ω resistors and a PhotoMOS relay. CAN and USB share ground, so this is not an isolated adapter.
USB-C supplies power through a TPS22918 soft-start load switch and provides the USB connection. There are SWD pads and a BOOT button for programming and recovery through the STM32's ROM bootloader.
Configuration
- R18/R19 select TX clock delay on the DP83TC811 (
MAC[2:0] = 101). The DP83822 also delays its incoming TX clock by default (0x17[11] = 0,0x17[12] = 0). Each PHY handles the delay on its own input. - Both boards boot as T1 master. One needs to be set to slave for the link to work.
- Firmware needs to advertise only 100BASE-TX full duplex on the RJ45 side. The PHY's default settings also advertise 10 Mb/s and half duplex.
Schematics
Complete schematic PDF · KiCad schematics. Click each image for a zoomable SVG.
Top level
Power
MCU
Dual CAN FD
100BASE-T1 PHY
100BASE-TX Ethernet PHY
Assembly and mechanical views
Top assembly
Board underside

Bottom assembly PDF. Both underside views are mirrored relative to the copper-layer plots below.
PCB layers
The board is four layers, ~1.6 mm thick. The planned stackup is JLC04161H-7628. All copper-layer pictures are viewed from above, including B.Cu, so features line up between layers. Click an image for its vector version.
| Layer | Use |
|---|---|
| L1: F.Cu | Components, signals, and local copper pours |
| L2: In1.Cu | Ground plane |
| L3: In2.Cu | Power planes: 3.3 V, USB VBUS, and Ethernet AVD33 |
| L4: B.Cu | Signals and local copper pours |
Both signal layers
L1: Top copper and silkscreen
L2: Ground plane
L3: Power planes
L4: Bottom copper
Design status and export provenance
This is a design-review snapshot, not a manufacturing release. KiCad 10.0.6 checks on 4 November 2026 reported 0 unrouted connections, 4 DRC errors, and 0 ERC errors. The four DRC errors are SW1 copper-to-board-edge clearances. There are also 23 DRC warnings, 15 schematic/PCB parity warnings, and 16 ERC warnings; see the DRC report and ERC report. These checks do not establish hardware functionality or replace bring-up testing. The earlier August Gerber package predates this design and should not be used to manufacture this snapshot.
To regenerate the review exports, use KiCad 10 (including its Python pcbnew
module), Inkscape, and Python 3:
python3 scripts/export-hardware.pyUse --skip-3d to update only the drawings and rule-check reports. Rendering
requires the standard KiCad 3D models and the personal models referenced by
${ATJ_LIB}; missing models do not appear in the 3D views. The drawings use
the symbols and footprints embedded in the design. Exported copper views
refill zones in memory; the script does not save changes to the source board.
Source SHA-256 hashes identify the saved
hardware used for these exports.
Parts
125| Qty | Value | Footprint | References |
|---|---|---|---|
| 18 | .1uF | Capacitor_SMD:C_0603_1608Metric | C3, C4, C10, C12, C14, C15, C17, C21, C24, C25, C32, C36, C39, C41, C43, C45 +2 |
| 7 | 1uF | Capacitor_SMD:C_0603_1608Metric | C18, C22, C33, C37, C40, C42, C47 |
| 5 | 470 | Resistor_SMD:R_0603_1608Metric | R6, R7, R8, R12, R24 |
| 4 | 10nF | Capacitor_SMD:C_0603_1608Metric | C16, C20, C31, C35 |
| 4 | 10uF | Capacitor_SMD:C_0805_2012Metric | C19, C23, C34, C38 |
| 4 | 12pF | Capacitor_SMD:C_0603_1608Metric | C6, C7, C29, C30 |
| 4 | 1k@100MHz | Resistor_SMD:R_0805_2012Metric | FB1, FB2, FB4, FB5 |
| 4 | 2.49k | Resistor_SMD:R_0603_1608Metric | R5, R18, R19, R23 |
| 4 | 49.9 | Resistor_SMD:R_0603_1608Metric | R25, R26, R27, R28 |
| 4 | 60.4 | Resistor_SMD:R_0603_1608Metric | R9, R10, R30, R31 |
| 4 | LED | LED_SMD:LED_0603_1608Metric | D1, D2, D3, D5 |
| 3 | 4.7uF | Capacitor_SMD:C_0603_1608Metric | C11, C13, C44 |
| 2 | 100k | Resistor_SMD:R_0603_1608Metric | R14, R17 |
| 2 | 10k | Resistor_SMD:R_0603_1608Metric | R3, R4 |
| 2 | 22pF | Capacitor_SMD:C_0603_1608Metric | C27, C28 |
| 2 | 22uF | Capacitor_SMD:C_1206_3216Metric | C1, C2 |
| 2 | 25MHz | passive:Crystal_SMD_3225-4Pin_3.2x2.5mm | Y3, Y4 |
| 2 | 2k | Resistor_SMD:R_0603_1608Metric | R15, R16 |
| 2 | 330 | Resistor_SMD:R_0603_1608Metric | R11, R29 |
| 2 | 5.1k | Resistor_SMD:R_0603_1608Metric | R1, R2 |
| 2 | AQY212GHA | ic:AQY212GHA | U5, U10 |
| 2 | PESD2CAN | ic:SOT-23 | D4, D6 |
| 2 | PhoenixMC_1x03 | connector:PhoenixContact_MC_1,5_3-G-3.5_1x03_P3.50mm_Horizontal | J3, J5 |
| 2 | SRF4532-510Y | passive:SRF4532 | FL2, FL3 |
| 2 | TCAN1042HGVDRBRQ1 | ic:TCAN1042_VSON8 | U4, U9 |
| 1 | 08B0-1X1T-06-F | connector:08B0-1X1T-06-F | J6 |
| 1 | 1.96k | Resistor_SMD:R_0603_1608Metric | R22 |
| 1 | 10uF | Capacitor_SMD:C_1206_3216Metric | C5 |
| 1 | 10uH | passive:SWPA5040 | L1 |
| 1 | 16MHz | passive:Crystal_SMD_3225-4Pin_3.2x2.5mm | Y2 |
| 1 | 1k | Resistor_SMD:R_0603_1608Metric | R34 |
| 1 | 2.2k | Resistor_SMD:R_0603_1608Metric | R33 |
| 1 | 270 | Resistor_SMD:R_0603_1608Metric | R13 |
| 1 | 4.7k | Resistor_SMD:R_0603_1608Metric | R32 |
| 1 | 4.7nF | Capacitor_SMD:C_1210_3225Metric | C26 |
| 1 | 4.7nF | Capacitor_SMD:C_0603_1608Metric | C46 |
| 1 | 4.87k | Resistor_SMD:R_0603_1608Metric | R20 |
| 1 | 6.2k | Resistor_SMD:R_0603_1608Metric | R21 |
| 1 | ACT1210L-201 | passive:ACT1210L_3225 | FL1 |
| 1 | AO3400A | ic:SOT-23 | Q1 |
| 1 | AP63203QWU | ic:AP63203_TSOT26 | U1 |
| 1 | Conn_ARM_SWD_TagConnect_TC2030-NL | Connector:Tag-Connect_TC2030-IDC-NL_2x03_P1.27mm_Vertical | J4 |
| 1 | DP83822 | ic:DP83822_RHB0032B | U7 |
| 1 | DP83TC811R | ic:DP83TC811R_RND0036A | U6 |
| 1 | PhoenixMC_1x02 | connector:PhoenixContact_MC_1,5_2-G-3.5_1x02_P3.50mm_Horizontal | J2 |
| 1 | STM32G0B1CET6 | ic:STM32G0B1_LQFP48 | U3 |
| 1 | SW_Push | passive:SW_Push_Panasonic_EVQP4_EdgeMount | SW1 |
| 1 | TPD4E05U06DQA | ic:TPD4E05U06_DQA0010A | U8 |
| 1 | TPS22918TDBVRQ1 | ic:DBV0006A_N | U11 |
| 1 | TYPE-C-31-M-12 | Connector_USB:USB_C_Receptacle_HRO_TYPE-C-31-M-12 | J1 |
| 1 | USBLC6-2SC6 | ic:SOT-23-6 | U2 |
The 117 most common of 125 parts.
Questions
How big is the T1conv PCB?
It measures 100 × 60 mm and has 4 copper layers, 1.61 mm thick.
What parts does the T1conv use?
125 parts, built around the STM32G0B1CET6, TCAN1042HGVDRBRQ1, DP83TC811RWRNDRQ1 and AP63203QWU. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the T1conv KiCad files?
From the ajefferies2/t1conv repository on GitHub, at the commit this page was made from: the board is hw/t1conv.kicad_pcb and its schematic hw/Can.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the T1conv design in my own project?
Its repository states no licence, so its author keeps all rights: ask ajefferies2 before reusing the design.
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