2 layers57.8 × 64.8 mm
2 layers57.8 × 64.8 mm
Bottom board
Japm-Engineer/LaserDriver_ISS- Size
- 57.8 × 64.8 mm
- Copper layers
- 2
- Thickness
- 1.6 mm
- Parts
- 60
- Nets
- 47
- Pads
- 174
- Tracks, vias
- 288, 14
- Pours
- 1
- Routed
- Yes
- KiCad
- KiCad 8.0 (file 20240108)
- Created
- 18 Nov 2024
- Updated
- 18 Jun 2025
Overview
Bottom board is an open-source printed circuit board by Japm-Engineer, from the Japm-Engineer/LaserDriver_ISS repository on GitHub. It is a 2-layer board of 57.8 × 64.8 mm with 60 parts on 47 nets, routed with 288 tracks and 14 vias.
It is built around the TL081, TL082 and ADS1115. Its parts include 26 resistors, 15 capacitors, 5 ICs, 1 transistor and 1 connector.
Main components
3
TL081
SOP-8-18V~18V -20℃~+85℃ 1 1.8mA 100pA 200nA 20V/us 3MHz 3mV 85dB Built-in compensation SOP-8 Operational Amplifier ROHSGcoreOperational AmplifierTL082
SOP-8-18V~18V 0℃~+70℃ 1.4mA 1.5nA 13V/us 2 2.5nA 36V 3MHz 3mV 85dB Short-Circuit Protection SOP-8 FET Input Amplifiers ROHSGcoreOperational AmplifierADS1115
UncategorisedTexas Instruments
Parts
60| Qty | Value | Footprint | References |
|---|---|---|---|
| 9 | 0.1U | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C2, C3, C4, C5, C6, C7, C8, C9, C11 |
| 6 | 1U | Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder | C1, C10, C12, C13, C16, C17 |
| 5 | 4k7 | Resistor_SMD:R_1210_3225Metric_Pad1.30x2.65mm_HandSolder | R1, R2, R3, R26, R27 |
| 4 | 10k | Resistor_SMD:R_1210_3225Metric_Pad1.30x2.65mm_HandSolder | R15, R18, R23, R24 |
| 4 | 220 | Resistor_SMD:R_1210_3225Metric_Pad1.30x2.65mm_HandSolder | R6, R12, R25, R28 |
| 4 | MountingHole | MountingHole:MountingHole_3.2mm_M3 | H1, H2, H3, H4 |
| 2 | 100 | Resistor_THT:R_Axial_DIN0614_L14.3mm_D5.7mm_P20.32mm_Horizontal | R19, R20 |
| 2 | 220 | Resistor_THT:R_Axial_DIN0614_L14.3mm_D5.7mm_P20.32mm_Horizontal | R11, R17 |
| 2 | 2k2 | Resistor_SMD:R_1210_3225Metric_Pad1.30x2.65mm_HandSolder | R4, R5 |
| 2 | 47 | Resistor_SMD:R_1210_3225Metric_Pad1.30x2.65mm_HandSolder | R13, R14 |
| 2 | Conn_01x04_Male | Connector_JST:JST_XA_B04B-XASK-1_1x04_P2.50mm_Vertical | I2C3V3, I2C5V1 |
| 2 | LM317L_SO8 | Package_SO:SO-8_3.9x4.9mm_P1.27mm | LM317L1, LM317L2 |
| 1 | 100 | Resistor_SMD:R_1210_3225Metric_Pad1.30x2.65mm_HandSolder | R10 |
| 1 | 100k | Resistor_SMD:R_1210_3225Metric_Pad1.30x2.65mm_HandSolder | R16 |
| 1 | 1k | Resistor_SMD:R_1210_3225Metric_Pad1.30x2.65mm_HandSolder | R9 |
| 1 | 2n2907 | Package_TO_SOT_THT:TO-92_Inline_Wide | Q1 |
| 1 | 330 | Resistor_SMD:R_1210_3225Metric_Pad1.30x2.65mm_HandSolder | R7 |
| 1 | 3k3 | Resistor_SMD:R_1210_3225Metric_Pad1.30x2.65mm_HandSolder | R8 |
| 1 | 5V | Connector_JST:JST_EH_B2B-EH-A_1x02_P2.50mm_Vertical | J1 |
| 1 | AD5175 | Package_SO:MSOP-10_3x3mm_P0.5mm | U4 |
| 1 | ADS1115 | Created:ADS1115 | U5 |
| 1 | Conn_01x02_Male | Connector_JST:JST_EH_B2B-EH-A_1x02_P2.50mm_Vertical | LDCOM1 |
| 1 | Conn_01x03_Male | Connector_JST:JST_XH_B3B-XH-A_1x03_P2.50mm_Vertical | Supply1 |
| 1 | D_Laser_Photo_NType | Connector_JST:JST_XH_B3B-XH-A_1x03_P2.50mm_Vertical | LD1 |
| 1 | Jumper_3_Open | Connector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical | JP3 |
| 1 | LogicConvert | Created:CONV_BOB-12009 | U2 |
| 1 | TL081 | Package_DIP:DIP-8_W7.62mm | U8 |
| 1 | TL082 | Package_SO:SO-8_5.3x6.2mm_P1.27mm | U3 |
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Questions
How big is the Bottom board PCB?
It measures 57.8 × 64.8 mm and has 2 copper layers, 1.6 mm thick.
What parts does the Bottom board use?
60 parts, built around the TL081, TL082 and ADS1115. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the Bottom board KiCad files?
From the Japm-Engineer/LaserDriver_ISS repository on GitHub, at the commit this page was made from: the board is Bottom/bottom_board.kicad_pcb and its schematic Bottom/bottom_board.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the Bottom board design in my own project?
Its repository states no licence, so its author keeps all rights: ask Japm-Engineer before reusing the design.