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4 layers81.9 × 35.3 mmUSB3 ethernet, the printed circuit board in 3D

High-speed USB 3.1 Gen 1 to Gigabit Ethernet interface PCB designed in KiCad using the Microchip LAN7801 and KSZ9031RNX.

Size
81.9 × 35.3 mm
Copper layers
4
Thickness
1.59 mm
Parts
81
Nets
87
Pads
345
Tracks, vias
892, 155
Pours
25
Routed
Yes
KiCad
KiCad 9.0 (file 20241229)
Created
2 Aug 2026
Updated
2 Aug 2026

Overview

USB3 ethernet is an open-source printed circuit board by AyushShuklaaa7, from the AyushShuklaaa7/USB3_Ethernet_Interface repository on GitHub, published under the MIT licence. It is a 4-layer board of 81.9 × 35.3 mm with 81 parts on 87 nets, routed with 892 tracks and 155 vias.

It is built around the KSZ9031RNXCA, TLV1117LV33DCYT and ABM8G-25.000MHZ-B4Y-T, with the DMG2301L among its other parts. Its parts include 34 capacitors, 30 resistors, 4 ICs, 1 diode and 1 transistor. It belongs with the interfaces and adapters boards of this library.

Main components

4

README

README.md

USB 3.1 Gen 1 to Gigabit Ethernet Interface

This project is a hardware implementation of a USB 3.1 Gen 1 to Gigabit Ethernet adapter designed in KiCad. It is based on the Microchip LAN7801 USB-to-Ethernet controller and the KSZ9031RNX Gigabit Ethernet PHY.

The goal of this project was to gain practical experience in designing a high-speed PCB while following signal integrity, power integrity, and layout guidelines required for USB 3.1 and Gigabit Ethernet interfaces.


Overview

The LAN7801 acts as the USB 3.1 Gen 1 bridge and Ethernet MAC, converting 5 Gbps USB SuperSpeed data into a 125 MHz RGMII interface. The KSZ9031RNX then converts the RGMII data into standard Gigabit Ethernet signals that are transmitted through the RJ45 MagJack.

The design uses dedicated 3.3V and 1.2V power rails. Instead of using an external 1.2V regulator, the KSZ9031RNX's integrated LDO controller is used with a DMG2301L P-channel MOSFET to generate the PHY core supply, reducing the overall component count.

A 25 MHz ABM8G crystal provides the reference clock for both devices.


PCB Layout

Top Layer

Top Layer


Bottom Layer

Bottom Layer


3D View

3D View


Hardware Block Diagram

Block Diagram

The USB Type-A connector interfaces with the LAN7801 controller. The controller communicates with the KSZ9031RNX Gigabit PHY over the RGMII interface, while MDIO/MDC is used for PHY configuration. The PHY then drives the RJ45 MagJack to provide a standard Gigabit Ethernet connection.


Design Approach

The project started by studying the LAN7801 and KSZ9031RNX datasheets along with the manufacturer's reference designs to understand the required interfaces, power supplies, clocking, and layout recommendations.

After completing the schematic, component placement was planned carefully to keep high-speed signal paths as short as possible. The USB controller was placed close to the USB connector, while the Ethernet PHY was positioned near the RJ45 MagJack to minimize RGMII routing.

During PCB layout, the main focus was maintaining signal integrity by following controlled impedance routing, differential pair routing, length matching, proper grounding, and good decoupling practices.


Main Components

ComponentDescription
LAN7801USB 3.1 Gen 1 to Gigabit Ethernet Controller
KSZ9031RNXGigabit Ethernet PHY
ABM8G25 MHz Crystal Oscillator
DMG2301LP-Channel MOSFET
RJ45 MagJackGigabit Ethernet Connector
USB Type-A ConnectorUSB SuperSpeed Interface

PCB Design Highlights

  • 4-layer PCB stack-up
  • USB 3.1 SuperSpeed differential pair routing
  • 125 MHz RGMII interface routing
  • Controlled impedance traces
  • Differential pair length matching
  • Continuous ground plane
  • Proper decoupling capacitor placement
  • ESD protection for external interfaces
  • Power integrity considerations

Design Challenges

Some of the key challenges while designing this PCB were:

  • Routing USB SuperSpeed differential pairs while maintaining impedance.
  • Length matching the RGMII interface.
  • Placing decoupling capacitors close to the IC power pins.
  • Maintaining clean return current paths using continuous ground planes.
  • Planning the component placement to minimize high-speed routing complexity.
  • Following the layout recommendations provided in the component datasheets.

Software Used

  • KiCad
  • Saturn PCB Toolkit
  • Pspice

Future Improvements

  • Generate complete fabrication outputs (Gerber, Drill, BOM and Pick & Place files).
  • Perform impedance verification using PCB stack-up calculations.
  • Prototype and validate the hardware with functional testing.
  • Perform USB and Ethernet compliance testing.

Author

Ayush Shukla

B.Tech Electronics & Telecommunication Engineering

Parts

81
QtyValueFootprintReferences
160.1uFCapacitor_SMD:C_0402_1005MetricC7, C8, C13, C16, C17, C19, C21, C24, C25, C27, C28, C29, C31, C32, C33, C34
84.7KResistor_SMD:R_0402_1005MetricR2, R3, R5, R6, R7, R8, R9, R10
7100nFCapacitor_SMD:C_0402_1005MetricC1, C2, C3, C4, C5, C18, C30
722RResistor_SMD:R_0402_1005MetricR30, R31, R32, R33, R34, R35, R37
610KResistor_SMD:R_0402_1005MetricR1, R23, R25, R26, R38, R40
41uFCapacitor_SMD:C_0402_1005MetricC11, C22, C23, C26
212KResistor_SMD:R_0402_1005MetricR4, R28
215pFCapacitor_SMD:C_0402_1005MetricC14, C15
2MountingHole_PadMountingHole:MountingHole_3.2mm_M3_Pad_ViaH1, H2
10.1uFResistor_SMD:R_0402_1005MetricR29
10483930003Connector_USB:USB3_A_Molex_48393-001USB_A
10RResistor_SMD:R_0402_1005MetricR39
1100KResistor_SMD:R_0402_1005MetricR22
110kResistor_SMD:R_0402_1005MetricR27
110uFCapacitor_SMD:C_0805_2012MetricC6
110uFCapacitor_SMD:C_0402_1005MetricC12
11KResistor_SMD:R_0402_1005MetricR36
1220RInductor_SMD:L_0805_2012MetricFB1
122uFCapacitor_SMD:C_0402_1005MetricC9
12KCapacitor_SMD:C_0402_1005MetricC20
13.3uHME3220-102MLB:IND_ME3220-102MLBL1
1330kResistor_SMD:R_0402_1005MetricR21
14.7uFCapacitor_SMD:C_0402_1005MetricC10
175RResistor_SMD:R_0402_1005MetricR11
193AAxxCPackage_SO:SOIC-8_3.9x4.9mm_P1.27mmU7
1ABM8G-25.000MHZ-B4Y-TCrystal:Crystal_SMD_Abracon_ABM8G-4Pin_3.2x2.5mmY1
1DMG2301LPackage_TO_SOT_SMD:SOT-23Q1
1ESD8008MUTAGESD8008MUTAG:DIO_ESD8008MUTAGD1
1FerriteBeadInductor_SMD:L_0805_2012MetricFB2
1KSZ9031RNXCAPackage_DFN_QFN:QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mmU1
1LAN7801-I_9JXLAN7801-I_9JX:QFN50P900X900X100-65N_LAN7801-I_9JXU8
1LOGON_logo:sh_shG***
1PolyfuseFuse:Fuse_0805_2012MetricF2
1TLV1117LV33DCYTTLV1117LV33DCYT:SOT230P700X180-4NU2
1WE-RJ45_7499111446Connector_RJ:RJ45_Wuerth_7499111446_HorizontalETHERNET

The 80 most common of 81 parts.

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Questions

How big is the USB3 ethernet PCB?

It measures 81.9 × 35.3 mm and has 4 copper layers, 1.59 mm thick.

What parts does the USB3 ethernet use?

81 parts, built around the KSZ9031RNXCA, TLV1117LV33DCYT, ABM8G-25.000MHZ-B4Y-T and DMG2301L. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the USB3 ethernet KiCad files?

From the AyushShuklaaa7/USB3_Ethernet_Interface repository on GitHub, at the commit this page was made from: the board is USB3_ethernet.kicad_pcb and its schematic POWER.kicad_sch. PCBKit opens the board in the browser, with nothing to install.

Can I use the USB3 ethernet design in my own project?

Its repository publishes it under the MIT licence: you may reuse it on that licence's terms (keep the author's notice, and for a copyleft licence share your changes alike).