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CH582F on a board, in 3D

CH582F

WCH (Nanjing Qinheng Microelectronics)

-40℃~+85℃ 12bit 2.3V~3.6V 32 Bit 32KB 448KB 48MHz Built-in+External FLASH Power-on reset (POR)、Watchdog reset、Software reset、External pin reset (NRST)、Built-in general-purpose timer、Integrated LDO、Calendar function、Built-in temperature sensor、Touch function RISC-V QFN-28-EP(4x4) Microcontrollers (MCU/MPU/SOC) ROHS

Extended
DatasheetJLCPCBLCSCwch/CH582F
Category
Microcontrollers (MCU, MPU, SOC)
Package
QFN-28-EP(4x4)
Pins
29

Overview

The CH582F is a microcontroller made by WCH (Nanjing Qinheng Microelectronics) in a QFN-28-EP(4x4) package with 29 pins. -40℃~+85℃ 12bit 2.3V~3.6V 32 Bit 32KB 448KB 48MHz Built-in+External FLASH Power-on reset (POR)、Watchdog reset、Software reset、External pin reset (NRST)、Built-in general-purpose timer、Integrated LDO、Calendar function、Built-in temperature sensor、Touch function RISC-V QFN-28-EP(4x4) Microcontrollers (MCU/MPU/SOC) ROHS.

PCBKit's library has its KiCad symbol (EasyEDA_Cloud:CH582F_C3001175, from EasyEDA) and its footprint (EasyEDA_Cloud:QFN-28_L4.0-W4.0-P0.40-BL-EP2.8, from EasyEDA), ready for a KiCad board. 1,456 are in stock at JLCPCB (part C3001175). 2 open-source boards in 2 repositories on GitHub use it.

Symbol

EP29PA12/SCS/PWM4/AIN228PA13/SCK0/PWM5/AIN327PA14/MOSI/TXD0_/AIN426PA15/MISO/RXD0_/AIN525PA5/TXD3/AIN124PA4/RXD3/AIN023VDCIA22ANT21VINTA20X32MI19X32MO18PB22/TMR3/RXD217PB23/RST/TMR0_/TXD2_/PWM1116PB4/RXD0/PWM715PB7/TXD0/PWM914PB10/UD-/TMR1_13PB11/UD+/TMR2_12PB12/U2D-/SCS_/SDA/RXD1_11PB13/U2D+/SCK0_/SCL/TXD1_10PB14/TIO/DSR_/MOSI_/PWM109PB15/TCK/MISO_/DTR_8PA9/TMR0/TXD1/AIN137PA8/RXD1/AIN126VIO33/VDD335VSW4VDCID3PA10/X32KI/TMR12PA11/X32KO/TMR21
EasyEDA_Cloud:CH582F_C3001175From EasyEDA

Footprint

29
EasyEDA_Cloud:QFN-28_L4.0-W4.0-P0.40-BL-EP2.8From EasyEDA

From the datasheet

9
Supply, least
2.3 V · VDD33, recommended operating min, 非 CH583M · p. 108
Supply, most
3.6 V · VDD33, recommended operating max, 非 CH583M · p. 108
Supply, absolute maximum
4.2 V · VDD33, absolute max · p. 108
Works from
-40 °C · TA, operating ambient min · p. 108
Works up to
85 °C · TA, operating ambient max · p. 108
Takes working
6 mA · typical, direct supply, RAM execution, Fsys=48M · p. 108
Takes working
4 mA · typical, DC-DC enabled, RAM execution, Fsys=48M · p. 108
Takes asleep
700 nA · typical sleep, PMU+core+RAM2K, GPIO wake, no RTC · p. 109
Takes asleep
200 nA · typical shutdown, PMU only, GPIO wake reset, no RTC · p. 109

What it is and has

14
CodeFlash
448KB · p. 1
DataFlash
32KB · p. 1
BootLoader
24KB · p. 1
InfoFlash
8KB · p. 1
SRAM
32K bytes · p. 1
UART
4, 16C550 compatible, 8-level FIFO · p. 1
UART baud rate
up to 6Mbps · p. 1
ADC
12-bit, differential and single-ended inputs · p. 1
Security
AES-128 encryption/decryption, unique chip ID · p. 1
Bluetooth
Bluetooth Low Energy 5.0 · p. 1
BLE data rates
2Mbps, 1Mbps, 500Kbps, 125Kbps · p. 1
RF
2.4GHz transceiver, baseband and link control · p. 1
RF sensitivity and transmit power
-98dBm receive sensitivity, programmable +6dBm transmit power · p. 1
Power conversion
Integrated DC-DC · p. 1

Specifications

55
ParameterConditionsAs printedPage
工作时的环境温度 TAmin -40 · max 85 ℃108
储存时的环境温度 TSmin -40 · max 125 ℃108
系统电源电压（VDD33 接电源，GND 接地） VDD33min -0.4 · max 4.2 V108
I/O 电源电压（VIO33 接电源，GND 接地） VIO33min -0.4 · max 4.2 V108
输入或者输出引脚上的电压 VIOmin -0.4 V108
支持 5V 耐压的输入或者输出引脚上的电压 VIO5min -0.4 · max 5.5 V108
VDCID/VDCIA 引脚上的电压（如果用外置 DC-DC） VDCImin -0.4 V108
X32MI/X32MO/启用 LSE 后的 PA10/PA11 的电压 VXCKmin -0.3 · max 1.4 V108
系统电源电压@VDD33 VDD33非 CH583M; TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHzmin 2.3 · typ 3.3 · max 3.6 V108
I/O 电源电压@VIO33 VIO33非 CH583M; TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHzmin 2.3 · typ 3.3 · max 3.6 V108
直通方式静态电源电流 ICC8Fsys=8M; 代码运行于 RAM 中，如运行于 Flash 中另加 5mA; TA=25℃，VDD33=VIO33=3.3Vtyp 2 mA108
直通方式静态电源电流 ICC16Fsys=16M; 代码运行于 RAM 中，如运行于 Flash 中另加 5mA; TA=25℃，VDD33=VIO33=3.3Vtyp 2.2 mA108
直通方式静态电源电流 ICC48Fsys=48M; 代码运行于 RAM 中，如运行于 Flash 中另加 5mA; TA=25℃，VDD33=VIO33=3.3Vtyp 6 mA108
启用 DC-DC 后静态电源电流 IDDC8Fsys=8M; 代码运行于 RAM 中，如运行于 Flash 中另加 4mA; TA=25℃，VDD33=VIO33=3.3Vtyp 1.5 mA108
启用 DC-DC 后静态电源电流 IDDC16Fsys=16M; 代码运行于 RAM 中，如运行于 Flash 中另加 4mA; TA=25℃，VDD33=VIO33=3.3Vtyp 1.6 mA108
启用 DC-DC 后静态电源电流 IDDC48Fsys=48M; 代码运行于 RAM 中，如运行于 Flash 中另加 4mA; TA=25℃，VDD33=VIO33=3.3Vtyp 4 mA108
GPIO 低电平输入电压 VILTA=25℃，VDD33=VIO33=3.3V，Fsys=16MHzmin 0 · max 0.9 V108
GPIO 高电平输入电压 VIHTA=25℃，VDD33=VIO33=3.3V，Fsys=16MHzmin 2 V108
支持 5V 耐压的 GPIO 低电平输入电压 VIL5TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHzmin 0 · max 0.9 V108
支持 5V 耐压的 GPIO 高电平输入电压 VIH5TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHzmin 2 · max 5 V108
低电平输出电压（5mA/20mA 吸入电流） VOLTA=25℃，VDD33=VIO33=3.3V，Fsys=16MHzmin 0 · typ 0.3 · max 0.4 V108
GPIO 浮空输入端的输入电流 IINTA=25℃，VDD33=VIO33=3.3V，Fsys=16MHzmin -3 · typ 0 · max 3 uA108
GPIO 内置上拉电阻的输入端的输入电流 IUPTA=25℃，VDD33=VIO33=3.3V，Fsys=16MHzmin 25 · typ 60 · max 90 uA108
GPIO 内置下拉电阻的输入端的输入电流 IDNTA=25℃，VDD33=VIO33=3.3V，Fsys=16MHzmin -90 · typ -60 · max 25 uA108
VINTA 引脚的电压（ADC 参考电压） VrefTA=25℃，VDD33=VIO33=3.3V，Fsys=16MHzmin 1.035 · typ 1.05 · max 1.065 V108
VDCID 引脚在启用 DC-DC 后的电压 VdciTA=25℃，VDD33=VIO33=3.3V，Fsys=16MHzmin 1.18 · typ 1.3 · max 1.38 V108
LVR 低压复位的门限电压 Vlvr非 CH583X; TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHzmin 1.8 · typ 2.05 · max 2.3 V108
空闲模式，开启各模块时钟组合TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHzmin 1.2 · typ 1.6 · max 1.8 mA109
暂停模式，关闭所有时钟TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 320 uA109
睡眠模式，PMU+内核+RAM2K，GPIO 唤醒，无 RTCTA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 0.7 uA109
下电模式，仅 PMU，GPIO 唤醒后复位，无 RTCTA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 0.2 uA109
RAM2K：2KB SRAM IDD(RAM2K)TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 0.3 uA109
RAM30K：30KB SRAM IDD(RAM30K)TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 1.4 uA109
内部 LSI 振荡器 IDD(LSI)TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 0.3 uA109
外部 LSE 振荡器 IDD(LSE)TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 0.4 uA109
外部 HSE 振荡器 IDD(HSE)TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHzmin 100 · typ 200 · max 300 uA109
低功耗的电池低压监控 BM 模块 IDD(BM)TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 0.9 uA109
高精度的电池低压检测 BD 模块 IDD(BD)TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 100 uA109
内部 PLL 振荡器 IDD(PLL)TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 150 uA109
ADC 模块 IDD(ADC)TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 0.4 mA109
TouchKey 模块 IDD(TKEY)TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 0.1 mA109
温度传感器 TS 模块 IDD(TS)TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 0.1 mA109
USB 模块 IDD(USB)非发送状态; TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHzmin 1.2 · typ 1.6 · max 2 mA109
USB 模块 IDD(USB)发送状态; TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 3 mA109
BLE 蓝牙 IDD(BLE)接收，直通电源; TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 13.5 mA109
BLE 蓝牙 IDD(BLE)接收，启用 DC-DC; TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 6.5 mA109
BLE 蓝牙 IDD(BLE)-16dBm 发送功率，直通电源; TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 5 mA109
BLE 蓝牙 IDD(BLE)-16dBm 发送功率，启用 DC-DC; TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 2.5 mA109
BLE 蓝牙 IDD(BLE)0dBm 发送功率，直通电源; TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 10 mA109
BLE 蓝牙 IDD(BLE)0dBm 发送功率，启用 DC-DC; TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 4.5 mA109
BLE 蓝牙 IDD(BLE)+6dBm 发送功率，直通电源; TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 15.5 mA109
BLE 蓝牙 IDD(BLE)+6dBm 发送功率，启用 DC-DC; TA=25℃，VDD33=VIO33=3.3V，Fsys=16MHztyp 7 mA109
外部 HSE 振荡器频率 FHSEtyp 32 MHz109
外部 HSE 振荡器启动到可用时间 TSUHSEmin 80 · typ 200 · max 500 uS109
外部 HSE 振荡器启动到稳定时间 TSTHSEmin 200 · typ 500 · max 3000 uS109

Parameters

14
ADC (Bit)
12bit
CPU Core
RISC-V
CPU Maximum Speed
48MHz
Core Size
32 Bit
Current - Supply
6mA
Features
Software reset
Operating Temperature
-40℃~+85℃
Oscillator Type
Built-in+External
Program Memory Type
FLASH
Program Storage Size
448KB
RAM Size
32KB
Standby Current
700nA
Voltage - Supply
2.3V~3.6V
Voltage - Supply(Absolute Max)
4.2V

Order codes

1

Pinout

29
The pins of the CH582F
PinNameType
1PA11/X32KO/TMR2Unspecified
2PA10/X32KI/TMR1Unspecified
3VDCIDUnspecified
4VSWUnspecified
5VIO33/VDD33Unspecified
6PA8/RXD1/AIN12Unspecified
7PA9/TMR0/TXD1/AIN13Unspecified
8PB15/TCK/MISO_/DTR_Unspecified
9PB14/TIO/DSR_/MOSI_/PWM10Unspecified
10PB13/U2D+/SCK0_/SCL/TXD1_Unspecified
11PB12/U2D-/SCS_/SDA/RXD1_Unspecified
12PB11/UD+/TMR2_Unspecified
13PB10/UD-/TMR1_Unspecified
14PB7/TXD0/PWM9Unspecified
15PB4/RXD0/PWM7Unspecified
16PB23/RST/TMR0_/TXD2_/PWM11Unspecified
17PB22/TMR3/RXD2Unspecified
18X32MOUnspecified
19X32MIUnspecified
20VINTAUnspecified
21ANTUnspecified
22VDCIAUnspecified
23PA4/RXD3/AIN0Unspecified
24PA5/TXD3/AIN1Unspecified
25PA15/MISO/RXD0_/AIN5Unspecified
26PA14/MOSI/TXD0_/AIN4Unspecified
27PA13/SCK0/PWM5/AIN3Unspecified
28PA12/SCS/PWM4/AIN2Unspecified
29EPUnspecified

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Questions

Is there a KiCad symbol and footprint for the CH582F?

Yes. The symbol is EasyEDA_Cloud:CH582F_C3001175 and the footprint EasyEDA_Cloud:QFN-28_L4.0-W4.0-P0.40-BL-EP2.8, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the CH582F?

QFN-28-EP(4x4), with 29 pins. Its footprint is drawn on this page.

Where is the CH582F datasheet?

WCH (Nanjing Qinheng Microelectronics) publishes it: the Datasheet link on this page opens it.

Where can I order the CH582F?

JLCPCB lists it as part C3001175, with 1,456 in stock; the sellers' links on this page open their listings.

What can replace the CH582F?

Parts like it in the library: the CH32V305GBU6 by WCH (Nanjing Qinheng Microelectronics), the GD32E230G8U6TR by GigaDevice Semicon Beijing, the GD32F310G8U6TR by GigaDevice Semicon Beijing and the GD32E230G6U6TR by GigaDevice Semicon Beijing. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the CH582F?

2 boards in 2 repositories on GitHub; the most starred are listed on this page, with their KiCad files.

Parts like it

8