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1234D1D1D1D1D2D2D2D2

SI7232DN

Vishay IntertechnologyExtended

-55℃~+150℃ 1.22nF 13.5mΩ@4.5V 180pF 18nC@4.5V 1V 2 N-Channel 20V 23W 25A 80pF N-Channel PowerPAK1212-8 MOSFETs ROHS

Part id
vishay/SI7232DN
Category
MOSFETs
Package
PowerPAK1212-8
Pins
10
In stock
0 at JLCPCB (C144854)
Used on
8 open-source boards

Overview

The SI7232DN is a MOSFET made by Vishay Intertechnology in a PowerPAK1212-8 package with 6 pins. -55℃~+150℃ 1.22nF 13.5mΩ@4.5V 180pF 18nC@4.5V 1V 2 N-Channel 20V 23W 25A 80pF N-Channel PowerPAK1212-8 MOSFETs ROHS.

PCBKit's library has its KiCad symbol (Transistors:SI7232DN, from CERN's library) and its footprint (ICs And Semiconductors SMD:VISHAY_POWERPAK-1212-8-DUAL, from CERN's library), ready for a KiCad board. JLCPCB lists it (part C144854). 8 open-source boards in 6 repositories on GitHub use it.

Symbol

2GDS7,81
Transistors:SI7232DNFrom CERN's library

Footprint

1234D1D1D1D1D2D2D2D2
ICs And Semiconductors SMD:VISHAY_POWERPAK-1212-8-DUALFrom CERN's library

From the datasheet

10
Drain-source, most
20 V · Drain-source voltage, absolute max · p. 1
Gate-source, most
8 V · Gate-source voltage, absolute max ±8 V · p. 1
Drain current, most
25 A · Continuous drain current, max at TC = 25 °C; package limited · p. 1
Junction, hottest
150 °C · Operating junction temperature, max · p. 1
On resistance
16.4 mΩ · VGS = 4.5 V, ID = 10 A, max · p. 2
On resistance
20 mΩ · VGS = 2.5 V, ID = 9 A, max · p. 2
On resistance
24 mΩ · VGS = 1.8 V, ID = 8.2 A, max · p. 2
Gate threshold
1 V · Gate-source threshold, max at VDS = VGS, ID = 250 uA · p. 2
Junction to air (PowerPAK® 1212-8 Dual)
38 K/W · Junction-to-ambient, typical at t ≤ 10 s on 1 inch square FR4 board · p. 1
Junction to case (PowerPAK® 1212-8 Dual)
4.3 K/W · Junction-to-case (drain), typical, steady state · p. 1

What it is and has

3
MOSFET technology
TrenchFET power MOSFET · p. 1
Configuration
Dual N-Channel 20 V (D-S) MOSFET · p. 1
Package
PowerPAK 1212-8 Dual · p. 1

Specifications

55
ParameterConditionsAs printedPage
Drain-Source Voltage VDSTA = 25 °Cmax 20 V1
Gate-Source Voltage VGSTA = 25 °Cmin -8 · max 8 V1
Continuous Drain Current (TJ = 150 °C) IDTC = 25 °C; package limitedmax 25 A1
Continuous Drain Current (TJ = 150 °C) IDTC = 70 °Cmax 23.8 A1
Continuous Drain Current (TJ = 150 °C) IDTA = 25 °C; surface mounted on 1 inch square FR4 board; t = 10 smax 10 A1
Continuous Drain Current (TJ = 150 °C) IDTA = 70 °C; surface mounted on 1 inch square FR4 board; t = 10 smax 8 A1
Pulsed Drain Current IDMTA = 25 °Cmax 40 A1
Continuous Source-Drain Diode Current ISTC = 25 °Cmax 19 A1
Continuous Source-Drain Diode Current ISTA = 25 °C; surface mounted on 1 inch square FR4 board; t = 10 smax 2.2 A1
Single Pulse Avalanche Current IASL = 0.1 mHmax 15 A1
Single Pulse Avalanche Energy EASL = 0.1 mHmax 11 mJ1
Maximum Power Dissipation PDTC = 25 °Cmax 23 W1
Maximum Power Dissipation PDTC = 70 °Cmax 14.8 W1
Maximum Power Dissipation PDTA = 25 °C; surface mounted on 1 inch square FR4 board; t = 10 smax 2.6 W1
Maximum Power Dissipation PDTA = 70 °C; surface mounted on 1 inch square FR4 board; t = 10 smax 1.7 W1
Operating Junction and Storage Temperature Range TJ, Tstgmin -55 · max 150 °C1
Soldering Recommendations (Peak Temperature)See solder profile; manual soldering with a soldering iron is not recommendedmax 260 °C1
Maximum Junction-to-Ambient RthJAPowerPAK 1212-8 Dual; t ≤ 10 s; surface mounted on 1 inch square FR4 boardtyp 38 · max 48 °C/W1
Maximum Junction-to-Ambient RthJAPowerPAK 1212-8 Dual; steady state; surface mounted on 1 inch square FR4 boardmax 94 °C/W1
Maximum Junction-to-Case (Drain) RthJCPowerPAK 1212-8 Dual; Steady Statetyp 4.3 · max 5.4 °C/W1
Drain-Source Breakdown Voltage VDSVGS = 0 V, ID = 250 uAmin 20 V2
VDS Temperature Coefficient VDS/TJID = 250 uAtyp 22 mV/°C2
VGS(th) Temperature Coefficient VGS(th)/TJID = 250 uAtyp -3 mV/°C2
Gate-Source Threshold Voltage VGS(th)VDS = VGS , ID = 250 uAmin 0.4 · max 1 V2
Gate-Source Leakage IGSSVDS = 0 V, VGS = ± 8 V; maximum magnitude ±100 nAmax 100 nA2
Zero Gate Voltage Drain Current IDSSVDS = 20 V, VGS = 0 Vmax 1 uA2
Zero Gate Voltage Drain Current IDSSVDS = 20 V, VGS = 0 V, TJ = 55 °Cmax 10 uA2
On-State Drain Current ID(on)VDS ≥ 5 V, VGS = 10 V; pulse width ≤ 300 us, duty cycle ≤ 2 %min 20 A2
Drain-Source On-State Resistance RDS(on)VGS = 4.5 V, ID = 10 A; pulse width ≤ 300 us, duty cycle ≤ 2 %typ 0.0135 · max 0.0164 2
Drain-Source On-State Resistance RDS(on)VGS = 2.5 V, ID = 9 A; pulse width ≤ 300 us, duty cycle ≤ 2 %typ 0.016 · max 0.02 2
Drain-Source On-State Resistance RDS(on)VGS = 1.8 V, ID = 8.2 A; pulse width ≤ 300 us, duty cycle ≤ 2 %typ 0.019 · max 0.024 2
Forward Transconductance gfsVDS = 10 V, ID = 10 A; pulse width ≤ 300 us, duty cycle ≤ 2 %typ 47 S2
Input Capacitance CissVDS = 10 V, VGS = 0 V, f = 1 MHz; guaranteed by designtyp 1220 pF2
Output Capacitance CossVDS = 10 V, VGS = 0 V, f = 1 MHz; guaranteed by designtyp 180 pF2
Reverse Transfer Capacitance CrssVDS = 10 V, VGS = 0 V, f = 1 MHz; guaranteed by designtyp 80 pF2
Total Gate Charge QgVDS = 15 V, VGS = 8 V, ID = 10 A; guaranteed by designtyp 21 · max 32 nC2
Total Gate Charge QgVDS = 15 V, VGS = 4.5 V, ID = 10 A; guaranteed by designtyp 12 · max 18 nC2
Gate-Source Charge QgsVDS = 15 V, VGS = 4.5 V, ID = 10 A; guaranteed by designtyp 2 nC2
Gate-Drain Charge QgdVDS = 15 V, VGS = 4.5 V, ID = 10 A; guaranteed by designtyp 1.3 nC2
Gate Resistance Rgf = 1 MHz; guaranteed by designtyp 1.8 · max 3.6 2
Turn-On Delay Time td(on)VDD = 10 V, RL = 1.25 , ID ≅ 8 A, VGEN = 4.5 V, Rg = 1 ; guaranteed by designtyp 10 · max 15 ns2
Rise Time trVDD = 10 V, RL = 1.25 , ID ≅ 8 A, VGEN = 4.5 V, Rg = 1 ; guaranteed by designtyp 10 · max 15 ns2
Turn-Off Delay Time td(off)VDD = 10 V, RL = 1.25 , ID ≅ 8 A, VGEN = 4.5 V, Rg = 1 ; guaranteed by designtyp 35 · max 55 ns2
Fall Time tfVDD = 10 V, RL = 1.25 , ID ≅ 8 A, VGEN = 4.5 V, Rg = 1 ; guaranteed by designtyp 10 · max 15 ns2
Turn-On Delay Time td(on)VDD = 10 V, RL = 1.25 , ID ≅ 8 A, VGEN = 8 V, Rg = 1 ; guaranteed by designtyp 10 · max 15 ns2
Rise Time trVDD = 10 V, RL = 1.25 , ID ≅ 8 A, VGEN = 8 V, Rg = 1 ; guaranteed by designtyp 10 · max 15 ns2
Turn-Off Delay Time td(off)VDD = 10 V, RL = 1.25 , ID ≅ 8 A, VGEN = 8 V, Rg = 1 ; guaranteed by designtyp 25 · max 40 ns2
Fall Time tfVDD = 10 V, RL = 1.25 , ID ≅ 8 A, VGEN = 8 V, Rg = 1 ; guaranteed by designtyp 10 · max 15 ns2
Continuous Source-Drain Diode Current ISTC = 25 °Cmax 19 A2
Pulse Diode Forward Current ISMTJ = 25 °Cmax 40 A2
Body Diode Voltage VSDIS = 8 A, VGS = 0 Vtyp 0.81 · max 1.2 V2
Body Diode Reverse Recovery Time trrIF = 8 A, dI/dt = 100 A/us, TJ = 25 °Ctyp 20 · max 30 ns2
Body Diode Reverse Recovery Charge QrrIF = 8 A, dI/dt = 100 A/us, TJ = 25 °Ctyp 15 · max 25 nC2
Reverse Recovery Fall Time taIF = 8 A, dI/dt = 100 A/us, TJ = 25 °Ctyp 12.5 ns2
Reverse Recovery Rise Time tbIF = 8 A, dI/dt = 100 A/us, TJ = 25 °Ctyp 7.5 ns2

Ordering codes, by the datasheet

1
Si7232DN-T1-GE3
PowerPAK 1212-8 Dual · Lead (Pb)-free and halogen-free · p. 1

Open-source boards using it

8
  • 4 layers30.5 × 82.6 mmCircuit board design, the printed circuit board in 3D

    Circuit board design

    ImperialSpaceSociety/Project-Mach-1

    This is the code and hardware designs for the high powered rocketry project at the Imperial College Space Society

    89 parts12
  • 4 layers45 × 24 mmAltimeter, the printed circuit board in 3D

    Altimeter

    rckTom/alturia-pcb

    altimeter for rocket recovery and flight status recording

    100 parts7
  • 4 layers42 × 65 mmIcarus Flight Computer, the printed circuit board in 3D

    Icarus Flight Computer

    daedalus-ind/icarus-hardware

    Hardware of the onboard flight computer for the Icarus rocket.

    106 parts2MIT
  • 2 layers34.5 × 19.5 mmCycloneVBuddy, the printed circuit board in 3D

    CycloneVBuddy

    metacollin/BuckyBuddy

    Cyclone V Bucky Buddy Board

    92 parts1
  • 4 layers45 × 100 mmMIDAS MK2.1, the printed circuit board in 3D

    MIDAS MK2.1

    ISSUIUC/ISS-PCB

    Building custom flight computers

    219 parts33
  • 4 layers25 × 80 mmMini MK1, the printed circuit board in 3D

    Mini MK1

    ISSUIUC/ISS-PCB

    Building custom flight computers

    135 parts33
  • 4 layers48.4 × 61.4 mmFlight computer, the printed circuit board in 3D

    Flight computer

    Terrapin-Rocket-Team/SRAD-Avionics

    Code and PCBs for the avionics subteam for the SRAD flight computer and side projects

    101 parts17
  • 4 layers30.5 × 82.6 mmCircuit board design, the printed circuit board in 3D

    Circuit board design

    ImperialSpaceSociety/Project-Mach-1

    This is the code and hardware designs for the high powered rocketry project at the Imperial College Space Society

    87 parts12

Questions

Is there a KiCad symbol and footprint for the SI7232DN?

Yes. The symbol is Transistors:SI7232DN and the footprint ICs And Semiconductors SMD:VISHAY_POWERPAK-1212-8-DUAL, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the SI7232DN?

PowerPAK1212-8, with 6 pins. Its footprint is drawn on this page.

Where is the SI7232DN datasheet?

Vishay Intertechnology publishes it: the Datasheet link on this page opens it.

Where can I order the SI7232DN?

JLCPCB lists it as part C144854, with 0 in stock; the sellers' links on this page open their listings.

Which open-source boards use the SI7232DN?

8 boards in 6 repositories on GitHub; the most starred are listed on this page, with their KiCad files.