TS3USB30ERSW
Texas InstrumentsExtended
-40℃~+85℃ 1 1.4GHz 10Ω 250ps 25ns 2:2 30ns 3V~4.3V 7.5pF UQFN-10(1.4x1.8) Analog Switches, Multiplexers ROHS
- Part id
- ti/TS3USB30ERSW
- Category
- Analog Switches, Multiplexers
- Package
- UQFN-10(1.4x1.8)
- Pins
- 10
- In stock
- 12,286 at JLCPCB (C73880)
Overview
The TS3USB30ERSW is an analog Switches, Multiplexer made by Texas Instruments in a UQFN-10(1.4x1.8) package with 10 pins. -40℃~+85℃ 1 1.4GHz 10Ω 250ps 25ns 2:2 30ns 3V~4.3V 7.5pF UQFN-10(1.4x1.8) Analog Switches, Multiplexers ROHS.
PCBKit's library has its KiCad symbol (Interface_USB:TS3USB30ERSWR, from KiCad's library) and its footprint (Package_DFN_QFN:UQFN-10_1.4x1.8mm_P0.4mm, from KiCad's library), ready for a KiCad board. 12,286 are in stock at JLCPCB (part C73880).
Symbol
Footprint
From the datasheet
11- Supply, least
- 3 V · VCC, recommended operating min · p. 4
- Supply, most
- 4.3 V · VCC, recommended operating max · p. 4
- Supply, absolute maximum
- 7 V · VCC, absolute max · p. 4
- Works from
- -40 °C · Operating free-air temperature min · p. 4
- Works up to
- 85 °C · Operating free-air temperature max · p. 4
- Takes working
- 1 µA · VCC supply current max, 4.3 V, switch ON or OFF, no load · p. 5
- A pin gives at most
- 64 mA · ON-state switch current absolute max · p. 4
- Junction to air (RSW (UQFN))
- 114.5 K/W · Junction-to-ambient thermal resistance · p. 4
- Junction to case (RSW (UQFN))
- 64.7 K/W · Junction-to-case (top) thermal resistance · p. 4
- Junction to board (RSW (UQFN))
- 21 K/W · Junction-to-board thermal resistance · p. 4
- Data rate, most
- 480 Mbit/s · USB 2.0 signal rate max · p. 1
What it is and has
5- Switch configuration
- 1:2 multiplexer/demultiplexer with single enable · p. 1
- Control inputs
- 1.8V compatible · p. 1
- Partial power-down
- IOFF supports partial power-down-mode operation · p. 1
- Signal pin tolerance
- D+/D– tolerate up to 5.25V · p. 1
- Package
- 10-pin UQFN, 1.8mm × 1.4mm · p. 1
Around it
1- res 50Ω
- between unused pin and GND; Recommended for unused pins to prevent signal reflections. · p. 13
Specifications
47| Parameter | Conditions | As printed | Page |
|---|---|---|---|
| Supply voltage VCC | Over operating free-air temperature range | min -0.5 · max 7 V | 4 |
| Control input voltage VIN | Over operating free-air temperature range | min -0.5 · max 7 V | 4 |
| Signal path I/O voltage (3) VI/O | D+, D– when VCC > 0V; maximum VCC + 0.3 V | min -0.5 V | 4 |
| Signal path I/O voltage (3) VI/O | D+, D– when VCC = 0V | min -0.5 · max 5.25 V | 4 |
| Control input clamp current IIK | VIN < 0V | max -50 mA | 4 |
| I/O port clamp current II/OK | VI/O < 0V | max -50 mA | 4 |
| ON-state switch current(4) II/O | Limit ±64 mA | max 64 mA | 4 |
| Continuous current through VCC or GND | Limit ±100 mA | max 100 mA | 4 |
| Storage temperature Tstg | min -65 · max 150 °C | 4 | |
| Electrostatic discharge V(ESD) | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001; all pins | typ 8000 V | 4 |
| Electrostatic discharge V(ESD) | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001; I/O port to GND | typ 15000 V | 4 |
| Electrostatic discharge V(ESD) | Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002 | typ 1000 V | 4 |
| Supply voltage VCC | min 3 · max 4.3 V | 4 | |
| High-level control input voltage VIH | VCC = 3V to 3.6V; maximum VCC | min 1.3 V | 4 |
| High-level control input voltage VIH | VCC = 4.3V; maximum VCC | min 1.7 V | 4 |
| Low-level control input voltage VIL | VCC = 3V to 3.6V | min 0 · max 0.5 V | 4 |
| Low-level control input voltage VIL | VCC = 4.3V | min 0 · max 0.7 V | 4 |
| Data input/output voltage VI/O | Maximum VCC | min 0 V | 4 |
| Operating free-air temperature TA | min -40 · max 85 °C | 4 | |
| Junction-to-ambient thermal resistance RθJA | RSW (UQFN), 10 pins | typ 114.5 °C/W | 4 |
| Junction-to-case (top) thermal resistance RθJC(top) | RSW (UQFN), 10 pins | typ 64.7 °C/W | 4 |
| Junction-to-board thermal resistance RθJB | RSW (UQFN), 10 pins | typ 21 °C/W | 4 |
| Junction-to-top characterization parameter ψJT | RSW (UQFN), 10 pins | typ 1.9 °C/W | 4 |
| Junction-to-board characterization parameter ψJB | RSW (UQFN), 10 pins | typ 21 °C/W | 5 |
| Control inputs clamp voltage VIK | VCC = 3V, II = –18mA | max -1.2 V | 5 |
| Control inputs IIN | VCC = 4.3V, 0V, VIN = 0V to 4.3V; limit ±1 uA | max 1 uA | 5 |
| D+ and D– OFF-state leakage current(3) IOZ | VCC = 4.3V, VO = 0V to 3.6V, VI = 0V, Switch OFF; limit ±1 uA | max 1 uA | 5 |
| Powered off leakage current IOFF | VCC = 0V, VO = 0V to 4.3V, VI = 0V, VIN = VCC or GND; limit ±2 uA | max 2 uA | 5 |
| Supply current ICC | VCC = 4.3V, II/O = 0mA, Switch ON or OFF | max 1 uA | 5 |
| Control inputs ΔICC | VCC = 4.3V, VIN = 2.6V; increase per input | max 10 uA | 5 |
| Control inputs digital input capacitance Cin | VCC = 0V, VIN = VCC or GND | typ 1 pF | 5 |
| OFF-state input capacitance Cio(OFF) | VCC = 3.3V, VI/O = 3.3V or 0V, Switch OFF | typ 2 pF | 5 |
| ON-state input capacitance Cio(ON) | VCC = 3.3V, VI/O = 3.3V or 0V, Switch ON | typ 7.5 pF | 5 |
| ON-state resistance(5) RON | VCC = 3V, VI = 0.4V, IO = –8mA | typ 6 · max 10 Ω | 5 |
| ON-state resistance match between channels ΔRON | VCC = 3V, VI = 0.4V, IO = –8mA | typ 0.35 Ω | 5 |
| ON-state resistance flatness ron(flat) | VCC = 3V, VI = 0V or 1V, IO = –8mA | typ 2 Ω | 5 |
| Crosstalk XTALK | TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V; RL = 50Ω, f = 240MHz, See Figure 6-3 | typ -32 dB | 5 |
| OFF isolation OISO | TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V; RL = 50Ω, f = 240MHz, See Figure 6-2 | typ -32 dB | 5 |
| Bandwidth (–3 dB) BW | TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V; RL = 50Ω, See Figure 6-4 | typ 1400 MHz | 5 |
| Propagation delay(2) (3) tpd | TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V; RL = 50Ω, CL = 5pF, At 480Mbps, See Figure 6-5 | typ 0.25 ns | 5 |
| Line enable time, SEL to D, nD tON | TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V; RL = 50Ω, CL = 5pF, See Figure 6-1 | max 30 ns | 5 |
| Line disable time, SEL to D, nD tOFF | TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V; RL = 50Ω, CL = 5pF, See Figure 6-1 | max 25 ns | 5 |
| Line enable time, OE to D, nD tON | TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V; RL = 50Ω, CL = 5pF, See Figure 6-1 | max 30 ns | 5 |
| Line disable time, OE to D, nD tOFF | TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V; RL = 50Ω, CL = 5pF, See Figure 6-1 | max 25 ns | 5 |
| Output skew between center port to any other port(2) tSK(O) | TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V; RL = 50Ω, CL = 5pF, See Figure 6-6 | max 50 ps | 6 |
| Skew between opposite transitions of the same output (tPHL – tPLH)(2) tSK(P) | TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V; RL = 50Ω, CL = 5pF, See Figure 6-6 | max 20 ps | 6 |
| Total jitter(2) tJ | TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V; RL = 50Ω, CL = 5pF, tR = tF = 500ps at 480Mbps (PRBS = 215 – 1) | max 20 ps | 6 |
Pins, by the datasheet
10- 1 D1+
- USB signal path port 1. · p. 3
- 2 D2+
- USB signal path port 2. · p. 3
- 3 D+
- Common USB signal path. · p. 3
- 4 GND
- Ground. · p. 3
- 5 D–
- Common USB signal path. · p. 3
- 6 D2–
- USB signal path port 2. · p. 3
- 7 D1–
- USB signal path port 1. · p. 3
- 8 OE
- Bus-switch enable. · p. 3
- 9 VCC
- Voltage supply. · p. 3
- 10 S
- Select input. · p. 3
Ordering codes, by the datasheet
9- TS3USB30EDGSR
- VSSOP (DGS), 10 pins · 2500, LARGE T&R; -40 to 85°C; marking (L6Q, L6R) · p. 18
- TS3USB30EDGSR.B
- VSSOP (DGS), 10 pins · 2500, LARGE T&R; -40 to 85°C; marking (L6Q, L6R) · p. 18
- TS3USB30EDGSRG4
- VSSOP (DGS), 10 pins · 2500, LARGE T&R; -40 to 85°C; marking L6R · p. 18
- TS3USB30EDGSRG4.B
- VSSOP (DGS), 10 pins · 2500, LARGE T&R; -40 to 85°C; marking L6R · p. 18
- TS3USB30ERSWR
- UQFN (RSW), 10 pins · 3000, LARGE T&R; -40 to 85°C; marking (LY7, LYO, LYV) · p. 18
- TS3USB30ERSWR.A
- UQFN (RSW), 10 pins · 3000, LARGE T&R; -40 to 85°C; marking (LY7, LYO, LYV) · p. 18
- TS3USB30ERSWR.B
- UQFN (RSW), 10 pins · 3000, LARGE T&R; -40 to 85°C; marking (LY7, LYO, LYV) · p. 18
- TS3USB30ERSWRG4.A
- UQFN (RSW), 10 pins · 3000, LARGE T&R; -40 to 85°C; marking LYV · p. 18
- TS3USB30ERSWRG4.B
- UQFN (RSW), 10 pins · 3000, LARGE T&R; -40 to 85°C; marking LYV · p. 18
Parts like it
1Questions
Is there a KiCad symbol and footprint for the TS3USB30ERSW?
Yes. The symbol is Interface_USB:TS3USB30ERSWR and the footprint Package_DFN_QFN:UQFN-10_1.4x1.8mm_P0.4mm, both drawn on this page. PCBKit places them on a board for you when you design with it.
What package is the TS3USB30ERSW?
UQFN-10(1.4x1.8), with 10 pins. Its footprint is drawn on this page.
Where is the TS3USB30ERSW datasheet?
Texas Instruments publishes it: the Datasheet link on this page opens it.
Where can I order the TS3USB30ERSW?
JLCPCB lists it as part C73880, with 12,286 in stock; the sellers' links on this page open their listings.
What can replace the TS3USB30ERSW?
Parts like it in the library: the TMUX154ERSW by Texas Instruments. Check their datasheets: a part that fits the footprint may still differ in its ratings.