TS3USB30EDGS

Q: Is there a KiCad symbol and footprint for the TS3USB30EDGS?

Yes. The symbol is Interface_USB:TS3USB30EDGSR and the footprint Package_SO:TSSOP-10_3x3mm_P0.5mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

Q: What package is the TS3USB30EDGS?

VSSOP-10-0.5mm, with 10 pins. Its footprint is drawn on this page.

Q: Where is the TS3USB30EDGS datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Q: Where can I order the TS3USB30EDGS?

JLCPCB lists it as part C131998, with 799 in stock; the sellers' links on this page open their listings.

Q: Which open-source boards use the TS3USB30EDGS?

1 board in 1 repository on GitHub; the most starred are listed on this page, with their KiCad files.

Texas Instruments

-40℃~+85℃ 250ps 25ns 2:1 30ns 3V~4.3V 6Ω 7.5pF 900MHz USB VSSOP-10-0.5mm Analog Switches - Special Purpose ROHS

Extended

Datasheetti/TS3USB30EDGS

Category: Analog Switches Special Purpose
Package: VSSOP-10-0.5mm
Pins: 10

Overview

The TS3USB30EDGS is an analog Switches Special Purpose made by Texas Instruments in a VSSOP-10-0.5mm package with 10 pins. -40℃~+85℃ 250ps 25ns 2:1 30ns 3V~4.3V 6Ω 7.5pF 900MHz USB VSSOP-10-0.5mm Analog Switches - Special Purpose ROHS.

PCBKit's library has its KiCad symbol (Interface_USB:TS3USB30EDGSR, from KiCad's library) and its footprint (Package_SO:TSSOP-10_3x3mm_P0.5mm, from KiCad's library), ready for a KiCad board. 799 are in stock at JLCPCB (part C131998). 1 open-source board in 1 repository on GitHub use it.

Symbol

Interface_USB:TS3USB30EDGSRFrom KiCad's library

Footprint

Package_SO:TSSOP-10_3x3mm_P0.5mmFrom KiCad's library

From the datasheet

Supply, least: 3 V · VCC, recommended operating min · p. 4
Supply, most: 4.3 V · VCC, recommended operating max · p. 4
Supply, absolute maximum: 7 V · VCC, absolute max · p. 4
Works from: -40 °C · Operating free-air temperature min · p. 4
Works up to: 85 °C · Operating free-air temperature max · p. 4
Takes working: 1 µA · Supply current max, VCC = 4.3V, II/O = 0mA, switch ON or OFF · p. 5
A pin gives at most: 64 mA · ON-state switch current absolute max magnitude · p. 4
Junction to air (DGS (VSSOP)): 203.1 K/W · Junction-to-ambient thermal resistance · p. 4
Junction to case (DGS (VSSOP)): 88.7 K/W · Junction-to-case (top) thermal resistance · p. 4
Junction to board (DGS (VSSOP)): 123 K/W · Junction-to-board thermal resistance · p. 4
Data rate, most: 480 Mbit/s · High-speed USB 2.0 data rate · p. 1

What it is and has

Switch configuration: 1:2 multiplexer/demultiplexer with single enable · p. 1
Control inputs: 1.8V compatible · p. 1
Partial power-down: IOFF support · p. 1
ON resistance: 10Ω maximum · p. 1
Bandwidth: 1400MHz typical at –3dB · p. 1

Around it

res 50Ω: between unused pins and GND; Recommended for unused pins to prevent signal reflections. · p. 13

Specifications

Parameter	Conditions	As printed	Page
Supply voltage VCC	Over operating free-air temperature range	min -0.5 · max 7 V	4
Control input voltage VIN	Over operating free-air temperature range	min -0.5 · max 7 V	4
Signal path I/O voltage VI/O	D+, D– when VCC > 0V; maximum VCC + 0.3V	min -0.5 V	4
Signal path I/O voltage VI/O	D+, D– when VCC = 0V	min -0.5 · max 5.25 V	4
Control input clamp current IIK	VIN < 0V	max -50 mA	4
I/O port clamp current II/OK	VI/O < 0V	max -50 mA	4
ON-state switch current II/O	Rating ±64mA	max 64 mA	4
Continuous current through VCC or GND	Rating ±100mA	max 100 mA	4
Storage temperature Tstg		min -65 · max 150 °C	4
Electrostatic discharge V(ESD)	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001; all pins	max 8000 V	4
Electrostatic discharge V(ESD)	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001; I/O port to GND	max 15000 V	4
Electrostatic discharge V(ESD)	Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002	max 1000 V	4
Supply voltage VCC	Over operating free-air temperature range	min 3 · max 4.3 V	4
High-level control input voltage VIH	VCC = 3V to 3.6V; maximum VCC	min 1.3 V	4
High-level control input voltage VIH	VCC = 4.3V; maximum VCC	min 1.7 V	4
Low-level control input voltage VIL	VCC = 3V to 3.6V	min 0 · max 0.5 V	4
Low-level control input voltage VIL	VCC = 4.3V	min 0 · max 0.7 V	4
Data input/output voltage VI/O	Maximum VCC	min 0 V	4
Operating free-air temperature TA		min -40 · max 85 °C	4
Junction-to-ambient thermal resistance RθJA	DGS (VSSOP), 10 PINS	typ 203.1 °C/W	4
Junction-to-case (top) thermal resistance RθJC(top)	DGS (VSSOP), 10 PINS	typ 88.7 °C/W	4
Junction-to-board thermal resistance RθJB	DGS (VSSOP), 10 PINS	typ 123 °C/W	4
Junction-to-top characterization parameter ψJT	DGS (VSSOP), 10 PINS	typ 21.2 °C/W	4
Junction-to-board characterization parameter ψJB	DGS (VSSOP), 10 PINS	typ 121.6 °C/W	5
Control inputs clamp voltage VIK	VCC = 3V, II = –18mA	max -1.2 V	5
Control inputs IIN	VCC = 4.3V, 0V, VIN = 0V to 4.3V; limit ±1uA	max 1 uA	5
D+ and D– OFF-state leakage current IOZ	VCC = 4.3V, VO = 0V to 3.6V, VI = 0V, Switch OFF; limit ±1uA	max 1 uA	5
Powered off leakage current IOFF	VCC = 0V, VO = 0V to 4.3V, VI = 0V, VIN = VCC or GND; limit ±2uA	max 2 uA	5
Supply current ICC	VCC = 4.3V, II/O = 0mA, Switch ON or OFF	max 1 uA	5
Control inputs ΔICC	VCC = 4.3V, VIN = 2.6V	max 10 uA	5
Control inputs digital input capacitance Cin	VCC = 0V, VIN = VCC or GND	typ 1 pF	5
OFF-state input capacitance Cio(OFF)	VCC = 3.3V, VI/O = 3.3V or 0V, Switch OFF	typ 2 pF	5
ON-state input capacitance Cio(ON)	VCC = 3.3V, VI/O = 3.3V or 0V, Switch ON	typ 7.5 pF	5
ON-state resistance RON	VCC = 3V, VI = 0.4V, IO = –8mA	typ 6 · max 10 Ω	5
ON-state resistance match between channels ΔRON	VCC = 3V, VI = 0.4V, IO = –8mA	typ 0.35 Ω	5
ON-state resistance flatness ron(flat)	VCC = 3V, VI = 0V or 1V, IO = –8mA	typ 2 Ω	5
Crosstalk XTALK	RL = 50Ω, f = 240MHz, See Figure 6-3; TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V	typ -32 dB	5
OFF isolation OISO	RL = 50Ω, f = 240MHz, See Figure 6-2; TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V	typ -32 dB	5
Bandwidth (–3 dB) BW	RL = 50Ω, See Figure 6-4; TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V	typ 1400 MHz	5
Propagation delay tpd	RL = 50Ω, CL = 5pF, At 480Mbps, See Figure 6-5; TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V	typ 0.25 ns	5
Line enable time, SEL to D, nD tON	RL = 50Ω, CL = 5pF, See Figure 6-1; TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V	max 30 ns	5
Line disable time, SEL to D, nD tOFF	RL = 50Ω, CL = 5pF, See Figure 6-1; TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V	max 25 ns	5
Line enable time, OE to D, nD tON	RL = 50Ω, CL = 5pF, See Figure 6-1; TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V	max 30 ns	5
Line disable time, OE to D, nD tOFF	RL = 50Ω, CL = 5pF, See Figure 6-1; TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V	max 25 ns	5
Output skew between center port to any other port tSK(O)	RL = 50Ω, CL = 5pF, See Figure 6-6; TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V; specified by design	max 50 ps	6
Skew between opposite transitions of the same output (tPHL – tPLH) tSK(P)	RL = 50Ω, CL = 5pF, See Figure 6-6; TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V; specified by design	max 20 ps	6
Total jitter tJ	RL = 50Ω, CL = 5pF, tR = tF = 500ps at 480Mbps (PRBS = 215 – 1); TA = –40°C to 85°C, VCC = 3.3V ±10%, GND = 0V; specified by design	max 20 ps	6

Pins, by the datasheet

1 S: Select input. · p. 3
2 D1+: USB signal path port 1. · p. 3
3 D2+: USB signal path port 2. · p. 3
4 D+: Common USB signal path. · p. 3
5 GND: Ground. · p. 3
6 D–: Common USB signal path. · p. 3
7 D2–: USB signal path port 2. · p. 3
8 D1–: USB signal path port 1. · p. 3
9 OE: Bus-switch enable. · p. 3
10 VCC: Voltage supply. · p. 3

Ordering codes, by the datasheet

TS3USB30EDGSR: VSSOP (DGS), 10 pins · 2500, LARGE T&R; -40 to 85°C; marking L6Q or L6R · p. 18
TS3USB30EDGSR.B: VSSOP (DGS), 10 pins · 2500, LARGE T&R; -40 to 85°C; marking L6Q or L6R · p. 18
TS3USB30EDGSRG4: VSSOP (DGS), 10 pins · 2500, LARGE T&R; -40 to 85°C; marking L6R · p. 18
TS3USB30EDGSRG4.B: VSSOP (DGS), 10 pins · 2500, LARGE T&R; -40 to 85°C; marking L6R · p. 18
TS3USB30ERSWR: UQFN (RSW), 10 pins · 3000, LARGE T&R; -40 to 85°C; marking LY7, LYO or LYV · p. 18
TS3USB30ERSWR.A: UQFN (RSW), 10 pins · 3000, LARGE T&R; -40 to 85°C; marking LY7, LYO or LYV · p. 18
TS3USB30ERSWR.B: UQFN (RSW), 10 pins · 3000, LARGE T&R; -40 to 85°C; marking LY7, LYO or LYV · p. 18
TS3USB30ERSWRG4.A: UQFN (RSW), 10 pins · 3000, LARGE T&R; -40 to 85°C; marking LYV · p. 18
TS3USB30ERSWRG4.B: UQFN (RSW), 10 pins · 3000, LARGE T&R; -40 to 85°C; marking LYV · p. 18

Parameters

-3dB Bandwidth: 900MHz
Applications: USB
Con: 7.5pF
Current - Supply: 1uA
Data Rate: 480Mbps
Features: Bidirectional analog channel
Number of Channels: 2
Operating Temperature: -40℃~+85℃
Output Current per Pin(Max): 64mA
Propagation Delay (tpd): 250ps
Ron: 6Ω
Switch Circuit: 2:1
Thermal Resistance(Junction to Ambient): 203.1℃/W
Thermal Resistance(Junction to Board): 123℃/W
Thermal Resistance(Junction to Case): 88.7℃/W
Turn-off time: 25ns
Turn-on time: 30ns
Voltage - Supply: 3V~4.3V
Voltage - Supply(Absolute Max): 7V

Order codes

TS3USB30EDGSRLCSC C131998

Pinout

The pins of the TS3USB30EDGS
Pin	Name	Type
1	S	Input
2	D1+	Input/output
3	D2+	Input/output
4	D+	Input/output
5	GND	Power in
6	D-	Input/output
7	D2-	Input/output
8	D1-	Input/output
9	OE	Input
10	VCC	Power in

Open-source boards using it

All 1

2 layers357.5 × 131.8 mm
K Type
kiibohd/pcb
PCB and PCB related bits
362 parts417

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Questions

Is there a KiCad symbol and footprint for the TS3USB30EDGS?