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TPA2016D2RTJ

Texas InstrumentsExtended

-40℃~+85℃ -80dB 0.1% 1.7W×2@8Ω、2.8W×2@4Ω、1.5W×2@4Ω、750mW×2@8Ω 2 Pairs Differential Inputs 2-Channel 2.5V~5.5V 3.5mA 90% Class D Enable/shutdown function、Filterless architecture、Digitally programmable gain、Built-in audio processing VQFN-20-EP(4x4) Audio Amplifiers ROHS

Part id
ti/TPA2016D2RTJ
Category
Audio Amplifiers
Package
VQFN-20-EP(4x4)
Pins
21
In stock
1,212 at JLCPCB (C2878939)
Used on
2 open-source boards

Overview

The TPA2016D2RTJ is an audio Amplifier made by Texas Instruments in a VQFN-20-EP(4x4) package with 21 pins. -40℃~+85℃ -80dB 0.1% 1.7W×2@8Ω、2.8W×2@4Ω、1.5W×2@4Ω、750mW×2@8Ω 2 Pairs Differential Inputs 2-Channel 2.5V~5.5V 3.5mA 90% Class D Enable/shutdown function、Filterless architecture、Digitally programmable gain、Built-in audio processing VQFN-20-EP(4x4) Audio Amplifiers ROHS.

PCBKit's library has its KiCad symbol (dk_Linear-Amplifiers-Audio:TPA2016D2RTJR, from Digikey) and its footprint (Source_Footprints:WQFN-20-1EP_4x4mm, from Digikey), ready for a KiCad board. 1,212 are in stock at JLCPCB (part C2878939). 2 open-source boards in 1 repository on GitHub use it.

Symbol

1INL+2INL-3AGND4PVDDL5PVDDL6OUTL+7OUTL-8PGND9OUTR-10OUTR+11PVDDR12PVDDR13AVDD14INR-15INR+16NC17SCL18SDZ19SDA20NC21EP
dk_Linear-Amplifiers-Audio:TPA2016D2RTJRFrom Digikey

Footprint

21
Source_Footprints:WQFN-20-1EP_4x4mmFrom Digikey

From the datasheet

13
Supply, least
2.5 V · VDD, AVDD/PVDDR/PVDDL recommended operating min · p. 5
Supply, most
5.5 V · VDD, AVDD/PVDDR/PVDDL recommended operating max · p. 5
Supply, absolute maximum
6 V · VDD, AVDD/PVDDR/PVDDL absolute max · p. 5
Works from
-40 °C · Operating free-air temperature min · p. 5
Works up to
85 °C · Operating free-air temperature max · p. 5
Junction, hottest
150 °C · Operating junction temperature absolute max · p. 5
Takes working
3.7 mA · Supply current typical, VDD = 3.6 V · p. 6
Takes asleep
200 nA · Shutdown quiescent current typical, SDZ = 0.35 V, VDD = 3.6 V · p. 6
Takes asleep
50 µA · Software shutdown current typical, SDZ = 1.3 V, VDD = 3.6 V · p. 6
Switches at
300 kHz · Class D switching frequency typical · p. 6
Junction to air (RTJ (QFN))
33.3 K/W · Junction-to-ambient thermal resistance · p. 5
Junction to board (RTJ (QFN))
9.6 K/W · Junction-to-board thermal resistance · p. 5
Junction to case (RTJ (QFN))
22.5 K/W · Junction-to-case top thermal resistance · p. 5

What it is and has

10
Architecture
Filter-Free Class-D · p. 1
Output power
1.7 W/Ch into 8 Ω at 5 V, 10% THD+N · p. 1
Output power
750 mW/Ch into 8 Ω at 3.6 V, 10% THD+N · p. 1
Output power
2.8 W/Ch into 4 Ω at 5 V, 10% THD+N · p. 1
Output power
1.5 W/Ch into 4 Ω at 3.6 V, 10% THD+N · p. 1
Audio processing
Programmable DRC and AGC parameters · p. 1
Volume control
Digital I2C · p. 1
Timing controls
Selectable attack, release, and hold times · p. 1
Compression ratios
4 selectable · p. 1
Package
QFN (20), 4.00 mm × 4.00 mm · p. 1

Specifications

53
ParameterConditionsAs printedPage
Supply voltage VDDAVDD, PVDDR, PVDDLmin -0.3 · max 6 V5
Input voltageSDZ, INR+, INR–, INL+, INL–; maximum VDD + 0.3 Vmin -0.3 V5
Input voltageSDA, SCLmin -0.3 · max 6 V5
Operating free-air temperature TAmin -40 · max 85 °C5
Operating junction temperature TJmin -40 · max 150 °C5
Minimum load resistance RLOADmax 3.2 Ω5
Storage temperature Tstgmin -65 · max 150 °C5
Electrostatic discharge V(ESD)Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001; ±2000 Vmax 2000 V5
Electrostatic discharge V(ESD)Charged-device model (CDM), per JEDEC specification JESD22-C101; ±500 Vmax 500 V5
Supply voltage VDDAVDD, PVDDR, PVDDLmin 2.5 · max 5.5 V5
High-level input voltage VIHSDZ, SDA, SCLmin 1.3 V5
Low-level input voltage VILSDZ, SDA, SCLmax 0.6 V5
Operating free-air temperature TAmin -40 · max 85 °C5
Junction-to-ambient thermal resistance RθJARTJ (QFN), 20 PINStyp 33.3 °C/W5
Junction-to-case (top) thermal resistance RθJC(top)RTJ (QFN), 20 PINStyp 22.5 °C/W5
Junction-to-board thermal resistance RθJBRTJ (QFN), 20 PINStyp 9.6 °C/W5
Junction-to-top characterization parameter ψJTRTJ (QFN), 20 PINStyp 0.2 °C/W5
Junction-to-board characterization parameter ψJBRTJ (QFN), 20 PINStyp 9.6 °C/W5
Junction-to-case (bottom) thermal resistance RθJC(bot)RTJ (QFN), 20 PINStyp 2.4 °C/W5
Supply voltage range VDDTA = 25°C, SDZ = 1.3 V, RL = 8 Ω + 33 uHmin 2.5 · typ 3.6 · max 5.5 V6
Shutdown quiescent current ISDZSDZ = 0.35 V, VDD = 2.5 Vtyp 0.1 · max 1 uA6
Shutdown quiescent current ISDZSDZ = 0.35 V, VDD = 3.6 Vtyp 0.2 · max 1 uA6
Shutdown quiescent current ISDZSDZ = 0.35 V, VDD = 5.5 Vtyp 0.3 · max 1 uA6
Software shutdown quiescent current ISWSSDZ = 1.3 V, VDD = 2.5 Vtyp 35 · max 50 uA6
Software shutdown quiescent current ISWSSDZ = 1.3 V, VDD = 3.6 Vtyp 50 · max 70 uA6
Software shutdown quiescent current ISWSSDZ = 1.3 V, VDD = 5.5 Vtyp 75 · max 110 uA6
Supply current IDDVDD = 2.5 Vtyp 3.5 · max 4.5 mA6
Supply current IDDVDD = 3.6 Vtyp 3.7 · max 4.7 mA6
Supply current IDDVDD = 5.5 Vtyp 4.5 · max 5.5 mA6
Class D Switching Frequency fSWTA = 25°C, VDD = 3.6 V, SDZ = 1.3 V, RL = 8 Ω + 33 uHmin 275 · typ 300 · max 325 kHz6
High-level input current IIHVDD = 5.5 V, SDZ = 5.8 Vmax 1 uA6
Low-level input current IILVDD = 5.5 V, SDZ = –0.3 Vmin -1 uA6
Start-up time tSTART2.5 V ≤ VDD ≤ 5.5 V no pop, CIN ≤ 1 uFtyp 5 ms6
Power on reset ON threshold PORTA = 25°Ctyp 2 · max 2.3 V6
Power on reset hysteresis PORTA = 25°Ctyp 0.2 V6
Input common mode rejection CMRRRL = 8 Ω, Vicm = 0.5 V and Vicm = VDD – 0.8 V, differential inputs shortedtyp -70 dB6
Output offset voltage VooVDD = 3.6 V, AV = 6 dB, RL = 8 Ω, inputs AC-groundedmin -10 · typ 2 · max 10 mV6
Output Impedance in shutdown mode ZOUTSDZ = 0.35 Vtyp 2 kΩ6
Gain accuracyCompression and limiter disabled, Gain = 0 to 30 dBmin -0.5 · max 0.5 dB6
Power supply rejection ratio PSRRVDD = 2.5 V to 4.7 Vtyp -80 dB6
Frequency, SCL fSCLNo wait states; over recommended operating conditionsmax 400 kHz6
Pulse duration, SCL high tW(H)Over recommended operating conditionsmin 0.6 us6
Pulse duration, SCL low tW(L)Over recommended operating conditionsmin 1.3 us6
Setup time, SDA to SCL tSU(1)Over recommended operating conditionsmin 100 ns6
Hold time, SCL to SDA th1Over recommended operating conditionsmin 10 ns6
Bus free time between stop and start condition t(buf)Over recommended operating conditionsmin 1.3 us6
Setup time, SCL to start condition tSU2Over recommended operating conditionsmin 0.6 us6
Hold time, start condition to SCL th2Over recommended operating conditionsmin 0.6 us6
Setup time, SCL to stop condition tSU3Over recommended operating conditionsmin 0.6 us6
Power dissipation20–pin QFN; TA ≤ 25°C; 2-side, 2-plane PCBmax 5.2 W6
DERATING FACTOR20–pin QFN; 2-side, 2-plane PCBtyp 41.6 mW/°C6
Power dissipation20–pin QFN; TA = 70°C; 2-side, 2-plane PCBmax 3.12 W6
Power dissipation20–pin QFN; TA = 85°C; 2-side, 2-plane PCBmax 2.7 W6

Pins, by the datasheet

18
1 INL+
Left channel positive audio input. · p. 4
2 INL–
Left channel negative audio input. · p. 4
3 AGND
Analog ground; connect all GND pins. · p. 4
4 PVDDL
Left channel power supply; must be the same as AVDD and PVDDR. · p. 4
5 PVDDL
Left channel power supply; must be the same as AVDD and PVDDR. · p. 4
6 OUTL+
Left channel positive differential output. · p. 4
7 OUTL–
Left channel negative differential output. · p. 4
8 PGND
Power ground; connect all GND pins. · p. 4
9 OUTR–
Right channel negative differential output. · p. 4
10 OUTR+
Right channel positive differential output. · p. 4
11 PVDDR
Right channel power supply; must be the same as AVDD and PVDDL. · p. 4
12 PVDDR
Right channel power supply; must be the same as AVDD and PVDDL. · p. 4
13 AVDD
Analog supply; must be the same as PVDDR and PVDDL. · p. 4
14 INR–
Right channel negative audio input. · p. 4
15 INR+
Right channel positive audio input. · p. 4
17 SCL
I2C clock interface. · p. 4
18 SDZ
Shutdown terminal, active low. · p. 4
19 SDA
I2C data interface. · p. 4

Ordering codes, by the datasheet

9
TPA2016D2RTJR
QFN (RTJ) | 20 · 3000 units, LARGE T&R · p. 38
TPA2016D2RTJR.A
QFN (RTJ) | 20 · 3000 units, LARGE T&R · p. 38
TPA2016D2RTJR.B
QFN (RTJ) | 20 · 3000 units, LARGE T&R · p. 38
TPA2016D2RTJRG4
QFN (RTJ) | 20 · 3000 units, LARGE T&R · p. 38
TPA2016D2RTJRG4.A
QFN (RTJ) | 20 · 3000 units, LARGE T&R · p. 38
TPA2016D2RTJRG4.B
QFN (RTJ) | 20 · 3000 units, LARGE T&R · p. 38
TPA2016D2RTJT
QFN (RTJ) | 20 · 250 units, SMALL T&R · p. 38
TPA2016D2RTJT.A
QFN (RTJ) | 20 · 250 units, SMALL T&R · p. 38
TPA2016D2RTJT.B
QFN (RTJ) | 20 · 250 units, SMALL T&R · p. 38

Open-source boards using it

2
  • 4 layers99.1 × 91.4 mmPanel, the printed circuit board in 3D

    Panel

    bfrigon/alarm-clock-v3

    Alarm clock (v3)

    187 parts18CC-BY-SA-4.0
  • 4 layers67.3 × 39.4 mmDaughterboard, the printed circuit board in 3D

    Daughterboard

    bfrigon/alarm-clock-v3

    Alarm clock (v3)

    87 parts18CC-BY-SA-4.0

Questions

Is there a KiCad symbol and footprint for the TPA2016D2RTJ?

Yes. The symbol is dk_Linear-Amplifiers-Audio:TPA2016D2RTJR and the footprint Source_Footprints:WQFN-20-1EP_4x4mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the TPA2016D2RTJ?

VQFN-20-EP(4x4), with 21 pins. Its footprint is drawn on this page.

Where is the TPA2016D2RTJ datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Where can I order the TPA2016D2RTJ?

JLCPCB lists it as part C2878939, with 1,212 in stock; the sellers' links on this page open their listings.

Which open-source boards use the TPA2016D2RTJ?

2 boards in 1 repository on GitHub; the most starred are listed on this page, with their KiCad files.