
TPA2016D2RTJ
Texas InstrumentsExtended
-40℃~+85℃ -80dB 0.1% 1.7W×2@8Ω、2.8W×2@4Ω、1.5W×2@4Ω、750mW×2@8Ω 2 Pairs Differential Inputs 2-Channel 2.5V~5.5V 3.5mA 90% Class D Enable/shutdown function、Filterless architecture、Digitally programmable gain、Built-in audio processing VQFN-20-EP(4x4) Audio Amplifiers ROHS
- Part id
- ti/TPA2016D2RTJ
- Category
- Audio Amplifiers
- Package
- VQFN-20-EP(4x4)
- Pins
- 21
- In stock
- 1,212 at JLCPCB (C2878939)
- Used on
- 2 open-source boards
Overview
The TPA2016D2RTJ is an audio Amplifier made by Texas Instruments in a VQFN-20-EP(4x4) package with 21 pins. -40℃~+85℃ -80dB 0.1% 1.7W×2@8Ω、2.8W×2@4Ω、1.5W×2@4Ω、750mW×2@8Ω 2 Pairs Differential Inputs 2-Channel 2.5V~5.5V 3.5mA 90% Class D Enable/shutdown function、Filterless architecture、Digitally programmable gain、Built-in audio processing VQFN-20-EP(4x4) Audio Amplifiers ROHS.
PCBKit's library has its KiCad symbol (dk_Linear-Amplifiers-Audio:TPA2016D2RTJR, from Digikey) and its footprint (Source_Footprints:WQFN-20-1EP_4x4mm, from Digikey), ready for a KiCad board. 1,212 are in stock at JLCPCB (part C2878939). 2 open-source boards in 1 repository on GitHub use it.
Symbol
Footprint
From the datasheet
13- Supply, least
- 2.5 V · VDD, AVDD/PVDDR/PVDDL recommended operating min · p. 5
- Supply, most
- 5.5 V · VDD, AVDD/PVDDR/PVDDL recommended operating max · p. 5
- Supply, absolute maximum
- 6 V · VDD, AVDD/PVDDR/PVDDL absolute max · p. 5
- Works from
- -40 °C · Operating free-air temperature min · p. 5
- Works up to
- 85 °C · Operating free-air temperature max · p. 5
- Junction, hottest
- 150 °C · Operating junction temperature absolute max · p. 5
- Takes working
- 3.7 mA · Supply current typical, VDD = 3.6 V · p. 6
- Takes asleep
- 200 nA · Shutdown quiescent current typical, SDZ = 0.35 V, VDD = 3.6 V · p. 6
- Takes asleep
- 50 µA · Software shutdown current typical, SDZ = 1.3 V, VDD = 3.6 V · p. 6
- Switches at
- 300 kHz · Class D switching frequency typical · p. 6
- Junction to air (RTJ (QFN))
- 33.3 K/W · Junction-to-ambient thermal resistance · p. 5
- Junction to board (RTJ (QFN))
- 9.6 K/W · Junction-to-board thermal resistance · p. 5
- Junction to case (RTJ (QFN))
- 22.5 K/W · Junction-to-case top thermal resistance · p. 5
What it is and has
10- Architecture
- Filter-Free Class-D · p. 1
- Output power
- 1.7 W/Ch into 8 Ω at 5 V, 10% THD+N · p. 1
- Output power
- 750 mW/Ch into 8 Ω at 3.6 V, 10% THD+N · p. 1
- Output power
- 2.8 W/Ch into 4 Ω at 5 V, 10% THD+N · p. 1
- Output power
- 1.5 W/Ch into 4 Ω at 3.6 V, 10% THD+N · p. 1
- Audio processing
- Programmable DRC and AGC parameters · p. 1
- Volume control
- Digital I2C · p. 1
- Timing controls
- Selectable attack, release, and hold times · p. 1
- Compression ratios
- 4 selectable · p. 1
- Package
- QFN (20), 4.00 mm × 4.00 mm · p. 1
Specifications
53| Parameter | Conditions | As printed | Page |
|---|---|---|---|
| Supply voltage VDD | AVDD, PVDDR, PVDDL | min -0.3 · max 6 V | 5 |
| Input voltage | SDZ, INR+, INR–, INL+, INL–; maximum VDD + 0.3 V | min -0.3 V | 5 |
| Input voltage | SDA, SCL | min -0.3 · max 6 V | 5 |
| Operating free-air temperature TA | min -40 · max 85 °C | 5 | |
| Operating junction temperature TJ | min -40 · max 150 °C | 5 | |
| Minimum load resistance RLOAD | max 3.2 Ω | 5 | |
| Storage temperature Tstg | min -65 · max 150 °C | 5 | |
| Electrostatic discharge V(ESD) | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001; ±2000 V | max 2000 V | 5 |
| Electrostatic discharge V(ESD) | Charged-device model (CDM), per JEDEC specification JESD22-C101; ±500 V | max 500 V | 5 |
| Supply voltage VDD | AVDD, PVDDR, PVDDL | min 2.5 · max 5.5 V | 5 |
| High-level input voltage VIH | SDZ, SDA, SCL | min 1.3 V | 5 |
| Low-level input voltage VIL | SDZ, SDA, SCL | max 0.6 V | 5 |
| Operating free-air temperature TA | min -40 · max 85 °C | 5 | |
| Junction-to-ambient thermal resistance RθJA | RTJ (QFN), 20 PINS | typ 33.3 °C/W | 5 |
| Junction-to-case (top) thermal resistance RθJC(top) | RTJ (QFN), 20 PINS | typ 22.5 °C/W | 5 |
| Junction-to-board thermal resistance RθJB | RTJ (QFN), 20 PINS | typ 9.6 °C/W | 5 |
| Junction-to-top characterization parameter ψJT | RTJ (QFN), 20 PINS | typ 0.2 °C/W | 5 |
| Junction-to-board characterization parameter ψJB | RTJ (QFN), 20 PINS | typ 9.6 °C/W | 5 |
| Junction-to-case (bottom) thermal resistance RθJC(bot) | RTJ (QFN), 20 PINS | typ 2.4 °C/W | 5 |
| Supply voltage range VDD | TA = 25°C, SDZ = 1.3 V, RL = 8 Ω + 33 uH | min 2.5 · typ 3.6 · max 5.5 V | 6 |
| Shutdown quiescent current ISDZ | SDZ = 0.35 V, VDD = 2.5 V | typ 0.1 · max 1 uA | 6 |
| Shutdown quiescent current ISDZ | SDZ = 0.35 V, VDD = 3.6 V | typ 0.2 · max 1 uA | 6 |
| Shutdown quiescent current ISDZ | SDZ = 0.35 V, VDD = 5.5 V | typ 0.3 · max 1 uA | 6 |
| Software shutdown quiescent current ISWS | SDZ = 1.3 V, VDD = 2.5 V | typ 35 · max 50 uA | 6 |
| Software shutdown quiescent current ISWS | SDZ = 1.3 V, VDD = 3.6 V | typ 50 · max 70 uA | 6 |
| Software shutdown quiescent current ISWS | SDZ = 1.3 V, VDD = 5.5 V | typ 75 · max 110 uA | 6 |
| Supply current IDD | VDD = 2.5 V | typ 3.5 · max 4.5 mA | 6 |
| Supply current IDD | VDD = 3.6 V | typ 3.7 · max 4.7 mA | 6 |
| Supply current IDD | VDD = 5.5 V | typ 4.5 · max 5.5 mA | 6 |
| Class D Switching Frequency fSW | TA = 25°C, VDD = 3.6 V, SDZ = 1.3 V, RL = 8 Ω + 33 uH | min 275 · typ 300 · max 325 kHz | 6 |
| High-level input current IIH | VDD = 5.5 V, SDZ = 5.8 V | max 1 uA | 6 |
| Low-level input current IIL | VDD = 5.5 V, SDZ = –0.3 V | min -1 uA | 6 |
| Start-up time tSTART | 2.5 V ≤ VDD ≤ 5.5 V no pop, CIN ≤ 1 uF | typ 5 ms | 6 |
| Power on reset ON threshold POR | TA = 25°C | typ 2 · max 2.3 V | 6 |
| Power on reset hysteresis POR | TA = 25°C | typ 0.2 V | 6 |
| Input common mode rejection CMRR | RL = 8 Ω, Vicm = 0.5 V and Vicm = VDD – 0.8 V, differential inputs shorted | typ -70 dB | 6 |
| Output offset voltage Voo | VDD = 3.6 V, AV = 6 dB, RL = 8 Ω, inputs AC-grounded | min -10 · typ 2 · max 10 mV | 6 |
| Output Impedance in shutdown mode ZOUT | SDZ = 0.35 V | typ 2 kΩ | 6 |
| Gain accuracy | Compression and limiter disabled, Gain = 0 to 30 dB | min -0.5 · max 0.5 dB | 6 |
| Power supply rejection ratio PSRR | VDD = 2.5 V to 4.7 V | typ -80 dB | 6 |
| Frequency, SCL fSCL | No wait states; over recommended operating conditions | max 400 kHz | 6 |
| Pulse duration, SCL high tW(H) | Over recommended operating conditions | min 0.6 us | 6 |
| Pulse duration, SCL low tW(L) | Over recommended operating conditions | min 1.3 us | 6 |
| Setup time, SDA to SCL tSU(1) | Over recommended operating conditions | min 100 ns | 6 |
| Hold time, SCL to SDA th1 | Over recommended operating conditions | min 10 ns | 6 |
| Bus free time between stop and start condition t(buf) | Over recommended operating conditions | min 1.3 us | 6 |
| Setup time, SCL to start condition tSU2 | Over recommended operating conditions | min 0.6 us | 6 |
| Hold time, start condition to SCL th2 | Over recommended operating conditions | min 0.6 us | 6 |
| Setup time, SCL to stop condition tSU3 | Over recommended operating conditions | min 0.6 us | 6 |
| Power dissipation | 20–pin QFN; TA ≤ 25°C; 2-side, 2-plane PCB | max 5.2 W | 6 |
| DERATING FACTOR | 20–pin QFN; 2-side, 2-plane PCB | typ 41.6 mW/°C | 6 |
| Power dissipation | 20–pin QFN; TA = 70°C; 2-side, 2-plane PCB | max 3.12 W | 6 |
| Power dissipation | 20–pin QFN; TA = 85°C; 2-side, 2-plane PCB | max 2.7 W | 6 |
Pins, by the datasheet
18- 1 INL+
- Left channel positive audio input. · p. 4
- 2 INL–
- Left channel negative audio input. · p. 4
- 3 AGND
- Analog ground; connect all GND pins. · p. 4
- 4 PVDDL
- Left channel power supply; must be the same as AVDD and PVDDR. · p. 4
- 5 PVDDL
- Left channel power supply; must be the same as AVDD and PVDDR. · p. 4
- 6 OUTL+
- Left channel positive differential output. · p. 4
- 7 OUTL–
- Left channel negative differential output. · p. 4
- 8 PGND
- Power ground; connect all GND pins. · p. 4
- 9 OUTR–
- Right channel negative differential output. · p. 4
- 10 OUTR+
- Right channel positive differential output. · p. 4
- 11 PVDDR
- Right channel power supply; must be the same as AVDD and PVDDL. · p. 4
- 12 PVDDR
- Right channel power supply; must be the same as AVDD and PVDDL. · p. 4
- 13 AVDD
- Analog supply; must be the same as PVDDR and PVDDL. · p. 4
- 14 INR–
- Right channel negative audio input. · p. 4
- 15 INR+
- Right channel positive audio input. · p. 4
- 17 SCL
- I2C clock interface. · p. 4
- 18 SDZ
- Shutdown terminal, active low. · p. 4
- 19 SDA
- I2C data interface. · p. 4
Ordering codes, by the datasheet
9- TPA2016D2RTJR
- QFN (RTJ) | 20 · 3000 units, LARGE T&R · p. 38
- TPA2016D2RTJR.A
- QFN (RTJ) | 20 · 3000 units, LARGE T&R · p. 38
- TPA2016D2RTJR.B
- QFN (RTJ) | 20 · 3000 units, LARGE T&R · p. 38
- TPA2016D2RTJRG4
- QFN (RTJ) | 20 · 3000 units, LARGE T&R · p. 38
- TPA2016D2RTJRG4.A
- QFN (RTJ) | 20 · 3000 units, LARGE T&R · p. 38
- TPA2016D2RTJRG4.B
- QFN (RTJ) | 20 · 3000 units, LARGE T&R · p. 38
- TPA2016D2RTJT
- QFN (RTJ) | 20 · 250 units, SMALL T&R · p. 38
- TPA2016D2RTJT.A
- QFN (RTJ) | 20 · 250 units, SMALL T&R · p. 38
- TPA2016D2RTJT.B
- QFN (RTJ) | 20 · 250 units, SMALL T&R · p. 38
Open-source boards using it
2- 4 layers99.1 × 91.4 mm

- 4 layers67.3 × 39.4 mm

Questions
Is there a KiCad symbol and footprint for the TPA2016D2RTJ?
Yes. The symbol is dk_Linear-Amplifiers-Audio:TPA2016D2RTJR and the footprint Source_Footprints:WQFN-20-1EP_4x4mm, both drawn on this page. PCBKit places them on a board for you when you design with it.
What package is the TPA2016D2RTJ?
VQFN-20-EP(4x4), with 21 pins. Its footprint is drawn on this page.
Where is the TPA2016D2RTJ datasheet?
Texas Instruments publishes it: the Datasheet link on this page opens it.
Where can I order the TPA2016D2RTJ?
JLCPCB lists it as part C2878939, with 1,212 in stock; the sellers' links on this page open their listings.
Which open-source boards use the TPA2016D2RTJ?
2 boards in 1 repository on GitHub; the most starred are listed on this page, with their KiCad files.