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21

TPA2012D2RTJT

Texas InstrumentsExtended

-40℃~+85℃ -55dB 0.11% 2 Pairs Differential Inputs 2-Channel 2.1Wx2@4Ω 2.5V~5.5V 9mA Class D Enable/shutdown function、Filterless architecture、ESD protection、Digitally programmable gain QFN-20-EP(4x4) Audio Amplifiers ROHS

Part id
ti/TPA2012D2RTJT
Category
Audio Amplifiers
Package
QFN-20-EP(4x4)
Pins
21
In stock
1 at JLCPCB (C116656)
Used on
2 open-source boards

Overview

The TPA2012D2RTJT is an audio Amplifier made by Texas Instruments in a QFN-20-EP(4x4) package with 21 pins. -40℃~+85℃ -55dB 0.11% 2 Pairs Differential Inputs 2-Channel 2.1Wx2@4Ω 2.5V~5.5V 9mA Class D Enable/shutdown function、Filterless architecture、ESD protection、Digitally programmable gain QFN-20-EP(4x4) Audio Amplifiers ROHS.

PCBKit's library has its KiCad symbol (EasyEDA_Cloud:TPA2012D2RTJRG4, from EasyEDA) and its footprint (EasyEDA_Cloud:QFN-20_L4.0-W4.0-P0.5-TL-EP, from EasyEDA), ready for a KiCad board. 1 are in stock at JLCPCB (part C116656). 2 open-source boards in 2 repositories on GitHub use it.

Symbol

21EP20INL+19INL-18AGND17INR-16INR+15G014OUTR+13PVDD12PGND11OUTR-10NC9AVDD8/SDR7/SDL6NC5OUTL-4PGND3PVDD2OUTL+1G1
EasyEDA_Cloud:TPA2012D2RTJRG4From EasyEDA

Footprint

21
EasyEDA_Cloud:QFN-20_L4.0-W4.0-P0.5-TL-EPFrom EasyEDA

From the datasheet

14
Supply, least
2.5 V · AVDD, PVDD, recommended operating min; same voltage required · p. 4
Supply, most
5.5 V · AVDD, PVDD, recommended operating max; same voltage required · p. 4
Supply, absolute maximum
6 V · AVDD, PVDD, active mode absolute max · p. 4
Supply, absolute maximum
7 V · AVDD, PVDD, shutdown mode absolute max · p. 4
Works from
-40 °C · operating free-air temperature min · p. 4
Works up to
85 °C · operating free-air temperature max · p. 4
Junction, hottest
150 °C · operating junction temperature absolute max · p. 4
Takes working
6 mA · typical supply current at VDD = 5.5 V, no load or output filter · p. 5
Takes asleep
1.5 µA · max supply current in shutdown mode · p. 5
Switches at
300 kHz · typical switching frequency at VDD = 2.5 V to 5.5 V · p. 5
Junction to air (RTJ (WQFN))
34.6 K/W · junction-to-ambient thermal resistance · p. 4
Junction to case (RTJ (WQFN))
34.3 K/W · junction-to-case top thermal resistance · p. 4
Junction to board (RTJ (WQFN))
11.5 K/W · junction-to-board thermal resistance · p. 4
Junction to air (WQFN)
24 K/W · Junction to ambient, calculated from package derating factor · p. 23

What it is and has

12
Amplifier
Stereo filter-free Class-D audio power amplifier · p. 1
Output power
WQFN: 2.1 W/channel into 4 Ω at 5 V · p. 1
Output power
WQFN: 1.4 W/channel into 8 Ω at 5 V · p. 1
External components
Only two required · p. 1
Shutdown
Independent control for each channel · p. 1
Gain
Selectable 6, 12, 18, and 24 dB · p. 1
Shutdown pin bias
Internal pulldown resistor · p. 1
Protection
Short-circuit and thermal protection · p. 1
Package
WQFN, 20 pins, 4.00 mm × 4.00 mm · p. 1
Amplifier
Stereo, filter-free Class-D audio power amplifier · p. 1
Output power
WQFN: 720 mW/channel into 8 Ω at 3.6 V · p. 1
Protection
Thermal shutdown above 150°C junction temperature · p. 23

Around it

4
cap 1 µF
between PVDD and GND; Low-ESR ceramic supply decoupling capacitor; place as close as possible to PVDD. · p. 17
cap 4.7 µF or greater
between PVDD and GND; Optional lower-frequency supply filtering; place near the amplifier. · p. 17
cap 0.1-µF
between PVDD/AVDD and GND; Low-ESR ceramic supply decoupling; place within 2 mm of PVDD/AVDD pins. · p. 19
cap 2.2-µF to 10-µF
between PVDD/AVDD and GND; Additional supply charge reservoir on the PVDD/AVDD supply trace. · p. 19

Specifications

56
ParameterConditionsAs printedPage
Supply voltage, VSS (AVDD, PVDD) VSSActive modemin -0.3 · max 6 V4
Supply voltage, VSS (AVDD, PVDD) VSSShutdown modemin -0.3 · max 7 V4
Input voltage, VI VIMaximum is VDD + 0.3 Vmin -0.3 V4
Operating junction temperature, TJ TJmin -40 · max 150 °C4
Storage temperature, Tstg Tstgmin -65 · max 150 °C4
Electrostatic discharge V(ESD)Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001; ±2000 Vmax 2000 V4
Electrostatic discharge V(ESD)Charged-device model (CDM), per JEDEC specification JESD22-C101; ±1500 Vmax 1500 V4
Supply voltage, AVDD, PVDD VSSmin 2.5 · max 5.5 V4
High-level input voltage, SDL, SDR, G0, G1 VIHmin 1.3 V4
Low-level input voltage, SDL, SDR, G0, G1 VILmax 0.35 V4
Operating free-air temperature TAmin -40 · max 85 °C4
Junction-to-ambient thermal resistance RθJARTJ (WQFN), 20 pinstyp 34.6 °C/W4
Junction-to-case (top) thermal resistance RθJC(top)RTJ (WQFN), 20 pinstyp 34.3 °C/W4
Junction-to-board thermal resistance RθJBRTJ (WQFN), 20 pinstyp 11.5 °C/W4
Junction-to-top characterization parameter ψJTRTJ (WQFN), 20 pinstyp 0.4 °C/W4
Junction-to-board characterization parameter ψJBRTJ (WQFN), 20 pinstyp 11.6 °C/W4
Junction-to-case (bottom) thermal resistance RθJC(bot)RTJ (WQFN), 20 pinstyp 3.2 °C/W4
Output offset voltage (measured differentially) |VOO|TA = 25°C; Inputs ac grounded, AV = 6 dB, VDD = 2.5 to 5.5 Vtyp 5 · max 25 mV5
Power supply rejection ratio PSRRTA = 25°C; VDD = 2.5 to 5.5 Vtyp -75 · max -55 dB5
Common-mode input voltage VicmTA = 25°C; maximum is VDD – 0.8 Vmin 0.5 V5
Common-mode rejection ration CMRRTA = 25°C; Inputs shorted together, VDD = 2.5 to 5.5 Vtyp -69 · max -50 dB5
High-level input current |IIH|TA = 25°C; VDD = 5.5 V, VI = VDDmax 50 uA5
Low-level input current |IIL|TA = 25°C; VDD = 5.5 V, VI = 0 Vmax 5 uA5
Supply current IDDTA = 25°C; VDD = 5.5 V, no load or output filtertyp 6 · max 9 mA5
Supply current IDDTA = 25°C; VDD = 3.6 V, no load or output filtertyp 5 · max 7.5 mA5
Supply current IDDTA = 25°C; VDD = 2.5 V, no load or output filtertyp 4 · max 6 mA5
Supply current IDDTA = 25°C; Shutdown modemax 1.5 uA5
Static drain-source on-state resistance rDS(on)TA = 25°C; VDD = 5.5 Vtyp 500 mΩ5
Static drain-source on-state resistance rDS(on)TA = 25°C; VDD = 3.6 Vtyp 570 mΩ5
Static drain-source on-state resistance rDS(on)TA = 25°C; VDD = 2.5 Vtyp 700 mΩ5
Output impedance in shutdown modeTA = 25°C; V(SDR, SDL)= 0.35 Vtyp 2 kΩ5
Switching frequency f(sw)TA = 25°C; VDD = 2.5 V to 5.5 Vmin 250 · typ 300 · max 350 kHz5
Closed-loop voltage gainTA = 25°C; G0, G1 = 0.35 Vmin 5.5 · typ 6 · max 6.5 dB5
Closed-loop voltage gainTA = 25°C; G0 = VDD, G1 = 0.35 Vmin 11.5 · typ 12 · max 12.5 dB5
Closed-loop voltage gainTA = 25°C; G0 = 0.35 V, G1 = VDDmin 17.5 · typ 18 · max 18.5 dB5
Closed-loop voltage gainTA = 25°C; G0, G1 = VDDmin 23.5 · typ 24 · max 24.5 dB5
Output power (per channel) POTA = 25°C; RL = 8 Ω; VDD = 5 V, f = 1 kHz, THD = 10%typ 1.4 W5
Output power (per channel) POTA = 25°C; RL = 8 Ω; VDD = 3.6 V, f = 1 kHz, THD = 10%typ 0.72 W5
Output power (per channel) POTA = 25°C; RL = 4 Ω; VDD = 5 V, f = 1 kHz, THD = 10%typ 2.1 W5
Total harmonic distortion plus noise THD+NTA = 25°C; RL = 8 Ω; PO = 1 W, VDD = 5 V, AV = 6 dB, f = 1 kHztyp 0.14 %5
Total harmonic distortion plus noise THD+NTA = 25°C; RL = 8 Ω; PO = 0.5 W, VDD = 5 V, AV = 6 dB, f = 1 kHztyp 0.11 %5
Channel crosstalkTA = 25°C; RL = 8 Ω; f = 1 kHztyp -85 dB5
Supply ripple rejection ratio kSVRTA = 25°C; RL = 8 Ω; VDD = 5 V, AV = 6 dB, f = 217 Hztyp -77 dB5
Supply ripple rejection ratio kSVRTA = 25°C; RL = 8 Ω; VDD = 3.6 V, AV = 6 dB, f = 217 Hztyp -73 dB5
Common mode rejection ratio CMRRTA = 25°C; RL = 8 Ω; VDD = 3.6 V, VIC = 1 Vpp, f = 217 Hztyp -69 dB5
Input impedanceTA = 25°C; RL = 8 Ω; Av = 6 dBtyp 28.1 kΩ5
Input impedanceTA = 25°C; RL = 8 Ω; Av = 12 dBtyp 17.3 kΩ5
Input impedanceTA = 25°C; RL = 8 Ω; Av = 18 dBtyp 9.8 kΩ5
Input impedanceTA = 25°C; RL = 8 Ω; Av = 24 dBtyp 5.2 kΩ5
Start-up time from shutdownTA = 25°C; RL = 8 Ω; VDD = 3.6 Vtyp 3.5 ms5
Output voltage noise VnTA = 25°C; RL = 8 Ω; VDD = 3.6 V, f = 20 to 20 kHz, inputs are ac grounded, AV = 6 dB; No weightingtyp 35 uV5
Output voltage noise VnTA = 25°C; RL = 8 Ω; VDD = 3.6 V, f = 20 to 20 kHz, inputs are ac grounded, AV = 6 dB; A weightingtyp 27 uV5
POWER RATINGRTJ; TA = 25°Cmax 5.2 W5
DERATING FACTORRTJtyp 41.6 mW/°C5
POWER RATINGRTJ; TA = 75°Cmax 3.12 W5
POWER RATINGRTJ; TA = 85°Cmax 2.7 W5

Pins, by the datasheet

21
1 G1
Gain select (MSB). · p. 3
2 OUTL+
Left channel positive differential output. · p. 3
3 PVDD
Power supply; must be the same voltage as AVDD. · p. 3
4 PGND
Power ground. · p. 3
5 OUTL–
Left channel negative differential output. · p. 3
6 NC
No internal connection. · p. 3
7 SDL
Left channel shutdown terminal, active low. · p. 3
8 SDR
Right channel shutdown terminal, active low. · p. 3
9 AVDD
Analog supply; must be the same voltage as PVDD. · p. 3
10 NC
No internal connection. · p. 3
11 OUTR–
Right channel negative differential output. · p. 3
12 PGND
Power ground. · p. 3
13 PVDD
Power supply; must be the same voltage as AVDD. · p. 3
14 OUTR+
Right channel positive differential output. · p. 3
15 G0
Gain select (LSB). · p. 3
16 INR+
Right channel positive input. · p. 3
17 INR–
Right channel negative input. · p. 3
18 AGND
Analog ground. · p. 3
19 INL–
Left channel negative input. · p. 3
20 INL+
Left channel positive input. · p. 3
Thermal Pad Thermal Pad
Connect the thermal pad of the WQFN package to PCB GND. · p. 3

Ordering codes, by the datasheet

11
TPA2012D2RTJR
QFN (RTJ) | 20 · 3000, LARGE T&R; Level-1-260C-UNLIM; -40 to 85°C · p. 25
TPA2012D2RTJR.B
QFN (RTJ) | 20 · 3000, LARGE T&R; Level-1-260C-UNLIM; -40 to 85°C · p. 25
TPA2012D2RTJRG4
QFN (RTJ) | 20 · 3000, LARGE T&R; Level-2-260C-1 YEAR; -40 to 85°C · p. 25
TPA2012D2RTJRG4.B
QFN (RTJ) | 20 · 3000, LARGE T&R; Level-2-260C-1 YEAR; -40 to 85°C · p. 25
TPA2012D2RTJT
QFN (RTJ) | 20 · 250, SMALL T&R; Level-2-260C-1 YEAR; -40 to 85°C · p. 25
TPA2012D2RTJT.B
QFN (RTJ) | 20 · 250, SMALL T&R; Level-2-260C-1 YEAR; -40 to 85°C · p. 25
TPA2012D2RTJTG4
QFN (RTJ) | 20 · 250, SMALL T&R; Level-2-260C-1 YEAR; -40 to 85°C · p. 25
TPA2012D2YZHR
DSBGA (YZH) | 16 · 3000, LARGE T&R; SNAGCU ball material; Level-1-260C-UNLIM; -40 to 85°C · p. 25
TPA2012D2YZHR.B
DSBGA (YZH) | 16 · 3000, LARGE T&R; SNAGCU ball material; Level-1-260C-UNLIM; -40 to 85°C · p. 25
TPA2012D2YZHT
DSBGA (YZH) | 16 · 250, SMALL T&R; SNAGCU ball material; Level-1-260C-UNLIM; -40 to 85°C · p. 25
TPA2012D2YZHT.B
DSBGA (YZH) | 16 · 250, SMALL T&R; SNAGCU ball material; Level-1-260C-UNLIM; -40 to 85°C · p. 25

Open-source boards using it

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Parts like it

1

Questions

Is there a KiCad symbol and footprint for the TPA2012D2RTJT?

Yes. The symbol is EasyEDA_Cloud:TPA2012D2RTJRG4 and the footprint EasyEDA_Cloud:QFN-20_L4.0-W4.0-P0.5-TL-EP, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the TPA2012D2RTJT?

QFN-20-EP(4x4), with 21 pins. Its footprint is drawn on this page.

Where is the TPA2012D2RTJT datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Where can I order the TPA2012D2RTJT?

JLCPCB lists it as part C116656, with 1 in stock; the sellers' links on this page open their listings.

What can replace the TPA2012D2RTJT?

Parts like it in the library: the TPA6130A2RTJR by Texas Instruments. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the TPA2012D2RTJT?

2 boards in 2 repositories on GitHub; the most starred are listed on this page, with their KiCad files.