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TMUX1574RSVR

Texas InstrumentsExtended

-40℃~+125℃ 1.5V~5.5V 2:1 2GHz 2Ω 35us 4 50ps 7.5pF 95ns UQFN-16(1.8x2.6) Analog Switches, Multiplexers ROHS

DatasheetJLCPCBLCSC
Part id
ti/TMUX1574RSVR
Category
Analog Switches, Multiplexers
Package
UQFN-16(1.8x2.6)
Pins
16
In stock
0 at JLCPCB (C2673120)
Used on
9 open-source boards

Overview

The TMUX1574RSVR is an analog Switches, Multiplexer made by Texas Instruments in a UQFN-16(1.8x2.6) package with 16 pins. -40℃~+125℃ 1.5V~5.5V 2:1 2GHz 2Ω 35us 4 50ps 7.5pF 95ns UQFN-16(1.8x2.6) Analog Switches, Multiplexers ROHS.

PCBKit's library has its KiCad symbol (Analog_Switch:TMUX1574RSV, from KiCad's library) and its footprint (Package_DFN_QFN:UQFN-16_1.8x2.6mm_P0.4mm, from KiCad's library), ready for a KiCad board. JLCPCB lists it (part C2673120). 9 open-source boards in 8 repositories on GitHub use it.

Symbol

S1B1D12S2A3S2B4D25GND6D37S3B8S3A9D410S4B11S4A12EN13VDD14SEL15S1A16
Analog_Switch:TMUX1574RSVFrom KiCad's library

Footprint

Package_DFN_QFN:UQFN-16_1.8x2.6mm_P0.4mmFrom KiCad's library

From the datasheet

13
Supply, least
1.5 V · VDD, recommended operating min · p. 5
Supply, most
5.5 V · VDD, recommended operating max · p. 5
Supply, absolute maximum
6 V · VDD, absolute max · p. 5
Works from
-40 °C · Ambient temperature min · p. 5
Works up to
125 °C · Ambient temperature max · p. 5
Junction, hottest
150 °C · Junction temperature absolute max · p. 5
Takes working
40 µA · VDD, active supply current typical · p. 6
Takes at most
68 µA · VDD, active supply current max · p. 6
Takes asleep
7.5 µA · VDD, supply current when disabled typical · p. 6
A pin gives at most
25 mA · Source or drain pin continuous current absolute max · p. 5
Junction to air (RSV (UQFN))
129.2 K/W · Junction-to-ambient thermal resistance · p. 5
Junction to case (RSV (UQFN))
69.7 K/W · Junction-to-case top thermal resistance · p. 5
Junction to board (RSV (UQFN))
58.7 K/W · Junction-to-board thermal resistance · p. 5

What it is and has

9
Switch configuration
2:1 (SPDT), 4 channels · p. 1
On-capacitance
7.5pF · p. 1
On-resistance
2Ω · p. 1
Bandwidth
2GHz · p. 1
Logic compatibility
1.8 V · p. 23
Signal paths
Bidirectional · p. 1
Protection
Powered-off protection up to 3.6 V · p. 23
Logic protection
Fail-Safe Logic, control inputs up to 5.5 V · p. 23
Internal pull-down resistors
6 MΩ to GND on logic pins · p. 23

Around it

1
cap 0.1 µF to 10 µF
between VDD and GND; Supply decoupling capacitor for reliable operation. · p. 4

Specifications

35
ParameterConditionsAs printedPage
Supply voltage VDDOver operating free-air temperature rangemin -0.5 · max 6 V5
Logic control input pin voltage (SEL or EN) VSEL or VENOver operating free-air temperature rangemin -0.5 · max 6 V5
Logic control input pin current (SEL or EN) ISEL or IENOver operating free-air temperature rangemin -30 · max 30 mA5
Source or drain pin voltage VS or VDOver operating free-air temperature rangemin -0.5 · max 6 V5
Source and drain pin continuous current: (SxA, SxB, Dx) IS or ID (CONT)Over operating free-air temperature rangemin -25 · max 25 mA5
Storage temperature Tstgmin -65 · max 150 °C5
Junction temperature TJmax 150 °C5
Electrostatic discharge V(ESD)Human body model (HBM), per ANSI/ESDA/JEDEC JS-001; ±2000 Vmax 2000 V5
Electrostatic discharge V(ESD)Charged-device model (CDM), per JEDEC specification JESD22-C101; ±750 Vmax 750 V5
Supply voltage VDDmin 1.5 · max 5.5 V5
Signal path input/output voltage (source or drain pin) VS or VDVDD ≥ 1.5 V; maximum VDD x 2, with a maximum input/output voltage of 5.5 Vmin 0 V5
Signal path input/output voltage (source or drain pin) VS_off or VD_offVDD < 1.5 Vmin 0 · max 3.6 V5
Logic control input voltage (EN, SEL) VSEL or VENmin 0 · max 5.5 V5
Ambient temperature TAmin -40 · max 125 ºC5
Junction-to-ambient thermal resistance RθJARSV (UQFN), 16 PINStyp 129.2 °C/W5
Junction-to-case (top) thermal resistance RθJC(top)RSV (UQFN), 16 PINStyp 69.7 °C/W5
Junction-to-board thermal resistance RθJBRSV (UQFN), 16 PINStyp 58.7 °C/W5
Junction-to-top characterization parameter ΨJTRSV (UQFN), 16 PINStyp 3.6 °C/W5
Junction-to-board characterization parameter ΨJBRSV (UQFN), 16 PINStyp 56.8 °C/W5
Power supply voltage VDDGND = 0V, TA = –40°C to +125°Cmin 1.5 · max 5.5 V6
Active supply current IDDVSEL = 0 V, 1.4V or VDD; VS = 0 V to 5.5 V; VDD = 1.5 V to 5.5 V; TA = –40°C to +125°C; typical at VDD = 3.3 V, TA = 25°Ctyp 40 · max 68 uA6
Supply current when disabled IDD_STANDBYVEN = 1.4V or VDD; VS = 0 V to 5.5 V; VDD = 1.5 V to 5.5 V; TA = –40°C to +125°C; typical at VDD = 3.3 V, TA = 25°Ctyp 7.5 · max 15 uA6
On-resistance RONVS = 0 V to VDD*2; VS(max) = 5.5 V; ISD = 8 mA; VDD = 1.5 V to 5.5 V; TA = –40°C to +125°C; typical at VDD = 3.3 V, TA = 25°Ctyp 2 · max 4.5 Ω6
On-resistance match between channels ΔRONVS = VDD; ISD = 8 mA; VDD = 1.5 V to 5.5 V; TA = –40°C to +125°C; typical at VDD = 3.3 V, TA = 25°Ctyp 0.07 · max 0.28 Ω6
On-resistance flatness RON (FLAT)VS = 0 V to VDD; ISD = 8 mA; VDD = 1.5 V to 5.5 V; TA = –40°C to +125°C; typical at VDD = 3.3 V, TA = 25°Ctyp 1 · max 1.8 Ω6
Powered-off I/O pin leakage current IPOFFVDD = 0 V; VS = 0 V to 3 V; VD = 0 V; TA = 25℃min -10 · typ 0.01 · max 10 nA6
Powered-off I/O pin leakage current IPOFFVDD = 0 V; VS = 0 V to 3.6 V; VD = 0 V; TA = –40°C to +125°C; typical at TA = 25°Cmin -2 · typ 0.01 · max 2 uA6
OFF leakage current IS(OFF), ID(OFF)Switch Off; VD = 0.8*VDD / 0.2*VDD; VS = 0.2*VDD / 0.8*VDD; VDD = 1.5 V to 5.5 V; TA = –40°C to +125°C; typical at VDD = 3.3 V, TA = 25°Cmin -100 · typ 0.03 · max 100 nA6
ON leakage current ID(ON), IS(ON)Switch On; VD = 0.8*VDD / 0.2*VDD, S pins floating, or VS = 0.8*VDD / 0.2*VDD, D pins floating; VDD = 1.5 V to 5.5 V; TA = –40°C to +125°C; typical at VDD = 3.3 V, TA = 25°Cmin -50 · typ 0.01 · max 50 nA6
Input logic high VIHVDD = 1.5 V to 5.5 V; TA = –40°C to +125°Cmin 1.2 · max 5.5 V6
Input logic low VILVDD = 1.5 V to 5.5 V; TA = –40°C to +125°Cmin 0 · max 0.45 V6
Input high leakage current IIHVSEL = 1.8 V, VDD; maximum specified as ±2 uA; VDD = 1.5 V to 5.5 V; TA = –40°C to +125°C; typical at VDD = 3.3 V, TA = 25°Ctyp 1 · max 2 uA6
Input low leakage current IILVSEL = 0 V; maximum specified as ±2 uA; VDD = 1.5 V to 5.5 V; TA = –40°C to +125°C; typical at VDD = 3.3 V, TA = 25°Ctyp 0.2 · max 2 uA6
Internal pull-down resistor on logic pins RPDTypical at VDD = 3.3 V, TA = 25°Ctyp 6 MΩ6
Logic input capacitance CIVSEL = 0 V, 1.8 V or VDD; f = 1 MHz; typical at VDD = 3.3 V, TA = 25°Ctyp 3 pF6

Pins, by the datasheet

16
1 S1B
Source pin 1B. Can be an input or output. · p. 4
2 D1
Drain pin 1. Can be an input or output. · p. 4
3 S2A
Source pin 2A. Can be an input or output. · p. 4
4 S2B
Source pin 2B. Can be an input or output. · p. 4
5 D2
Drain pin 2. Can be an input or output. · p. 4
6 GND
Ground (0 V) reference. · p. 4
7 D3
Drain pin 3. Can be an input or output. · p. 4
8 S3B
Source pin 3B. Can be an input or output. · p. 4
9 S3A
Source pin 3A. Can be an input or output. · p. 4
10 D4
Drain pin 4. Can be an input or output. · p. 4
11 S4B
Source pin 4B. Can be an input or output. · p. 4
12 S4A
Source pin 4A. Can be an input or output. · p. 4
13 EN
Active-low enable; high turns all switches off, low allows SEL to select the signal path. Internal 6 MΩ pull-down to GND. · p. 4
14 VDD
Positive power supply; connect a 0.1 uF to 10 uF decoupling capacitor between VDD and GND. · p. 4
15 SEL
Select pin controls switch states. Internal 6 MΩ pull-down to GND. · p. 4
16 S1A
Source pin 1A. Can be an input or output. · p. 4

Open-source boards using it

9See all 9
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    Panel

    nrdsp/rvPhone

    The goal of the this project is to develop a privacy enhanced, simple and fully featured mobile phone.

    319 parts
  • 4 layers130.1 × 183.6 mmMsfOwlClock, the printed circuit board in 3D

    MsfOwlClock

    pete-restall/MsfOwlClock

    MSF Owl Clock

    449 partsMIT
  • 6 layers143.4 × 126.2 mmEsl gsu, the printed circuit board in 3D

    Esl gsu

    tiancilliers/esl-gsu

    Satellite interfacing kit in development by the ESL (Electronic Systems Lab)

    741 parts
  • 6 layers120 × 57 mmNitride nano, the printed circuit board in 3D

    Nitride nano

    NovaPrime18/nitride-nano

    USB-C PD3.1 240W compatible 60V buck/boost converter nano powersupply

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  • 2 layers297.3 × 119.5 mmNRF54LM20 TMR2615, the printed circuit board in 3D

    NRF54LM20 TMR2615

    girishji/tmr-keyboard

    Custom keyboard based on TMR sensor

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  • 4 layers126 × 68 mmRvPhone, the printed circuit board in 3D

    RvPhone

    nrdsp/rvPhone

    The goal of the this project is to develop a privacy enhanced, simple and fully featured mobile phone.

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Parts like it

8

Questions

Is there a KiCad symbol and footprint for the TMUX1574RSVR?

Yes. The symbol is Analog_Switch:TMUX1574RSV and the footprint Package_DFN_QFN:UQFN-16_1.8x2.6mm_P0.4mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the TMUX1574RSVR?

UQFN-16(1.8x2.6), with 16 pins. Its footprint is drawn on this page.

Where is the TMUX1574RSVR datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Where can I order the TMUX1574RSVR?

JLCPCB lists it as part C2673120, with 0 in stock; the sellers' links on this page open their listings.

What can replace the TMUX1574RSVR?

Parts like it in the library: the TMUX1112RSVR by Texas Instruments, the HD3SS3202RSVR by Texas Instruments, the TMUX1209RSVR by Texas Instruments and the DG2788ADN-T1-GE4 by Vishay Intertechnology. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the TMUX1574RSVR?

9 boards in 8 repositories on GitHub; the most starred are listed on this page, with their KiCad files.