TLV75533PDQN
Texas Instruments
-40℃~+125℃@(Tj) 1 238mV@(500mA) 25uA 3.3V 46dB@(100kHz) 5.5V 500mA 71.5uVrms Fixed Over Current Protection、Soft Start、Enable、Thermal Shutdown Positive X2-SON-4-EP(1x1) Voltage Regulators - Linear, Low Drop Out (LDO) Regulators ROHS
Extended
- Category
- Voltage Regulators Linear, Low Drop Out (LDO) Regulators
- Package
- X2-SON-4-EP(1x1)
- Pins
- 5
Overview
The TLV75533PDQN is a voltage Regulators Linear, Low Drop Out (LDO) Regulator made by Texas Instruments in a X2-SON-4-EP(1x1) package with 5 pins. -40℃~+125℃@(Tj) 1 238mV@(500mA) 25uA 3.3V 46dB@(100kHz) 5.5V 500mA 71.5uVrms Fixed Over Current Protection、Soft Start、Enable、Thermal Shutdown Positive X2-SON-4-EP(1x1) Voltage Regulators - Linear, Low Drop Out (LDO) Regulators ROHS.
PCBKit's library has its KiCad symbol (Celestial_Power_Linear_VReg:TI TLV75533PDQN, from Altium's library) and its footprint (EasyEDA_Cloud:X2SON-4_L1.0-W1.0-P0.65-TL-EP, from EasyEDA), ready for a KiCad board. 1,315 are in stock at JLCPCB (part C2861882).
Symbol
Footprint
From the datasheet
12- Supply, least
- 1.45 V · VIN, recommended operating min · p. 4
- Supply, most
- 5.5 V · VIN, recommended operating max · p. 4
- Supply, absolute maximum
- 6 V · VIN, absolute max · p. 4
- Junction, hottest
- 150 °C · Junction temperature, absolute max · p. 4
- Takes working
- 25 µA · Ground current, typical at TJ = 25°C, IOUT = 0mA · p. 5
- Takes asleep
- 100 nA · Shutdown current, typical at VEN ≤ 0.4V · p. 5
- Gives
- 500 mA · Output current, recommended max · p. 4
- Current limit
- 720 mA · Output current limit, typical at VOUT = 0.9 x VOUT · p. 5
- Dropout
- 150 mV · Typical at 500mA, 3.3V output, −40°C to +85°C · p. 6
- Junction to air (DQN)
- 168.4 K/W · JEDEC junction-to-ambient · p. 5
- Junction to case (DQN)
- 139.1 K/W · JEDEC junction-to-case top · p. 5
- Junction to board (DQN)
- 101.4 K/W · JEDEC junction-to-board · p. 5
What it is and has
4- Soft-start
- Built-in, monotonic VOUT rise · p. 1
- Current protection
- Foldback current limit · p. 1
- Output discharge
- Active · p. 1
- Package
- 1mm × 1mm X2SON-4 (DQN) · p. 1
Around it
2- cap 1µF or larger
- between IN and GND; Required input capacitor; effective capacitance at the pin must exceed 0.47uF. · p. 3
- cap 1µF or larger
- between OUT and GND; Required output capacitor; effective capacitance at the pin must exceed 0.47uF. · p. 3
Specifications
45| Parameter | Conditions | As printed | Page |
|---|---|---|---|
| Supply voltage VIN | Over operating free-air temperature range | min -0.3 · max 6 V | 4 |
| Enable voltage VEN | Over operating free-air temperature range | min -0.3 · max 6 V | 4 |
| Output voltage VOUT | Maximum is VIN + 0.3 V or 6.0 V, whichever is smaller | min -0.3 V | 4 |
| Operating junction temperature TJ | min -40 · max 150 °C | 4 | |
| Storage temperature Tstg | min -65 · max 150 °C | 4 | |
| Electrostatic discharge V(ESD) | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001; ±1000 V | max 1000 V | 4 |
| Electrostatic discharge V(ESD) | Charged-device model (CDM), per JEDEC specification JESD22-C101; ±500 V | max 500 V | 4 |
| Input voltage VIN | min 1.45 · max 5.5 V | 4 | |
| Output voltage VOUT | min 0.6 · max 5 V | 4 | |
| Enable voltage VEN | min 0 · max 5.5 V | 4 | |
| Output current IOUT | min 0 · max 500 mA | 4 | |
| Input capacitor CIN | min 1 uF | 4 | |
| Output capacitor COUT | min 1 · max 200 uF | 4 | |
| Enable toggle frequency fEN | max 10 kHz | 4 | |
| Junction temperature TJ | min -40 · max 125 °C | 4 | |
| Junction-to-ambient thermal resistance RθJA | DQN (X2SON), 4 pins; JEDEC | typ 168.4 °C/W | 5 |
| Junction-to-case (top) thermal resistance RθJC(top) | DQN (X2SON), 4 pins; JEDEC | typ 139.1 °C/W | 5 |
| Junction-to-board thermal resistance RθJB | DQN (X2SON), 4 pins; JEDEC | typ 101.4 °C/W | 5 |
| Junction-to-top characterization parameter ψJT | DQN (X2SON), 4 pins; JEDEC | typ 5.6 °C/W | 5 |
| Junction-to-board characterization parameter ψJB | DQN (X2SON), 4 pins; JEDEC | typ 101.7 °C/W | 5 |
| Junction-to-case (bottom) thermal resistance RθJC(bot) | DQN (X2SON), 4 pins; JEDEC | typ 88.4 °C/W | 5 |
| Output accuracy | −40°C ≤ TJ ≤ +85°C; VOUT ≥ 1.0V, DQN package | min -1.2 · max 1.2 % | 5 |
| Output accuracy | VOUT ≥ 1V; TJ = −40°C to 125°C | min -1.5 · max 1.5 % | 5 |
| Line regulation (ΔVOUT)ΔVIN | VOUT + 0.5V ≤ VIN ≤ 5.5V, VOUT > 1.5V | typ 2 mV | 5 |
| Load regulation ΔVOUT/ΔIOUT | DQN package; 0.1mA ≤ IOUT ≤ 500mA | typ 0.036 V/A | 5 |
| Ground current IGND | TJ = 25°C, IOUT = 0mA | min 14 · typ 25 · max 31 uA | 5 |
| Ground current IGND | −40°C ≤ TJ ≤ +85°C, IOUT = 0mA | max 33 uA | 5 |
| Ground current IGND | −40°C ≤ TJ ≤ +125°C, IOUT = 0mA | max 40 uA | 5 |
| Shutdown current ISHDN | VEN ≤ 0.4V, 1.4V ≤ VIN ≤ 5.5V, −40°C ≤ TJ ≤ +125°C | typ 0.1 · max 1 uA | 5 |
| Output current limit ICL | VIN = VOUT + VDO(MAX) + 0.25V; VOUT = 0.9 x VOUT, 1.5V < VOUT ≤ 4.5V | min 560 · typ 720 · max 865 mA | 5 |
| Short-circuit current limit ISC | VOUT = 0V | typ 355 mA | 5 |
| Dropout voltage VDO | DQN; IOUT = 500mA, −40°C ≤ TJ ≤ +85°C; 3.3V ≤ VOUT < 5.0V | typ 150 · max 215 mV | 6 |
| Dropout voltage VDO | DQN; IOUT = 500mA, −40°C ≤ TJ ≤ +125°C; 3.3V ≤ VOUT < 5.0V | max 238 mV | 6 |
| Power-supply rejection ratio PSRR | f = 1kHz, VIN = VOUT + 1V, IOUT = 50mA | typ 52 dB | 6 |
| Power-supply rejection ratio PSRR | f = 100kHz, VIN = VOUT + 1V, IOUT = 50mA | typ 46 dB | 6 |
| Power-supply rejection ratio PSRR | f = 1MHz, VIN = VOUT + 1 V, IOUT = 50mA | typ 52 dB | 6 |
| Undervoltage lockout VUVLO | VIN rising | min 1.21 · typ 1.3 · max 1.44 V | 6 |
| Undervoltage lockout hysteresis VUVLO,HYST | VIN falling | typ 40 mV | 6 |
| Startup time tSTR | typ 550 us | 6 | |
| EN pin high voltage (enabled) VHI | min 1 V | 6 | |
| EN pin low voltage (enabled) VLO | max 0.3 V | 6 | |
| Enable pin current IEN | EN = 5.5V | typ 10 nA | 6 |
| Thermal shutdown TSD | Shutdown, temperature increasing | typ 165 °C | 6 |
| Thermal shutdown TSD | Reset, temperature decreasing | typ 155 °C | 6 |
| Pulldown resistance RPULLDOWN | VIN = 5.5V | typ 120 Ω | 6 |
Pins, by the datasheet
5- 1 OUT
- Regulated output voltage; requires a capacitor of 1uF or larger to ground. · p. 3
- 2 GND
- Ground pin. · p. 3
- 3 EN
- Drive above VHI to enable the regulator or below VLO to enter shutdown. · p. 3
- 4 IN
- Input supply; requires a capacitor of 1uF or larger to ground. · p. 3
- Pad Thermal pad
- Internally connected to GND; connect to a large-area ground plane. · p. 3
Parameters
18- Current Limit
- 720mA
- Features
- Built-in soft-start
- Junction Temperature(Max)
- 150℃
- Noise
- 71.5uVrms
- Number of Outputs
- 1
- Operating Temperature
- -40℃~+125℃@(Tj)
- Output Configuration
- Positive
- Output Current
- 500mA
- Output Type
- Fixed
- Output Voltage
- 3.3V
- Power Supply Rejection Ratio (PSRR)
- 46dB@(100kHz)
- Thermal Resistance(Junction to Ambient)
- 168.4℃/W
- Thermal Resistance(Junction to Board)
- 101.4℃/W
- Thermal Resistance(Junction to Case)
- 139.1℃/W
- Voltage - Supply
- 1.45V~5.5V
- Voltage - Supply(Absolute Max)
- 6V
- Voltage Dropout
- 150mV
- standby current
- 25uA
Order codes
2- TLV75533PDQNRLCSC C2861882
- TLV75533PDQNTLCSC C2873244
Pinout
5| Pin | Name | Type |
|---|---|---|
| 1 | OUT | Passive |
| 2 | GND | Passive |
| 3 | EN | Passive |
| 4 | IN | Passive |
| 5 | PAD | Passive |
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Is there a KiCad symbol and footprint for the TLV75533PDQN?
Yes. The symbol is Celestial_Power_Linear_VReg:TI TLV75533PDQN and the footprint EasyEDA_Cloud:X2SON-4_L1.0-W1.0-P0.65-TL-EP, both drawn on this page. PCBKit places them on a board for you when you design with it.
What package is the TLV75533PDQN?
X2-SON-4-EP(1x1), with 5 pins. Its footprint is drawn on this page.
Where is the TLV75533PDQN datasheet?
Texas Instruments publishes it: the Datasheet link on this page opens it.
Where can I order the TLV75533PDQN?
JLCPCB lists it as part C2861882, with 1,315 in stock; the sellers' links on this page open their listings.
What can replace the TLV75533PDQN?
Parts like it in the library: the AMS1117-3.3 by Advanced Monolithic Systems, the AMS1117-3.3 by UMW, the ME6211C33M5G-N by MICRONE and the SPX3819M5-L-3-3/TR by MaxLinear. Check their datasheets: a part that fits the footprint may still differ in its ratings.
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