
PCM1865DBTR
Texas InstrumentsExtended
-40℃~+125℃ 1.65V 110dB 192kHz 192kHz 24 3V~3.6V 4 Programmable gain、Multiplexers、Internal reference source、ESD protection SPI、I2C TSSOP-30 Analog Front End (AFE) ROHS
- Part id
- ti/PCM1865DBTR
- Category
- Analog Front End (AFE)
- Package
- TSSOP-30
- Pins
- 30
- In stock
- 741 at JLCPCB (C181312)
- Used on
- 7 open-source boards
Overview
The PCM1865DBTR is an analog Front End made by Texas Instruments in a TSSOP-30 package with 30 pins. -40℃~+125℃ 1.65V 110dB 192kHz 192kHz 24 3V~3.6V 4 Programmable gain、Multiplexers、Internal reference source、ESD protection SPI、I2C TSSOP-30 Analog Front End (AFE) ROHS.
PCBKit's library has its KiCad symbol (EasyEDA_Cloud:PCM1865DBTR, from EasyEDA) and its footprint (EasyEDA_Cloud:TSSOP-30_L7.8-W4.4-P0.50-LS6.4-BL, from EasyEDA), ready for a KiCad board. 741 are in stock at JLCPCB (part C181312). 7 open-source boards in 4 repositories on GitHub use it.
Symbol
Footprint
From the datasheet
16- Supply, least
- 3 V · AVDD, recommended operating min · p. 12
- Supply, most
- 3.6 V · AVDD, recommended operating max · p. 12
- Supply, least
- 1.62 V · IOVDD, 1.8 V operation min · p. 12
- Supply, most
- 1.98 V · IOVDD, 1.8 V operation max · p. 12
- Supply, absolute maximum
- 3.9 V · AVDD to AGND, absolute max · p. 12
- Works from
- -40 °C · Operating ambient temperature min · p. 12
- Works up to
- 125 °C · Operating ambient temperature max · p. 12
- Junction, hottest
- 150 °C · Junction temperature absolute max · p. 12
- Junction to air (DBT (TSSOP))
- 79.6 K/W · Junction-to-ambient thermal resistance · p. 12
- Junction to case (DBT (TSSOP))
- 15.1 K/W · Junction-to-case top thermal resistance · p. 12
- Junction to board (DBT (TSSOP))
- 33.1 K/W · Junction-to-board thermal resistance · p. 12
- Takes working
- 41.01 mA · sum of AVDD, DVDD and IOVDD typical currents, 4-channel active mode, 3.3 V supplies · p. 14
- Takes working
- 39.31 mA · sum of AVDD, DVDD and IOVDD and LDO typical currents, 4-channel active mode, IOVDD = LDO = 1.8 V · p. 15
- Takes asleep
- 5.35 mA · sum of AVDD, DVDD and IOVDD typical currents, 4-channel sleep mode, 3.3 V supplies · p. 14
- Takes asleep
- 195 µA · sum of AVDD, DVDD and IOVDD typical currents, 4-channel software standby, 3.3 V supplies · p. 14
- Takes asleep
- 5.15 mA · sum of AVDD, DVDD and IOVDD and LDO typical currents, 4-channel sleep mode, IOVDD = LDO = 1.8 V · p. 15
What it is and has
12- Audio ADC sample rate
- 8 kHz to 192 kHz · p. 1
- Signal-to-noise ratio
- 110 dB · p. 1
- Single-ended full-scale input
- 2.1 VRMS · p. 1
- Differential full-scale input
- 4.2 VRMS · p. 1
- Audio PLL
- Integrated high-performance audio PLL · p. 1
- Supply
- Single 3.3-V power-supply operation · p. 1
- Audio interface
- Master or slave · p. 1
- Protection
- Automatic PGA clipping suppression control · p. 1
- Package
- TSSOP (30), 7.80 mm × 4.40 mm · p. 1
- SNR
- 110 dB · p. 1
- ADC sample rate
- 8 kHz to 192 kHz · p. 1
- Digital microphones
- Up to four, shared clock from GPIO2 and two data lines · p. 34
Around it
7- cap 1-µF
- between VREF and AGND; Reference voltage output decoupling. · p. 11
- cap 0.1-µF
- between AVDD and AGND; Analog supply decoupling. · p. 11
- cap 10-µF
- between AVDD and AGND; Analog supply decoupling. · p. 11
- cap 0.1-µF
- between LDO and DGND; Internal LDO decoupling. · p. 11
- cap 10-µF
- between LDO and DGND; Internal LDO decoupling. · p. 11
- cap 0.1-µF
- between DVDD and DGND; Digital supply decoupling. · p. 11
- cap 10-µF
- between DVDD and DGND; Digital supply decoupling. · p. 11
Specifications
101| Parameter | Conditions | As printed | Page |
|---|---|---|---|
| Supply voltage | AVDD to AGND; over operating temperature | min -0.3 · max 3.9 V | 12 |
| Supply voltage | DVDD to DGND; over operating temperature | min -0.3 · max 3.9 V | 12 |
| Supply voltage | IOVDD to DGND; over operating temperature | min -0.3 · max 3.9 V | 12 |
| Ground voltage differences | AGND to DGND | min -0.3 · max 0.3 V | 12 |
| Digital input voltage | Digital input to DGND | min -0.3 V | 12 |
| Digital input voltage | XI to DGND | min -0.3 · max 2.1 V | 12 |
| Analog input voltage | VINxx to AGND | min -1.7 · max 5 V | 12 |
| Temperature TA | Operating ambient | min -40 · max 125 °C | 12 |
| Temperature TJ | Junction | min -40 · max 150 °C | 12 |
| Temperature Tstg | Storage | min -40 · max 150 °C | 12 |
| Electrostatic discharge V(ESD) | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001; ±2000 V | max 2000 V | 12 |
| Electrostatic discharge V(ESD) | Charged-device model (CDM), per JEDEC specification JESD22-C101; ±750 V | max 750 V | 12 |
| Analog supply voltage to AGND AVDD | min 3 · typ 3.3 · max 3.6 V | 12 | |
| Digital supply voltage to DGND DVDD | min 3 · typ 3.3 · max 3.6 V | 12 | |
| IO supply voltage to DGND IOVDD | at 1.8 V | min 1.62 · typ 1.8 · max 1.98 V | 12 |
| IO supply voltage to DGND IOVDD | at 3.3 V | min 3 · typ 3.3 · max 3.6 V | 12 |
| Operating ambient temperature TA | min -40 · max 125 °C | 12 | |
| Junction-to-ambient thermal resistance RθJA | PCM186x, DBT (TSSOP), 30 PINS | typ 79.6 °C/W | 12 |
| Junction-to-case (top) thermal resistance RθJC(top) | PCM186x, DBT (TSSOP), 30 PINS | typ 15.1 °C/W | 12 |
| Junction-to-board thermal resistance RθJB | PCM186x, DBT (TSSOP), 30 PINS | typ 33.1 °C/W | 12 |
| Junction-to-top characterization parameter ψJT | PCM186x, DBT (TSSOP), 30 PINS | typ 0.4 °C/W | 12 |
| Junction-to-board characterization parameter ψJB | PCM186x, DBT (TSSOP), 30 PINS | typ 32.6 °C/W | 12 |
| Input channel signal-to-noise ratio, differential input | PCM1865; 0-dB PGA gain, –60-dB input signal, master mode at Diff input | min 97 · typ 110 dB | 13 |
| Input channel signal-to-noise ratio, differential input | 32-dB PGA gain, –86-dB input signal, master mode at Diff input | min 85 · typ 90 dB | 13 |
| Input channel THD+N, differential input | 0-dB PGA gain, –1-dB input signal, master mode at Diff input | min -85 · typ -93 dB | 13 |
| Input channel THD+N, differential input | 32-dB PGA gain, –33-dB input signal, master mode at Diff input | min -76 · typ -84 dB | 13 |
| L channel to R channel separation line input | 0-dB PGA gain, –1-dB input signal, master mode | typ -105 dB | 13 |
| L channel to R channel separation mic input | 20-dB PGA gain, –1-dB input signal, master mode | typ -105 dB | 13 |
| L1 channel to L2 channel separation line input | 0-dB PGA gain, –1-dB input signal, master mode | typ -105 dB | 13 |
| R1 channel to R2 channel separation line input | 0-dB PGA gain, –1-dB input signal, master mode | typ -105 dB | 13 |
| L1 channel to L2 channel separation mic input | 20-dB PGA gain, –1-dB input signal, master mode | typ -105 dB | 13 |
| R1 channel to R2 channel separation mic input | 20-dB PGA gain, –1-dB input signal, master mode | typ -105 dB | 13 |
| Range of analog PGA | –12 to +12 dB (1-dB step), 20 dB, and 32 dB | min -12 · max 32 dB | 13 |
| Accuracy of PGA + ADC | typ 0.5 dB | 13 | |
| Matching between PGA + ADCs on-chip | typ 0.05 dB | 13 | |
| Full-scale voltage input | Single-ended mode | max 2.1 VRMS | 13 |
| Full-scale voltage input | Differential mode (2.1 VRMS per pin) | max 4.2 VRMS | 13 |
| Input channel signal-to-noise ratio, single-ended input | PCM1865; 0-dB PGA gain, –60-dB input signal, master mode at SE input | typ 106 dB | 13 |
| Input channel signal-to-noise ratio, single-ended input | 32-dB PGA gain, –92-dB input signal, master mode at SE input | typ 75 dB | 13 |
| Input channel THD+N, single-ended input | 0-dB PGA gain, –1-dB input signal, master mode at SE input | typ 87 dB | 13 |
| Input channel THD+N, single-ended input | 32-dB PGA gain, –33-dB input signal, master mode at SE input | typ 68 dB | 13 |
| Input impedance per analog input pin | PCM1865 | typ 10 kΩ | 13 |
| Common-mode rejection ratio CMRR | Differential input, 1-kHz signal on both pins and measure level at output | typ 56 dB | 13 |
| Default Energysense signal detection threshold | At 1 kHz | typ -57 dBFS | 13 |
| Energysense signal bandwidth | typ 10 kHz | 13 | |
| Energysense accuracy | Specified by design | typ 3 dB | 13 |
| Secondary ADC accuracy | typ 12 bits | 13 | |
| Secondary ADC sampling rate | min 8 · max 192 kHz | 13 | |
| AVDD current | 4-channel device, AVDD = DVDD = IOVDD = 3.3 V, active mode; TA = 25°C, slave mode, single-speed mode, fS = 48 kHz, system clock = 512 × fS, 24-bit data | typ 31 mA | 14 |
| DVDD current | 4-channel device, AVDD = DVDD = IOVDD = 3.3 V, active mode | typ 0.01 mA | 14 |
| IOVDD current | 4-channel device, AVDD = DVDD = IOVDD = 3.3 V, active mode | typ 10 mA | 14 |
| Total power | 4-channel device, AVDD = DVDD = IOVDD = 3.3 V, active mode | typ 135.3 mW | 14 |
| AVDD current | 4-channel device, AVDD = DVDD = IOVDD = 3.3 V, sleep mode | typ 2.8 mA | 14 |
| DVDD current | 4-channel device, AVDD = DVDD = IOVDD = 3.3 V, sleep mode | typ 0.35 mA | 14 |
| IOVDD current | 4-channel device, AVDD = DVDD = IOVDD = 3.3 V, sleep mode | typ 2.2 mA | 14 |
| Total power | 4-channel device, AVDD = DVDD = IOVDD = 3.3 V, sleep mode | typ 17.655 mW | 14 |
| AVDD current | 4-channel device, AVDD = DVDD = IOVDD = 3.3 V, standby mode for software device | typ 0.06 mA | 14 |
| DVDD current | 4-channel device, AVDD = DVDD = IOVDD = 3.3 V, standby mode for software device | typ 0.015 mA | 14 |
| IOVDD current | 4-channel device, AVDD = DVDD = IOVDD = 3.3 V, standby mode for software device | typ 0.12 mA | 14 |
| Total power | 4-channel device, AVDD = DVDD = IOVDD = 3.3 V, standby mode for software device | typ 0.644 mW | 14 |
| AVDD current | 4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, active mode | typ 31 mA | 15 |
| DVDD current | 4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, active mode | typ 0.01 mA | 15 |
| IOVDD and LDO Current | 4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, active mode | typ 8.3 mA | 15 |
| Total power | 4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, active mode | typ 117.3 mW | 15 |
| AVDD current | 4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, sleep mode | typ 2.8 mA | 15 |
| DVDD current | 4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, sleep mode | typ 0.35 mA | 15 |
| IOVDD and LDO Current | 4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, sleep mode | typ 2 mA | 15 |
| Total power | 4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, sleep mode | typ 13.995 mW | 15 |
| AVDD current | 4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, standby mode for software device | typ 0.06 mA | 15 |
| DVDD current | 4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, standby mode for software device | typ 0.007 mA | 15 |
| Total power (1) | 4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, standby mode for software device | typ 0.221 mW | 15 |
| Additional current consumption | on IOVDD when XTAL is used | typ 0.5 mA | 15 |
| Additional current consumption | on DVDD in BCK PLL mode | typ 1.5 mA | 15 |
| Additional current consumption | on IOVDD when master mode is enabled | typ 2 mA | 15 |
| Additional current consumption | IOVDD = 3.3 V or IOVDD = LDO = 1.8 V, fS = 192 kHz, 4-channel active mode | typ 7.5 mA | 15 |
| Power-supply rejection ratio PSRR | TA = 25°C, AVDD = DVDD = IOVDD = 3.3 V, slave mode, single-speed mode, fS = 48 kHz, system clock = 512 × fS, 24-bit data | typ 80 dB | 15 |
| Mic bias noise | TA = 25°C, AVDD = DVDD = IOVDD = 3.3 V | typ 5 uVRMS | 15 |
| Mic bias current drive | TA = 25°C, AVDD = DVDD = IOVDD = 3.3 V | typ 4 mA | 15 |
| Mic bias voltage | TA = 25°C, AVDD = DVDD = IOVDD = 3.3 V | typ 2.6 V | 15 |
| Output logic high voltage level VOH | IOH = 2 mA | typ 75 %IOVDD | 15 |
| Output logic low voltage level VOL | IOL = –2 mA | typ 25 %IOVDD | 15 |
| Input logic high current level |IIH|1 | All digital pins | max 10 uA | 15 |
| Input logic low current level |IIL|1 | All digital pins | max -10 uA | 15 |
| Pass band | CLASSIC FIR | typ 0.454 fS | 16 |
| Stop band | CLASSIC FIR | typ 0.583 fS | 16 |
| Pass-band ripple | CLASSIC FIR | typ 0.05 dB | 16 |
| Stop-band attenuation | CLASSIC FIR | typ -65 dB | 16 |
| Group delay or latency | CLASSIC FIR | typ 30 Samples | 16 |
| HPF –3-dB cutoff frequency | CLASSIC FIR | typ 1 Hz | 16 |
| Pass band | LOW LATENCY IIR | typ 0.454 fS | 16 |
| Stop band | LOW LATENCY IIR | typ 0.546 fS | 16 |
| Pass-band ripple | LOW LATENCY IIR | typ 0.02 dB | 16 |
| Stop-band attenuation | LOW LATENCY IIR | typ -75 dB | 16 |
| Group delay or latency | LOW LATENCY IIR | typ 10 Samples | 16 |
| HPF –3-dB cutoff frequency | LOW LATENCY IIR | typ 1 Hz | 16 |
| XTAL support | TA = 25°C, AVDD = DVDD = IOVDD = 3.3 V, master mode, single-speed mode, fS = 48 kHz, system clock = 256 × fS, 24-bit data | min 15 · max 35 MHz | 16 |
| MCLK frequency | 3.3 V on MCLK pin | min 1 · max 50 MHz | 16 |
| MCLK | 1.8 V MCLK input on XI pin | min 1 · max 50 MHz | 16 |
| MCLK input duty cycle | 1.8 V MCLK | min 48 · max 52 % | 16 |
| Maximum BCK frequency | IOVDD = 3.3 V | max 50 MHz | 16 |
| Maximum BCK frequency | IOVDD = 1.8 V | max 25 MHz | 16 |
Pins, by the datasheet
30- 1 VINL2/VIN1M
- Analog input 2, L-channel, or differential M input for input 1. · p. 11
- 2 VINR2/VIN2M
- Analog input 2, R-channel, or differential M input for input 2. · p. 11
- 3 VINL1/VIN1P
- Analog input 1, L-channel, or differential P input for input 1. · p. 11
- 4 VINR1/VIN2P
- Analog input 1, R-channel, or differential P input for input 2. · p. 11
- 5 Mic Bias
- Microphone bias output. · p. 11
- 6 VREF
- Reference voltage output decoupling point, typically 0.5 AVDD; connect 1-uF capacitor to AGND. · p. 11
- 7 AGND
- Analog ground. · p. 11
- 8 AVDD
- Analog power supply, typically 3.3 V; connect 0.1-uF and 10-uF capacitors to AGND. · p. 11
- 9 XO
- Crystal oscillator output. · p. 11
- 10 XI
- Crystal oscillator input or master clock input, 1.8-V CMOS signal. · p. 11
- 11 LDO
- Internal LDO decoupling output or external 1.8-V input to bypass LDO; connect 0.1-uF and 10-uF capacitors to DGND. · p. 11
- 12 DGND
- Digital ground. · p. 11
- 13 DVDD
- Digital power supply, typically 3.3 V; connect 0.1-uF and 10-uF capacitors to DGND. · p. 11
- 14 IOVDD
- Power supply for I/O voltages, typically 3.3 V or 1.8 V. · p. 11
- 15 SCKI
- CMOS level (3.3 V) master clock input. · p. 11
- 16 LRCK
- Audio data world clock (left right clock) input/output; Schmitt trigger input with internal pull-down, typically 50 kΩ. · p. 11
- 17 BCK
- Audio data bit clock input/output; Schmitt trigger input with internal pull-down, typically 50 kΩ. · p. 11
- 18 DOUT
- Audio data digital output. · p. 11
- 19 GPIO3/INTC
- GPIO 3 or interrupt C. · p. 11
- 20 GPIO2/INTB/DMCLK
- GPIO 2, interrupt B, or digital microphone clock output. · p. 11
- 21 GPIO1/INTA/DMIN
- GPIO 1, interrupt A, or digital microphone input. · p. 11
- 22 MISO/GPIO0/DMIN2
- SPI master in, slave out; in I2C mode GPIO0 or DMIN2. · p. 11
- 23 MOSI/SDA
- SPI master out, slave in; I2C SDA. · p. 11
- 24 MC/SCL
- Serial bit clock in SPI or I2C mode. · p. 11
- 25 MS/AD
- SPI chip select or I2C address pin. · p. 11
- 26 MD0
- Control method select: I2C when tied low or not connected, SPI when tied high. · p. 11
- 27 VINL4/VIN4M
- Analog input 4, L-channel, or differential M input for input 4. · p. 11
- 28 VINR4/VIN3M
- Analog input 4, R-channel, or differential M input for input 3. · p. 11
- 29 VINL3/VIN4P
- Analog input 3, L-channel, or differential P input for input 4. · p. 11
- 30 VINR3/VIN3P
- Analog input 3, R-channel, or differential P input for input 3. · p. 11
Open-source boards using it
7- 4 layers327.6 × 186.9 mm

- 2 layers38.1 × 17.8 mm

PCM186x Breakout
cyfinfaza/PCM186x-Breakout
Breadboard-compatible breakout board for PCM186x audio ADCs
16 parts - 6 layers176 × 122 mm

Route
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
238 parts3MIT - 6 layers170 × 120 mm

Rv2 final
misko/prompt2device
The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.
203 parts3MIT - 4 layers100 × 90 mm

- 4 layers85 × 50 mm

- 4 layers171.5 × 103.6 mm

Questions
Is there a KiCad symbol and footprint for the PCM1865DBTR?
Yes. The symbol is EasyEDA_Cloud:PCM1865DBTR and the footprint EasyEDA_Cloud:TSSOP-30_L7.8-W4.4-P0.50-LS6.4-BL, both drawn on this page. PCBKit places them on a board for you when you design with it.
What package is the PCM1865DBTR?
TSSOP-30, with 30 pins. Its footprint is drawn on this page.
Where is the PCM1865DBTR datasheet?
Texas Instruments publishes it: the Datasheet link on this page opens it.
Where can I order the PCM1865DBTR?
JLCPCB lists it as part C181312, with 741 in stock; the sellers' links on this page open their listings.
Which open-source boards use the PCM1865DBTR?
7 boards in 4 repositories on GitHub; the most starred are listed on this page, with their KiCad files.