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PCM1864DBTR

Texas InstrumentsExtended

-40℃~+125℃ 1.65V 103dB 192kHz 24 3V~3.6V 4 Programmable gain、Multiplexers、Internal reference source、ESD protection SPI、I2C TSSOP-30 Analog Front End (AFE) ROHS

Part id
ti/PCM1864DBTR
Category
Analog Front End (AFE)
Package
TSSOP-30
Pins
30
In stock
70 at JLCPCB (C544855)
Used on
4 open-source boards

Overview

The PCM1864DBTR is an analog Front End made by Texas Instruments in a TSSOP-30 package with 30 pins. -40℃~+125℃ 1.65V 103dB 192kHz 24 3V~3.6V 4 Programmable gain、Multiplexers、Internal reference source、ESD protection SPI、I2C TSSOP-30 Analog Front End (AFE) ROHS.

PCBKit's library has its KiCad symbol (Audio:PCM1864DBT, from KiCad's library) and its footprint (Package_SO:TSSOP-30_4.4x7.8mm_P0.5mm, from KiCad's library), ready for a KiCad board. 70 are in stock at JLCPCB (part C544855). 4 open-source boards in 2 repositories on GitHub use it.

Symbol

25MS/AD26MD027VINL4/VIN4M28VINR4/VIN3M29VINL3/VIN4P30VINR3/VIN3P1VINL2/VIN1M2VINR2/VIN2M3VINL1/VIN1P4VINR1/VIN2P5Mic_Bias6VREF7AGND8AVDD9XO10XI11LDO12DGND13DVDD14IOVDD15SCKI16LRCK17BCK18DOUT19GPIO3/INTC20GPIO2/INTB/DMCLK21GPIO1/INTA/DMIN22MISO/GPIO0/DMIN223MOSI/SDA24MC/SCL
Audio:PCM1864DBTFrom KiCad's library

Footprint

Package_SO:TSSOP-30_4.4x7.8mm_P0.5mmFrom KiCad's library

From the datasheet

17
Supply, least
3 V · AVDD, recommended operating min · p. 12
Supply, most
3.6 V · AVDD, recommended operating max · p. 12
Supply, least
1.62 V · IOVDD, 1.8-V operation min · p. 12
Supply, most
1.98 V · IOVDD, 1.8-V operation max · p. 12
Supply, absolute maximum
3.9 V · AVDD to AGND, absolute max · p. 12
Works from
-40 °C · Operating ambient temperature min · p. 12
Works up to
125 °C · Operating ambient temperature max · p. 12
Junction, hottest
150 °C · Junction temperature absolute max · p. 12
Junction to air (DBT (TSSOP))
79.6 K/W · Junction-to-ambient thermal resistance · p. 12
Junction to case (DBT (TSSOP))
15.1 K/W · Junction-to-case (top) thermal resistance · p. 12
Junction to board (DBT (TSSOP))
33.1 K/W · Junction-to-board thermal resistance · p. 12
Takes working
41.01 mA · sum of AVDD, DVDD and IOVDD typical active currents, 4-channel device, 3.3 V supplies · p. 14
Takes working
39.31 mA · sum of AVDD, DVDD and IOVDD/LDO typical active currents, 4-channel device, IOVDD = LDO = 1.8 V · p. 15
Takes asleep
5.35 mA · sum of AVDD, DVDD and IOVDD typical sleep currents, 4-channel device, 3.3 V supplies · p. 14
Takes asleep
195 µA · sum of AVDD, DVDD and IOVDD typical software standby currents, 4-channel device, 3.3 V supplies · p. 14
Takes asleep
5.15 mA · sum of AVDD, DVDD and IOVDD/LDO typical sleep currents, 4-channel device, IOVDD = LDO = 1.8 V · p. 15
Takes asleep
67 µA · sum of AVDD and DVDD typical software standby currents, IOVDD/LDO negligible, IOVDD = LDO = 1.8 V · p. 15

What it is and has

15
Signal-to-noise ratio
103 dB · p. 1
ADC sample rate
8 kHz to 192 kHz · p. 1
Single-ended full-scale input
2.1 VRMS · p. 1
Differential full-scale input
4.2 VRMS · p. 1
Programmable gain
–12 dB to +32 dB, software controlled · p. 1
Audio PLL
Integrated high-performance audio PLL · p. 1
Power supply
Single 3.3-V operation · p. 1
Power dissipation at 3.3 V
< 145 mW · p. 1
Audio interface
Master or slave · p. 1
Protection
Automatic PGA clipping suppression control · p. 1
Package
TSSOP (30), 7.80 mm × 4.40 mm · p. 1
SNR
103 dB · p. 1
Digital microphone interface
Up to four digital microphones; shared GPIO2 output clock · p. 34
Secondary ADC
One-bit delta-sigma · p. 48
Secondary ADC input impedance
20 kΩ · p. 49

Around it

7
cap 1 µF
between VREF and AGND; Reference voltage output decoupling. · p. 11
cap 0.1 µF
between AVDD and AGND; Analog supply decoupling. · p. 11
cap 10 µF
between AVDD and AGND; Analog supply decoupling. · p. 11
cap 0.1 µF
between LDO and DGND; Internal LDO decoupling. · p. 11
cap 10 µF
between LDO and DGND; Internal LDO decoupling. · p. 11
cap 0.1 µF
between DVDD and DGND; Digital supply decoupling. · p. 11
cap 10 µF
between DVDD and DGND; Digital supply decoupling. · p. 11

Specifications

101
ParameterConditionsAs printedPage
Supply voltageAVDD to AGNDmin -0.3 · max 3.9 V12
Supply voltageDVDD to DGNDmin -0.3 · max 3.9 V12
Supply voltageIOVDD to DGNDmin -0.3 · max 3.9 V12
Ground voltage differencesAGND to DGNDmin -0.3 · max 0.3 V12
Digital input voltageDigital input to DGNDmin -0.3 V12
Digital input voltageXI to DGNDmin -0.3 · max 2.1 V12
Analog input voltageVINxx to AGNDmin -1.7 · max 5 V12
Temperature TAOperating ambientmin -40 · max 125 °C12
Temperature TJJunctionmin -40 · max 150 °C12
Temperature TstgStoragemin -40 · max 150 °C12
Electrostatic discharge V(ESD)Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001max 2000 V12
Electrostatic discharge V(ESD)Charged-device model (CDM), per JEDEC specification JESD22-C101; ±750 Vmax 750 V12
Analog supply voltage to AGND AVDDmin 3 · typ 3.3 · max 3.6 V12
Digital supply voltage to DGND DVDDmin 3 · typ 3.3 · max 3.6 V12
IO supply voltage to DGND IOVDDat 1.8 Vmin 1.62 · typ 1.8 · max 1.98 V12
IO supply voltage to DGND IOVDDat 3.3 Vmin 3 · typ 3.3 · max 3.6 V12
Operating ambient temperature TAmin -40 · max 125 °C12
Junction-to-ambient thermal resistance RθJADBT (TSSOP), 30 pinstyp 79.6 °C/W12
Junction-to-case (top) thermal resistance RθJC(top)DBT (TSSOP), 30 pinstyp 15.1 °C/W12
Junction-to-board thermal resistance RθJBDBT (TSSOP), 30 pinstyp 33.1 °C/W12
Junction-to-top characterization parameter ψJTDBT (TSSOP), 30 pinstyp 0.4 °C/W12
Junction-to-board characterization parameter ψJBDBT (TSSOP), 30 pinstyp 32.6 °C/W12
Input channel signal-to-noise ratio, differential inputPCM1864; 0-dB PGA gain, –60-dB input signal, master mode at Diff inputmin 97 · typ 103 dB13
Input channel signal-to-noise ratio, differential input32-dB PGA gain, –86-dB input signal, master mode at Diff inputmin 85 · typ 90 dB13
Input channel THD+N, differential input0-dB PGA gain, –1-dB input signal, master mode at Diff inputmin -85 · typ -93 dB13
Input channel THD+N, differential input32-dB PGA gain, –33-dB input signal, master mode at Diff inputmin -76 · typ -84 dB13
L channel to R channel separation line input0-dB PGA gain, –1-dB input signal, master modetyp -105 dB13
L channel to R channel separation mic input20-dB PGA gain, –1-dB input signal, master modetyp -105 dB13
L1 channel to L2 channel separation line input0-dB PGA gain, –1-dB input signal, master modetyp -105 dB13
R1 channel to R2 channel separation line input0-dB PGA gain, –1-dB input signal, master modetyp -105 dB13
L1 channel to L2 channel separation mic input20-dB PGA gain, –1-dB input signal, master modetyp -105 dB13
R1 channel to R2 channel separation mic input20-dB PGA gain, –1-dB input signal, master modetyp -105 dB13
Range of analog PGA–12 to +12 dB (1-dB step), 20 dB, and 32 dBmin -12 · max 32 dB13
Accuracy of PGA + ADCtyp 0.5 dB13
Matching between PGA + ADCs on-chiptyp 0.05 dB13
Full-scale voltage inputSingle-ended modemax 2.1 VRMS13
Full-scale voltage inputDifferential mode (2.1 VRMS per pin)max 4.2 VRMS13
Input channel signal-to-noise ratio, single-ended inputPCM1864; 0-dB PGA gain, –60-dB input signal, master mode at SE inputtyp 103 dB13
Input channel signal-to-noise ratio, single-ended input32-dB PGA gain, –92-dB input signal, master mode at SE inputtyp 75 dB13
Input channel THD+N, single-ended input0-dB PGA gain, –1-dB input signal, master mode at SE inputtyp 87 dB13
Input channel THD+N, single-ended input32-dB PGA gain, –33-dB input signal, master mode at SE inputtyp 68 dB13
Input impedance per analog input pinPCM1864typ 10 kΩ13
Common-mode rejection ratio CMRRDifferential input, 1-kHz signal on both pins and measure level at outputtyp 56 dB13
Default Energysense signal detection thresholdAt 1 kHztyp -57 dBFS13
Energysense signal bandwidthtyp 10 kHz13
Energysense accuracySpecified by designtyp 3 dB13
Secondary ADC accuracytyp 12 bits13
Secondary ADC sampling ratemin 8 · max 192 kHz13
AVDD current4-channel device, AVDD = DVDD = IOVDD = 3.3 V, active modetyp 31 mA14
DVDD current4-channel device, AVDD = DVDD = IOVDD = 3.3 V, active modetyp 0.01 mA14
IOVDD current4-channel device, AVDD = DVDD = IOVDD = 3.3 V, active modetyp 10 mA14
Total power4-channel device, AVDD = DVDD = IOVDD = 3.3 V, active modetyp 135.3 mW14
AVDD current4-channel device, AVDD = DVDD = IOVDD = 3.3 V, sleep modetyp 2.8 mA14
DVDD current4-channel device, AVDD = DVDD = IOVDD = 3.3 V, sleep modetyp 0.35 mA14
IOVDD current4-channel device, AVDD = DVDD = IOVDD = 3.3 V, sleep modetyp 2.2 mA14
Total power4-channel device, AVDD = DVDD = IOVDD = 3.3 V, sleep modetyp 17.655 mW14
AVDD current4-channel device, AVDD = DVDD = IOVDD = 3.3 V, standby mode for software devicetyp 0.06 mA14
DVDD current4-channel device, AVDD = DVDD = IOVDD = 3.3 V, standby mode for software devicetyp 0.015 mA14
IOVDD current4-channel device, AVDD = DVDD = IOVDD = 3.3 V, standby mode for software devicetyp 0.12 mA14
Total power4-channel device, AVDD = DVDD = IOVDD = 3.3 V, standby mode for software devicetyp 0.644 mW14
AVDD current4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, active modetyp 31 mA15
DVDD current4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, active modetyp 0.01 mA15
IOVDD and LDO Current4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, active modetyp 8.3 mA15
Total power4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, active modetyp 117.3 mW15
AVDD current4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, sleep modetyp 2.8 mA15
DVDD current4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, sleep modetyp 0.35 mA15
IOVDD and LDO Current4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, sleep modetyp 2 mA15
Total power4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, sleep modetyp 13.995 mW15
AVDD current4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, standby mode for software devicetyp 0.06 mA15
DVDD current4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, standby mode for software devicetyp 0.007 mA15
Total power (1)4-channel device, AVDD = DVDD = 3.3 V, IOVDD = LDO = 1.8 V, standby mode for software devicetyp 0.221 mW15
Additional current consumptionon IOVDD when XTAL is usedtyp 0.5 mA15
Additional current consumptionon DVDD in BCK PLL modetyp 1.5 mA15
Additional current consumptionon IOVDD when master mode is enabledtyp 2 mA15
Additional current consumptionIOVDD = 3.3 V or IOVDD = LDO = 1.8 V, fS = 192 kHz, 4-channel active modetyp 7.5 mA15
Power-supply rejection ratio PSRRtyp 80 dB15
Mic bias noisetyp 5 uVRMS15
Mic bias current drivetyp 4 mA15
Mic bias voltagetyp 2.6 V15
Output logic high voltage level VOHIOH = 2 mAtyp 75 %IOVDD15
Output logic low voltage level VOLIOL = –2 mAtyp 25 %IOVDD15
Input logic high current level |IIH|1All digital pinsmax 10 uA15
Input logic low current level |IIL|1All digital pinsmax -10 uA15
Pass bandCLASSIC FIRtyp 0.454 fS16
Stop bandCLASSIC FIRtyp 0.583 fS16
Pass-band rippleCLASSIC FIR; ±0.05 dBtyp 0.05 dB16
Stop-band attenuationCLASSIC FIRtyp -65 dB16
Group delay or latencyCLASSIC FIRtyp 30 Samples16
HPF –3-dB cutoff frequencyCLASSIC FIRtyp 1 Hz16
Pass bandLOW LATENCY IIRtyp 0.454 fS16
Stop bandLOW LATENCY IIRtyp 0.546 fS16
Pass-band rippleLOW LATENCY IIR; ±0.02 dBtyp 0.02 dB16
Stop-band attenuationLOW LATENCY IIRtyp -75 dB16
Group delay or latencyLOW LATENCY IIRtyp 10 Samples16
HPF –3-dB cutoff frequencyLOW LATENCY IIRtyp 1 Hz16
XTAL supportmin 15 · max 35 MHz16
MCLK frequency3.3 V on MCLK pinmin 1 · max 50 MHz16
MCLK1.8 V MCLK input on XI pinmin 1 · max 50 MHz16
MCLK input duty cycle1.8 V MCLKmin 48 · max 52 %16
Maximum BCK frequencyIOVDD = 3.3 Vmax 50 MHz16
Maximum BCK frequencyIOVDD = 1.8 Vmax 25 MHz16

Pins, by the datasheet

30
1 VINL2/VIN1M
Analog input 2, L-channel, or differential M input for input 1. · p. 11
2 VINR2/VIN2M
Analog input 2, R-channel, or differential M input for input 2. · p. 11
3 VINL1/VIN1P
Analog input 1, L-channel, or differential P input for input 1. · p. 11
4 VINR1/VIN2P
Analog input 1, R-channel, or differential P input for input 2. · p. 11
5 Mic Bias
Microphone bias output. · p. 11
6 VREF
Reference voltage output decoupling point, typically 0.5 AVDD; connect 1-uF capacitor to AGND. · p. 11
7 AGND
Analog ground. · p. 11
8 AVDD
Analog supply, typically 3.3 V; connect 0.1-uF and 10-uF capacitors to AGND. · p. 11
9 XO
Crystal oscillator output. · p. 11
10 XI
Crystal oscillator input or master clock input, 1.8-V CMOS signal. · p. 11
11 LDO
Internal LDO decoupling output or external 1.8-V input to bypass LDO; connect 0.1-uF and 10-uF capacitors to DGND. · p. 11
12 DGND
Digital ground. · p. 11
13 DVDD
Digital supply, typically 3.3 V; connect 0.1-uF and 10-uF capacitors to DGND. · p. 11
14 IOVDD
Power supply for I/O voltages, typically 3.3 V or 1.8 V. · p. 11
15 SCKI
CMOS level (3.3 V) master clock input. · p. 11
16 LRCK
Audio data world clock (left right clock) input/output; Schmitt trigger input with typically 50-kΩ internal pull-down. · p. 11
17 BCK
Audio data bit clock input/output; Schmitt trigger input with typically 50-kΩ internal pull-down. · p. 11
18 DOUT
Audio data digital output. · p. 11
19 GPIO3/INTC
GPIO 3 or interrupt C. · p. 11
20 GPIO2/INTB/DMCLK
GPIO 2, interrupt B, or digital microphone clock output. · p. 11
21 GPIO1/INTA/DMIN
GPIO 1, interrupt A, or digital microphone input. · p. 11
22 MISO/GPIO0/DMIN2
SPI master in, slave out; in I2C mode, GPIO0 or DMIN2. · p. 11
23 MOSI/SDA
SPI master out, slave in; in I2C mode, SDA. · p. 11
24 MC/SCL
Serial bit clock in SPI or I2C mode. · p. 11
25 MS/AD
SPI chip select or I2C address pin. · p. 11
26 MD0
Control method select: I2C when tied low or unconnected; SPI when tied high. · p. 11
27 VINL4/VIN4M
Analog input 4, L-channel, or differential M input for input 4. · p. 11
28 VINR4/VIN3M
Analog input 4, R-channel, or differential M input for input 3. · p. 11
29 VINL3/VIN4P
Analog input 3, L-channel, or differential P input for input 4. · p. 11
30 VINR3/VIN3P
Analog input 3, R-channel, or differential P input for input 3. · p. 11

Open-source boards using it

4
  • 4 layers200 × 100 mmCarrier, the printed circuit board in 3D

    Carrier

    misko/prompt2device

    The separate vNext PCB skill and orchestrator package is available alongside the reference workflow below; existing projects keep their accepted toolchain until an explicit migration.

    142 parts3MIT

Questions

Is there a KiCad symbol and footprint for the PCM1864DBTR?

Yes. The symbol is Audio:PCM1864DBT and the footprint Package_SO:TSSOP-30_4.4x7.8mm_P0.5mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the PCM1864DBTR?

TSSOP-30, with 30 pins. Its footprint is drawn on this page.

Where is the PCM1864DBTR datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Where can I order the PCM1864DBTR?

JLCPCB lists it as part C544855, with 70 in stock; the sellers' links on this page open their listings.

Which open-source boards use the PCM1864DBTR?

4 boards in 2 repositories on GitHub; the most starred are listed on this page, with their KiCad files.