

Overview
The PCM1802DB is an ADCs, DACs Special Purpose made by Texas Instruments in a SSOP-20 package with 20 pins. -40℃~+85℃ 2 24 3.3V、5V 96000Hz Audio Analog-to-Digital Converter Built-in I2S SSOP-20 ADCs/DACs - Special Purpose ROHS.
PCBKit's library has its KiCad symbol (EasyEDA_Cloud:PCM1802DBR, from EasyEDA) and its footprint (Package_SO:SSOP-20_5.3x7.2mm_P0.65mm, from KiCad's library), ready for a KiCad board. 129 are in stock at JLCPCB (part C2866894). 5 open-source boards in 4 repositories on GitHub use it.
Symbol
Footprint
From the datasheet
14- Supply, least
- 4.5 V · VCC, recommended operating min · p. 6
- Supply, most
- 5.5 V · VCC, recommended operating max · p. 6
- Supply, least
- 2.7 V · VDD, recommended operating min · p. 6
- Supply, most
- 3.6 V · VDD, recommended operating max · p. 6
- Supply, absolute maximum
- 6.5 V · VCC, absolute max · p. 4
- Supply, absolute maximum
- 4 V · VDD, absolute max · p. 4
- Works from
- -40 °C · Operating free-air temperature min · p. 4
- Works up to
- 85 °C · Operating free-air temperature max · p. 4
- Junction, hottest
- 150 °C · Junction temperature absolute max · p. 4
- Takes working
- 32.3 mA · sum of ICC and IDD, typical at 44.1 kHz, VCC = 5 V, VDD = 3.3 V · p. 6
- Takes at most
- 40 mA · sum of ICC and IDD, max at 44.1 kHz, VCC = 5 V, VDD = 3.3 V · p. 6
- Junction to air (DB (SSOP))
- 80.8 K/W · Junction-to-ambient thermal resistance · p. 5
- Junction to case (DB (SSOP))
- 40 K/W · Junction-to-case top thermal resistance · p. 5
- Junction to board (DB (SSOP))
- 37.6 K/W · Junction-to-board thermal resistance · p. 5
What it is and has
15- ADC
- 24-bit delta-sigma stereo · p. 1
- Analog input
- Single-ended, 3 VP–P · p. 1
- Antialiasing filter
- Included · p. 1
- Oversampling
- ×64, ×128 · p. 1
- Pass-band ripple
- ±0.05 dB · p. 1
- Stop-band attenuation
- –65 dB · p. 1
- High-pass filter
- On-chip, 0.84 Hz at 44.1 kHz · p. 1
- THD+N
- 96 dB typical · p. 1
- SNR
- 105 dB typical · p. 1
- Dynamic range
- 105 dB typical · p. 1
- PCM audio interface
- Selectable master and slave modes · p. 1
- Sampling rate
- 16 kHz to 96 kHz · p. 1
- System clock
- 256 fS, 384 fS, 512 fS, 768 fS · p. 1
- Power supplies
- 5 V analog, 3.3 V digital · p. 1
- Package
- 20-pin SSOP · p. 1
Around it
8- cap 1 µF
- between L-Ch IN and VINL; C1, AC coupling; approximately 8-Hz input HPF cutoff. · p. 22
- cap 0.1 µF
- between VCC and AGND; Ceramic bypass capacitor, as close to the pins as possible. · p. 24
- cap 10 µF
- between VCC and AGND; Tantalum bypass capacitor, as close to the pins as possible. · p. 24
- cap 0.1 µF
- between VREF1 and AGND; Ceramic; place as close as possible to VREF1. · p. 24
- cap 10 µF
- between VREF1 and AGND; Electrolytic; place as close as possible to VREF1. · p. 24
- cap 0.1 µF
- between VREF2 and AGND; Ceramic; recommended for a noisy analog supply, close to VREF2. · p. 24
- cap 10 µF
- between VREF2 and AGND; Electrolytic; recommended for a noisy analog supply, close to VREF2. · p. 24
- res 1 kΩ
- between VCC and VREF2; Use with a noisy analog supply; not required for a clean supply. · p. 24
Specifications
67| Parameter | Conditions | As printed | Page |
|---|---|---|---|
| Supply voltage VCC | max 6.5 V | 4 | |
| Supply voltage VDD | max 4 V | 4 | |
| Ground voltage differences | AGND and DGND; maximum magnitude ±0.1 V | max 0.1 V | 4 |
| Supply voltage difference (VCC – VDD) | VCC and VDD | max 3 V | 4 |
| Digital input voltage | FSYNC, LRCK, BCK, and DOUT; maximum VDD + 0.3 V | min -0.3 V | 4 |
| Digital input voltage | PDWN, BYPAS, SCKI, OSR, FMT0, FMT1, MODE0, and MODE1 | min -0.3 · max 6.5 V | 4 |
| Analog input voltage | VINL, VINR, VREF1, and VREF2; maximum VCC + 0.3 V | min -0.3 V | 4 |
| Input current (any pins except supplies) | Maximum magnitude ±10 mA | max 10 mA | 4 |
| Ambient temperature under bias | min -40 · max 125 °C | 4 | |
| Junction temperature | max 150 °C | 4 | |
| Package temperature (IR reflow, peak) | max 260 °C | 4 | |
| Storage temperature, Tstg Tstg | min -55 · max 150 °C | 4 | |
| Electrostatic discharge V(ESD) | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001; rated magnitude ±1500 V | max 1500 V | 4 |
| Electrostatic discharge V(ESD) | Charged-device model (CDM), per JEDEC specification JESD22-C101; rated magnitude ±1000 V | max 1000 V | 4 |
| Analog supply voltage, VCC VCC | Nominal value | typ 5 V | 4 |
| Digital supply voltage, VDD VDD | Nominal value | typ 3.3 V | 4 |
| Analog input voltage, full-scale (–0 dB) | Nominal value | typ 3 VP–P | 4 |
| Digital input clock frequency | Sampling clock, as labeled in this table | min 8.192 · max 49.152 MHz | 4 |
| Digital input clock frequency | System clock, as labeled in this table | min 32 · max 96 kHz | 4 |
| Digital output load capacitance | max 20 pF | 4 | |
| Operating free-air temperature, TA TA | min -40 · max 85 °C | 4 | |
| Junction-to-ambient thermal resistance RθJA | DB (SSOP), 20 pins | typ 80.8 °C/W | 5 |
| Junction-to-case (top) thermal resistance RθJC(top) | DB (SSOP), 20 pins | typ 40 °C/W | 5 |
| Junction-to-board thermal resistance RθJB | DB (SSOP), 20 pins | typ 37.6 °C/W | 5 |
| Junction-to-top characterization parameter ψJT | DB (SSOP), 20 pins | typ 7.2 °C/W | 5 |
| Junction-to-board characterization parameter ψJB | DB (SSOP), 20 pins | typ 37 °C/W | 5 |
| Resolution | typ 24 Bits | 5 | |
| Sampling frequency fS | min 16 · typ 44.1 · max 96 kHz | 5 | |
| System clock frequency | 256 fS | min 4.096 · typ 11.2896 · max 24.576 MHz | 5 |
| System clock frequency | 384 fS | min 6.144 · typ 16.9344 · max 36.864 MHz | 5 |
| System clock frequency | 512 fS | min 8.192 · typ 22.5792 · max 49.152 MHz | 5 |
| System clock frequency | 768 fS; maximum not applicable at fS = 96 kHz | min 12.288 · typ 33.8688 MHz | 5 |
| Input logic level VIH | FSYNC, LRCK, BCK; maximum VDD | min 2 VDC | 5 |
| Input logic level VIL | FSYNC, LRCK, BCK | min 0 · max 0.8 VDC | 5 |
| Input logic level VIH | PDWN, BYPAS, SCKI, OSR, FMT0, FMT1, MODE0, MODE1 | min 2 · max 5.5 VDC | 5 |
| Input logic level VIL | PDWN, BYPAS, SCKI, OSR, FMT0, FMT1, MODE0, MODE1 | min 0 · max 0.8 VDC | 5 |
| Input logic current IIH | VIN = VDD; FSYNC, LRCK, BCK, SCKI; maximum magnitude ±10 uA | max 10 uA | 5 |
| Input logic current IIL | VIN = 0 V; FSYNC, LRCK, BCK, SCKI; maximum magnitude ±10 uA | max 10 uA | 5 |
| Input logic current IIH | VIN = VDD; PDWN, BYPAS, OSR, FMT0, FMT1, MODE0, MODE1 | typ 65 · max 100 uA | 5 |
| Input logic current IIL | VIN = 0 V; PDWN, BYPAS, OSR, FMT0, FMT1, MODE0, MODE1; maximum magnitude ±10 uA | max 10 uA | 5 |
| Output logic level VOH | IOUT = –1 mA; FSYNC, LRCK, BCK in master mode, DOUT | min 2.8 VDC | 5 |
| Output logic level VOL | IOUT = 1 mA; FSYNC, LRCK, BCK in master mode, DOUT | max 0.5 VDC | 5 |
| Gain mismatch, channel-to-channel | Typical ±1%, maximum ±4% of FSR | typ 1 · max 4 FSR | 5 |
| Gain error | Typical ±2%, maximum ±6% of FSR | typ 2 · max 6 FSR | 5 |
| Bipolar zero error | HPF bypassed; typical ±2% of FSR | typ 2 FSR | 5 |
| Total harmonic distortion + noise THD+N | fS = 44.1 kHz, VIN = –0.5 dB | typ 0.0015 · max 0.003 % | 6 |
| Total harmonic distortion + noise THD+N | fS = 96 kHz, VIN = –0.5 dB, system clock = 256 fS, oversampling ratio = ×64 | typ 0.0025 % | 6 |
| Total harmonic distortion + noise THD+N | fS = 44.1 kHz, VIN = –60 dB | typ 0.7 % | 6 |
| Total harmonic distortion + noise THD+N | fS = 96 kHz, VIN = –60 dB, system clock = 256 fS, oversampling ratio = ×64 | typ 1.2 % | 6 |
| Dynamic range | fS = 44.1 kHz, A-weighted | min 100 · typ 105 dB | 6 |
| Dynamic range | fS = 96 kHz, A-weighted, system clock = 256 fS, oversampling ratio = ×64 | typ 103 dB | 6 |
| Signal to noise ratio | fS = 44.1 kHz, A-weighted | min 100 · typ 105 dB | 6 |
| Signal to noise ratio | fS = 96 kHz, A-weighted, system clock = 256 fS, oversampling ratio = ×64 | typ 103 dB | 6 |
| Channel separation | fS = 44.1 kHz | min 96 · typ 103 dB | 6 |
| Channel separation | fS = 96 kHz, system clock = 256 fS, oversampling ratio = ×64 | typ 98 dB | 6 |
| Input impedance | typ 20 kΩ | 6 | |
| Antialiasing filter frequency response | –3 dB | typ 300 kHz | 6 |
| Pass-band ripple | Maximum magnitude ±0.05 dB | max 0.05 dB | 6 |
| Stop-band attenuation | min -65 dB | 6 | |
| Voltage VCC | min 4.5 · typ 5 · max 5.5 VDC | 6 | |
| Voltage VDD | min 2.7 · typ 3.3 · max 3.6 VDC | 6 | |
| Supply current ICC | VCC = 5 V, VDD = 3.3 V; minimum load on DOUT, BCK, LRCK, FSYNC | typ 24 · max 30 mA | 6 |
| Supply current IDD | fS = 44.1 kHz, VCC = 5 V, VDD = 3.3 V; minimum load on DOUT, BCK, LRCK, FSYNC | typ 8.3 · max 10 mA | 6 |
| Supply current IDD | fS = 96 kHz, VCC = 5 V, VDD = 3.3 V; minimum load on DOUT, BCK, LRCK, FSYNC | typ 17 mA | 6 |
| Power dissipation PD | Operation; fS = 44.1 kHz, VCC = 5 V, VDD = 3.3 V | typ 147 · max 183 mW | 6 |
| Power dissipation PD | Operation; fS = 96 kHz, VCC = 5 V, VDD = 3.3 V | typ 176 mW | 6 |
| Power dissipation PD | Power down; VCC = 5 V, VDD = 3.3 V | typ 0.5 mW | 6 |
Pins, by the datasheet
20- 1 VINL
- Analog input, L-channel. · p. 3
- 2 VINR
- Analog input, R-channel. · p. 3
- 3 VREF1
- Reference-1 decoupling capacitor. · p. 3
- 4 VREF2
- Reference-2 voltage input, normally connected to VCC. · p. 3
- 5 VCC
- Analog power supply, 5 V. · p. 3
- 6 AGND
- Analog GND. · p. 3
- 7 PDWN
- Active-low power-down control; Schmitt-trigger input with internal pulldown, 5-V tolerant. · p. 3
- 8 BYPAS
- HPF bypass control: low selects normal DC-cut mode; high selects bypass mode. · p. 3
- 9 FSYNC
- Frame synchronous clock input and output; Schmitt-trigger input. · p. 3
- 10 LRCK
- Sampling clock input and output; Schmitt-trigger input. · p. 3
- 11 BCK
- Bit clock input and output; Schmitt-trigger input. · p. 3
- 12 DOUT
- Audio data output. · p. 3
- 13 DGND
- Digital GND. · p. 3
- 14 VDD
- Digital power supply, 3.3 V. · p. 3
- 15 SCKI
- System clock input: 256 fS, 384 fS, 512 fS, or 768 fS; Schmitt-trigger input, 5-V tolerant. · p. 3
- 16 OSR
- Oversampling ratio select: low selects ×64 fS; high selects ×128 fS. · p. 3
- 17 FMT0
- Audio data format select 0. · p. 3
- 18 FMT1
- Audio data format select 1. · p. 3
- 19 MODE0
- Mode select 0. · p. 3
- 20 MODE1
- Mode select 1. · p. 3
Ordering codes, by the datasheet
6- PCM1802DB
- SSOP (DB), 20 pins · 65 per tube; lead finish Call TI | Nipdau; -40 to 85 °C. · p. 27
- PCM1802DB.B
- SSOP (DB), 20 pins · 65 per tube; lead finish Call TI; -40 to 85 °C. · p. 27
- PCM1802DBG4
- SSOP (DB), 20 pins · 65 per tube; lead finish Call TI; -40 to 85 °C. · p. 27
- PCM1802DBR
- SSOP (DB), 20 pins · 2000 per large tape and reel; lead finish Call TI | Nipdau; -40 to 85 °C. · p. 27
- PCM1802DBR.B
- SSOP (DB), 20 pins · 2000 per large tape and reel; lead finish Call TI; -40 to 85 °C. · p. 27
- PCM1802DBRG4.B
- SSOP (DB), 20 pins · 2000 per large tape and reel; lead finish NIPDAU; -40 to 85 °C. · p. 27
Parameters
16- Architecture
- Sigma-Delta
- Current - Supply
- 32.3mA
- Current - Supply(Max)
- 40mA
- Features
- Power-down mode
- Interface Type
- I2S
- Junction Temperature(Max)
- 150℃
- Number of Channels
- 2
- Operating Temperature
- -40℃~+85℃
- Resolution (Bits)
- 24
- Sampling Rate
- 96000Hz
- The Chip Type
- Audio Analog-to-Digital Converter
- Thermal Resistance(Junction to Ambient)
- 80.8℃/W
- Thermal Resistance(Junction to Board)
- 37.6℃/W
- Thermal Resistance(Junction to Case)
- 40℃/W
- Voltage - Supply
- 2.7V~5.5V
- Voltage - Supply(Absolute Max)
- 6.5V
Order codes
2- PCM1802DBLCSC C1520787
- PCM1802DBRLCSC C2866894
Pinout
20| Pin | Name | Type |
|---|---|---|
| 1 | VINL | Unspecified |
| 2 | VINR | Unspecified |
| 3 | VREF1 | Unspecified |
| 4 | VREF2 | Unspecified |
| 5 | VCC | Unspecified |
| 6 | AGND | Unspecified |
| 7 | PDWN# | Unspecified |
| 8 | BYPAS | Unspecified |
| 9 | FSYNC | Unspecified |
| 10 | LRCK | Unspecified |
| 11 | BCK | Unspecified |
| 12 | DOUT | Unspecified |
| 13 | DGND | Unspecified |
| 14 | VDD | Unspecified |
| 15 | SCKI | Unspecified |
| 16 | OSR | Unspecified |
| 17 | FMT0 | Unspecified |
| 18 | FMT1 | Unspecified |
| 19 | MODE0 | Unspecified |
| 20 | MODE1 | Unspecified |
Open-source boards using it
All 5- 2 layers101.6 × 137.4 mm

- 2 layers40 × 75 mm

Phone pcb
kangp3/phone
This is a repository containing some code artifacts but mostly testing fragments for a project to develop a device to connect landline phones to other landline phones via a private VoIP network.
29 parts11MIT - 2 layers70 × 64.5 mm

Clockgen main board
GDH-Technologies/cx-clockgen
Essentially a fork of Rene Wolf's `cxadc-clock-generator-audio-adc` gitlab project
17 parts1 - 4 layers50 × 90 mm

Tuner pedal
kulovac/tuner-pedal
Source for my tuner pedal project from algorithm design to PCB implementation
108 parts - 2 layers99.1 × 99.1 mm

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Is there a KiCad symbol and footprint for the PCM1802DB?
Yes. The symbol is EasyEDA_Cloud:PCM1802DBR and the footprint Package_SO:SSOP-20_5.3x7.2mm_P0.65mm, both drawn on this page. PCBKit places them on a board for you when you design with it.
What package is the PCM1802DB?
SSOP-20, with 20 pins. Its footprint is drawn on this page.
Where is the PCM1802DB datasheet?
Texas Instruments publishes it: the Datasheet link on this page opens it.
Where can I order the PCM1802DB?
JLCPCB lists it as part C2866894, with 129 in stock; the sellers' links on this page open their listings.
What can replace the PCM1802DB?
Parts like it in the library: the AS8510-ASSP by Advanced Monolithic Systems, the WM8786GEDS/RV by Cirrus Logic, the MAX186AEAP+ by Maxim Integrated (Analog Devices) and the MAX186AEAP+T by Maxim Integrated (Analog Devices). Check their datasheets: a part that fits the footprint may still differ in its ratings.
Which open-source boards use the PCM1802DB?
5 boards in 4 repositories on GitHub; the most starred are listed on this page, with their KiCad files.
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