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LM5013DDA, in 3D

LM5013DDA

Texas Instruments

-40℃~+150℃@(TJ) 1 10uA 1MHz 3.5A 6V~100V Buck Buck Built-in No PowerSOIC-8 DC-DC Converters ROHS

Extended
Category
DC DC Converters
Package
PowerSOIC-8
Pins
9

Overview

The LM5013DDA is a DC DC Converter made by Texas Instruments in a PowerSOIC-8 package with 9 pins. -40℃~+150℃@(TJ) 1 10uA 1MHz 3.5A 6V~100V Buck Buck Built-in No PowerSOIC-8 DC-DC Converters ROHS.

PCBKit's library has its KiCad symbol (EasyEDA_Cloud:LM5012QDDARQ1, from EasyEDA) and its footprint (EasyEDA_Cloud:SOP-8_L4.9-W3.9-P1.27-LS6.0-BL-EP-2, from EasyEDA), ready for a KiCad board. 11,428 are in stock at JLCPCB (part C5383001).

Symbol

GND1VIN2EN/UVLO3RON4FB5PGOOD6BST7SW8EP9
EasyEDA_Cloud:LM5012QDDARQ1From EasyEDA

Footprint

123456789
EasyEDA_Cloud:SOP-8_L4.9-W3.9-P1.27-LS6.0-BL-EP-2From EasyEDA

From the datasheet

15
Supply, least
6 V · VIN, recommended operating min · p. 6
Supply, most
100 V · VIN, recommended operating max · p. 6
Supply, absolute maximum
100 V · VIN to GND, absolute max · p. 5
Junction, hottest
150 °C · Operating junction temperature max · p. 6
Takes working
450 µA · VIN active current typical, VEN = 2.5 V · p. 6
Takes asleep
3.1 µA · VIN shutdown current typical, VEN/UVLO = 0 V · p. 6
Takes asleep
10 µA · VIN sleep current typical, non-switching · p. 6
Takes asleep
25 µA · VIN standby current typical, VEN = 1.2 V · p. 6
Gives
3.5 A · Output current range max · p. 6
Current limit
4.2 A · Peak current limit threshold typical · p. 7
Feedback reference
1.2 V · FB regulation voltage typical · p. 6
Junction to air (DDA (SOIC))
29 K/W · Junction-to-ambient thermal resistance, LM5013-Q1 EVM · p. 6
Junction to air (DDA (SOIC))
34.8 K/W · Junction-to-ambient thermal resistance · p. 6
Junction to case (DDA (SOIC))
22.8 K/W · Junction-to-case top thermal resistance · p. 6
Junction to board (DDA (SOIC))
9.5 K/W · Junction-to-board thermal resistance · p. 6

What it is and has

14
Control architecture
Constant on-time (COT) · p. 1
Soft start
Fixed 3.5-ms internal timer · p. 1
Protection
Peak current-limit protection · p. 1
Protection
Input UVLO and thermal shutdown · p. 1
EMI
Meets CISPR 25 class 5 · p. 1
Minimum timing
50-ns minimum on and off times · p. 1
Loop compensation
No loop compensation components · p. 1
Integration
Internal VCC bias regulator and boot diode · p. 1
Power good
Open-drain output · p. 10
Start-up
Monotonic start-up into prebiased loads · p. 10
Protection
Input voltage UVLO · p. 17
Soft start
Internal · p. 17
Switching frequency
Programmable · p. 17
Power good
PGOOD indicator · p. 17

Around it

7
cap 2.2 nF
between BST and SW; High-quality 50-V X7R ceramic bootstrap capacitor. · p. 14
res 10 kΩ to 100 kΩ
between PGOOD and source voltage; External pullup resistor. · p. 4
res 100 kΩ to 1 MΩ
between VOUT and FB; Recommended RFB1 range for most applications; keep feedback resistors close to FB. · p. 13
res 10 kΩ to 100 kΩ
between PGOOD and pullup supply; Pullup required for the open-drain output; supply must not exceed 14 V. · p. 15
res 100-kΩ
between RON and GND; 1% resistor; sets 300 kHz switching frequency in the design example. · p. 18
ind at least 22 μH
between SW and VOUT; For applications supporting input transients exceeding 72 V. · p. 19
cap 22-µF
between VOUT and GND; Design example: 25-V rated ceramic capacitor with X7R dielectric. · p. 19

Specifications

54
ParameterConditionsAs printedPage
Pin voltageVIN to GNDmin -0.3 · max 100 V5
Pin voltageSW to GNDmin -1.5 · max 100 V5
Pin voltageSW to GND, <20-ns transientmin -3 V5
Pin voltageBST to GNDmin -3 · max 105.5 V5
Pin voltageBST to SWmin -0.3 · max 5.5 V5
Pin voltageEN/UVLO to GNDmin -0.3 · max 100 V5
Pin voltageFB, RON to GNDmin -0.3 · max 5.5 V5
Pin voltagePGOOD to GNDmin -0.3 · max 14 V5
Boostrap capacitorExternal BST to SW capacitormin 1.5 · max 2.5 nF5
Operating junction temperature TJmin -40 · max 150 °C5
Storage temperature Tstgmin -65 · max 150 °C5
Electrostatic discharge V(ESD)Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001min -1000 · max 1000 V5
Electrostatic discharge V(ESD)Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002min -750 · max 750 V5
Input voltage voltage range VINmin 6 · max 100 V6
Pin voltageSW to GNDmin -0.3 · max 100 V6
Pin voltageBST to GNDmin -0.3 · max 105.5 V6
PGOOD to GNDmin -0.3 · max 14 V6
Output current range IOUTNOM column represented as typtyp 3 · max 3.5 A6
FSWmax 1000 kHz6
Programmable on-time tONmin 50 · max 1000 ns6
External BST to SW capacitance CBSTNOM column represented as typmin 1.5 · typ 2.2 · max 2.5 nF6
Operating junction temperature TJmin -40 · max 150 °C6
Junction-to-ambient thermal resistance (LM5013-Q1 EVM) RθJADDA (SOIC), 8 PINS; LM5013-Q1 EVMtyp 29 °C/W6
Junction-to-ambient thermal resistance RθJADDA (SOIC), 8 PINStyp 34.8 °C/W6
Junction-to-case (top) thermal resistance RθJC(top)DDA (SOIC), 8 PINStyp 22.8 °C/W6
Junction-to-board thermal resistance RθJBDDA (SOIC), 8 PINStyp 9.5 °C/W6
Junction-to-case (bottom) thermal resistance RθJC(bot)DDA (SOIC), 8 PINStyp 1.3 °C/W6
Junction-to-board characterization parameter ΨJBDDA (SOIC), 8 PINStyp 9.4 °C/W6
Junction-to-top characterization parameter ΨJTDDA (SOIC), 8 PINStyp 0.3 °C/W6
VIN shutdown current IQ-SHUTDOWNVEN/UVLO = 0Vtyp 3.1 · max 9.9 uA6
VIN sleep current IQ-SLEEPVEN = 2.5 V, VFB = 1.5 V, VBST –VSW = 5 V, non-switchingtyp 10 · max 20 uA6
VIN standby current IQ-STANDBYVEN = 1.2 Vtyp 25 · max 40 uA6
VIN Active current IQ-ACTIVEVEN = 2.5 Vtyp 450 uA6
Shutdown threshold VSD-RISINGmax 1.1 V6
Shutdown threshold VSD-FALLINGmin 0.45 V6
EN threshold rising VEN-RISINGmin 1.43 · typ 1.5 · max 1.6 V6
EN threshold falling VEN-FALLINGmin 1.35 · typ 1.4 · max 1.47 V6
FB regulation voltage VREFmin 1.181 · typ 1.2 · max 1.218 V6
On-time1 tON1VVIN = 12 V, RRON = 75 kΩtyp 2550 ns6
On-time2 tON2VVIN = 12 V, RRON = 25 kΩtyp 830 ns6
On-time3 tON3VVIN = 48 V, RRON = 75 kΩtyp 625 ns6
On-time4 tON4VVIN = 48 V, RRON = 25 kΩtyp 245 ns7
On-time5 tON5VVIN = 100 V, RRON = 75 kΩtyp 330 ns7
On-time6 tON6VVIN = 100 V, RRON = 25 kΩtyp 128 ns7
FB upper threshold for PGOOD low to high VPG-UTHVFB risingmin 1.1 · typ 1.14 · max 1.2 V7
FB lower threshold for PGOOD high to low VPG-LTHVFB fallingmin 1.05 · typ 1.08 · max 1.12 V7
PGOOD upper and lower threshold hysteresis VPG-HYSVFB fallingtyp 60 mV7
PGOOD pulldown resistance RPGVFB = 1 Vtyp 8 Ω7
Gate drive UVLO VBST-UVVBST fallingtyp 2.4 · max 3.4 V7
High-side MOSFET RDSON RDSON-HSISW = –100 mAtyp 0.25 Ω7
Internal soft-start tSSmin 1.75 · typ 3.5 · max 4.75 ms7
Peak current limit threshold IPEAKmin 3.7 · typ 4.2 · max 5 A7
Thermal shutdown threshold (1) TJ-SDTemperature rising; specified by design, not product testedtyp 175 °C7
Thermal shutdown hysteresis (1) TJ-HYSSpecified by design, not product testedtyp 10 °C7

Pins, by the datasheet

9
1 GND
Ground connection for internal circuits. · p. 4
2 VIN
Supply input for the high-side power MOSFET and internal bias regulator; connect directly to the input supply with short, low impedance paths. · p. 4
3 EN/UVLO
Precision enable and undervoltage lockout programming input; below 1.1 V shuts down, between 1.1 V and 1.5 V selects standby, and above 1.5 V starts the converter. · p. 4
4 RON
On-time programming input; a resistor to GND sets buck switch on time. · p. 4
5 FB
Feedback input of voltage regulation comparator. · p. 4
6 PGOOD
Power-good indicator; connect to a source voltage through an external 10 kΩ to 100 kΩ pullup resistor. · p. 4
7 BST
Bootstrap gate-drive supply; connect a high-quality 2.2-nF, 50-V X7R ceramic capacitor between BST and SW. · p. 4
8 SW
Switching node connected internally to the high-side NMOS source; connect to the power supply inductor and Schottky diode switch node. · p. 4
— EP
Exposed pad with no internal electrical connection; connect to GND and a large copper plane to reduce thermal resistance. · p. 4

Ordering codes, by the datasheet

1
LM5013DDAR
SO PowerPAD · DDA drawing, 8 pins, package quantity 2500; operating temperature -40 to 150 °C. · p. 30

Parameters

20
Current Limit
4.2A
Features
Overcurrent Protection
Frequency - Switching
1MHz
Function
Step-down type
Junction Temperature(Max)
150℃
Number of Outputs
1
Operating Temperature
-40℃~+150℃@(TJ)
Output Current
3.5A
Output Type
Adjustable
Quiescent Current
450uA
Reference Voltage
1.2V
Standby Current
3.1uA
Switch tube (built-in/external)
Built-in
Synchronous Rectifier
No
Thermal Resistance(Junction to Ambient)
34.8℃/W
Thermal Resistance(Junction to Board)
9.5℃/W
Thermal Resistance(Junction to Case)
22.8℃/W
Topology
Buck
Voltage - Supply
6V~100V
Voltage - Supply(Absolute Max)
100V

Order codes

1

Pinout

9
The pins of the LM5013DDA
PinNameType
1GNDUnspecified
2VINUnspecified
3EN/UVLOUnspecified
4RONUnspecified
5FBUnspecified
6PGOODUnspecified
7BSTUnspecified
8SWUnspecified
9EPUnspecified

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Questions

Is there a KiCad symbol and footprint for the LM5013DDA?

Yes. The symbol is EasyEDA_Cloud:LM5012QDDARQ1 and the footprint EasyEDA_Cloud:SOP-8_L4.9-W3.9-P1.27-LS6.0-BL-EP-2, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the LM5013DDA?

PowerSOIC-8, with 9 pins. Its footprint is drawn on this page.

Where is the LM5013DDA datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Where can I order the LM5013DDA?

JLCPCB lists it as part C5383001, with 11,428 in stock; the sellers' links on this page open their listings.

What can replace the LM5013DDA?

Parts like it in the library: the HT7180SPER by Jiaxing Heroic Elec Tech, the BD9C401EFJ-E2 by ROHM Semiconductor, the AOZ6605PI-1 by Alpha & Omega Semiconductor and the HT7181SPER by Jiaxing Heroic Elec Tech. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Parts like it

8