LM3429MH

Texas Instruments

-40℃~+125℃ 1 2MHz 4.5V~75V Analog、PWM External Over Voltage Protection、Over-Temperature Protection (OTP) SEPIC、Buck、Boost、Buck-Boost TSSOP-14 LED Drivers ROHS

Extended

Datasheetti/LM3429MH

Category: LED Drivers
Package: TSSOP-14
Pins: 15

Overview

The LM3429MH is a LED Driver made by Texas Instruments in a TSSOP-14 package with 15 pins. -40℃~+125℃ 1 2MHz 4.5V~75V Analog、PWM External Over Voltage Protection、Over-Temperature Protection (OTP) SEPIC、Buck、Boost、Buck-Boost TSSOP-14 LED Drivers ROHS.

PCBKit's library has its KiCad symbol (EasyEDA_Cloud:LM3429MH, from EasyEDA) and its footprint (EasyEDA_Cloud:TSSOP-14_L5.0-W4.4-P0.65-LS6.4-BL-EP, from EasyEDA), ready for a KiCad board. 250 are in stock at JLCPCB (part C15769).

Symbol

EasyEDA_Cloud:LM3429MHFrom EasyEDA

Footprint

EasyEDA_Cloud:TSSOP-14_L5.0-W4.4-P0.65-LS6.4-BL-EPFrom EasyEDA

From the datasheet

Supply, least: 4.5 V · VIN, recommended operating min · p. 4
Supply, most: 75 V · VIN, recommended operating max · p. 4
Supply, absolute maximum: 76 V · VIN, absolute max · p. 4
Junction, hottest: 125 °C · recommended operating junction temperature max · p. 4
Takes working: 1.6 mA · VIN quiescent current, static, typical · p. 5
Junction to air (PWP (HTSSOP)): 47.8 K/W · junction-to-ambient thermal resistance · p. 5
Junction to board (PWP (HTSSOP)): 22.3 K/W · junction-to-board thermal resistance · p. 5
Junction to case (PWP (HTSSOP)): 26.5 K/W · junction-to-case top thermal resistance · p. 5

What it is and has

Driver topologies: Buck, Boost, Buck-Boost, SEPIC · p. 1
Current sense: Adjustable current sense voltage · p. 1
Current sensing: High-side · p. 1
Gate driver: 2 Ω, 1 A peak · p. 1
Protection: Input undervoltage protection · p. 1
Protection: Overvoltage protection · p. 1
Dimming: PWM · p. 1
Dimming: Analog · p. 1
Protection: Cycle-by-cycle current limit · p. 1
Switching frequency: Programmable · p. 1
Package: Low profile 14-lead HTSSOP · p. 1
Protection: Thermal shutdown · p. 1
Current sense voltage: Adjustable · p. 1

Around it

cap 100 nF: between VIN and AGND; Place as close to the device as possible. · p. 3
cap 2.2 µF–3.3 µF: between VCC and PGND; Ceramic bypass capacitor. · p. 3
cap 2.2 µF to 3.3 µF: between VCC and GND; Recommended bypass capacitance for the internal VCC regulator. · p. 21
cap 0.1-µF: between VIN and GND; Ceramic bypass capacitor placed as close as possible to VIN. · p. 23
res 10-Ω: between Bulk input capacitance and VIN bypass capacitor; Optional series resistor when bulk input capacitance is far from the device; forms a noise filter with the bypass capacitor. · p. 23
cap 47 pF: between OVP and GND; Filter capacitor to reduce coupled switching noise. · p. 33

Specifications

Parameter	Conditions	As printed	Page
Voltage	VIN, nDIM	min -0.3 · max 76 V	4
Voltage	OVP, HSP, HSN	min -0.3 · max 76 V	4
Voltage	RCT	min -0.3 · max 3 V	4
Voltage	IS, continuous	min -0.3 · max 76 V	4
Voltage	IS, negative transient for 100 ns	min -2 V	4
Voltage	VCC	min -0.3 · max 8 V	4
Voltage	COMP, CSH	min -0.3 · max 6 V	4
Voltage	GATE, minimum; maximum is VCC	min -0.3 V	4
Voltage	GATE, for 100 ns; maximum is VCC+2.5 V	min -2.5 V	4
Voltage	PGND, continuous	min -0.3 · max 0.3 V	4
Voltage	PGND, for 100 ns	min -2.5 · max 2.5 V	4
Continuous Current	VIN, nDIM	max -1 mA	4
Continuous Current	OVP, HSP, HSN	max -100 uA	4
Continuous Current	RCT	min -1 · max 5 mA	4
Continuous Current	IS	max -1 mA	4
Continuous Current	COMP, CSH	min -200 · max 200 uA	4
Continuous Current	GATE	min -1 · max 1 mA	4
Maximum Lead Temperature (Reflow and Solder)		max 260 °C	4
Storage Temperature Tstg		min -65 · max 150 °C	4
Electrostatic discharge V(ESD)	LM3429 in PWP package; Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins; ±2000 V	max 2000 V	4
Electrostatic discharge V(ESD)	LM3429 in PWP package; Charged device model (CDM), per JEDEC specification JESD22-C101, all pins; ±1000 V	max 1000 V	4
Operating Junction Temperature Range		min -40 · max 125 °C	4
Input Voltage VIN		min 4.5 · max 75 V	4
Junction-to-ambient thermal resistance RθJA	LM3429, PWP (HTSSOP), 14 pins	typ 47.8 °C/W	5
Junction-to-case (top) thermal resistance RθJC(top)	LM3429, PWP (HTSSOP), 14 pins	typ 26.5 °C/W	5
Junction-to-board thermal resistance RθJB	LM3429, PWP (HTSSOP), 14 pins	typ 22.3 °C/W	5
Junction-to-top characterization parameter ψJT	LM3429, PWP (HTSSOP), 14 pins	typ 0.7 °C/W	5
Junction-to-board characterization parameter ψJB	LM3429, PWP (HTSSOP), 14 pins	typ 22.1 °C/W	5
Junction-to-case (bottom) thermal resistance RθJC(bot)	LM3429, PWP (HTSSOP), 14 pins	typ 3.3 °C/W	5
VCC Regulation VCC-REG	VIN = 14 V; ICC = 0 mA	min 6.3 · typ 6.9 · max 7.35 V	5
VCC Current Limit ICC-LIM	VIN = 14 V; VCC = 0V	min 20 · typ 27 mA	5
Quiescent Current IQ	VIN = 14 V; Static	typ 1.6 · max 3 mA	5
VCC UVLO Threshold VCC-UVLO	VIN = 14 V; VCC Increasing	typ 4.17 · max 4.5 V	5
VCC UVLO Threshold VCC-UVLO	VIN = 14 V; VCC Decreasing	min 3.7 · typ 4.08 V	5
VCC UVLO Hysteresis VCC-HYS	VIN = 14 V	typ 0.1 V	5
OVP OVLO Threshold VTH-OVP	VIN = 14 V; OVP Increasing	min 1.18 · typ 1.24 · max 1.28 V	5
OVP Hysteresis Source Current IHYS-OVP	VIN = 14 V; OVP Active (high)	min 10 · typ 20 · max 30 uA	5
CSH Reference Voltage VCSH	VIN = 14 V; With Respect to AGND	min 1.21 · typ 1.235 · max 1.26 V	5
Error Amplifier Input Bias Current	VIN = 14 V; MIN, MAX: TJ = 25°C	min -0.6 · typ 0 · max 0.6 uA	5
COMP Sink / Source Current	VIN = 14 V	min 10 · typ 26 · max 40 uA	5
Transconductance	Error amplifier; VIN = 14 V	typ 100 uA/V	5
Linear Input Range	Error amplifier; VIN = 14 V; specified by design; ±125 mV	typ 125 mV	5
Transconductance Bandwidth	Error amplifier; VIN = 14 V; -6dB Unloaded Response; MIN: TJ = 25°C; specified by design	min 0.5 · typ 1 MHz	5
Minimum Off-time tOFF-MIN	VIN = 14 V; RCT = 1V through 1 kΩ	typ 35 · max 75 ns	5
RCT Reset Pulldown Resistance RRCT	VIN = 14 V	typ 36 · max 120 Ω	5
VIN/25 Reference Voltage VRCT	VIN = 14V	min 540 · typ 565 · max 585 mV	5
COMP to PWM Offset	VIN = 14 V	min 700 · typ 800 · max 900 mV	5
Current Limit Threshold VLIM	VIN = 14 V	min 215 · typ 245 · max 275 mV	5
VLIM Delay to Output	VIN = 14 V	typ 35 · max 75 ns	5
Leading Edge Blanking Time tON-MIN	VIN = 14 V	min 75 · typ 250 · max 450 ns	5
Input Bias Current	High side transconductance amplifier; VIN = 14 V	typ 10 uA	6
Transconductance	High side transconductance amplifier; VIN = 14 V	min 20 · typ 119 mA/V	6
Input Offset Current	High side transconductance amplifier; VIN = 14 V	min -1.5 · typ 0 · max 1.5 uA	6
Input Offset Voltage	High side transconductance amplifier; VIN = 14 V	min -7 · typ 0 · max 7 mV	6
Transconductance Bandwidth	High side transconductance amplifier; VIN = 14 V; ICSH = 100 uA; MIN: TJ = 25°C; specified by design	min 250 · typ 500 kHz	6
GATE Sourcing Resistance RSRC(GATE)	VIN = 14 V; GATE = High	typ 2 · max 6 Ω	6
GATE Sinking Resistance RSNK(GATE)	VIN = 14 V; GATE = Low	typ 1.3 · max 4.5 Ω	6
nDIM / UVLO Threshold VTH-nDIM	VIN = 14 V	min 1.18 · typ 1.24 · max 1.28 V	6
nDIM Hysteresis Current IHYS-nDIM	VIN = 14 V	min 10 · typ 20 · max 30 uA	6
Thermal Shutdown Threshold TSD	VIN = 14 V; specified by design	typ 165 °C	6
Thermal Shutdown Hysteresis THYS	VIN = 14 V; specified by design	typ 25 °C	6

Pins, by the datasheet

1 VIN: Input voltage; bypass with 100 nF to AGND close to the device. · p. 3
2 COMP: Compensation; connect a capacitor to AGND. · p. 3
3 CSH: Current Sense High; connect a resistor to AGND to set signal current, or a current source or potentiometer for analog dimming. · p. 3
4 RCT: Resistor Capacitor Timing; connect a resistor from the switch node and a capacitor to AGND to set switching frequency. · p. 3
5 AGND: Analog ground; connect to PGND through the DAP copper pad for CSH, COMP, and RCT ground return. · p. 3
6 OVP: Overvoltage protection; connect a resistor divider from the output or input to program OVLO. · p. 3
7 nDIM: Not DIM input; connect a PWM dimming signal and/or a resistor divider from VIN to program UVLO. · p. 3
8 NC: No connection; leave open. · p. 3
9 PGND: Power ground for GATE; connect to AGND through the DAP copper pad. · p. 3
10 GATE: Gate drive output; connect to the external NFET gate. · p. 3
11 VCC: Internal regulator output; bypass with a 2.2 uF–3.3 uF ceramic capacitor to PGND. · p. 3
12 IS: Main switch current sense; connect to the NFET drain for RDS-ON sensing or a sense resistor in its source. · p. 3
13 HSP: LED Current Sense Positive; connect through a series resistor to the positive side of the LED current sense resistor. · p. 3
14 HSN: LED Current Sense Negative; connect through a series resistor to the negative side of the LED current sense resistor. · p. 3
15 DAP: Thermal pad on bottom of IC; connect to AGND and PGND. · p. 3

Ordering codes, by the datasheet

LM3429MH/NOPB: HTSSOP (PWP) · 14 pins; 94-piece tube; operating temperature -40 to 125 °C · p. 57
LM3429MH/NOPB.A: HTSSOP (PWP) · 14 pins; 94-piece tube; operating temperature -40 to 125 °C · p. 57
LM3429MHX/NOPB: HTSSOP (PWP) · 14 pins; 2500-piece large tape and reel; operating temperature -40 to 125 °C · p. 57
LM3429MHX/NOPB.A: HTSSOP (PWP) · 14 pins; 2500-piece large tape and reel; operating temperature -40 to 125 °C · p. 57
LM3429Q1MH/NOPB: HTSSOP (PWP) · Automotive version; 14 pins; 94-piece tube; operating temperature -40 to 125 °C · p. 57
LM3429Q1MH/NOPB.A: HTSSOP (PWP) · Automotive version; 14 pins; 94-piece tube; operating temperature -40 to 125 °C · p. 57
LM3429Q1MHX/NOPB: HTSSOP (PWP) · Automotive version; 14 pins; 2500-piece large tape and reel; operating temperature -40 to 125 °C · p. 57
LM3429Q1MHX/NOPB.A: HTSSOP (PWP) · Automotive version; 14 pins; 2500-piece large tape and reel; operating temperature -40 to 125 °C · p. 57

Parameters

Current - Supply: 1.6mA
Dimming: PWM
Features: Over-Temperature Protection (OTP)
Frequency - Switching: 2MHz
Junction Temperature(Max): 125℃
Number of Channels: 1
Operating temperature: -40℃~+125℃
Switch Tube (Built-In/External): External
Thermal Resistance(Junction to Ambient): 47.8℃/W
Thermal Resistance(Junction to Board): 22.3℃/W
Thermal Resistance(Junction to Case): 26.5℃/W
Topology: Buck-Boost
Voltage - Input(DC): 4.5V~75V
Voltage - Supply(Absolute Max): 76V

Order codes

LM3429MH/NOPBLCSC C15769

Pinout

The pins of the LM3429MH
Pin	Name	Type
1	VIN	Unspecified
2	COMP	Unspecified
3	CSH	Unspecified
4	RCT	Unspecified
5	AGND	Unspecified
6	OVP	Unspecified
7	NDIM	Unspecified
8	NC	Unspecified
9	PGND	Unspecified
10	GATE	Output
11	VCC	Unspecified
12	IS	Unspecified
13	HSP	Unspecified
14	HSN	Unspecified
15	DAP	Unspecified

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Questions

Is there a KiCad symbol and footprint for the LM3429MH?

Yes. The symbol is EasyEDA_Cloud:LM3429MH and the footprint EasyEDA_Cloud:TSSOP-14_L5.0-W4.4-P0.65-LS6.4-BL-EP, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the LM3429MH?

TSSOP-14, with 15 pins. Its footprint is drawn on this page.

Where is the LM3429MH datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Where can I order the LM3429MH?

JLCPCB lists it as part C15769, with 250 in stock; the sellers' links on this page open their listings.

What can replace the LM3429MH?

Parts like it in the library: the FP7209MR-G1 by Advanced Analog Technology and the MAX20051AAUD/V+ by Maxim Integrated (Analog Devices). Check their datasheets: a part that fits the footprint may still differ in its ratings.