INA3221AIRGVR

Texas InstrumentsExtended

-300mV~26V -40℃~+125℃ 0.5uV/℃ 10uA 120dB 2.7V~5.5V 3 350uA 500nV High-side detection、Digital output interface、Programmable threshold alarm、Integrated ADC ±26V QFN-16-EP(4x4) Current Sense Amplifiers ROHS

Datasheet JLCPCB LCSC

Part id: ti/INA3221AIRGVR
Category: Current Sense Amplifiers
Package: QFN-16-EP(4x4)
Pins: 17
In stock: 6,784 at JLCPCB (C181255)
Used on: 11 open-source boards

Overview

The INA3221AIRGVR is a current Sense Amplifier made by Texas Instruments in a QFN-16-EP(4x4) package with 17 pins. -300mV~26V -40℃~+125℃ 0.5uV/℃ 10uA 120dB 2.7V~5.5V 3 350uA 500nV High-side detection、Digital output interface、Programmable threshold alarm、Integrated ADC ±26V QFN-16-EP(4x4) Current Sense Amplifiers ROHS.

PCBKit's library has its KiCad symbol (Power_Management:INA3221, from KiCad's library) and its footprint (Package_DFN_QFN:Texas_RGV0016A_VQFN-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm, from KiCad's library), ready for a KiCad board. 6,784 are in stock at JLCPCB (part C181255). 11 open-source boards in 10 repositories on GitHub use it.

Symbol

Power_Management:INA3221From KiCad's library

Footprint

Package_DFN_QFN:Texas_RGV0016A_VQFN-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mmFrom KiCad's library

From the datasheet

Supply, least: 2.7 V · VS, recommended operating min · p. 4
Supply, most: 5.5 V · VS, recommended operating max · p. 4
Supply, absolute maximum: 6 V · VS, absolute maximum · p. 4
Works from: -40 °C · TA, operating ambient min · p. 4
Works up to: 125 °C · TA, operating ambient max · p. 4
Junction, hottest: 150 °C · TJ, absolute maximum · p. 4
Takes working: 350 µA · VS, quiescent current typical, 3.3V at 25°C · p. 6
Takes at most: 450 µA · VS, quiescent current max, 3.3V at 25°C · p. 6
Takes asleep: 500 nA · VS, power-down current typical · p. 6
A pin gives at most: 10 mA · Open-drain digital output, absolute maximum · p. 4
Junction to air (RGV (VQFN)): 36.5 K/W · Junction-to-ambient thermal resistance · p. 5
Junction to board (RGV (VQFN)): 14.7 K/W · Junction-to-board thermal resistance · p. 5
Junction to case (RGV (VQFN)): 42.7 K/W · Junction-to-case top thermal resistance · p. 5

What it is and has

Bus voltage sensing: 0V to 26V · p. 1
Measurements: Shunt and bus voltage · p. 1
Offset voltage: ±80µV maximum · p. 1
Gain error: 0.25% maximum · p. 1
Averaging: Configurable averaging options · p. 1
Programmable addresses: 4 · p. 1
Alerts: Programmable alert and warning outputs · p. 1
Package: RGV (VQFN, 16), 4.00mm × 4.00mm · p. 1
ADC resolution: 13 Bits · p. 5

Specifications

Parameter	Conditions	As printed	Page
Voltage VS	Supply, VS	max 6 V	4
Analog inputs	IN+, IN–; Differential (VIN+) – (VIN–)	min -26 · max 26 V	4
Analog inputs	IN+, IN–; Common-mode (VIN+) + (VIN–) / 2	min -0.3 · max 26 V	4
Analog inputs VPU	VPU	max 26 V	4
Digital outputs	Critical, warning, power valid	max 6 V	4
Digital outputs	Timing control	max 26 V	4
Serial bus SDA	Data line, SDA; minimum GND – 0.3V	max 6 V	4
Serial bus SCL	Clock line, SCL; minimum GND – 0.3V	max 6 V	4
Current	Input, into any pin	max 5 mA	4
Current	Open-drain, digital output	max 10 mA	4
Temperature TA	Operating	min -40 · max 125 °C	4
Temperature TJ	Junction	max 150 °C	4
Temperature Tstg	Storage	min -65 · max 150 °C	4
Electrostatic discharge V(ESD)	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001; ± rating	max 2500 V	4
Electrostatic discharge V(ESD)	Charged-device model (CDM), per JEDEC specification JESD22C101; ± rating	max 1000 V	4
Electrostatic discharge V(ESD)	Machine model; ± rating	max 200 V	4
Operating supply voltage	Over operating free-air temperature range	min 2.7 · max 5.5 V	4
Operating temperature, TA TA	Operating free-air temperature	min -40 · max 125 °C	4
Junction-to-ambient thermal resistance RθJA	RGV (VQFN), 16 PINS	typ 36.5 °C/W	5
Junction-to-case (top) thermal resistance RθJC(top)	RGV (VQFN), 16 PINS	typ 42.7 °C/W	5
Junction-to-board thermal resistance RθJB	RGV (VQFN), 16 PINS	typ 14.7 °C/W	5
Junction-to-top characterization parameter ψJT	RGV (VQFN), 16 PINS	typ 0.5 °C/W	5
Junction-to-board characterization parameter ψJB	RGV (VQFN), 16 PINS	typ 14.8 °C/W	5
Junction-to-case (bottom) thermal resistance RθJC(bot)	RGV (VQFN), 16 PINS	typ 3.3 °C/W	5
Shunt voltage input VSHUNT	TA = 25°C, VS = 3.3V, VIN+ = 12V	min -163.84 · max 163.8 mV	5
Bus voltage input VBUS	TA = 25°C, VS = 3.3V	min 0 · max 26 V	5
Common-mode rejection CMR	VIN+ = 0V to +26V	min 110 · typ 120 dB	5
Shunt offset voltage, RTI VOS	TA = 25°C, VS = 3.3V, VIN+ = VBUS = 12V, VSHUNT = 0mV; ± values	typ 40 · max 80 uV	5
Shunt offset voltage, RTI VOS	TA = –40°C to +125°C; temperature drift	typ 0.1 · max 0.5 uV/°C	5
Shunt offset voltage, RTI PSRR	vs power supply, VS = 2.7V to 5.5V	typ 15 uV/V	5
Bus offset voltage, RTI VOS	TA = 25°C, VS = 3.3V, VIN+ = VBUS = 12V, VSHUNT = 0mV; ± values	typ 8 · max 16 mV	5
Bus offset voltage, RTI VOS	TA = –40°C to +125°C; temperature drift	max 80 uV/°C	5
Bus offset voltage, RTI PSRR	vs power supply	typ 0.5 mV/V	5
Input bias current at IN+ IIN+	TA = 25°C, VS = 3.3V, VIN+ = VBUS = 12V, VSHUNT = 0mV	typ 10 uA	5
Input leakage	(IN+ pin) + (IN– pin), power-down mode	typ 0.1 · max 0.5 uA	5
ADC native resolution	TA = 25°C, VS = 3.3V	typ 13 Bits	5
1LSB step size	Shunt voltage	typ 40 uV	5
1LSB step size	Bus voltage	typ 8 mV	5
Shunt voltage gain error	TA = 25°C, VS = 3.3V, VIN+ = VBUS = 12V	typ 0.1 · max 0.25 %	5
Shunt voltage gain error	TA = –40°C to +125°C; temperature drift	typ 10 · max 50 ppm/°C	5
Bus voltage gain error	TA = 25°C, VS = 3.3V, VIN+ = VBUS = 12V	typ 0.1 · max 0.25 %	5
Bus voltage gain error	TA = –40°C to +125°C; temperature drift	typ 10 · max 50 ppm/°C	5
Differential nonlinearity DNL	± typical value	typ 0.1 LSB	5
ADC conversion time tCONVERT	CT bit = 000	typ 140 · max 154 us	5
ADC conversion time tCONVERT	CT bit = 001	typ 204 · max 224 us	5
ADC conversion time tCONVERT	CT bit = 010	typ 332 · max 365 us	5
ADC conversion time tCONVERT	CT bit = 011	typ 588 · max 646 us	5
ADC conversion time tCONVERT	CT bit = 100	typ 1.1 · max 1.21 ms	5
ADC conversion time tCONVERT	CT bit = 101	typ 2.116 · max 2.328 ms	5
ADC conversion time tCONVERT	CT bit = 110	typ 4.156 · max 4.572 ms	5
ADC conversion time tCONVERT	CT bit = 111	typ 8.244 · max 9.068 ms	5
SMBus timeout	TA = 25°C, VS = 3.3V	typ 28 · max 35 ms	5
Input capacitance CI	Digital input/output	typ 3 pF	5
Leakage input current	0V ≤ VIN ≤ VS	typ 0.1 · max 1 uA	6
High-level input voltage VIH	Minimum 0.7 (VS)	max 6 V	6
Low-level input voltage VIL	Maximum 0.3 (VS)	min -0.5 V	6
Low-level output voltage VOL	SDA, critical, warning, PV; VS > +2.7V, IOL = 3mA	min 0 · max 0.4 V	6
Low-level output voltage VOL	TC; VS > +2.7V, IOL = 1.2mA	min 0 · max 0.4 V	6
Hysteresis voltage Vhys	Digital input/output	typ 500 mV	6
Quiescent current	TA = 25°C, VS = 3.3V, VIN+ = VBUS = 12V, VSHUNT = 0mV	typ 350 · max 450 uA	6
Quiescent current	Power-down mode	typ 0.5 · max 2 uA	6
Power-on reset threshold	TA = 25°C	typ 2 V	6

Pins, by the datasheet

1 IN–3: Connect to the load side of the channel 3 shunt resistor; bus voltage is measured from this pin to ground. · p. 3
2 IN+3: Connect to supply side of the channel 3 shunt resistor. · p. 3
3 GND: Ground. · p. 3
4 VS: Power supply, 2.7V to 5.5V. · p. 3
5 A0: Address pin; connect to GND, SCL, SDA, or VS. · p. 3
6 SCL: Serial bus clock line; open-drain input. · p. 3
7 SDA: Serial bus data line; open-drain input/output. · p. 3
8 Warning: Averaged measurement warning alert; open-drain output. · p. 3
9 Critical: Conversion-triggered critical alert; open-drain output. · p. 3
10 PV: Power valid alert; open-drain output. · p. 3
11 IN–1: Connect to the load side of the channel 1 shunt resistor; bus voltage is measured from this pin to ground. · p. 3
12 IN+1: Connect to supply side of the channel 1 shunt resistor. · p. 3
13 TC: Timing control alert; open-drain output. · p. 3
14 IN–2: Connect to the load side of the channel 2 shunt resistor; bus voltage is measured from this pin to ground. · p. 3
15 IN+2: Connect to supply side of the channel 2 shunt resistor. · p. 3
16 VPU: Pull-up supply voltage used to bias power valid output circuitry. · p. 3
- Thermal Pad: Connect to ground or leave floating. · p. 40

Parameters

Common Mode Rejection Ratio (CMRR): 120dB
Current - Supply(Max): 450uA
Differential Voltage: ±26V
Features: Input filter
Ib - Input Bias Current: 10uA
Input Offset Voltage Drift(Vos TC): 0.5uV/℃
Junction Temperature(Max): 150℃
Number of Channels: 3
Operating Temperature: -40℃~+125℃
Output Current per Pin(Max): 10mA
Quiescent Current: 350uA
Single Supply: 2.7V~5.5V
Standby Current: 500nA
Thermal Resistance(Junction to Ambient): 36.5℃/W
Thermal Resistance(Junction to Board): 14.7℃/W
Thermal Resistance(Junction to Case): 42.7℃/W
Vcm - Common Mode Voltage: -300mV~26V
Voltage - Supply(Absolute Max): 6V
Vos - Input Offset Voltage: 500nV

Order codes

INA3221AIRGVRLCSC C181255

Pinout

The pins of the INA3221AIRGVR
Pin	Name	Type
1	IN-3	Input
2	IN+3	Input
3	GND	Power in
4	VS	Power in
5	A0	Input
6	SCL	Input
7	SDA	Input/output
8	WARNING	Open collector
9	CRITICAL	Open collector
10	PV	Open collector
11	IN-1	Input
12	IN+1	Input
13	TC	Open collector
14	IN-2	Input
15	IN+2	Input
16	VPU	Power in
17	EP	Passive

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Questions

Is there a KiCad symbol and footprint for the INA3221AIRGVR?

Yes. The symbol is Power_Management:INA3221 and the footprint Package_DFN_QFN:Texas_RGV0016A_VQFN-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the INA3221AIRGVR?

QFN-16-EP(4x4), with 17 pins. Its footprint is drawn on this page.

Where is the INA3221AIRGVR datasheet?

Texas Instruments publishes it: the Datasheet link on this page opens it.

Where can I order the INA3221AIRGVR?

JLCPCB lists it as part C181255, with 6,784 in stock; the sellers' links on this page open their listings.

What can replace the INA3221AIRGVR?

Parts like it in the library: the INA3221AIRGVT by Texas Instruments. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the INA3221AIRGVR?

11 boards in 10 repositories on GitHub; the most starred are listed on this page, with their KiCad files.