
Sensei puck
PaoloJN/sensei-puck
Drop-in BLE water sensor puck. College proof of concept, archived before the first board order.
TE ConnectivityExtended
LGA-4(3.3x3.3x2) New Arrivals ROHS
The MS5837-02BA is an uncategorised made by TE Connectivity in a LGA-4(3.3x3.3x2) package with 4 pins. LGA-4(3.3x3.3x2) New Arrivals ROHS.
PCBKit's library has its KiCad symbol (Sensor_Pressure:MS5837-xxBA, from KiCad's library) and its footprint (Sensor_Pressure:TE_MS5837-xxBA, from KiCad's library), ready for a KiCad board. JLCPCB lists it (part C2887129). 2 open-source boards in 2 repositories on GitHub use it.
| Pin | Name | Type |
|---|---|---|
| 1 | GND | Power in |
| 2 | VDD | Power in |
| 3 | SCL | Passive |
| 4 | SDA | Input/output |

PaoloJN/sensei-puck
Drop-in BLE water sensor puck. College proof of concept, archived before the first board order.

jayis1/hardware-design-lab
Full-cycle hardware device designs — each device in its own subfolder with architecture, schematics, PCB layout, and software stack
Yes. The symbol is Sensor_Pressure:MS5837-xxBA and the footprint Sensor_Pressure:TE_MS5837-xxBA, both drawn on this page. PCBKit places them on a board for you when you design with it.
LGA-4(3.3x3.3x2), with 4 pins. Its footprint is drawn on this page.
JLCPCB lists it as part C2887129, with 0 in stock; the sellers' links on this page open their listings.
Parts like it in the library: the MS5837-05BA by TE Connectivity, the MS5837-01BA by TE Connectivity and the MS5837-02BA21 by TYCO ELECTRONICS. Check their datasheets: a part that fits the footprint may still differ in its ratings.
2 boards in 2 repositories on GitHub; the most starred are listed on this page, with their KiCad files.