
Overview
The RSMF12JT2K70 is a through Hole Resistor made by Stackpole Electronics (SEI) in a 插件,D2.3xL6mm package with 2 pins. -55℃~+200℃ 2.7kΩ 500mW Metal Oxide Film Resistor ±200ppm/℃ ±5% 插件,D2.3xL6mm Through Hole Resistors ROHS.
PCBKit's library has its KiCad symbol (Device:R, from KiCad's library) and its footprint (EasyEDA_Cloud:RES-TH_BD2.3-L6.0-P10.00-D0.6, from EasyEDA), ready for a KiCad board. JLCPCB lists it (part C2587296).
Symbol
Footprint
Parameters
6- Operating Temperature
- -55℃~+200℃
- Power(Watts)
- 0.5W
- Resistance
- 2.7kΩ
- Temperature Coefficient
- ±200ppm/℃
- Tolerance
- ±5%
- Type
- Metal Oxide Resistors
Order codes
1- RSMF12JT2K70LCSC C2587296
Pinout
2| Pin | Name | Type |
|---|---|---|
| 1 | — | Passive |
| 2 | — | Passive |
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<iframe src="https://pcbkit.io/embed/parts/stackpole/RSMF12JT2K70" title="RSMF12JT2K70 in PCBKit" width="100%" height="480" style="border:0;border-radius:12px" allow="fullscreen" loading="lazy"></iframe><img src="https://pcbkit.io/embed/parts/stackpole/RSMF12JT2K70.jpg" alt="RSMF12JT2K70" width="1200" height="900">[](https://pcbkit.io/parts/stackpole/RSMF12JT2K70)Questions
Is there a KiCad symbol and footprint for the RSMF12JT2K70?
Yes. The symbol is Device:R and the footprint EasyEDA_Cloud:RES-TH_BD2.3-L6.0-P10.00-D0.6, both drawn on this page. PCBKit places them on a board for you when you design with it.
What package is the RSMF12JT2K70?
插件,D2.3xL6mm, with 2 pins. Its footprint is drawn on this page.
Where is the RSMF12JT2K70 datasheet?
Stackpole Electronics (SEI) publishes it: the Datasheet link on this page opens it.
Where can I order the RSMF12JT2K70?
JLCPCB lists it as part C2587296, with 0 in stock; the sellers' links on this page open their listings.
What can replace the RSMF12JT2K70?
Parts like it in the library: the RSPF12FT2K70 by Stackpole Electronics (SEI), the CFM12JT2K70 by Stackpole Electronics (SEI), the MF0207FTE52-2K7 by YAGEO and the MFR50SFTE52-2K7 by YAGEO. Check their datasheets: a part that fits the footprint may still differ in its ratings.
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