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RNF18DTE422K, in 3D

RNF18DTE422K

Stackpole Electronics (SEI)

-55℃~+155℃ 125mW 422kΩ Metal Film Resistor ±0.5% ±25ppm/℃ 插件,D1.8xL3.3mm Through Hole Resistors ROHS

Extended
DatasheetJLCPCBLCSCstackpole/RNF18DTE422K
Category
Through Hole Resistors
Package
插件,D1.8xL3.3mm
Pins
2

Overview

The RNF18DTE422K is a through Hole Resistor made by Stackpole Electronics (SEI) in a 插件,D1.8xL3.3mm package with 2 pins. -55℃~+155℃ 125mW 422kΩ Metal Film Resistor ±0.5% ±25ppm/℃ 插件,D1.8xL3.3mm Through Hole Resistors ROHS.

PCBKit's library has its KiCad symbol (Device:R, from KiCad's library) and its footprint (EasyEDA_Cloud:CAP-TH_L10.0-W5.0-P7.50-D0.6_MEF104J2L3AS3035A1, from EasyEDA), ready for a KiCad board. JLCPCB lists it (part C2591642).

Symbol

Device:RFrom KiCad's library

Footprint

12
EasyEDA_Cloud:CAP-TH_L10.0-W5.0-P7.50-D0.6_MEF104J2L3AS3035A1From EasyEDA

Parameters

6
Operating Temperature
-55℃~+155℃
Power(Watts)
0.125W
Resistance
422kΩ
Temperature Coefficient
±25ppm/℃
Tolerance
±0.5%
Type
Metal Film Resistors

Order codes

1

Pinout

2
The pins of the RNF18DTE422K
PinNameType
1—Passive
2—Passive

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Questions

Is there a KiCad symbol and footprint for the RNF18DTE422K?

Yes. The symbol is Device:R and the footprint EasyEDA_Cloud:CAP-TH_L10.0-W5.0-P7.50-D0.6_MEF104J2L3AS3035A1, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the RNF18DTE422K?

插件,D1.8xL3.3mm, with 2 pins. Its footprint is drawn on this page.

Where is the RNF18DTE422K datasheet?

Stackpole Electronics (SEI) publishes it: the Datasheet link on this page opens it.

Where can I order the RNF18DTE422K?

JLCPCB lists it as part C2591642, with 0 in stock; the sellers' links on this page open their listings.

What can replace the RNF18DTE422K?

Parts like it in the library: the MFP50SBRD52-422K by YAGEO, the MFR50SDRD52-422K by YAGEO, the MFR50SDRE52-422K by YAGEO and the RNC65J4223BRB14 by Vishay Intertechnology. Check their datasheets: a part that fits the footprint may still differ in its ratings.

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