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M24C32-DFDW6TP, in 3D

M24C32-DFDW6TP

STMicroelectronics

-40℃~+85℃ 1.7V~5.5V 200 Years 32Kbit 4,000,000 Cycles 400kHz~1MHz 5ms Hardware write protection function、Noise suppression function、Built-in power-on reset (POR)、Built-in error correction code (ECC) function I2C TSSOP-8 EEPROM ROHS

Extended
DatasheetJLCPCBLCSCst/M24C32-DFDW6TP
Category
EEPROM
Package
TSSOP-8
Pins
8

Overview

The M24C32-DFDW6TP is an EEPROM made by STMicroelectronics in a TSSOP-8 package with 8 pins. -40℃~+85℃ 1.7V~5.5V 200 Years 32Kbit 4,000,000 Cycles 400kHz~1MHz 5ms Hardware write protection function、Noise suppression function、Built-in power-on reset (POR)、Built-in error correction code (ECC) function I2C TSSOP-8 EEPROM ROHS.

PCBKit's library has its KiCad symbol (EasyEDA_Cloud:M24C32-DFDW6TP, from EasyEDA) and its footprint (Package_SO:TSSOP-8_4.4x3mm_P0.65mm, from KiCad's library), ready for a KiCad board. 23 are in stock at JLCPCB (part C2971426).

Symbol

E01E12E23VSS4SDA5SCL6WP#7VCC8
EasyEDA_Cloud:M24C32-DFDW6TPFrom EasyEDA

Footprint

12345678
Package_SO:TSSOP-8_4.4x3mm_P0.65mmFrom KiCad's library

From the datasheet

9
Supply, least
1.7 V · VCC, recommended operating min · p. 24
Supply, most
5.5 V · VCC, recommended operating max · p. 24
Supply, absolute maximum
6.5 V · VCC, absolute maximum · p. 23
Works from
-40 °C · Ambient operating min at VCC ≥ 1.7 V · p. 24
Works up to
85 °C · Ambient operating max · p. 24
Takes working
800 µA · VCC, Read max at 1.6 V or 1.7 V, 400 kHz · p. 28
Takes at most
5 mA · VCC, Write max at 2.5 V ≤ VCC ≤ 5.5 V; characterized · p. 26
Takes asleep
1 µA · VCC, standby max at 1.6 V or 1.7 V · p. 28
A pin gives at most
5 mA · SDA, DC output current absolute maximum · p. 23

What it is and has

8
EEPROM memory
32 Kbit (4 Kbyte) · p. 1
Page size
32 byte · p. 1
Read modes
Random and sequential · p. 1
Write protection
Whole memory array · p. 1
Protection
Enhanced ESD/Latch-Up protection · p. 1
Byte Write time
Within 5 ms · p. 1
Page Write time
Within 5 ms · p. 1
Package option
TSSOP8 ECOPACK2® · p. 1

Around it

1
cap 10 nF to 100 nF
between VCC and VSS; Supply decoupling capacitor, close to the VCC/VSS package pins · p. 9

Specifications

72
ParameterConditionsAs printedPage
Ambient operating temperaturemin -40 · max 130 °C23
Storage temperature TSTGmin -65 · max 150 °C23
DC output current (SDA = 0) IOLmax 5 mA23
Input or output range VIOmin -0.5 · max 6.5 V23
Supply voltage VCCmin -0.5 · max 6.5 V23
Electrostatic pulse (Human Body model) VESD4000 V for devices identified with process letter K and Pmax 3000 V23
Supply voltage VCCM24C32-F, standard rangemin 1.7 · max 5.5 V24
Supply voltage VCCOnly for devices identified with process letter Tmin 1.6 · max 5.5 V24
Ambient operating temperature: READ TAVCC ≥ 1.7 Vmin -40 · max 85 °C24
Ambient operating temperature: READ TA1.6 V ≤ VCC < 1.7 V; only process letter Tmin -40 · max 85 °C24
Ambient operating temperature: WRITE TAVCC ≥ 1.7 Vmin -40 · max 85 °C24
Ambient operating temperature: WRITE TA1.6 V ≤ VCC < 1.7 V; only process letter Tmin 0 · max 85 °C24
Operating clock frequency, VCC ≥ 1.6 V fCOnly for devices identified with process letter Tmax 400 kHz24
Operating clock frequency, VCC ≥ 1.7 V fCmax 1000 kHz24
Input capacitance (SDA) CINCharacterized only, not tested in productionmax 8 pF25
Input capacitance (other pins) CINCharacterized only, not tested in productionmax 6 pF25
Input impedance (E2, E1, E0, WC) ZLVIN < 0.3 VCC; E2, E1, E0 when selected after a Start condition; characterized onlymin 30 kΩ25
Input impedance (E2, E1, E0, WC) ZHVIN > 0.7 VCC; E2, E1, E0 when selected after a Start condition; characterized onlymin 500 kΩ25
Load capacitance Cbusmax 100 pF25
SCL input rise/fall time, SDA input fall timemax 50 ns25
Data retentionTA = 55 °C; process letter K or Tmin 200 Year25
Input leakage current (E1, E2, SCL, SDA) ILIVIN = VSS or VCC; device in Standby modemax 2 uA28
Output leakage current ILOSDA in Hi-Z, external voltage applied on SDA: VSS or VCCmax 2 uA28
Supply current (Read) ICCVCC = 1.6 V or 1.7 V, fC = 400 kHzmax 0.8 mA28
Supply current (Read) ICCfC = 1 MHz; only devices operating at fC max = 1 MHzmax 2.5 mA28
Supply current (Write) ICC0During tW, VCC < 2.5 V; characterized value, not tested in productionmax 3 mA28
Standby supply current ICC1Device not selected, VIN = VSS or VCC, VCC = 1.6 V or 1.7 Vmax 1 uA28
Input low voltage (SCL, SDA, WC, Ei) VILVCC < 2.5 V; Ei inputs should be tied to VSSmin -0.45 V28
Input high voltage (SCL, SDA) VIHVCC < 2.5 Vmax 6.5 V28
Output low voltage VOLIOL = 1 mA, VCC = 1.6 V or 1.7 Vmax 0.2 V28
Input leakage current (SCL, SDA, E2, E1, E0) ILIM24C32-F at 2.5 V < VCC < 5.5 V, -40 °C < TA < +85 °C; VIN = VSS or VCC, device in Standby modemax 2 uA26
Output leakage current ILOM24C32-F at 2.5 V < VCC < 5.5 V, -40 °C < TA < +85 °C; SDA in Hi-Z, external voltage on SDA: VSS or VCCmax 2 uA26
Supply current (Read) ICCM24C32-F at 2.5 V < VCC < 5.5 V, -40 °C < TA < +85 °C; fc = 400 kHz, rise/fall time < 50 nsmax 2 mA26
Supply current (Read) ICCM24C32-F at 2.5 V < VCC < 5.5 V, -40 °C < TA < +85 °C; fc = 1 MHz, rise/fall time < 50 ns; process letter K or Tmax 2.5 mA26
Supply current (Write) ICC0M24C32-F high voltage operation; during tW, 2.5 V ≤ VCC ≤ 5.5 V; characterized valuemax 5 mA26
Standby supply current ICC1Device not selected, VIN = VSS or VCC, VCC = 2.5 Vmax 2 uA26
Input low voltage (SCL, SDA, WC, E2, E1, E0) VILM24C32-F at 2.5 V < VCC < 5.5 V, -40 °C < TA < +85 °C; Ei inputs tied to Vssmin -0.45 V26
Input high voltage (SCL, SDA) VIHM24C32-F at 2.5 V < VCC < 5.5 V, -40 °C < TA < +85 °Cmax 6.5 V26
Output low voltage VOLIOL = 2.1 mA, VCC = 2.5 V or IOL = 3 mA, VCC = 5.5 V; applicable to F high voltage operationmax 0.4 V26
Clock frequency fCmax 400 kHz30
Clock pulse width high tCHCLmin 600 ns30
Clock pulse width low tCLCHmin 1300 ns30
SDA (out) fall time tQL1QL2Characterized only; minimum with CL = 10 pFmin 20 · max 300 ns30
Data in set up time tDXCHmin 100 ns30
Data in hold time tCLDXmin 0 ns30
Data out hold time tCLQXmin 100 ns30
Clock low to next data valid (access time) tCLQVRbus × Cbus within Figure 13 limitsmax 900 ns30
Start condition setup time tCHDLmin 600 ns30
Start condition hold time tDLCLmin 600 ns30
Stop condition set up time tCHDHmin 600 ns30
Time between Stop condition and next Start condition tDHDLmin 1300 ns30
WC set up time (before the Start condition) tWLDLWC = 0 to enable WRITE; characterized onlymin 0 us30
WC hold time (after the Stop condition) tDHWHWC = 0 to enable WRITE; characterized onlymin 1 us30
Internal Write cycle duration tWM24C32-DFmax 5 ms30
Pulse width ignored (input filter on SCL and SDA) - single glitch tNSCharacterized onlymax 80 ns30
Clock frequency fCOnly process letter K or T, devices qualified at 1 MHzmin 0 · max 1 MHz31
Clock pulse width high tCHCLOnly process letter K or Tmin 260 ns31
Clock pulse width low tCLCHOnly process letter K or Tmin 500 ns31
SDA (out) fall time tQL1QL2Only process letter K or T; characterized only; minimum with CL = 10 pFmax 120 ns31
SDA (out) fall time tQL1QL2Only process letter K or T; characterized only; CL = 10 pFmin 20 ns31
Data in setup time tDXCHOnly process letter K or Tmin 50 ns31
Data in hold time tCLDXOnly process letter K or Tmin 0 ns31
Data out hold time tCLQXOnly process letter K or Tmin 100 ns31
Clock low to next data valid (access time) tCLQVOnly process letter K or T; Rbus × Cbus within Figure 14 limitsmax 450 ns31
Start condition setup time tCHDLOnly process letter K or Tmin 250 ns31
Start condition hold time tDLCLOnly process letter K or Tmin 250 ns31
Stop condition setup time tCHDHOnly process letter K or Tmin 250 ns31
Time between Stop condition and next Start condition tDHDLOnly process letter K or Tmin 500 ns31
WC set up time (before the Start condition) tWLDLOnly process letter K or T; WC = 0 to enable WRITE; characterized onlymin 0 us31
WC hold time (after the Stop condition) tDHWHOnly process letter K or T; WC = 0 to enable WRITE; characterized onlymin 1 us31
Write time tWM24C32-DF; only process letter K or Tmax 5 ms31
Pulse width ignored (input filter on SCL and SDA) tNSOnly process letter K or T; characterized onlymax 80 ns31

Parameters

15
Access Time
900ns
Clock Frequency
400kHz~1MHz
Current - Supply
800uA
Data Retention - TDR (Year)
200 Years
Features
Hardware write protection function
Interface
I2C
Memory Size
32Kbit
Operating Current
5mA
Operating Temperature
-40℃~+85℃
Output Current per Pin(Max)
5mA
Standby Current
1uA
Voltage - Supply
1.7V~5.5V
Voltage - Supply(Absolute Max)
6.5V
Write Cycle Endurance
4,000,000 Cycles
Write Cycle Time(Tw)
5ms

Order codes

1

Pinout

8
The pins of the M24C32-DFDW6TP
PinNameType
1E0Unspecified
2E1Unspecified
3E2Unspecified
4VSSUnspecified
5SDAUnspecified
6SCLUnspecified
7WP#Unspecified
8VCCUnspecified

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Questions

Is there a KiCad symbol and footprint for the M24C32-DFDW6TP?

Yes. The symbol is EasyEDA_Cloud:M24C32-DFDW6TP and the footprint Package_SO:TSSOP-8_4.4x3mm_P0.65mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the M24C32-DFDW6TP?

TSSOP-8, with 8 pins. Its footprint is drawn on this page.

Where is the M24C32-DFDW6TP datasheet?

STMicroelectronics publishes it: the Datasheet link on this page opens it.

Where can I order the M24C32-DFDW6TP?

JLCPCB lists it as part C2971426, with 23 in stock; the sellers' links on this page open their listings.

What can replace the M24C32-DFDW6TP?

Parts like it in the library: the BL24C256A-SFRC by BL, the M24C08-RDW6TP by STMicroelectronics, the BL24C32A-SFRC by BL and the BL24C64A-SFRC by BL. Check their datasheets: a part that fits the footprint may still differ in its ratings.

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